CRYSTALAS. UV Optics System for Excimer Laser Based Crystallization of Thin Silicon Films

Size: px
Start display at page:

Download "CRYSTALAS. UV Optics System for Excimer Laser Based Crystallization of Thin Silicon Films"

Transcription

1 L A S E R S Y S T E M G M B H CRYSTALAS UV Optics System for Excimer Laser Based Crystallization of Thin Silicon Films

2 CRYSTALAS The New Optical Crystallization System CRYSTALAS is an excimer laser-based optical system for the annealing and crystallization of thin silicon films. It is an ideal research tool for developing new production processes in the semiconductor industry. The flexible system design allows annealing processes on laboratory samples as well as on large size substrates. Thus, research results can be easily transferred to fabrication processes in industrial production lines. A well-established application of excimer laser- based annealing processes is the crystallization of thin amorphous silicon films on glass substrates by line beam exposure. This technique generates homogeneous polycrystalline films that provide the basis for the fabrication of thin-film-transistors (TFTs) for active-matrix liquid-crystal displays (AMLCDs). However, line beam exposure cannot produce single-crystal or near-single-crystal films that are required for the fabrication of complementary-metal-oxide-semiconductor (CMOS) devices for high-performance integrated circuits. The answer to this challenge is a new annealing process called Sequential Lateral Solidification (SLS). This low temperature process developed by Professor James Im at Columbia University (New York, NY) delivers a homogenous polycrystalline film with large, single crystals. Thus, it opens the door for semiconductor manufacturers to use ultra-high performance silicon films for the fabrication of systems-on-a-substrate such as silicon-on-insulator or silicon-on-glass. Even silicon on flexible plastic substrates can be considered. When considering flat panel display logic devices, like CPU and RAM, these devices could be integrated with the AMLCD. Furthermore, organic light emitting diode (OLED) displays that require high crystal quality to minimize leakage currents could profit from this technique. SLS employs a mask imaging technique instead of a line beam exposure. The amorphous silicon covered substrate is illuminated by a pattern of lines and spaces (typical widths 2 to 3 µm within a 4 x 15 mm 2 field). The projected pattern yields a melting zone of 2.5 µm wide with well-defined edges. Crystal growth at the solid/liquid interface appears and leads to a crystal length of µm. The second exposure, half of the grating period shifted, melts the unprocessed area and produces a closed, homogeneous polycrystalline film. Let Your Crystals Grow Large Microscope photo (left) and SEM image (right) show poly-silicon film created with the SLS process Speed Up Your Process The CRYSTALAS optical annealing system employs the mask imaging technique to generate polycrystalline thin films. Since only two laser pulses are needed to generate a poly-silicon film of 0.5 cm 2, a 15-inch display can be crystallized with only 3,000 laser pulses. Use Specific Mask Structures The SLS process can also produce controlled, single-crystal like silicon film segments. Specific mask structures like chevron shaped patterns can be used to illuminate the substrate. To obtain a homogeneous single-crystal segment, the pattern is scanned sequentially across the substrate. A scanned chevron pattern exposure yields a singlecrystal like region Masked exposure provides large direction- oriented silicon crystals Find More Literature J. S. Im et al., Controlled Super-Lateral Growth of Si Films for Microstructural Manipulation and Optimization, Phys. Stat. Sol. (a) 166, 1998, p H. J. Kahlert, Creating Crystals, OE magazine 11, 2001, p S. Uchikoga et al., Low Temperature Poly-Si TFT-LCD by Excimer Laser anneal, Thin Solid films 383, 2001, p

3 CRYSTALAS Optical System CrystaLas Optical Annealing System CrystaLas Mask Stage Wide System Applications Amorphous Silicon annealing for the fabrication of: - Thin film transistors (TFTs) for LCD and OLED-displays - CMOS elements (logic and memory devices) - High power electronic components (diodes etc.) Amorphous Silicon annealing on flexible plastic substrates Metal film annealing Superior System Benefits High energy density Homogeneous energy density profile Large area illumination Fast processing with high power lasers System versatility for the integration into other mechanical set-ups CrystaLas Homogenizer Optics Outstanding System Features Variable attenuator for precise control of energy density Energy measurement and feedback to attenuator for constant energy density CCD cameras for laser and mask beam profile measurement Homogenizer exchange capability for different mask beam profiles High precision XY-mask stage High resolution projection lenses with 18 mm and 30 mm field of view (FOV) Projection lens temperature stabilization Auto focus system for control of objective-substrate distance CCD cameras for mask and substrate observation Nitrogen purging of the entire beam path Pulse width enhancement by integration of pulse duration extender (option)

4 CRYSTALAS Optical Concept System Design The schematic drawing of the CRYSTALAS optical system shows the optical beam path and all optical components necessary to perform high precision laser annealing. The entire optical set-up is mounted on a granite table that ensures the required mechanical stability. The length of the granite table can be varied to meet customer requirements. System Beam Entrance The way the laser beam enters the optical system can be individually adapted to any beam height and beam orientation of Lambda Physik excimer lasers. Attenuator A variable attenuator with a dynamic range of 10 to 1 can adjust the energy density on the substrate. In case a pulse duration extender is employed, the attenuator also controls the amount of energy in the extender. Telescope An anamorphic telescope configuration efficiently adapts the beam profile to the aperture of the homogenizer. Homogenizer The homogenizer consists of two pairs of lens arrays two for each beam axis. The condenser lens generates the uniform illumination field on the mask. By exchanging the homogenizer elements, different field sizes on the mask can be adjusted. Field Lens Group The field lenses are used to project the light into the entrance aperture of the projection lens. Mask Stage The high precision 6 x 6 mask stage allows accurate positioning of the mask to the uniform beam profile. Different travel ranges and mask sizes are possible. Projection Lens The diffraction limited projection lens allows annealing processes to be performed with a resolution of 2 µm. Projection lenses with a field of view (FOV) of 18 mm or 30 mm are available.

5 CRYSTALAS System Specifications System wavelength (standard) 308 nm Optical system efficiency 1 up to 40 % Projection lens 5x/ x/ x/ Demagnification 5x 5x 5x - NA 0.13 diff. limited 0.13 diff. limited 0.10 diff. limited - Resolution 2.0 µm 2.0 µm 2.5 µm lines & spaces lines & spaces lines & spaces - Field of view (FOV) 10 mm 18 mm 30 mm - Depth of focus (DOF) 2 typical ± 15 µm typical ± 15 µm typical ± 25 µm Minimum uniform beam profile width on mask 5 mm x 5 mm Maximum length of mask profile 50 mm 80 mm 150 mm Homogeneity of beam profile at mask ± 2.5% (2σ) Substrate beam profile for full FOV in one axis 10 mm x 1 mm 16 mm x 1 mm 30 mm x 1mm Energy density 3 at 1100 mj/cm mj/cm mj/cm 2 substrate with LPX 210i with LS 670 with LS 1000 for 10 mm x 1 mm for 16 mm x 1 mm for 30 mm x 1 mm 1. Efficiency specification does not include pulse duration extender. 2. Stated DOF values derived from MicroLas SLS process data. 3. Higher energy density values can be easily achieved if the area of the substrate beam profile is decreased.

6 CRYSTALAS Laser Sources Lambda LPX 210i Medium to High Duty Excimer Lasers The LPX 210i is a medium to high duty cycle excimer laser, offering a high repetition rate for scientific and industrial applications. It combines proven design with state-of-the-art technology, setting new standards for reliability and performance. Features NovaTube technology for outstanding gas and tube lifetimes Magnetic Switch Control (MSC ) technology for extended thyratron lifetimes Electrostatic gas processor for extended gas lifetimes and window cleaning intervals Slide valves with an extra set of spare optics mounts for fast window exchange Easy access to optical components through the top panel of the laser Technical Data Model LPX 210i Multigas version Wavelength 308 nm Pulse energy 400 mj max. 1, 280 mj stabilized Max. repetition rate 100 Hz Average power 2 38 W Pulse duration 3 28 ns Pulse-to-pulse stability 4 ± 3.5 % Beam dimensions (v x h) x 23 mm 2 Beam divergence (v x h) 3 1 x 3 mrad Time jitter 5 ± 2 ns Electrical CEE 400 V, ±10 %, 32 A, 50 Hz, 3 Ph/N/PE, 7.5 kva. Optional 208 V, ±10 %, 50/60 Hz switchable, 3 phase Water cooling 4 l/min (1.1 gal/min), C, connection: 1/2 Dimensions (l x w x h) Laserhead: 1966 x 800 x (feet/range + 40 mm) mm x 31.5 x 18.6 (feet/range inches) inches Power supply: 460 x 185 x 750 mm 3 / 18.1 x 7.3 x 29.5 inches Vacuum pump: 230 x 240 x 530 mm 3 / 9.1 x 9.4 x 20.9 inches Weight Laserhead: 270 kg / 595 lbs Power supply: 50 kg /110 lbs Vacuum pump: 23 kg / 51 lbs 1. measured at low repetition rate 4. based on 90% of all pulses 2. measured at max. repetition rate 5. typical, 1s 3. typical, FWHM

7 CRYSTALAS Laser Sources Lambda STEEL Series Advanced Design for Better Performance Lambda STEEL (STable Energy Excimer Laser) lasers are designed for high throughput and high duty-cycle industrial production. The focus of the design was a high-power laser with excellent pulse stability that ensures superior accuracy of large area processing. Features Redesigned NovaTube technology for outstanding gas and tube lifetimes Super Magnetic Switch Control (SuperMSC ) technology for extended thyratron lifetimes Resonator optics separated from the laser tube for stable beam performance Pneumatic activated window slide valves mechanism for fast and safe window exchange Single-side access for maintenance and service minimizes clean room floor space requirements Technical Data Model Lambda STEEL 670 Lambda STEEL 1000 Wavelength 308 nm Pulse energy 670 mj stabilized 1000 mj stabilized Max. repetition rate 300 Hz Average power 200 W 300 W Pulse duration 22 ± 5 ns 29 ± 5 ns Pulse-to-pulse stability (6σ) 1 12 % 15 % Max. pulse energy deviation above average 2 7 % 8.5 % Beam dimensions (typical, FWHM) 3 (35 ± 3) x (12 ± 2) mm 2 (38 ± 3) x (13 ± 2) mm 2 Beam divergence (typical, FWHM) 4.5 mrad x 1.5 mrad Angular pointing stability (typical, FWHM) mrad x 0.15 mrad Gas lifetime > 30 x 10 6 pulses > 20 x 10 6 pulses Laser tube lifetime > 1 x 10 9 pulses Beam height 1200 ± 20 mm Electrical 5 25 kva 3-phase, 400 VAC ±10 %, 200 VAC ±10 % Water cooling l/min. T = (10 15) C at inlet for 100% duty cycle Cabinet size (l x w x h) 2500 x 850 x 1900 mm 3 / 98.5 x 33.5 x 75 inches 1. Full width of 6s, Interval ± 3s 4. at 1.0 m from beam exit, 10 pulses at 10 Hz 2. Max. energy minus average energy 5. LS 1000 delivered with external transformer 3. at 1.0 m from beam exit for 200 VAC version

8 CRYSTALAS Diagnostic Tools To ensure full annealing process control and stability, the CRYSTALAS annealing system is equipped with various diagnostic tools: CCD camera for laser beam profile analysis (including PC and beam analysis software). This allows checking the emitted laser beam profile in front the optical system. CCD camera for analysis of the homogenized mask beam (including PC and beam analysis software). This enables the examination of the homogeneity and the size of the beam profile on the mask. Online monitor for the measurement of the pulse energy incident on the mask. This provides pulse energy monitoring with feedback to the variable attenuator to precisely control the energy density. Mask structure observation by CCD camera. This permits a fast and an immediate check of mask patterns during the process. CCD camera for substrate monitoring during the laser operation. This enables accurate positioning of the substrate and immediate control of the annealing process. Energy measurement after the projection lens. This provides the means to monitor the overall optical efficiency between process intervals. System Integration The CRYSTALAS optical annealing system is designed for integration into a pure research tool for R&D process development as well as integration into a complete fabrication system for industrial production lines. MicroLas cooperates with specialized system integrators worldwide. Worldwide Sales Representatives Germany and Austria Lambda Physik AG Hans-Böckler-Str. 12 D Göttingen Tel.: Fax.: USA Lambda Physik Inc West Commercial Blvd. Fort Lauderdale, Fl 33308, USA Tel.: (954) (800) EXCIMER Fax.: (954) Asia Lambda Physik Japan Co.,Ltd. German Industry Center , Hakusan, Midoriku Yokohama 226, Japan Tel.: (045) Fax.: (045) Europe MicroLas Lasersystem GmbH Robert-Bosch-Breite Göttingen a subsidiary of TEL: 49 (0) FAX: 49 (0) info@microlas.de 01/02

Laser Crystallization for Low- Temperature Poly-Silicon (LTPS)

Laser Crystallization for Low- Temperature Poly-Silicon (LTPS) Laser Crystallization for Low- Temperature Poly-Silicon (LTPS) David Grant University of Waterloo ECE 639 Dr. Andrei Sazonov What s the current problem in AM- LCD and large-area area imaging? a-si:h has

More information

Excimer Laser-Induced Melting and Resolidification Dynamics of Silicon Thin Films

Excimer Laser-Induced Melting and Resolidification Dynamics of Silicon Thin Films Journal of the Korean Physical Society, Vol. 39, December 2001, pp. S419 S424 Excimer Laser-Induced Melting and Resolidification Dynamics of Silicon Thin Films Mutsuko Hatano Hitachi Research Laboratory,

More information

Amorphous and Polycrystalline Thin-Film Transistors

Amorphous and Polycrystalline Thin-Film Transistors Part I Amorphous and Polycrystalline Thin-Film Transistors HYBRID AMORPHOUS AND POLYCRYSTALLINE SILICON DEVICES FOR LARGE-AREA ELECTRONICS P. Mei, J. B. Boyce, D. K. Fork, G. Anderson, J. Ho, J. Lu, Xerox

More information

EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES

EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES G. Fortunato, A. Pecora, L. Maiolo, M. Cuscunà, D. Simeone, A. Minotti, and L. Mariucci CNR-IMM,

More information

Your Supplier for Fused Silica

Your Supplier for Fused Silica Your Supplier for Fused Silica Characteristics Our Company successfully developed synthetic fused silica SK-1300 as a result of significant improvements made by the conventional VAD (vapor-phase axial

More information

2-inch polycrystalline silicon thin film transistor array. using field aided lateral crystallization

2-inch polycrystalline silicon thin film transistor array. using field aided lateral crystallization 2-inch polycrystalline silicon thin film transistor array using field aided lateral crystallization JAE HOON JUNG, MYEONG HO KIM, YOUNG BAE KIM a, DUCK-KYUN CHOI, Division of Materials Science and Engineering,

More information

LASER MICROPROCESSING POWERED BY UV PHOTONS Paper #P109

LASER MICROPROCESSING POWERED BY UV PHOTONS Paper #P109 LASER MICROPROCESSING POWERED BY UV PHOTONS Paper #P109 Ralph Delmdahl, Rainer Paetzel Coherent GmbH, Hans-Boeckler-Str.12, Goettingen, 37079, Germany Abstract Lasers with ultraviolet (UV) output offer

More information

Chapter 3 Silicon Device Fabrication Technology

Chapter 3 Silicon Device Fabrication Technology Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale

More information

PATTERNING OF OXIDE THIN FILMS BY UV-LASER ABLATION

PATTERNING OF OXIDE THIN FILMS BY UV-LASER ABLATION Journal of Optoelectronics and Advanced Materials Vol. 7, No. 3, June 2005, p. 1191-1195 Invited lecture PATTERNING OF OXIDE THIN FILMS BY UV-LASER ABLATION J. Ihlemann * Laser-Laboratorium Göttingen e.v.,

More information

EECS130 Integrated Circuit Devices

EECS130 Integrated Circuit Devices EECS130 Integrated Circuit Devices Professor Ali Javey 9/13/2007 Fabrication Technology Lecture 1 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world)

More information

2D LASER CUTTING SYSTEMS WITH 3000 WATT CO2 LASER

2D LASER CUTTING SYSTEMS WITH 3000 WATT CO2 LASER Technical Description 1530 HIGH SPEED 2D LASER CUTTING SYSTEMS WITH 3000 WATT CO2 LASER 1 of 10 1.0 INTRODUCTION The PLATINO 1530 high-speed laser cutting system combines the latest developments in machine,

More information

Excimer Laser Annealing of Hydrogen Modulation Doped a-si Film

Excimer Laser Annealing of Hydrogen Modulation Doped a-si Film Materials Transactions, Vol. 48, No. 5 (27) pp. 975 to 979 #27 The Japan Institute of Metals Excimer Laser Annealing of Hydrogen Modulation Doped a-si Film Akira Heya 1, Naoto Matsuo 1, Tadashi Serikawa

More information

Crystallization of Continuing Wave Laser Applications for Low-Temperature Polycrystalline Thin Film Transistors

Crystallization of Continuing Wave Laser Applications for Low-Temperature Polycrystalline Thin Film Transistors Chapter 4 Crystallization of Continuing Wave Laser Applications for Low-Temperature Polycrystalline Thin Film Transistors 4.1 Introduction Low temperature poly-silicon TFTs fabricated by excimer laser

More information

Project III. 4: THIN FILM DEVICES FOR LARGE AREA ELECTRONICS

Project III. 4: THIN FILM DEVICES FOR LARGE AREA ELECTRONICS Project III. 4: THIN FILM DEVICES FOR LARGE AREA ELECTRONICS Project leader: Dr D.N. Kouvatsos Collaborating researchers from other projects: Dr D. Davazoglou Ph.D. candidates: M. Exarchos, L. Michalas

More information

JSM-7800F Field Emission Scanning Electron Microscope

JSM-7800F Field Emission Scanning Electron Microscope JSM-7800F catalogue JSM-7800F Field Emission Scanning Electron Microscope We provide high performance The Ultimate Research Tool for Multi-Disciplinary Research Institutions Extreme resolution The super

More information

A Novel Low Temperature Self-Aligned Field Induced Drain Polycrystalline Silicon Thin Film Transistor by Using Selective Side-Etching Process

A Novel Low Temperature Self-Aligned Field Induced Drain Polycrystalline Silicon Thin Film Transistor by Using Selective Side-Etching Process Chapter 3 A Novel Low Temperature Self-Aligned Field Induced Drain Polycrystalline Silicon Thin Film Transistor by Using Selective Side-Etching Process 3.1 Introduction Low-temperature poly-si (LTPS) TFTs

More information

CNC - LASER MACHINES OF THE SERIES LS Welding Cutting Hardening Drilling Structuring

CNC - LASER MACHINES OF THE SERIES LS Welding Cutting Hardening Drilling Structuring CNC - LASER MACHINES OF THE SERIES LS Welding Cutting Hardening Drilling Structuring Automotive E-Mobility Medical engineering CROSS-SECTOR COMPETENCE FOR YOUR SUCCESS. RIGHT FROM THE BEGINNING. Electrical

More information

UHF-ECR Plasma Etching System for Gate Electrode Processing

UHF-ECR Plasma Etching System for Gate Electrode Processing Hitachi Review Vol. 51 (2002), No. 4 95 UHF-ECR Plasma Etching System for Gate Electrode Processing Shinji Kawamura Naoshi Itabashi Akitaka Makino Masamichi Sakaguchi OVERVIEW: As the integration scale

More information

High-accuracy laser mask repair technology using ps UV solid state laser

High-accuracy laser mask repair technology using ps UV solid state laser RIKEN Review No. 43 (January, 2002): Focused on 2nd International Symposium on Laser Precision Microfabrication (LPM2001) High-accuracy laser mask repair technology using ps UV solid state laser Yukio

More information

MICROFABRICATION OF OPTICALLY ACTIVE InO X MICROSTRUCTURES BY ULTRASHORT LASER PULSES

MICROFABRICATION OF OPTICALLY ACTIVE InO X MICROSTRUCTURES BY ULTRASHORT LASER PULSES Journal of Optoelectronics and Advanced Materials Vol. 4, No. 3, September 2002, p. 809-812 MICROFABRICATION OF OPTICALLY ACTIVE InO X MICROSTRUCTURES BY ULTRASHORT LASER PULSES Foundation for Research

More information

Micro Patterning of Crystalline Structures on a-ito Films on Plastic Substrates Using Femtosecond Laser

Micro Patterning of Crystalline Structures on a-ito Films on Plastic Substrates Using Femtosecond Laser Technical Communication JLMN-Journal of Laser Micro/Nanoengineering Vol. 4, No. 3, 2009 Micro Patterning of Crystalline Structures on a-ito Films on Plastic Substrates Using Femtosecond Laser Chung-Wei

More information

Activation Behavior of Boron and Phosphorus Atoms Implanted in Polycrystalline Silicon Films by Heat Treatment at 250 C

Activation Behavior of Boron and Phosphorus Atoms Implanted in Polycrystalline Silicon Films by Heat Treatment at 250 C Japanese Journal of Applied Physics Vol. 44, No. 3, 2005, pp. 1186 1191 #2005 The Japan Society of Applied Physics Activation Behavior of Boron and Phosphorus Atoms Implanted in Polycrystalline Silicon

More information

Polycrystalline Silicon Produced by Joule-Heating Induced Crystallization

Polycrystalline Silicon Produced by Joule-Heating Induced Crystallization Polycrystalline Silicon Produced by Joule-Heating Induced Crystallization So-Ra Park 1,2, Jae-Sang Ro 1 1 Department of Materials Science and Engineering, Hongik University, Seoul, 121-791, Korea 2 EnSilTech

More information

Plasma Quest Limited

Plasma Quest Limited Plasma Quest Limited A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators Dr. Peter Hockley and Prof. Mike Thwaites,

More information

Characterization and control of defect states of polycrystalline silicon thin film transistor fabricated by laser crystallization

Characterization and control of defect states of polycrystalline silicon thin film transistor fabricated by laser crystallization Journal of Non-Crystalline Solids 299 302 (2002) 1321 1325 www.elsevier.com/locate/jnoncrysol Characterization and control of defect states of polycrystalline silicon thin film transistor fabricated by

More information

Laser technology. Laser cutting machine LC-ALPHA IV NT

Laser technology. Laser cutting machine LC-ALPHA IV NT Laser technology Laser cutting machine LC-ALPHA IV NT Speed and precision high performance and improved processes with the LC-2415 ALPHA IV The fourth generation of Amada s successful ALPHA series is still

More information

Challenges and Future Directions of Laser Fuse Processing in Memory Repair

Challenges and Future Directions of Laser Fuse Processing in Memory Repair Challenges and Future Directions of Laser Fuse Processing in Memory Repair Bo Gu, * T. Coughlin, B. Maxwell, J. Griffiths, J. Lee, J. Cordingley, S. Johnson, E. Karagiannis, J. Ehrmann GSI Lumonics, Inc.

More information

Lecture 5. SOI Micromachining. SOI MUMPs. SOI Micromachining. Silicon-on-Insulator Microstructures. Agenda:

Lecture 5. SOI Micromachining. SOI MUMPs. SOI Micromachining. Silicon-on-Insulator Microstructures. Agenda: EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie SOI Micromachining Agenda: SOI Micromachining SOI MUMPs Multi-level structures Lecture 5 Silicon-on-Insulator Microstructures Single-crystal

More information

Observation in the GB (Gentle Beam) Capabilities

Observation in the GB (Gentle Beam) Capabilities A field-emission cathode in the electron gun of a scanning electron microscope provides narrower probing beams at low as well as high electron energy, resulting in both improved spatial resolution and

More information

arxiv:cond-mat/ v2 [cond-mat.mtrl-sci] 29 Nov 2003

arxiv:cond-mat/ v2 [cond-mat.mtrl-sci] 29 Nov 2003 Fabrication and Electrical Properties of Pure Phase Films B. G. Chae, D. H. Youn, H. T. Kim, S. Maeng, and K. Y. Kang Basic Research Laboratory, ETRI, Daejeon 305-350, Republic of Korea arxiv:cond-mat/0311616v2

More information

CEM500-L. Online Gas Analyser. Specialist Of UV Spectroscopy

CEM500-L. Online Gas Analyser. Specialist Of UV Spectroscopy CEM500-L Online Gas Analyser Specialist Of UV Spectroscopy Crédits photos : Tethys Instruments Couverture : Kodda / agence 123rf Page intérieur : Bagiuiani / agence 123rf > CEM500-L Online Gas Analyser

More information

EXM500. Online Gas Analyser. Specialist Of UV Spectroscopy

EXM500. Online Gas Analyser. Specialist Of UV Spectroscopy EXM500 Online Gas Analyser Specialist Of UV Spectroscopy Crédits photos : Tethys Instruments Couverture : Kodda / agence 123rf Page intérieur : Bagiuiani / agence 123rf > EXM500 Online Gas Analyser The

More information

Low Energy Consumption, High-Speed Productivity LCG 3015 AJ. Fiber Laser Cutting System

Low Energy Consumption, High-Speed Productivity LCG 3015 AJ. Fiber Laser Cutting System Low Energy Consumption, High-Speed Productivity LCG 3015 AJ Fiber Laser Cutting System Development Concept The LCG 3015 AJ is the latest addition to Amada's line of fiber laser cutting systems. The 2kW

More information

Thin Film Processing with UV Excimer Lasers

Thin Film Processing with UV Excimer Lasers Thin Film Processing with UV Excimer Lasers Burkhard FECHNER, Jan BRUNE and Ralph DELMDAHL Coherent GmbH, Hans-Boeckler-Str. 12, D-37079 Goettingen, Germany E-mail: ralph.delmdahl@coherent.com Driving

More information

Interface quality and thermal stability of laser-deposited metal MgO multilayers

Interface quality and thermal stability of laser-deposited metal MgO multilayers Interface quality and thermal stability of laser-deposited metal MgO multilayers Christian Fuhse, Hans-Ulrich Krebs, Satish Vitta, and Göran A. Johansson Metal MgO multilayers metal of Fe, Ni 80 Nb 20,

More information

Quartz Glass for Optics

Quartz Glass for Optics Shin-Etsu Quartz Products Co., Ltd. Quartz Glass for Optics Quartz has outstanding optical properties such as light transmission and has characteristics such as high purity, high resistance to heat and

More information

Introduction to Lithography

Introduction to Lithography Introduction to Lithography G. D. Hutcheson, et al., Scientific American, 290, 76 (2004). Moore s Law Intel Co-Founder Gordon E. Moore Cramming More Components Onto Integrated Circuits Author: Gordon E.

More information

Laser Micromachining of Bulk Substrates and Thin Films Celine Bansal

Laser Micromachining of Bulk Substrates and Thin Films Celine Bansal Laser Micromachining of Bulk Substrates and Thin Films Celine Bansal Oxford Lasers Ltd Moorbrook Park Didcot, Oxfordshire, OX11 7HP Tel: +44 (0) 1235 810088 www.oxfordlasers.com Outline Oxford Lasers Importance

More information

Introduction. 1. Sputtering process, target materials and their applications

Introduction. 1. Sputtering process, target materials and their applications Sputtering is widely used in the production of electronic devices such as liquid crystal displays (LCDs), optical media, magnetic media and semiconductors. The Kobelco Research Institute, Inc. has been

More information

Surface Plasmon Resonance Analyzer

Surface Plasmon Resonance Analyzer Surface Plasmon Resonance Analyzer 5 6 SPR System Based on Microfluidics Wide Dynamic Range Kinetic Analysis by Detection of Association /Dissociation of Bio-Molecules Measuring of Mass Change below

More information

Micro- and Nano-Technology... for Optics

Micro- and Nano-Technology... for Optics Micro- and Nano-Technology...... for Optics 3.2 Lithography U.D. Zeitner Fraunhofer Institut für Angewandte Optik und Feinmechanik Jena Electron Beam Column electron gun beam on/of control magnetic deflection

More information

High Power Operation of Cryogenic Yb:YAG. K. F. Wall, B. Pati, and P. F. Moulton Photonics West 2007 San Jose, CA January 23, 2007

High Power Operation of Cryogenic Yb:YAG. K. F. Wall, B. Pati, and P. F. Moulton Photonics West 2007 San Jose, CA January 23, 2007 High Power Operation of Cryogenic Yb:YAG K. F. Wall, B. Pati, and P. F. Moulton Photonics West 2007 San Jose, CA January 23, 2007 Outline Early work on cryogenic lasers MPS laser technology Recent program

More information

Mater. Res. Soc. Symp. Proc. Vol Materials Research Society

Mater. Res. Soc. Symp. Proc. Vol Materials Research Society Mater. Res. Soc. Symp. Proc. Vol. 940 2006 Materials Research Society 0940-P13-12 A Novel Fabrication Technique for Developing Metal Nanodroplet Arrays Christopher Edgar, Chad Johns, and M. Saif Islam

More information

SAFETY PROCESS INDUSTRY LABORATORY & RESEARCH

SAFETY PROCESS INDUSTRY LABORATORY & RESEARCH SAFETY PROCESS INDUSTRY LABORATORY & RESEARCH Wuhan Cubic Optoelectronics Co.,Ltd ADD:Fenghuang No.3 Road, Fenghuang Industrial Park,Eastlake Hi-tech Development Zone, Wuhan, 430205, China TEL:+86-27-81628827

More information

In-situ laser-induced contamination monitoring using long-distance microscopy

In-situ laser-induced contamination monitoring using long-distance microscopy In-situ laser-induced contamination monitoring using long-distance microscopy Paul Wagner a, Helmut Schröder* a, Wolfgang Riede a a German Aerospace Center (DLR), Institute of Technical Physics, Pfaffenwaldring

More information

Developing Positioning Systems for Pathology Scanners

Developing Positioning Systems for Pathology Scanners Developing Positioning Systems for Pathology Scanners By Boaz Eidelberg, Ph.D., Jim Monnich, Parker Daedal Engineered Solutions, Electromechanical Automation North America Pathological scanners have unique

More information

IMPAC Infrared Thermometers

IMPAC Infrared Thermometers IMPAC Infrared Thermometers Very robust high-end IMPAC pyrometer for non-contact temperature measurements on metals, ceramics, graphite etc. between 250 and 3500 C IS 12 IS 12-S IGA 12 IGA 12-S Temperature

More information

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015 LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS Dr. Saad Ahmed XENON Corporation November 19, 2015 Topics Introduction to Pulsed Light Photonic sintering for Printed Electronics R&D Tools for

More information

Improvement of Laser Fuse Processing of Fine Pitch Link Structures for Advanced Memory Designs

Improvement of Laser Fuse Processing of Fine Pitch Link Structures for Advanced Memory Designs Improvement of Laser Fuse Processing of Fine Pitch Link Structures for Advanced Memory Designs Joohan Lee, Joseph J. Griffiths, and James Cordingley GSI Group Inc. 60 Fordham Rd. Wilmington, MA 01887 jlee@gsig.com

More information

Pulsed Fiber Laser on Flatbed Technology FP 100. High Performance Marking Solutions

Pulsed Fiber Laser on Flatbed Technology FP 100. High Performance Marking Solutions Pulsed Fiber Laser on Flatbed Technology FP 100 High Performance Marking Solutions FP 100 The Most Productive in Its Class Your Return Your Investment Your advantages at a glance The fastest laser in its

More information

Crystallization of Amorphous Silicon Thin Film. by Using a Thermal Plasma Jet. Hyun Seok Lee, Sooseok Choi, Sung Woo Kim, and Sang Hee Hong*

Crystallization of Amorphous Silicon Thin Film. by Using a Thermal Plasma Jet. Hyun Seok Lee, Sooseok Choi, Sung Woo Kim, and Sang Hee Hong* Crystallization of Amorphous Silicon Thin Film by Using a Thermal Plasma Jet Hyun Seok Lee, Sooseok Choi, Sung Woo Kim, and Sang Hee Hong* Department of Nuclear Engineering, Seoul National University Seoul

More information

Large-Field Laser System TP Cutting Engraving Marking

Large-Field Laser System TP Cutting Engraving Marking Large-Field Laser System TP 1313 Cutting Engraving Marking Cutting or engraving? You decide! Raise your profits with TP1313 from trotec! Cutting, engraving and marking Next to cutting, use your laser to

More information

ATTACHMENTES FOR APD 2000 PRO POWDER X-RAY DIFFRACTOMETER. Monochromators

ATTACHMENTES FOR APD 2000 PRO POWDER X-RAY DIFFRACTOMETER. Monochromators Monochromators Secondary graphite monochromator Johansson Ka 1 monochromator Parabolic monochromator Secondary flat and curved graphite monochromators suitable for Ag, Cr, Fe, Cu, Co and Mo radiations

More information

More on VLSI Fabrication Technologies. Emanuele Baravelli

More on VLSI Fabrication Technologies. Emanuele Baravelli More on VLSI Fabrication Technologies Emanuele Baravelli Some more details on: 1. VLSI meaning 2. p-si epitaxial layer 3. Lithography 4. Metallization 5. Process timings What does VLSI mean, by the way?

More information

Large-area laser-lift-off processing in microelectronics

Large-area laser-lift-off processing in microelectronics Available online at www.sciencedirect.com Physics Procedia 41 (2013 ) 241 248 Lasers in Manufacturing Conference 2013 Large-area laser-lift-off processing in microelectronics R. Delmdahl*, R. Pätzel, J.

More information

Advances in Intense Pulsed Light Solutions For Display Manufacturing. XENON Corporation Dr. Saad Ahmed Japan IDW 2016

Advances in Intense Pulsed Light Solutions For Display Manufacturing. XENON Corporation Dr. Saad Ahmed Japan IDW 2016 Advances in Intense Pulsed Light Solutions For Display Manufacturing XENON Corporation Dr. Saad Ahmed Japan IDW 2016 Talk Outline Introduction to Pulsed Light Applications in Display UV Curing Applications

More information

Defense Technical Information Center Compilation Part Notice

Defense Technical Information Center Compilation Part Notice UNCLASSIFIED Defense Technical Information Center Compilation Part Notice ADPO 11302 TITLE: A Novel Device Structure for Low-Temperature Polysilicon TFTs With Controlled Gain Growth in Channel Regions

More information

M. Hasumi, J. Takenezawa, Y. Kanda, T. Nagao and T. Sameshima

M. Hasumi, J. Takenezawa, Y. Kanda, T. Nagao and T. Sameshima Proceedings of 6th Thin Film Materials & Devices Meeting November 2-3, 2009, Kyoto, Japan http://www.tfmd.jp/ Characterization of SiO x /Si Interface Properties by Photo Induced Carrier Microwave Absorption

More information

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation.

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation. Figure 2.1 (p. 58) Basic fabrication steps in the silicon planar process: (a) oxide formation, (b) selective oxide removal, (c) deposition of dopant atoms on wafer, (d) diffusion of dopant atoms into exposed

More information

MODEL 1061 SEM Mill ION MILLING. Ion milling is used in the physical. sciences to enhance the sample s surface. characteristics. Inert gas, typically

MODEL 1061 SEM Mill ION MILLING. Ion milling is used in the physical. sciences to enhance the sample s surface. characteristics. Inert gas, typically MODEL 1061 SEM Mill A state-of-the-art ion milling and polishing system. It is compact, precise, and consistently produces high-quality scanning electron microscopy (SEM) samples in the shortest amount

More information

Fabrication and Layout

Fabrication and Layout ECEN454 Digital Integrated Circuit Design Fabrication and Layout ECEN 454 3.1 A Glimpse at MOS Device Polysilicon Aluminum ECEN 475 4.2 1 Material Classification Insulators Glass, diamond, silicon oxide

More information

Properties of Inclined Silicon Carbide Thin Films Deposited by Vacuum Thermal Evaporation

Properties of Inclined Silicon Carbide Thin Films Deposited by Vacuum Thermal Evaporation 182 Properties of Inclined Silicon Carbide Thin Films Deposited by Vacuum Thermal Evaporation Oday A. Hamadi, Khaled Z. Yahia, and Oday N. S. Jassim Abstract In this work, thermal evaporation system was

More information

Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon

Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon Chapter 5 Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon 5.1 Introduction In this chapter, we discuss a method of metallic bonding between two deposited silver layers. A diffusion

More information

MODEL NanoMill TEM Specimen Preparation System. Ultra-low-energy, inert-gas ion source. Concentrated ion beam with scanning capabilities

MODEL NanoMill TEM Specimen Preparation System. Ultra-low-energy, inert-gas ion source. Concentrated ion beam with scanning capabilities MODEL 1040 NanoMill TEM Specimen Preparation System The NanoMill system uses an ultra-low energy, concentrated ion beam to produce the highest quality specimens for transmission electron microscopy. Ultra-low-energy,

More information

Electronics from the Printing Press

Electronics from the Printing Press Electronics from the Printing Press Hannover Messe 2011 April 4 8, 2011, Hannover Research & Technology Leading Trade Fair for R & D and Technology Transfer Hall 2, Booth C18 Research Teaching Innovation

More information

CHAPTER 5. ABSORPTION AND FLUORESCENCE OF CsI(Tl) AND. CsI(Tl)In CRYSTALS

CHAPTER 5. ABSORPTION AND FLUORESCENCE OF CsI(Tl) AND. CsI(Tl)In CRYSTALS CHAPTER 5 ABSORPTION AND FLUORESCENCE OF CsI(Tl) AND CsI(Tl)In CRYSTALS 93 ABSTRACT In order to obtain a laser action in doped alkali halides crystals, fluorescence measurements have been performed in

More information

The laser efficiency. primapower.com. The Bend The Combi The Laser The Punch The System The Software

The laser efficiency. primapower.com. The Bend The Combi The Laser The Punch The System The Software primapower.com The laser efficiency The Bend The Combi The Laser The Punch The System The Software 104GB/Apr2012 Prima Industrie Group / Subject to changes without prior notice Innovative and reliable

More information

Fiber Lasers: Technology, Applications and Associated Laser Safety

Fiber Lasers: Technology, Applications and Associated Laser Safety Fiber Lasers: Technology, Applications and Associated Laser Safety Presentation to 2012 LSO Workshop Dr. Jay W. Dawson Fiber Laser Group Leader National Ignition Facility and Photon Sciences Directorate

More information

BAF 060 Freeze-Fracture System

BAF 060 Freeze-Fracture System BAL-TEC AG EM-TECHNOLOGY AND APPLICATION BAF 060 GRE BAF 060 Freeze-Fracture System 20.05.99 Internet: www.bal-tec.com 1 / 6 BAF 060 - Designed to meet your needs Load-Lock Transfer of Specimen: For fast

More information

Nanoscale Imaging, Material Removal and Deposition for Fabrication of Cutting-edge Semiconductor Devices

Nanoscale Imaging, Material Removal and Deposition for Fabrication of Cutting-edge Semiconductor Devices Hitachi Review Vol. 65 (2016), No. 7 233 Featured Articles Nanoscale Imaging, Material Removal and Deposition for Fabrication of Cutting-edge Semiconductor Devices Ion-beam-based Photomask Defect Repair

More information

Nanoscale Plasmonic Interferometers for Multi-Spectral, High-Throughput Biochemical Sensing

Nanoscale Plasmonic Interferometers for Multi-Spectral, High-Throughput Biochemical Sensing Supporting Online Information for Nanoscale Plasmonic Interferometers for Multi-Spectral, High-Throughput Biochemical Sensing Jing Feng (a), Vince S. Siu (a), Alec Roelke, Vihang Mehta, Steve Y. Rhieu,

More information

Hardness Testing Instruments Product Line Overview

Hardness Testing Instruments Product Line Overview Hardness Testing Instruments Product Line Overview Bulletin 300 (US) FH-1 series combined hardness testers FH-001-0000 Rrockwell Load cell, closed loop Advanced user interface Scales A, B, C, D, E, F,

More information

High-Rate Laser Micro Machining Systems Using Ultrashort Pulsed Lasers Uwe Wagner, 3D-Micromac AG

High-Rate Laser Micro Machining Systems Using Ultrashort Pulsed Lasers Uwe Wagner, 3D-Micromac AG High-Rate Laser Micro Machining Systems Using Ultrashort Pulsed Lasers Uwe Wagner, 3D-Micromac AG Content 1. 3D-Micromac At a glance 2. Cluster market related machine requirements 3. Solution examples

More information

Jewelry Laser Spot Welding Machine

Jewelry Laser Spot Welding Machine Jewelry Laser Spot Welding Machine This laser spot welding machines are used for perforation and spot welding of sand hole for gold and silver jewelleries. Laser spot welding is an important application

More information

In-process Monitoring and Adaptive Control during Micro Welding with CW Fiber Laser

In-process Monitoring and Adaptive Control during Micro Welding with CW Fiber Laser In-process Monitoring and Adaptive Control during Micro Welding with CW Fiber Laser Yousuke KAWAHITO*, Masaharu KAWASAKI* and Seiji KATAYAMA* * Osaka University, Joining and Welding Research Institute

More information

LSU3EA UV LASER MARKING MACHINE

LSU3EA UV LASER MARKING MACHINE LSU3EA UV LASER MARKING MACHINE Technical Proposal September. 207 Menu Foreword........03 Technical Solution.....04 Components of equipment and configuration...05 Internal Structure.......06 Laser.........06

More information

Making of a Chip Illustrations

Making of a Chip Illustrations Making of a Chip Illustrations 22nm 3D/Trigate Transistors Version April 2015 1 The illustrations on the following foils are low resolution images that visually support the explanations of the individual

More information

Dr Jack Gabzdyl Product Line Manager Pulsed Lasers

Dr Jack Gabzdyl Product Line Manager Pulsed Lasers AILU PHOTONEX 08 16 th October 2008 Fiber Lasers for Medical Applications Dr Jack Gabzdyl Product Line Manager Pulsed Lasers General Advantages of Fibre Lasers Beam Quality & Stability Diffraction-limited

More information

Laser Micromachining - Market Focus. Dr. Andrew Kearsley

Laser Micromachining - Market Focus. Dr. Andrew Kearsley Laser Micromachining - Market Focus Dr. Andrew Kearsley Oxford Lasers Ltd. Moorbrook Park, Didcot OX11 7HP andrew.kearsley@oxfordlasers.com 5th CIR HVM-UK: South East Conference Harwell, 17 November 2005

More information

FOUNDRY-MASTER Pro. First class laboratory optical emission spectrometer for complete professional metal analysisoes

FOUNDRY-MASTER Pro. First class laboratory optical emission spectrometer for complete professional metal analysisoes First class laboratory optical emission spectrometer for complete professional metal analysisoes OES Engineered for high performance and reliability, the, with its innovative optical system and extended

More information

Confocal Microscopy of Electronic Devices. James Saczuk. Consumer Optical Electronics EE594 02/22/2000

Confocal Microscopy of Electronic Devices. James Saczuk. Consumer Optical Electronics EE594 02/22/2000 Confocal Microscopy of Electronic Devices James Saczuk Consumer Optical Electronics EE594 02/22/2000 Introduction! Review of confocal principles! Why is CM used to examine electronics?! Several methods

More information

Die Bonder. Flip Chip Bonder Die Sorter

Die Bonder. Flip Chip Bonder Die Sorter Die Bonder Flip Chip Bonder Die Sorter T-6000-L/G Precision Die Attach Equipment with the most level of flexibility and customization T-6000-L T-8000-G T-6000-L/G Flexible High Precision Automatic Die

More information

THIN FILM DEVICES for LARGE AREA ELECTRONICS

THIN FILM DEVICES for LARGE AREA ELECTRONICS Institute of Microelectronics Annual Report 2009 7 Project III. 3: THIN FILM DEVICES for LARGE AREA ELECTRONICS Project leader: Dr. D.N. Kouvatsos Collaborating researchers from other projects: Dr. D.

More information

HSK SERIES FAST FIRE FURNACE

HSK SERIES FAST FIRE FURNACE HSK SERIES FAST FIRE FURNACE Features Rated to 1,050 C, the HSK Series rapid firing furnace features an ultra-clean low-mass refractory heating chamber. The HSK model heats from ambient to 1,050 C in approximately

More information

NanoTA2 Sub-100nm Local Thermal Imaging and Analysis

NanoTA2 Sub-100nm Local Thermal Imaging and Analysis Anasys Instruments introduces the second generation of its award winning nano thermal analysis product, the NanoTA2. This system extends the capabilities of the nano-ta system by the addition of local

More information

Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass

Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass Amorphous Oxide Transistor Electrokinetic Reflective Display on Flexible Glass Devin A. Mourey, Randy L. Hoffman, Sean M. Garner *, Arliena Holm, Brad Benson, Gregg Combs, James E. Abbott, Xinghua Li*,

More information

THE MPS FAMILY MODULAR PROCESSING SYSTEM

THE MPS FAMILY MODULAR PROCESSING SYSTEM THE MPS FAMILY MODULAR PROCESSING SYSTEM W E T H I N K L A S E R The MPS Family - Modular Processing System MPS COMPACT MPS FLEIBLE MPS ROTARY MPS ADVANCED Superior know-how creates superior Each MPS system

More information

Polymer Microfabrication (Part II) Prof. Tianhong Cui, Mechanical Engineering ME 8254

Polymer Microfabrication (Part II) Prof. Tianhong Cui, Mechanical Engineering ME 8254 Polymer Microfabrication (Part II) Prof. Tianhong Cui, Mechanical Engineering ME 8254 Other Polymer Techniques Embossing Low cost High throughput Structures as small as 25 nm Injection molding Features

More information

WATOM.. Wafer Topography Measurement KOCOS AUTOMATION GMBH [ ENG ]

WATOM.. Wafer Topography Measurement KOCOS AUTOMATION GMBH [ ENG ] KO C O S - T H E T E C H N O L O G Y G R O U P W H E R E P R E C I S I O N M E E T S Q UA L I T Y WATOM.. Wafer Topography Measurement KOCOS AUTOMATION GMBH [ ENG ] C O N T E N T S WATOM... 3 Wafer edge

More information

Liquid Metal Cleanliness Analyzer for Continuous Monitoring

Liquid Metal Cleanliness Analyzer for Continuous Monitoring LiMCA CM Liquid Metal Cleanliness Analyzer for Continuous Monitoring n Direct, in-line and real-time inclusion measurement n Fully automated n Minimum maintenance n Integrated to the Process To maintain

More information

Phosphor Screens. Applications. Features. Taper and glass substrates with phosphor layer.

Phosphor Screens. Applications. Features. Taper and glass substrates with phosphor layer. Phosphor Screens Taper and glass substrates with phosphor layer. Structure of a phosphor screen with ITO base coating, chromium ring, phosphor layer and aluminium reflection layer. Applications Electron

More information

GDMS. High Resolution GDMS.

GDMS. High Resolution GDMS. GDMS astrum ES High Resolution GDMS www.nu-ins.com Astrum ES Glow discharge mass spectrometry (GD-MS) is recognised as one of the ultimate techniques for the characterisation of conductive and non-conductive

More information

Chapter 2 Manufacturing Process

Chapter 2 Manufacturing Process Digital Integrated Circuits A Design Perspective Chapter 2 Manufacturing Process 1 CMOS Process 2 CMOS Process (n-well) Both NMOS and PMOS must be built in the same silicon material. PMOS in n-well NMOS

More information

Micron-Resolution Photocurrent of CdTe Solar Cells Using Multiple Wavelengths

Micron-Resolution Photocurrent of CdTe Solar Cells Using Multiple Wavelengths Mat. Res. Soc. Symp. Proc. Vol. 668 2001 Materials Research Society Micron-Resolution Photocurrent of CdTe Solar Cells Using Multiple Wavelengths Jason F. Hiltner 1 and James R. Sites Department of Physics,

More information

THE MPS FAMILY MODULAR PROCESSING SYSTEM W E T H I N K L A S E R

THE MPS FAMILY MODULAR PROCESSING SYSTEM W E T H I N K L A S E R THE MPS FAMILY MODULAR PROCESSING SYSTEM W E T H I N K L A S E R The MPS Family Modular Processing System MPS COMPACT MPS FLEIBLE MPS ROTARY MPS ADVANCED Superior know-how creates Each MPS system is way

More information

PROJECT PERIODIC REPORT

PROJECT PERIODIC REPORT PROJECT PERIODIC REPORT Grant Agreement number: 619456 Project acronym: SITOGA Project title: Silicon CMOS compatible transition metal oxide technology for boosting highly integrated photonic devices with

More information

Nano-Patterning by Diffraction Mask-Projection Laser Ablation

Nano-Patterning by Diffraction Mask-Projection Laser Ablation Nano-Patterning by Diffraction Mask-Projection Laser Ablation Marisa MÄDER, Klaus ZIMMER, Rico BÖHME, Thomas HÖCHE, Jürgen W. GERLACH and Bernd RAUSCHENBACH Leibniz Institute of Surface Modification, Permoserstrasse

More information

Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller

Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Photoresist Coat, Expose and Develop Laboratory Dr. Lynn Fuller Webpage: http://www.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604

More information

Visualization and Control of Particulate Contamination Phenomena in a Plasma Enhanced CVD Reactor

Visualization and Control of Particulate Contamination Phenomena in a Plasma Enhanced CVD Reactor Visualization and Control of Particulate Contamination Phenomena in a Plasma Enhanced CVD Reactor Manabu Shimada, 1 Kikuo Okuyama, 1 Yutaka Hayashi, 1 Heru Setyawan, 2 and Nobuki Kashihara 2 1 Department

More information

Which Microstat is right for you?

Which Microstat is right for you? STAT Microstat liquid cryogen optical cryostats for microscopy Which Microstat is right for you? Our easy to use, compact and efficient Microstat cryostats offer a wide range of options to suit most spectroscopy

More information