Process Solutions for Die Attach

Transcription

1 Process Solutions for Die Attach

2 process in tunnel oven or by substrate heating Placing of die For very fast processes, final curing by heat during wire bonding is possible dispensing Process solution 1: igh output: Large quantities make all the difference s that are specifically optimized for the snap cure process shorten cycle times and therefore allow manufacturers to cut down on costs. Certain applications with high output require fast-curing and highperformance adhesives: this is made possible by the special snap cure process, where adhesives completely cure in seconds. For curing, either a tunnel oven or substrate heating could be used. In addition, the adhesives have an impressive property profile. They give the strongest adhesion, equalize tensions and cure quickly. DELO s die attach adhesives for the snap cure process Electrical conductivity Isotropic (ICA) Fast curing igh output at low temperatures No tensions, stress on temperature-sensitive components is significantly reduced DELODUALBOND IC343 DA375 DA7 Anhydride Flexible adhesives reduce stress on the components during packaging in convection oven adhesive 5 test after 24 h : as good as oven curing but faster C / 85 % r. h. 1 high medium low IC = Isotropic Conductive DA581 DA255 DA376 DA358 cationic aminic DA587 cationic 30 C 30 C * 10 5 C 10 C C * Very flexible adhesive for low-stress applications (such as MEMS) DA = Die Attach = modified polycarbamin acid Derivates 24 rt 15 5 test after 30 min adhesives dual-curing Increased yield Non-conductive (NCA) anhydride aminic Anhydride and aminic epoxies withstand humidity 3

3 Preliminary fixation by light in less than 500 ms e. g. using DELOLUX / 365 Placing of die Final curing by heat during wire bonding dispensing Process solution 2: Dual curing A strong duo: Light and heat ensures the die is kept in place Options for adhesive modification: Adjusted flow behavior Wide range of flexibility Filler content Electrical conductivity DELO-DUALBOND AD3 Isotrop (ICA) Initial strength IC343 AD3 OB787 modified epoxy resin 30 C 10 C 30 C C Wet adhesion Light fixation 0.5 s DELOLUX / 365 Non-conductive (NCA) DELO-DUALBOND in convection oven 2.5 In microelectronics, components often have to be placed on a material with maximum accuracy. It is important that shift and tilt are prevented in subsequent process steps when the components are moved. For this requirement profile, DELO supplies very fast, dual-curing adhesives which allow for preliminary fixation by light and final curing by heat. DELO s dual-curing die attach adhesives high medium low Prefixation at the speed of light IC = Isotropic Conductive AD = ADhesive OB = Optical Bonding = modified polycarbamin acid Derivates X LED curing with the DELOLU Optimized production process and improved quality of the package Short cycle times and high positioning accuracy thanks to fast light fixation X DELOLULamp DELOLUX 50 DE LED L ED Spot Lamp curing with the DELOLUX 50 LED lamp lamp ng LED Curi at low temperatures 4 No tensions, stress on temperature-sensitive components is significantly reduced For further details on curing curin with LED lamps, see our DELOLUX and DELOLUX 50 brochures. 5

4 eat pulse process: Placing of chip and adhesive curing by heated placer dispensing Final curing during wire bonding (optional) Process solution 3: eat pulse DELO s die attach adhesives for the heat pulse process Current innovative systems already make it possible to cure adhesives extremely quickly during placing. The chemistry patented by DELO enables this cuttingedge heat pulse process that is new to the market. eat pulse DA eat pulse 250 C, test after 30 rt eat pulse 250 C, test after 24 rt eat pulse: in milliseconds but as strong as oven curing Thermode 5 Convection oven 10 C high Short cycle times Flexible adhesives reduce stress on the components during packaging Increased yield medium DA = Die Attach = modified polycarbamin acid Derivates Encaps ulants MEMS Packaging M Inn Innovative s and a nd Solutions Microelectromechanical system Chip-on-board encapsulation RAFI Eltec Extremely fast curing within a few milliseconds = modified polycarbamin acid Derivates During this process, the die is heated to approx. 250 C to 350 C by the placer. Afterwards, it is placed onto the substrate to which the adhesive has already been dispensed. In just milliseconds, the adhesive is cured. adhesive Chip size 2 x 2 mm², FR4 Gmb Fast is not fast enough for us with igh No oven necessary 6 Saving of energy and costs, minimal space required, improved in-line capability For further details details, see our MEMS Packaging and Encapsulants with igh brochures 7

5 CONTACT eadquarters Germany Windach / Munich Phone USA Sudbury / Boston, MA Phone info@delo.us Singapore Phone info@delo.com.sg China Shanghai Phone info@delo.cn Taiwan Taipei Phone info@delo.com.tw Malaysia Kuala Lumpur Phone South Korea Seoul Phone The data and information provided are based on tests performed under laboratory conditions. Reliable information about the behavior of the product under practical conditions and its suitability for a specific purpose cannot be concluded from this. It is the user s responsibility to test the suitability of the product for the intended purpose by considering all specific requirements. Type, physical and chemical properties of the materials to be processed with the product, as well as all actual influences occurring during transport, storage, processing and use, may cause deviations in the behavior of the product compared to its behavior under laboratory conditions. All data provided are typical average values or uniquely determined parameters measured under laboratory conditions. The data and information provided are therefore no guarantee for specific product properties or the suitability of the product for a specific purpose. Nothing contained herein shall be construed to indicate the non-existence of any relevant patents or to constitute a permission, encouragement or recommendation to practice any development covered by any patents, without permission of the owner of this patent. All products provided by DELO are subject to DELO s General Terms of Business. Verbal ancillary agreements are deemed not to exist. DELO This brochure including any and all parts is protected by copyright. Any use not expressly permitted by the Urheberrechtsgesetz (German Copyright Act) shall require DELO s written consent. This shall apply without limitation to reproductions, duplications, disseminations, adaptations, trans lations and microfilms as well as to the recording, processing, duplication and/or dissemination by electronic means. 08/15 s Dispensing Consulting