High-Rate Laser Micro Machining Systems Using Ultrashort Pulsed Lasers Uwe Wagner, 3D-Micromac AG

High-Rate Laser Micro Machining Systems Using Ultrashort Pulsed Lasers Uwe Wagner, 3D-Micromac AG

Content 1. 3D-Micromac At a glance 2. Cluster market related machine requirements 3. Solution examples 4. Summary

3D-Micromac Micromachining Excellence Our Mission Development of powerful, user-friendly, and future-oriented micromachining processes Manufacturing of Laser micromachining systems and Roll to roll processing systems with superior production efficiency Reliable and fast service for micromachining systems worldwide We are the leading specialist in laser micromachining. Our international customers place great value on future-oriented and user-friendly processes. Our solutions help them increase production efficiency and lower cost. Tino Petsch, CEO

Production Solutions for Innovators and Growth Markets microdice Systems for Semiconductor Industry Production equipment for the separation of semiconductor wafers using TLS-Dicing microcell Systems for Photovoltaics High throughput laser processing of crystalline solar cells Laser structuring of PERC solar cells Half cell cutting to increase PV module power microprep Laser Based Microdiagnostics Sample Preparation Enables high-throuput, clean, and efficient laser ablation for the preparation of samples for microstructure diagnostics and failure analysis micromark Laser Systems for Marking of Ophthalmic Glasses and Contact Lenses Marking of technical engravings or brandings in spectacle lenses UDI marking of contact lenses Industry experience in ophthalmic marking since 2004

Content 1. 3D-Micromac At a glance 2. Cluster market related machine requirements 3. Solution examples 4. Summary

Design of System Solutions Usage/market related requirements Task Process & system development Solution

Market & Customer Requirements Substitution of classical processes Specific process adjustment Reliability Process stability Branch specific equirements ( accuracy, throughput, clean processes ) Versatility Upgradable Suitable for different applications Flexibility Reliability Process stability Service Primary cost driven

Market Based Machine Requirements Transfer market and customer requirements in easy-to-use machine solutions Technical components complex laser systems beam path beam shaping optical components inspection scanning solutions fixed optics handling system laser safety axis systems process gas software solution measurement cutting head HMI exhausted system Process SMART MACHINE CONCEPTS open a wide field for industrial applications COST THROUGHPUT ACCURACY Market & Customer requirement cost of ownership cost of operation return on invest service availability main time to repair cost per piece long time stability upgradable

Content 1. 3D-Micromac At a glance 2. Cluster market related machine requirements 3. Solution examples 4. Summary

Industry Solution microstruct TM OTF Cost driven machine concepts for price sensitive markets Laser contact opening of PERC Solar Cells On-the-fly laser processing Contactless wafer handling Two working areas for parallel wafer processing Benefits High throughput and efficiency (> 3,600 wph) Unbeatable cost-benefit ratio Low cost of ownership and CAPEX High availability

Industry Solution microdrill TM Highest accuracy in the nm range for 24/7 production lines Source: XAAR High precision laser drilling of inkjet nozzles Using excimer laser 4 axis system with 50nm resolution and 250 nm repeatability Benefits Highest accuracy On the fly determination of focus position Monitoring of relevant process parameters MES-Interface with OnBoard Database

Industry Solution microflex TM RFID Highest throughput in R2R laser processing with several laser sources Laser cut RFID antennas On-the-fly laser processing Incl. quality control and inspection Benefits High throughput High repeatability High power laser sources Easy to upgrade green process (substitute wet etching processes)

Industry Solution microcut TM CC Laser cutting of glass and sapphire Unique laser/optic configuration, Customized optical beam path Machine set up capable for various materials High accuracy x-, y-, z- motion system Benefits Minimal CoO Increased yield by zero kerf Free form geometries possible No post processing required Cutting speed up to 1000 mm/sec, typical 300 mm/sec High throughput due the high process speed

R&D Solution microstruct TM C Versatile Laser Micromachining System Predominantly used in product development and applied research Benefits Independent free configurable working areas Integration of up to two different laser sources Quick changing of work piece clamping unit User-friendly, flexible, upgradeable system control

Branch Solution - microprep TM For microdiagnostics sample preparation Ready for laser cutting and local laser thinning Suitable for metals, semiconductors, ceramics, and compound materials Benefits: Use of ultra-short pulse laser for gentle machining User-friendly system control with predefined software recipes Process specific work piece mounting High accuracy target preparation of ± 3 µm by special axis kinematics microprep Large-area, plane parallel thinning

Content 1. 3D-Micromac At a glance 2. Cluster market related machine requirements 3. Solution examples 4. Summary

Summary R&D, customized and industrial solution requirements Smart combination of laser process and machine solution will enable new laser applications in the industry Laser process define only one part of a potential machine solution Translation into the market segment is a next development step

Summary Think out of the box The machine solution makes the difference for your business Micromachining Excellence

Thank you for your attention! 3D-Micromac AG Technologie-Campus 8 09126 Chemnitz, Germany http://3d-micromac.com Phone: +49 371 400 43 0 E-Mail: info@3d-micromac.com