Energy and resource savings in Subfab Andreas Neuber, Kent Lee Hsinchu, Dec. 4, 2015
Content ITRS benchmarks Energy consumption Focus areas Subfab Best Practices Future Outlook 2
ITRS Facilities Technology Requirements (Table ESH5) Year of Production 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 FACILITIES DESIGN Facilities Design Meet established goal and metrics Meet established goal and metrics WATER Total fab* water consumption (liters/cm 2 ) [1] 300mm/450mm fabs 7.8 7.8 7.3 7.0 6.4 6.4 5.8 5.5 5.5 5.3 5.0 5.0 5.0 4.6 4.6 4.6 200mm fabs 7.6 7.6 7.0 6.4 5.8 5.8 5.0 4.8 4.8 4.3 4.1 4.1 3.9 3.5 3.5 3.5 Total UPW consumption (liters/cm 2 ) [1] 6.5 6.5 6.5 6.0 6.0 6.0 5.0 5.0 5.0 4.5 4.5 4.5 4.5 4.5 4.5 4.5 Site water recycled/reclaimed** (% of use) 50% 50% 60% 60% 70% 70% 70% 75% 75% 75% 80% 80% 80% 90% 90% 90% ENERGY (ELECTRICITY, NATURAL GAS, ETC.) Total fab energy usage (kwh/cm2) Non EUV 1.0 1.0 1.0 0.9 0.9 0.9 0.8 0.8 0.8 0.7 0.7 0.7 0.6 0.6 0.6 0.6 EUV 1.1 1.1 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 WASTE Hazardous waste (g per cm 2 ) [1] 8.0 7.5 7.2 7.2 7.2 7.2 6.5 6.5 6.5 6.0 6.0 6.0 AIR EMISSIONS Volatile Organic Compounds (VOCs) (g per cm 2 ) [1] 0.060 0.055 0.050 0.050 0.050 0.050 0.045 0.045 0.045 0.045 0.045 0.045 Fluorinated greenhouse gases, fluorinated heat transfer fluids, and nitrous oxide Normalized emission rate (NER) to be 0.22 kg CO 2 equivalent/cm 2 by 2020 - - as agreed by (WSC) Normalized emission rate (NER) to be 0.22 kg CO 2 equivalent/cm 2 by 2020 - - as agreed by World Semiconductor Council (WSC) Normalized emission rate (NER) <0.22 kg CO 2 equivalent/cm 2 1 Water consumption 2 Energy consumption 3 Air emission: GHG, NOx, VOC Manufacturable solutions exist, being optimized Manufacturable solutions known Interim solutions are known Manufacturable solutions are NOT known 3
Equivalent energy consumption fabwide according to SEMI S23 Hot UPW 4% UPW 6% Heat 7% PCW 6% Exhaust 14% N2 6% CDA 5% Manufacturing use 46% -> Actually 71%! Power 52% SEMI S23 -> equivalent power consumption
Pareto Analysis 50.0% 45.0% Key system drivers 40.0% 35.0% 30.0% 25.0% 20.0% 15.0% 10.0% 5.0% 0.0% 12.0% 10.0% 8.0% 6.0% Key component drivers Vacuum pumps + local abatement 4.0% 2.0% 0.0% 5
Actual opportunities to reduce energy use High hanging fruit Manufacturing tool Subfab components Ultrapure water Hot ultrapure water Nitrogen Compressed air Process cooling water Process exhaust Other process gases Process chemicals Precursor Specialty waste disp. Others Dry pumps Local scrubber Heater Local chiller RF generator Laser Remote plasma clean Turbo & cryo pumps O3 generator Non process pumps Mini-Env. + other blowers Green mode opportunities Innovation RTP FCVD CMP vs. SOG Green mode capabilities, Improvements in subfab components Interface opportunities Process support systems Normally already optimized Infrastructure systems Cleanroom Exhaust treatment VOC Chiller Cooling tower General waste treatment Make-up air handling Other air handing Life safety Mechanical Others Low hanging fruit Normally already optimized
Fab Energy Consumption vs. Wafer Starts Traditionally a fab runs vacuum pumps and abatement as well as other subfab equipment all the time, even if there is no need Applied Materials offers a controller which conserves energy and resources by synchronizing fab and subfab operation This controller communicates with the tool, understands what is the equipment and chamber status, what gases are flowing in which quantities and then drive vacuum pump and abatement operation. Fab Energy Consumption Wafer Starts Source: ISMI 7
Disconnected Subfab Equipment Wastes Energy PROCESS CHAMBER Deposition (SiH 4 ) Clean (NF 3 ) Deposition (SiH 4 ) Clean (NF 3 ) VACUUM PUMP ENERGY ABATEMENT ENERGY Subfab equipment operation stays constant no matter what the process chamber is doing
Synchronizing Subfab Matches Energy Need to Operation PROCESS CHAMBER Deposition (SiH 4 ) Clean (NF 3 ) Deposition (SiH 4 ) Clean (NF 3 ) VACUUM PUMP ENERGY Energy Savings Energy Savings ABATEMENT ENERGY Subfab equipment operation synchronized with process to save energy
Best practices Energy savings in subfab Background: Operating costs in subfab has been systematically reduced over the last years. This has caused sometimes process issues, such as clogging, when purge flows have been selected as too small. A better way, which is not jeopardizing process is to align subfab operation to process requires communication of process status to subfab components, specifically dry pumps and abatement, e.g. purge can be reduced without any risk to process when only inert gases are flowing from the process. Two modes will be distinguished (Source: SEMI S23) Idle mode (hot standby mode): idle mode The condition where the equipment is energized and readied for process mode (all systems ready and temperatures controlled) but is not actually performing any active function such as material movement or processing. (refer to SEMI S23) Sleep mode: sleep mode the condition where the equipment is energized but it is using less energy than in idle mode. The sleep mode is primarily differentiated from idle mode in that it is initiated by a specific single command signal provided to equipment, either from an equipment actuator, from an equipment electric interface, or a message received through factory control software (e.g. SECS). Other than the possible initiation of the sleep mode by an equipment actuator, entry into the sleep mode does not require manual actions. (refer to SEMI S23) 10
isys 2.0 System Overview isys 2.0 QUAD Rack with Controllers Tool Ethernet cable Remote IO Ethernet cable Dry contact cables 24V DC Remote IO Modules Multiple Pumps Abatement(s) 11
Requirements for Dry pumps Pump purge and pump speed shall be synchronized with process Requirements: Idle mode Pump shall allow for multiple (two or three) purge N2 set points depending on type of gases coming from process Note: VFD changes require sleep level information since frequent acceleration/decceleration cycles would even increase power consumption Requirements: Sleep mode Pump shall allow for an lower N2 mode as well as one or more levels of reduced speed with a known and guaranteed wake-up time, e.g. To restabilize temperatures Requirements: Communication Pump shall be able to receive idle and sleep mode signals via dry contacts or other fail safe communication, e.g. Ethernet with Heartbeat signal When the signal is interrupted the pump shall go automatically in a safe operating mode The pump shall maintain the interlock signals to the tool, but shall not send alarms to the tool, when the reason for the deviation is the idle/sleep mode itself Pump shall provide hand shake signals to indicate when they are in a certain saving (green) mode. This will allow accurate recording of achieved savings and several checking functions, but is not available today. 12
Requirements for abatement (standard) Abatement operation shall be synchronized with process Requirements: Idle mode and several levels of processing mode depending on the gas type flowing at how many chambers Abatement shall allow for multiple oxidising, scrubbing and purge set points depending on type of gases coming from process Note: Thermal wet abatement maintains the same temperature. Savings are achieved via less gas flowing to the reactor Requirements: Sleep mode Abatement shall allow for an lower resource using modes with a known and guaranteed wake-up time, e.g. to restabilize temperatures. Especially to be used for thermal wet abatement systems Requirements: Communication Abatement shall be able to receive idle and sleep mode signals via dry contacts or other fail safe communication, e.g. Ethernet with Heartbeat signal When the signal is interrupted the abatement shall go automatically in a safe operating mode The abatement shall maintain the interlock signals to the tool, but shall not send alarms to the tool, when the reason for the deviation is the idle/sleep mode itself Abatement shall provide hand shake signals to indicate when they are in a certain saving (green) mode. This will allow accurate recording of achieved savings and several checking functions, but is not available today. 13
isys Energy/Utility Savings Abatement utilities Fuel gas Oxidizer (O2, CDA, Air) Power Purge gas (N2, CDA) PCW Water Caustic Foreline Secondary line heater power Pump utilities Pump purge N2 Power PCW Post pump purge Heat load To subfab Applied Materials External 14 Use
Requirements for abatement (advanced) Additional savings down to the theoretical minimum can be achieved, when the abatement considers the flow rates of the reactant gases as well and adjust both the caloric value of the reaction as well as the concentration of abatement reactants, typically oxygen, to the actually needs One example is the reduction of oxygen or combustion air in the abatement, when oxygen or ozone is flown unreacted / not completely reacted from the process. 15
Customer Saving Example Advanced isys Annual Savings 30,000 25,000 20,000 15,000 10,000 5,000 Process Tool: AMAT Producer TEOS Abatement: CT BW 2006 Pumps: Edwards ih 1000 0 0% 20% 40% 60% 80% 100% Equipment Utilization isys optimized solution captures process oxygen flow and reduces oxygen for combustion in burn wet abatement accordingly. High savings even at even high utilization No hardware solution can provide this
Zero Footprint Abatement for PFC Etch High Removal Efficiency for PFC gases DRE > 95% typical for CF 4 Abatement (1 per chamber) DRE > 99% typical for SF 6, CHF 3, C 3 F 8, NF 3, C 4 F 8 Low utilities consumption provides excellent CoO Virtual elimination of Cox and NOx emissions Zero Footprint & Ease of Installation Ideal for existing tool retrofit No additional subfab space needed Minimized installation cost Proven Reliability MTBF > 120,000 hours Uptime > 99.9% Functions on any Etch system regardless of manufacturer or wafer size Environmental impact on a 3-chamber oxide etch tool Abate PFC gases with an equivalent of about 400...700 tons CO 2 per year Equivalent carbon offset - 60...90ha of forest Applied Materials External 17 Use
ZFP2 Functional Destruction of PFCs 18
Inlet & Outlet Measurement CF4&SF6 19
DRE Results Burn Wet vs. ZFP2 Zero Footprint Plasma Abatement gives better DRE at flows <200sccm 20
PFC emissions as function of power RPS Off RPS On CF 4 Emissions are shown for several wafer cycles with the plasma off and then with the plasma on. When the plasma was on the power settings were varied to investigate the effect on CF 4 DRE. 2.8 2.6 2.4 2.2 2.0 ZFP2 POWER SETTINGS (kw)
EHS issues and Solutions 5...20% reduction of NOx, VOC, direct and indirect CO2 emission 5...20% reduction of subfab power consumption 5...20% reduction of local scrubber water consumption 22