Grace Electron Corp. Processing Guide Halogen Free Material Laminate/ Prepreg : GA-HF-14/ GA-HFB-14 Grace Electron Corp. Tech. & QA Dept. Revision 2009/5/18 Page 1 of 7 @2009Grace Group
Grace Declaration: The parameters and the processing guide contained in this document were developed through in-house evaluation result and field experience, and PCB makers should need some necessary additional adjustment for the parameters by themselves, to make sure that the parameters could meet the actual manufacture quality requirement. Grace could provide technical support when customers using any type of Grace products. Part1 Prepreg storage Prepreg storage suggestion (Vacuum package unbroken): Condition A: 23, 50% RH for three months. Condition B: lower than 5 for 6 months from date of manufacture. Prepreg usage suggestion: 1.1 Upon receipt, all prepreg should be immediately moved to a both temperature and humidity controlled environment. A FIFO (first-in-first-out) inventory management system should be used. 1.2 Prepreg has a lower lifetime; exposure in the air may have its properties degrade. Hold time after shearing had better no more than 24 hours. The remain prepreg must be vacuum packaged, and a remove moisture treatment is necessary when the second time use. 1.3 In shearing process, all prepreg panel sheets should be kept cleaning. Note: 1. Grace suggests the prepreg must be used as soon as possible from after shearing to lamination. 2. Prepreg exceeding shelf life must be retested and re-certified to agree upon specifications. Revision 2009/5/18 Page 2 of 7 @2009Grace Group
Part2 Laminate storage Laminate storage suggestion (Package unbroken): 2.1 Upon receipt, all laminate should be immediately moved to a catalytic environment such as UV light or excessive radiation. 2.2 All laminate should be used as soon as possible to avoid oxides on the surface. Laminate baking suggestion: In order to holding the dimensional stability of the laminate after shearing into panel sheets, the baking is recommendation. Materials GA-HF-14 Temperature 140 Time 2~4 hrs Note: When the storage of laminate is over one year, the properties must be retested and re-certified to agree upon specifications. Part3 Lamination process 3.1 Black or brown oxide treatment Chemistry suitability: 3.1.1 Both chemistry of black or brown oxide treatment are suitable. 3.1.2 After oxide treatment, the baking panel sheets is recommended and should no scratch or impurity contain on the surface. Please dry before lamination process for reducing moisture if inner layer boards absorb moisture. Revision 2009/5/18 Page 3 of 7 @2009Grace Group
Peel strength of copper foil oxide treatment side: 3.1.1 For the fillers added materials, the higher peel strength of copper foil oxide treatment side and the better performance of the PCB board in the reliability evaluation. Above 4.0 Lb/in is recommended, especially for the PCB board used into Lead Free solder process. 3.1.2 The board holds time had better no more than 12 hours after oxide treatment process. Note: Grace suggests the board must be used as soon as possible from after oxide treatment to lamination. 3.2 Lamination suggestion Prepreg and core prepare: The PCB makers use the prepreg and core must be the same kind of product and from the same suppliers. Prepreg lamination condition: Materials Heating rate Curing condition GA-HF-14 Heating rate: 1.5~2.5 /min (Material temperature from 80 ~140 ) 170 ~180, over 40min Note: All values mentioned above are just for reference, the parameters can be modified depend upon board design, machine as well as other factors. Revision 2009/5/18 Page 4 of 7 @2009Grace Group
Part4 Drilling process As the greater modulus strength of epoxy material which is filler added, the drilling parameters should be well adjustment to avoid excessive roughness after drilling and meet the requirement of the quality. Drilling parameters suggestion: Diameter (mm) Speed (KRPM) Infeed (IPM) Chipload (µm/rev) Max. Hit Ø < 0.5 90 52 14 500~1000 0.5 < Ø <1.0 70 65 23 1000~2000 Note: All values mentioned above are just for reference, the parameters can be modified depend upon different materials, layer counts, thickness, inner layer copper thickness as well as other factors. Baking condition after drilling: Grace recommends to baking the laminates just after drilling to releasing residual stress in the laminates. Materials GA-HF-14 Temperature 140 Time 2~3 hrs Note: In baking process, all laminate panel sheets should be kept cleaning. Part5 Desmear and weight loss The parameters of desmear should be suitable adjustment depend upon different materials characteristics to make sure the epoxy smear should be cleaned. The PTH back light should be over 8 grades. Revision 2009/5/18 Page 5 of 7 @2009Grace Group
Weight loss suggestion: Materials Weight loss (mg/dm 2 ) GA-HF-14 25~35 Part6 Routing As the greater modulus strength of epoxy material which is filler added, the routing fabrication is recommended instead of punching fabrication to avoid excessive fracturing and white edge on the PCB board. Routing parameters suggestion: Diameter (mm) Speed (KRPM) Infeed (IPM) <1.0 45~50 20~30 1.0 Ø <1.4 40~45 20~40 1.4 Ø <2.0 25~40 20~50 2.0 Ø <2.6 20~27 30~60 2.6 Ø 15~18 30~60 Note : All values mentioned above are just for reference, the routing and v-cut parameters can be modified depend upon layer counts, thickness, different materials characteristics as well as other factors. Revision 2009/5/18 Page 6 of 7 @2009Grace Group
Part7 Solder mask rework The chemical resistance of fillers added material is inferior to that of standard FR4. In the process of solder mask rework, the risk of blister and weave exposure may increase easily. The parameters (such as dwelling time, temperature, rework times ) of rework process should be modified dependent on PCB stack-up, outer layer butter coat thickness and different materials characteristics. Part8 Package and shipment of PCB The PCB should be in a moisture proof packing with desiccant and avoid any physical damages during transport. If PCB absorbs moisture during transport, the risk of delamination might occur in SMT reflow assembly or another heating process. Please dry it more than 2 hours at 120. Revision 2009/5/18 Page 7 of 7 @2009Grace Group