Innovative Roll-to-Roll Equipment & Material Development Suite For Next Generation Technology from Carpe Diem Technologies and the University of Massachusetts Amherst By John Berg, Dimitur Benchev, James Watkins, Jeff Morse
Overview In the Beginning NIL Inkjet and Sintered Conductors Challenges Alignment and Combined Technologies Next Gen and New Facility 2
In the Beginning 1990 2010 3
UMass / CHM R2R NIL Tool Touch one side of web only Vacuum rolls Vibration isolation loops Tension Control Energy transfer variables secret to success 4
R2RNIL 500 nm to Sub-100 nm Gratings John, Tang, Rothstein, Watkins,, Carter Nanotechnology, 2013,
Nanoimprint Lithography - Intermediate Assessment NIL Offers Very High Pattern Resolution R2R NIL Offers High Rate Continuous Patterning Current NIL Resists Offer Limited Functionality Can We Imprint Directly into Useful Materials?
Large Area Antimicrobial Textured Layers NIL and R2RNIL Challenge: Can we replicate Sharklet pattern? PFPE daughter mold from 6 inch master with K. Carter
Direct Imprinting of Patterned Metal Oxides Nanostructures Patterned ITO for transistors Patterned TiO 2 for solar cells Patterned YSZ for SOFC ACS Appl. Mater. Interfaces 2012, 4, 1614 1619 Nanoscale, 2012, 4, 4464 Patterned electrodes for nanofluidics ACS Nano, 2011, 5, 5692-5696 Patterned dielectrics for photonic devices http://www.personal.psu.edu/sjf2/ Adv. Mater. 2010, 22, 487 491
Direct Imprinting NIL of Patterned Metal Oxides Nanostructures
Layer by Layer Printing of Crystalline Metal Oxides Pattern TiO 2 using NIL Planarize using polymers Remove planarizing layer at the end by calcination
What About Metals? Nanoimprinted/Photonically Sintered Cu Electrodes/Contacts
Conductors?...Inkjet-Printed Silver Pattern / Photonic Sintering Photonic sintering Optimized conditions: 420V, 5000us, 12uP, 6x, 25% duty Resistance ~ 5Ω Prototype Production
Cu Printed on PET followed by Photonic Sintering
UMass R2R Inkjet / Photonic Sintering Tool
Drying Cu Nanoink R2R
SIntering Cu R2R
Sintered Cu R2R
What Else? - Residual-Free Imprinting of Graphene 100 um 10 um 5 um 2 um
Nanoimprint for Microfluidic Channels Prototype Production
Challenges for Making more Complicated Devices Alignment of Ink jet to Nano Imprint Pattern Optical Lithography to Nano Imprint Ink Jet to Optical Lithography Pattern Optical Lithography to Ink jet Pattern Ink Jet to Ink jet Pattern Distorted Flexible Substrates and Masks Masters Seamless and Long life 20
Direct Write Stepper Lithography, Inkjet, & Interferometric Alignment / Metrology Ink jet Fiducial Projected Target Aligned Projected Pattern TI DLP UV projected through Nikon Objective Interferometer Alignment through Nikon Objective 21
Contact / Proximity Overlay Alignment for high speed & NIL Alignment Development 3 Cameras with.8 4.8 microns/pixel 300 frames per second 5 axes Alignment Motion Control to.1 micron Exposure UV Laser Polygon Scanned Nominal line speed 12 ipm.. Energy limited Assuming ~150 mj/cm 2 22
Contact / Proximity Overlay Alignment NIL Alignment Development 23
Practical Limits on Contact Alignment, Resolution Mylar Mask Quality 20-40K DPI resolution 2.5-1.25 micron resolution but 10-25 micron min feature for < $300 (18 x 6 ) 1.25 micron on flexible glass for $5-10K (18 x 6 ) Substrate Distortion Mask-Web Tracking Requires Servo Following Error Match Encoder Resolution 1 million counts/rev is only.5 micron! Not good enough!!! But, Encoders available with 1 billion counts/ revolution.5 nanometer resolution Velocity for servo has not zero error but matched error which is a function of velocity Force and vibration isolation Image System Web, Mask, and Web plus Mask all <.1 micron positioning resolution on required fiducials 24
Roller building blocks lead to ALD Vacuum Roller I Vacuum Roller II + Atomic Layer Deposition Drum Air Bearing / Air Turn 25
Spatial ALD in Development First runs now 26
Institute for Applied Life Sciences UMass Amherst
APRM: Advanced Print and Roll-to-Roll Manufacturing Demonstration Facility Rolling Opening 2016-2017 Dr y Organic La Electronics b Print Cure Sinter Class 10,000 R2R Clean Room Facility Slit/Laminate Characterization / Optics Wet Chemistry R2R Sputter Deposition 4 Target System (Choose - Cu, Au, Pd, ITO, Al 2 O 3, SiO 2, Ni, Ti) R2R Deep Reactive Ion Etching / Ion Beam Milling (CF 4, O 2, SF 6, Ar, CHF 3, He) R2R Spatial ALD Advanced R2R Coater Gravure and Slot Die with Controlled Emissions Exhaust R2R Inkjet Printing (Xaar) with Xenon Pulse Flash Lamp and NIR Cure (NovaCentrix) R2R Alignment Technology with overlay resolution of 1 micron Advanced R2R NIL with through master exposure and solvent assisted NIL R2R Optical Contact Lithography Sheet-Based and R2R Pick and Place Secondary processes: slitting/cutting, layer release/transfer, integration/bonding/assembly Dry Room Optomec Aerosol printing system Sheet-based Inkjet and Optical Cure Nanonex Batch NIL Tool NX-2608BA CHM legacy tools: UV-Assisted Nanoimprint and Nanocoater http://chm.pse.umass.edu/cphm/
Current Technology: Coating, Sputter, Etch, Laminate etc 29
Future Technology: Nanoimprint and Direct Print of Sub- Micron Inorganic Conductors, Semiconductors, Dielectrics 30
Emerging Technology: R2R Ink Jet with Photonic Cure, R2R Pick and Place, Aerosol Jet, Spatial ALD 31
THANK YOU 32