In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
|
|
- Elvin Floyd
- 6 years ago
- Views:
Transcription
1 Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of or use Instead of sales.addresses@ or sales.addresses@ use salesaddresses@nexperia.com ( ) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - NXP N.V. (year). All rights reserved or Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia
2 TSSOP14 Rev. 1 8 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning Circular sprocket holes opposite the label side of reel PQ-label (permanent) Cover tape Carrier tape 001aak603 Fig 1. Reel pack for SMD Table 1. Packing information Reel dimensions d x w (mm) SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) 330 x x 338 x 26
3 2. Product orientation Fig 2. Product orientation in carrier tape 3. Carrier tape dimensions 4 mm A 0 K 0 W B 0 P 1 direction of feed T 001aao148 Fig 3. Carrier tape dimensions Table 2. Carrier tape dimensions In accordance with IEC A 0 (mm) B 0 (mm) K 0 (mm) T (mm) P 1 (mm) W (mm) _118 All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Packing information Rev. 1 8 April of 4
4 4. Reel dimensions D Z W 1.5 mm min 12.8 mm min 20.2 mm min R 0.75 mm detail Z Schematic view of reel 001aaa751 Fig 4. Schematic view of reel Table 3. Reel dimensions In accordance with IEC D (mm) W (mm) _118 All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. Packing information Rev. 1 8 April of 4
5 5. Barcode label Fixed text Country of origin i.e. "Made in..." or "Diffused in EU [+] Assembled in... Packing unit (PQ) identification 2 nd traceability lot number* 2 nd (youngest) date code* 2 nd Quantity* Traceability lot number Date code Quantity Type number NXP 12NC NXP SEMICONDUCTORS MADE IN >COUNTRY< [PRODUCT INFO] (33T) PUID: B (30T) LOT2 (30D) DATE2 (30Q) QTY2 (1T) LOT (9D) DATE (31D) REDATE (32T) ORIG (31T) PMC (31P) MSL/PBT MSL/PBT (Q) QTY HALOGEN FREE (30P) TYPE RoHS compliant (1P) CODENO Optional product information* Re-approval date code* Origin code Product Manufacturing Code MSL at the Peak Body solder temperature with tin/lead* MSL at the higher lead-free Peak Body Temperature* 2D matrix with all data (including the data identifiers) Additional info if halogen free product Additional info on RoHS Lead-free symbol 001aak714 Fig 5. Box information barcode NXP -ASSEMBLED IN >COUNTRY< (30P)TYPE HALOGEN FREE (1T)LOT EU/CN RoHS compliant (Q)QTY (9D)DATE (1P)CODENO 001aak715 Fig 6. Reel information barcode Table 4. Box barcode label l x w (mm) Barcode dimensions 100 x x75 Reel barcode label l x w (mm) Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP B.V All rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 8 April 2013 Document identifier: _118
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationTSSOP16; Reel pack, SMD, 13" Q4/T2 180 deg product orientation Orderable part number ending, 128 or HP Ordering code (12NC) ending 128.
Rev. 2 14 October 2014 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning Circular sprocket holes opposite the label side of reel PQ-label (permanent)
More informationWLCSP4. 1 Packing method
1 Packing method PMCM440XXXX; Reel pack, SMD, 7"; Q1/T1 standard product orientation; Orderable part number ending,084 or Z; Ordering code (12NC) ending 084 Rev. 1 19 December 2018 Packing information
More informationSOT Packing method
1 Packing method TSSOP5; Reel pack, SMD, 7"; Q3/T4 standard product orientation; Orderable part number ending,125 or H; Ordering code (12NC) ending 125 Rev. 2 25 October 2017 Packing information Figure
More informationSOT Packing method
1 Packing method DFN1006-3; Leadless ultra small plastic package; Reel pack, SMD, 7"; Q3/T4 standard product orientation; Orderable part number ending,315 or YL; Ordering code (12NC) ending 315 Rev. 3
More informationRelease of Cu-wire bonding for the DHVQFN packages in ASEN and ATBK (phase 8)
Final Product Change Notification Issue Date: 01-Sep-2017 Effective Date: 01-Dec-2017 Dear pcn system2, 201708004F01 Here's your personalized quality information concerning products Future Electronics
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. 5,0 Inductance L 100 khz/ 100 mv 4.7 µh ±20% Rated Inductance L R 100 khz/ 100 mv/ 13.0
More informationUltra high-speed switching Voltage clamping Protection circuits Mobile communication, digital (still) cameras, PDAs and PCMCIA cards.
3 September 208 Product data sheet. General description 2. Features and benefits 3. Applications 4. Quick reference data Planar encapsulated in a SOD882 leadless ultra small plastic package. Low forward
More informationAN Wafer-level chip-scale package (fan-in WLP and fan-out WLP) Document information
Document information Information Content Keywords Wafer level, chip-scale, chip scale package, WLCSP, WLP, FO-WLP, FIWLP, fan-in, fan-out Abstract This application note provides the guidelines for the
More information1,35 1,0 0,6. Scale - 6:1
Dimensions: [mm] Recommended Land Pattern: [mm] 3 4 0,5 0,6 1,5 O 0,65 +0,1-0,0 0,8 1 2 0,4 1 4,7 2 3 4 2,2 1,6 4,05 1 3,5 Scale - 6:1 1,0 1,35 Schematic: 3,9 ±0,15 h 0,1 ref. 0,5 0,6 1 2 2,9 3,55 3 4
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 2,5 ±0,2 1,25 ±0,2 5 ±0,2 4 ±0,3 Recommended Land Pattern: [mm] 4,5 2,3 1,55 Scale - 5:1 Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 100 khz/ 1 V 15
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 8,0 ±0,3 5,0 ±0,2 12,0 ±0,5 Recommended Land Pattern: [mm] 5,4 7,0 2,9 12,8 no vias and sensitive traces underneath the component Scale - 2:1 Schematic: Electrical Properties: Properties
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 8,0 ±0,3 5,0 ±0,2 12,0 ±0,5 10,0 max. Recommended Land Pattern: [mm] 5,4 7,0 2,9 12,8 no vias and sensitive traces underneath the component Scale - 2:1 Schematic: Electrical Properties:
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 8,0 ±0,3 5,0 ±0,2 12,0 ±0,5 10,0 max. Recommended Land Pattern: [mm] 5,4 7,0 2,9 12,8 no vias and sensitive traces underneath the component Scale - 2:1 Schematic: Electrical Properties:
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical & Optical Properties: Properties Test conditions Value Unit Tol. 2,05 6,05 2,05 Inductance L 100 khz/ 10 ma 1.8 µh ±20% Rated Current I R ΔT =
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. 1,7 Inductance L 1 khz/ 250 mv 10 µh ±20% Rated Current I R ΔT = 40 K 1.83 A max. 1,5 ±0,3
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. 1,7 Inductance L 1 khz/ 250 mv 47 µh ±20% Rated Current I R ΔT = 40 K 1.03 A max. 1,5 ±0,3
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 8,0 ±0,3 5,0 ±0,2 12,0 ±0,5 Recommended Land Pattern: [mm] 5,4 7,0 2,9 12,8 no vias and sensitive traces underneath the component Scale - 2:1 Schematic: Electrical Properties: Properties
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): Properties Test conditions Value Unit Power Dissipation P Diss 72 mw 1 typ. 1 2 R,2 typ. 3,2 1, Peak
More informationApplication Note. DN[Document ID] POS Sensors. Tape & Reel Packing Information. ams Application Note Page 1
Application Note DN[Document ID] POS Sensors Tape & Reel Packing Information ams Application Note Page 1 Content Guide 1 General Description... 3 2 Tape & Reel... 4 3 Carrier Tape... 5 3.1 SSOP-16... 5
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 2 C): Properties Test conditions Value Unit,6 u,1 3 1 2,2 u,1 6 4 2 2,7 u,1,84 u,1 4,2 1,8 1,2 1 2 3 4 6,7
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): Properties Test conditions Value Unit 1 0,5 5,7 4,5 1,9 1 2 4 3 1,0 5 Thermal Pad 4 1 6,7 4,1 2,6 0,5
More informationAN Recommendations for PCB assembly of DSN1006. Document information
Recoendations for PCB assembly of DSN1006 Rev. 1 29 July 2015 Application note Document information Info Keywords Abstract Content DSN1006, DSN1006-2, DSN1006U-2, SOD993, SOD995, 0402 package size, reflow
More informationAN Recommendations for PCB assembly of DSN Document information
Rev. 2 23 September 2015 Application note Document information Info Keywords Abstract Content DSN0603, DSN0603-2, SOD962, 0603 package size, reflow soldering, surface mount, solder paste, stencil aperture,
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): 2,2,9 Properties Test conditions Value Unit Power Dissipation (Red) P Diss R 8 mw 2 3 2,2,5 Cathode
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 8,0 ±0,3 5,0 ±0,2 12,0 ±0,5 10,0 max. Recommended Land Pattern: [mm] 5,4 7,0 2,9 12,8 no vias and sensitive traces underneath the component Scale - 2:1 Schematic: Electrical Properties:
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 8,0 ±0,3 5,0 ±0,2 12,0 ±0,5 10,0 max. Recommended Land Pattern: [mm] 5,4 7,0 2,9 12,8 no vias and sensitive traces underneath the component Scale - 2:1 Schematic: Electrical Properties:
More informationSMV LF: Hyperabrupt Junction Tuning Varactor
DATA SHEET SMV1145-079LF: Hyperabrupt Junction Tuning Varactor Applications High volume commercial systems Features Frequency linear design Low series resistance Package is rated MSL1, 260 C per JEDEC
More informationMolding Power Choke. - CSAB0730 Series. Marking. Marking. Date Code. Outline: 1 Appearance and dimensions (mm)
Outline: Magnetic shielded structure: excellent resistance to electro magnetic interference(emi). A composite structure, ultra low buzz noise. Low loss, high efficiency, wide application frequency. Lightweight
More informationRecommended Hole Pattern: [mm]
Dimensions: [mm] 12,5 max. 6,5 max. 16,0 max. 25,0 min. 0,8 ±0,05 1,3 ±0,8 7,5 ±1,0 Recommended Hole Pattern: [mm] 1,3 Schematic: V O 0,9 7,5 Scale - 4:1 Electrical Properties: Properties Test conditions
More informationSMV LF: Hyperabrupt Junction Tuning Varactor
DATA SHEET SMV1800-079LF: Hyperabrupt Junction Tuning Varactor Applications Satellite tuners VCOs Tuneable couplings Features Cross to NXP s BB181 Low series resistance High capacitance ratio Ultra-small
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 1,2 ref. Recommended Land Pattern: [mm] 8,6 2,1 Electrical Properties: Properties Test conditions Value Unit Tol. Impedance @ 25 MHz Z 25 MHz 28 Ω ±25% Impedance @ 100 MHz Z 100 MHz 42
More informationPackage LGA6x FixPitch- / FreePitch-Sensors
Package LG6x FixPitch- / FreePitch-Sensors LG6x.HIE.03 Page 1 of 6 1. Packaging Package LG6x The sensors are delivered in vacuum sealed, ESD-compliant dry bag. The series delivery form is tape & reel with
More informationAN Handling and processing of sawn wafers on UV dicing tape. Document information. Sawn wafers, UV dicing tape, handling and processing
Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 13 January 2009 Application note Document information Info Keywords Abstract Content Sawn wafers, UV dicing tape, handling and processing
More informationISA-WELD // Precision resistors. BVS Size Features
BVS Size 3920 Features Power rating up to 2 W continuous current load up to 60 A (0.2 mohm) Heavy copper connectors Excellent long-term stability Max. solder temperature up to 350 C / 30 sec AEC-Q200 qualified
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 1.06 MHz 22 µh ±10% Rated Current I R ΔT = 40 K 650 ma max. DC Resistance
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Solder Resist 3,4 Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 100 khz/ 10 ma 10 µh ±20% Rated Current I R ΔT = 40 K 0.85
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] 5,5 ref. Solder Resist 1,7 ref. 2,15 ref. 6 ref. Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 10 khz/ 100 mv 3.3 µh ±20%
More informationMV5491A/QT333-5SRVGW/S39
Features Choice of various viewing angles Available on tape and reel. Reliable and robust The product itself will remain within RoHS compliant version. Compliance with EU REACH Compliance Halogen Free.(Br
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 3 ±0,2 10,2 ±0,3 6,3 ±0,5 Recommended Land Pattern: [mm] 10,6 3,4 2,4 5,8 2,4 Scale - 2:1 Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 100 khz/ 5 ma 11
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 100 khz/ 250 mv 4.7 µh ±20% Rated Current I R ΔT = 40 K 6.2 A max. 3 ±0,2
More informationSDLS940A MARCH 1974 REVISED MARCH Copyright 1988, Texas Instruments Incorporated
SN5490A, SN5492A, SN5493A, SN54LS90, SN54LS92, SN54LS93 SN7490A, SN7492A, SN7493A, SN74LS90, SN74LS92, SN74LS93 DECADE, DIVIDE-BY-TWELVE AND BINARY COUNTERS SDLS940A MARCH 1974 REVISED MARCH 1988 PRODUCTION
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. RDC is measured at these points. Inductance L 100 khz/ 10 ma 4.7 µh ±20% Rated Current
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. RDC is measured at these points. Inductance L 100 khz/ 10 ma 2.2 µh ±20% Rated Current
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. RDC is measured at these points. Inductance L 100 khz/ 10 ma 0.68 µh ±20% Rated Current
More informationTable 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V RRM
5 January 217 Product data sheet 1. General description Silicon Carbide Schottky diode in a TO22F-2L plastic package, designed for high frequency switched-mode power supplies. 2. Features and benefits
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 3 ±0,2 10,2 ±0,3 6,3 ±0,5 Recommended Land Pattern: [mm] 10,6 3,4 2,4 5,8 2,4 Scale - 2:1 Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 100 khz/ 5 ma 4.7
More informationHigh junction temperature capability Low leakage current Negligible switching losses Optimised design to give low V F and high T j(max)
TO-220AB 30 January 2013 Product data sheet 1. General description Dual common cathode power Schottky diode designed for high frequency switched mode power supplies in a SOT78 (TO-220AB) plastic package.
More informationTable 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V RRM
6 January 217 Product data sheet 1. General description Silicon Carbide Schottky diode in a TO22F-2L plastic package, designed for high frequency switched-mode power supplies. 2. Features and benefits
More informationData sheet acquired from Harris Semiconductor SCHS091B Revised July 2003
Data sheet acquired from Harris Semiconductor SCHS091B Revised July 2003 The CD4585B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages
More informationProduct Marking: Schematic: General Properties: WE-PD SMT Shielded Power Inductor SIZE REVISION STATUS DATE (YYYY-MM-DD) BUSINESS UNIT PAGE
Product Marking: Start of Winding Schematic: General Properties: It is recommended that the temperature of the component does not exceed +125 C under worst case conditions Storage Conditions (in original
More information333-2SUBC/H3/S400-A6 LAMP. Features. Description. Applications. 1 Ver.:3 Release Date:12/13/2016 狀態 :Approved( 正式發行 )
Features Choice of various viewing angles Available on tape and reel. Reliable and robust The product itself will remain within RoHS compliant version. Compliance with EU REACH Compliance Halogen Free.(Br
More informationDRAFT. Absolute Maximum Ratings (Ambient Temperature 25 C): Dimensions: [mm] Recommended Land Pattern: [mm] Optical Properties: Schematic:
Dimensions: [mm] 1 typ. 1 2 1,2 ±,1 1,4 ±,1 2 ±,1 Polarity Mark (Cathode) 1 2,3 ±,1 R,2 typ. 1,25 ±,1,7 ±,1 Scale - 15:1 Recommended Land Pattern: [mm] Schematic: - 1 3,2 1, 1 2 1,2 Scale - 1:1 + 2 Absolute
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): 2,2 0,9 Properties Test conditions Value Unit Power Dissipation (Red) P Diss R 8 mw 2 3 2,2 0,5 Cathode
More informationDRAFT. Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): Optical Properties: Schematic:
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): Properties Test conditions Value Unit Power Dissipation P Diss 15 mw,7 typ. 1 1 2,7 ±,1 1,1 ±,1 1,6
More informationDRAFT. Absolute Maximum Ratings (Ambient Temperature 25 C): Dimensions: [mm] Recommended Land Pattern: [mm] Optical Properties: Schematic:
Dimensions: [mm] 1 typ. 1 2 1,2 ±,1 1,4 ±,1 2 ±,1 Polarity Mark (Cathode) 1 2,3 ±,1 R,2 typ. 1,25 ±,1,7 ±,1 Scale - 15:1 Recommended Land Pattern: [mm] Schematic: - 1 3,2 1, 1 2 1,2 Scale - 1:1 + 2 Absolute
More informationDRAFT. Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): Optical Properties: Schematic:
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): Properties Test conditions Value Unit Power Dissipation P Diss 72 mw,7 typ. 1 1 2,7 ±,1 1,1 ±,1 1,6
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. Frequency Range f 5150-5875 MHz 1,3 Insertion Loss IL 5150-5875 MHz 1.5 db max. VSWR 5150-5875
More informationPCB Mount VIA Soldering Guidelines
APPLICATION NOTE AN:401 PCB Mount VIA Soldering Guidelines Ankur Patel Applications Engineering Contents Page Introduction 1 Storage 1 Handling 1 Placement 1 Soldering Process 2 Fluxing 2 Preheating 3
More informationDRAFT. Absolute Maximum Ratings (Ambient Temperature 25 C): Dimensions: [mm] Recommended Land Pattern: [mm] Optical Properties: Schematic:
Dimensions: [mm] 1,4 typ. 1,1 typ. 1 1 2 2 ±,1 2 ±,1 3,2 Polarity Mark (Cathode) 2 2,28 ±,1 R,375 typ. 1,6 ±,1,68 ±,1 Scale - 12:1 Recommended Land Pattern: [mm] Schematic: - 1 1 4,4 1,6 2 1,5 Scale -
More informationDRAFT. Absolute Maximum Ratings (Ambient Temperature 25 C): Dimensions: [mm] Recommended Land Pattern: [mm] Optical Properties: Schematic:
Dimensions: [mm] 1 typ. 1 2 1,2 ±,1 1,4 ±,1 2 ±,1 Polarity Mark (Cathode) 1 2,3 ±,1 R,2 typ. 1,25 ±,1,7 ±,1 Scale - 15:1 Recommended Land Pattern: [mm] Schematic: - 1 3,2 1, 1 2 1,2 Scale - 1:1 + 2 Absolute
More informationIR Sensor Module for Remote Control Systems
IR Sensor Module for Remote Control Systems TSMP6000 FEATURES Photo detector and preamplifier in one package AC coupled response from 20 khz to 60 khz, all data formats Improved shielding against electrical
More informationDRAFT. Absolute Maximum Ratings (Ambient Temperature 25 C): Dimensions: [mm] Recommended Land Pattern: [mm] Optical Properties: Schematic:
Dimensions: [mm] 1,4 typ. 1,1 typ. 1 1 2 2 ±,1 2 ±,1 3,2 Polarity Mark (Cathode) 2 2,28 ±,1 R,375 typ. 1,6 ±,1,68 ±,1 Scale - 12:1 Recommended Land Pattern: [mm] Schematic: - 1 1 4,4 1,6 2 1,5 Scale -
More informationTape and Packing. 1. Components description (Only for reference / Unit : mm) 2. Taping dimensions (Unit : mm)
1.25 2.1 Tape and Packing Product Diode Package SOT-323(UMD3) Type T106 1. Components description (Only for reference / Unit : ) 2.0 0.3 0.15 2. Taping dimensions (Unit : ) 0.9 3. Tape and packing specification
More informationDescription. Kingbright
3.5x2.8mm SURFACE MOUNT LED LAMP Part Number: Super Bright Orange Features Single color. Suitable for all SMD assembly and solder process. Available on tape and reel. Ideal for backlighting. Package :
More informationTN1171 Technical note
TN1171 Technical note Description of UFDFPN5, UFDFPN8 and WFDFPN8 for STMicroelectronics EEPROMs and recommendations for use Introduction This document describes the following Dual Flat No-Lead Package
More informationDRAFT. Recommended Land Pattern: [mm] Electrical Properties: Dimensions: [mm] Schematic: General Properties: Product Marking:
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 100 khz/ 1 ma 2.2 µh ±20% Start of Winding Marking 4,8 ±0,3 Product Marking:
More informationRecommended Land Pattern: [mm] Stencil Suggestion:
Dimensions: [mm] Recommended Land Pattern: [mm] Properties: 5,54 O 0,84 55 detail 0,2 suggested solder pad O 0,97 +0,2-0,0 non plated 3,33 Properties Value Unit Material Surface rass Solder Cream Thickness
More informationAN1235 Application note
Application note IPAD, 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recommendation information for 500 µm pitch Flip Chips. For
More informationSMD RFI CLIP Data Sheet
1/14 Attn : Data Sheet - CONDITION : 1. 2. 3. 4. We approved the product as above. WRITE REVIEW APPROVAL ICT NAME S.P. HONG J.E. KIM S.K,JUNG SIGNATURE Supplier : Innochips Technology CO., LTD By President
More informationSOT-23 (SST3) 2.9 (3) (2) 0.4 (1) Φ1.0 Min. 1.2±0.1
0~0.5 2.7±0.1 1.75±0.1 5.5±0.2 3.5±0.05 8.0±0.2 2.4 1.8 Tape and Packing Product Transistor / MOSFET Package SOT-23 (SST3) Type T116 1. Components description (Only for reference) 2.9 (3) 0.95 (2) 0.4
More informationPBD1040CS~BD10200CS SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS. Voltage 40~200 V Current 10 A Features. Mechanical Data
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS Voltage 40~200 V Current 10 A Features Plastic package has Underwriters Laboratory Flammability Classification 94V-O. For through hole applications Low power loss,
More informationISA-WELD // Precision resistors. BRS // Size Features
Features 2 W power rating at 2 C Constant current up to 32 A (2 mohm) copper connectors Solid metal precision resistance materials Excellent long-term stability Ideal suited for mounting on DBC / IMS substrate
More informationCFN Series Metal Foil, Current Sense Resistor
RoHS COMPLIANT* & HALOGEN FREE** Features n Metal foil n High power density n High reliability and stability n RoHS compliant* and halogen free** Applications n Current sensing n Power supplies n Stepper
More informationDRAFT. Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): Dimensions: [mm] Optical Properties: Schematic:
Dimensions: [mm] 3,25 ±,15 1,3 ±,15 1 2 1,48 ±,15 3,4 ±,15 Polarity Mark (Cathode) 2 3,25 ±,15 Thermal pad 3,4 ±,15 O 2,6 ±,15,77 ±,15 2,1 ±,15 Scale - 8:1 Recommended Land Pattern: [mm] Schematic: - 1
More informationSMS LF: Low Capacitance, High Voltage Schottky Diode
DT SHEET SMS3925-040LF: Low Capacitance, High Voltage Schottky Diode pplications Wireless handsets and general purpose switching systems Features Miniature SOD-882 package Package is rated MSL1, 260 C
More informationCRK Series Metal Strip, Wide Terminal Current Sense Resistor
RoHS COMPLIANT* & HALOGEN FREE** Features n ide terminal type n Excellent heat dissipation n High reliability n Metal alloy plate n RoHS compliant* and halogen free** Applications n Current sensing n Power
More informationUltrafast power diode in a SOD59 (2-lead TO-220AC) plastic package.
TO-220AC 17 September 2013 Product data sheet 1. General description in a SOD59 (2-lead TO-220AC) plastic package. 2. Features and benefits Fast switching Guaranteed ESD capability High thermal cycling
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] 2,5 ±0,2 Recommended Land Pattern: [mm] 2,7 Electrical Properties: Properties Test conditions Value Unit Tol. Inductance L 100 khz/ 1 V 2.2 µh ±20% Rated Current I R ΔT = 40 K 1.8 A max.
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Absolute Maximum Ratings (Ambient Temperature 25 C): 3,25 ±0,15 1,3 ±0,15 4,0 3,25 0,48 1,30 Properties Test conditions Value Unit Power Dissipation P Diss
More informationIR Sensor Module for Remote Control Systems
IR Sensor Module for Remote Control Systems TSMP77000 20953 1 2 DESIGN SUPPORT TOOLS Models Available MECHANICAL DATA 3 4 Pinning: 1, 4 = GND, 2 = V S, 3 = carrier OUT ORDERING CODE Taping: TSMP77000TT
More informationHigh Temperature (245 C) Thick Film Chip Resistor
High Temperature (245 C) Thick Film Chip Resistor For applications such as down hole applications or aircraft breaking systems, the need for parts able to withstand very severe conditions (temperature
More informationRecommended Land Pattern: [mm] Stencil Suggestion:
Dimensions: [mm] Recommended Land Pattern: [mm] Properties: Properties Value Unit Thread M3 Inner Diameter Ø ID 4.2 mm O 6,0 G u 0,1 1,0 O 4,2 sectional drawing - M 3,0 Suggested Solder pad Non plated
More informationRecommended Land Pattern: [mm] Stencil Suggestion:
Dimensions: [mm] Recommended Land Pattern: [mm] Properties: Properties Value Unit Thread M3 Inner Diameter Ø ID 4.2 mm O 6,0 G u 0,1 1,0 O 4,2 sectional drawing - M 3,0 Suggested Solder pad Non plated
More informationSPEC NO: DSAF1072 REV NO: V.7A DATE: MAR/24/2015 PAGE: 1 OF 5 APPROVED: WYNEC CHECKED:
3.0mmx1.5mm SMD CHIP LED LAMP Part Number: High Efficiency Red Features 3.0mmx1.5mm SMT LED, 1.4mm thickness. Low power consumption. Ideal for backlight and indicator. Package : 2000pcs / reel. Moisture
More information1.6mm Round Subminiature Reverse Package Phototransistor PT26-21C/TR8
Features Fast response time High photo sensitivity Small junction capacitance Pb free The product itself will remain within RoHS compliant version. Compliance with EU REACH Compliance Halogen Free.(Br
More informationSL3 ICS General description UCODE EPC G2
SL3 ICS 10 Rev. 3.0 20 September 2006 129430 Product short data sheet 1. General description The EPC global UHF Generation 2 Standard allows the commercialised provision of mass adaption of UHF EPC technology
More informationSPEC NO: DSAB0830 REV NO: V.15A DATE: MAY/05/2015 PAGE: 1 OF 5 APPROVED: WYNEC CHECKED:
2.0x1.25mm SMD CHIP LED LAMP Part Number: Super Bright Red Features 2.0mm x1.25mm SMT LED,0.75mm thickness. Low power consumption. Wide viewing angle. Ideal for backlight and indicator. Package : 2000pcs
More informationChip Phototransistor with Right Angle Lens
Chip Phototransistor with Right Angle Lens Features Fast response time High photo sensitivity Small junction capacitance Package in 8mm tape in 7 diameter reel Pb free The product itself will remain within
More informationDiode JEDEC code SOD-123FL Package PMDU TR
Tape and Packing Product Type Diode JEDEC code SOD-123FL Package PMDU TR 1. Components description (Only for reference / Unit : mm) 2. Taping dimensions (Unit : mm) 3. Tape and packing specification 3-1.
More information2.9 (3) (2) (1) 0.4 Φ1.1± ±0.08. Note) Feed holes might be cover with the adhesive tape, but nothing will affect for using by that.
0~0.5 3.2±0.08 5.5±0.2 8.0±0.2 1.75±0.1 3.5±0.05 2.8 1.6 Tape and Packing Product Transistor / MOSFET Package SOT-346T (TSMT3) Type TL 1. Components description (Only for reference) 2.9 (3) 0.85 (1) (2)
More informationFreescale Semiconductor Inc
Freescale Semiconductor Inc PART INFORMATION Mfg Item Number MC33MR2001R2VK Mfg Item Name RCPBGA 85 6*6*0.95 P0.5 SUPPLIER Company Name Freescale Semiconductor Inc Company Unique ID 14-141-7928 Response
More informationData sheet acquired from Harris Semiconductor SCHS058C Revised October 2003
Data sheet acquired from Harris Semiconductor SCHS058C Revised October 2003 The CD4076B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages
More informationMounting Method. V =Through Hole S = SMD H = Horizontal Adjust. (See note 2. (2) Horizontal adjust versions will be studied case by case
S-15 Rotary Switch FEATURES 2 and 6 positions versions (standard) SMD or Through-hole Mount Low Profile (4.4 mm) Embossed Tape (SMD) or Bulk packaging (Through hole) Reflow Soldering capability Shaft insertable
More informationDescription. Kingbright
1.0X0.5X0.2mm (0402)SMD CHIP LED LAMP Part Number: Super Bright Orange Features Description 1.0mmX0.5mm SMD LED, 0.2mm thickness. Low power consumption. Wide viewing angle. Compatible with automatic placement
More informationDescriptions. Kingbright
3.0mmx1.0mm RIGHT ANGLE SMD CHIP LED LAMP ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Part Number: Blue Features Descriptions 3.0mmx1.0mm right angle SMT LED, 2.0mm
More informationSpecifications. Drawing No. USY1M-H / 10 Issued Date. Customer Part Number - Customer Specification Number -
Specifications Drawing No. USY1M-H1-17107-00 1 / 10 Issued Date. Feb,7,2017 Messrs: Mouser Note: Part Number will be revised in case of specification change. Product Type Quartz Crystal Series CX1612DB
More informationProduct Description. CLD-DS39 Rev 3. Product family data sheet
Product family data sheet CLD-DS39 Rev 3 Cree XLamp ML-B LEDs Product Description The Cree XLamp ML-B LED brings lighting-class reliability and performance to 1/4-watt LEDs. The XLamp ML-B expands Cree
More informationDescription. Kingbright
2.0x1.25mm SMD CHIP LED LAMP Part Number: KP-2012CGCK Green Features 2.0mmx1.25mm SMD LED,1.1mm thickness. Low power consumption. Wide viewing angle. Ideal for backlight and indicator. Package : 2000pcs
More information1.6x0.8x0.5mm BI-COLOR SURFACE MOUNT LED. Descriptions. Features. Package Dimensions. Part Number: APHB1608SGNC. Super Bright Green Pure Orange
1.6x0.8x0.5mm BI-COLOR SURFACE MOUNT LED Part Number: APHB1608SGNC Features 1.6mmX0.8mm SMD LED, 0.5mm thickness. Compatible with reflow soldering. Available in various color combination. Package: 2000pcs
More information