Второй международный технологический форум "Инновации. Технологии. Производство." 23-25 марта 2015 года Electron beam technology for turbine coating Anastasiya Zagorni, MBA Prof. Dr. Christoph Metzner, Dr. Bert Scheffel Fraunhofer FEP, Dresden, Germany Rybinsk, Russia, March 23-25, 2015
Agenda 1. Fraunhofer FEP: forms of cooperation 2. Electron beam technology at FEP 3. Division Systems 4. Applications 5. Plasma-activated processes 6. Results 7. Summary
Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP page 3
Fraunhofer-Gesellschaft is Europe s largest applicationoriented research organization was set up in 1949 66 institutes and independent research units with 22,000 employees all over Germany the headquarters is located in Munich each institute has its own core competences the individual institutes act as profit centers on the market Headquarters in Munich
Fraunhofer-Gesellschaft We Forge the Future Fraunhofer-Gesellschaft is a non-profit organization
Fraunhofer Institute Center Dresden IFAM IKTS FEP founded in 1991 IWS premises: approx. 8,000 m² IFAM: Fraunhofer Institute for Manufacturing Technology and Advanced Materials IKTS: Fraunhofer Institute for Ceramic Technologies and Systems IWS: Fraunhofer Institute for Material and Beam Technology
Facts and Figures Employees: Total budget: Industry returns: Public funding: Investments: (March 2015) Director Prof. Dr. Volker Kirchhoff 193 25.8 M 8.3 M 9.0 M 2.3 M
Fraunhofer FEP and COMEDD History 1991 1991 1996 1998 2002 2004 2013 1. July 2014 foundation of the Fraunhofer FEP with approx. 70 employees of the former research institute Manfred von Ardenne construction and extension of the Technology Center Helmsdorf inauguration of the Dresden part of Fraunhofer FEP at the Fraunhofer Institute Center at Winterbergstrasse extension of the technology buildings at Winterbergstrasse inauguration of the Fraunhofer research center resource-saving energy technologies RESET by Fraunhofer FEP, Fraunhofer IKTS, and Fraunhofer IWS Merger of Fraunhofer COMEDD and Fraunhofer FEP
Core Competencies ELECTRON BEAM TECHNOLOGY PLASMA-ACTIVATED HIGH-RATE DEPOSITION SPUTTERING TECHNOLOGY HIGH-RATE PECVD TECHNOLOGIES FOR ORGANIC ELECTRONICS IC AND SYSTEM DESIGN
Fields of Application OPTICS, SENSOR TECHNOLOGY AND ELECTRONICS BIOMEDICAL ENGINEERING DISPLAYS LIGHTING SMART BUILDING AND ARCHITECTURE SOLAR ENERGY MECHANICAL ENGINEERING PACKAGING ENVIRONMENT AND ENERGY AGRICULTURE TRANSPORT PRESERVATION
Process and Equipment Know-how Lab-scale equipment Pilot-scale equipment Up-scaling of processes
Forms of Cooperation Research and development Key components/ organic-electronic devices Customer s product idea Prototyping Pilot production Customer s product Technology transfer Licensing
Key Components Electron beam sources (small and large scale) Sputtering sources (small and large scale) Plasma sources (small and large scale) Process control units Power supplies 40 cm / 16 inch 2.85 meter / 110 inch 60 cm / 24 inch 32 cm / 13 inch Our Specialty
Key Components in Integrated Packages Mechanical Components Technology Electronical Components Control / Visualization
Electron beam technology
Core Competence Thermal processes: Micromachining Welding Hardening Perforating Evaporation Melting Non-thermal processes: Cross-linking Modification Curing (e.g. of lacquers) Germ reduction Disinfection Sterilization
Division SYSTEMS Development and Manufacture of Key Components Serving the fields of Electron Beam Technology Sputtering Technology Plasma-activated high-rate Deposition High-Rate PECVD For use at FEP and external R&D Partners by Customers from Industry in Research and Production
Division Systems References Integrated Package: ERIC-LVO EB System for DVD pilot coater Customer s Technology: Directed Vapor Deposition (R&D / Pilot Scale) Application examples: Thermal barrier & bond coatings Hot corrosion resistant coatings FEP Components: EB gun ERIC-LVO 60 kw / 75 kv operation pressure 30 Pa deflection angle ± 30 deflection frequency 3 khz arc recovery time 5 ms MF high-voltage power supply three-stage vacuum system Control system & Supply cabinet
Application of YSZ as Thermal Barrier Coating YSZ-TBC coating for turbine blades by EBevaporation source: Schulz et al., Aerospace Science and Technology 7 (2003) 73 80 Structure zone model Grovenor et al. (1984) YSZ-melting temperature: ca. 2720 C at T = 1220 C homologous temperature 0,5
Plasma activation for reactive High-rate coating Plasma activated deposition process changes the microstructure enhances reactivity of reactive deposition high deposition rate is possible enhanced layer adhesion Available processes: HAD = Hollow cathode arc Activated Deposition SAD = Spotless arc Activated Deposition
HAD-Process, Experimental Evaporation of the Oxide 8 mol% YSZ Electron gun Radiation heater Movable substrate holder Substrate, biased Hollow cathode arc discharge (200 A, 80 V) Emission monitor Plasma Reactive gas input Plasma source C oating window Electron beam Crucible Rod feed
Spotless Arc Activated Deposition (SAD) with Dual Crucible, Reactive Process radiation heater substrate holder emission monitor reactive gas (O ) 2 electron gun plasma generation at anode cathode (Zr) anode (Y) electron beam Zr = cathode Y = anode diffuse arc discharge 200 A, 30 40 V + arc current supply - plasma electrodes = evaporation material - long term stable process with evaporating electrodes - plasma generation at cathode and anode - non-homogeneous layer composition caused by distance between vapor sources
YSZ-coatings onto steel substrates layer thickness ca. 5 µm, high deposition rate: 40 nm/s without plasma T = 600..870 C (structure zone 2) without bias with plasma activation (HAD) T = 350.. 900 C (structure zone T to 2) Ion current density 25 ma/cm² ratio Ions / condensed particles = ca. 30% pulsed bias 25 V pulsed bias 120 V
YSZ layers by Spotless arc Activated Deposition (SAD) substrate: NiO/YSZ ceramic substrate anode with anode functional layer YSZ layer thickness: 6 µm cubic phase (x-ray) as deposited after NiO reduction with H 2
Principle of a High-temperature SOFC fuel cell type Grafik: Forschungszentrum Jülich GmbH, Institut für Energieforschung
Summary Our offer: Development of plasma-assisted processes for various applications Development and manufacturing of customized plasma sources Feasibility studies and upscaling with FEP s plasma sources We are looking for a contract and joint research cooperation
Thank you for you attention!
Contact Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP Winterbergstraße 28 01277 Dresden, Germany Phone +49 351 2586-0 Fax +49 351 2586-105 info@fep.fraunhofer.de www.fep.fraunhofer.de We look forward working with you from the concept phase right through to industrial implementation.