Adhesives, Sealants & Coatings for the. Electronic Industry

Transcription

1 Adhesives, Sealants & Coatings for the Electronic Industry

2 Master Bond Inc. is a leading manufacturer of adhesives, sealants, coatings, potting and encapsulation compounds. We offer an extensive product line consisting of epoxies, silicones, light curing compounds, polysulfides and other polymer systems. These compounds for electronic assembly such as printed circuit boards and semiconductor packaging, are designed for ease of use and reliability. The extensive array of formulations offers engineers a variety of formats and curing characteristics designed to meet different manufacturing needs. Products are available as liquids, pastes, films and pre-forms. Formulations can also be modified to achieve a vast assortment of performance characteristics. Among the properties that can be controlled through each specific formulation are bond and physical strength, hardness, flexibility, temperature resistance, viscosity, thermal conductivity, electrical conductivity and color, as well as resistance to high/low temperatures, moisture, chemicals, shock and vibration. Because of their wide range of physical properties, these systems are often engineered specifically to perform additional functions, such as dissipating heat, providing an electrically conductive pathway between substrates, or relieving stress between substrates. The outstanding performance and versatility of these compounds have proven to be a tremendous asset to the electronics industry. 154 Hobart Street, Hackensack, NJ USA Phone Fax

3 We have what you need... Typical Applications Master Bond compounds have been utilized in thousands of applications all over the world. From prototype to assembly line, our materials have aided in the success of many companies across the electronic industry. Master Bond will help you find the most suitable material for your application and offer you assistance from the design stage through the manufacturing process. Applications include: Printed circuit board assemblies Conformal coatings Die-attach Chip and wire bonding Glob top encapsulants Lid sealants Surface mounts Underfills Packaging Options Specialty packaging is designed for applications ranging from design to high speed production. Master Bond s packaging adheres to the strictest quality standards to assure consistent reproducible reliability. Our packaging options include: Standard packaging (jars and cans) Bubble packs Syringes and cartridges Gun applicators Premixed and frozen syringes Ultraviolet specialty packaging

4 Products for the Electronic Industry Product Bonding/ Sealing Coating Potting/ Encapsulation Electrically Insulative Electrically Conductive Thermally Conductive Page No. Supreme 10HTS ONE COMPONENT HEAT CURING EPOXIES EP3HT 4 EP3RRLV 4 EP17HT-3 5 EP17HT 5 Supreme 3HTND-1SM 6 Supreme 3HTND-2GT 6 Supreme 10AOHT 7 Supreme 10HTS 7 TWO COMPONENT ROOM TEMPERATURE CURING EPOXIES EP21TCHT-1 8 EP21FRNS-2 8 EP21TDC-2LO 9 EP21TDCS 9 EP21LVSP6 10 EP30AN-1 10 EP29LPSP 11 EP30LTE-LO 11 EP37-3FLF 12 EP37-3FLFAO 12 EP79 13 Supreme 42HT-2 13 UV/LED CURABLE UV10TK40 14 UV15 14 UV15-7SP4 15

5 Product Bonding/ Sealing Coating Potting/ Encapsulation Electrically Insulative Electrically Conductive Thermally Conductive Page No. Supreme 10HTS UV/LED CURABLE (continued) UV15DC80 15 UV22 16 UV25 16 UV18S 17 UV24TKLO 17 LED SILICONES MasterSil MasterSil 151AO 20 MasterSil MasterSil 705C 21 MasterSil 705TC 21 MasterSil 705S 22 MasterSil 707FR 22 MasterSil MasterSil MasterSil MasterSil SPECIALTY COMPOUNDS FL901AO 25 FL901S 25 FLM36 26 Super Gel 9 27 Super Gel 9AO 27 MB600S 28

6 ONE COMPONENT EPOXY EP3HT Fast curing bonding and sealing compound EP3HT is a superb electrical insulator offering excellent physical strength properties. High shear strength Versatile cure schedules Wide service temperature range Superior dimensional stability Lap shear strength, aluminum to aluminum, 75 F Hardness, 75 F Service temperature range Thixotropic paste >2,200 psi >70 Shore D -60 F to +400 F [-51 C to +204 C] EP3RRLV Low viscosity underfill compound EP3RRLV is widely used in underfill applications and provides high mechanical strength properties. Exceptional dimensional stability Rapid curing at F Electrically insulative and thermally conductive Castable in sections up to 1 inch deep Thermal conductivity, 75 F 7-8 BTU in/ft 2 hr F [ to W/(m K)] Thixotropic, 10,000-40,000 cps Dielectric constant, 75 F, 60Hz 4.5 Dielectric strength, 75 F, ( 1 / 8 thick test specimen) >430 volts/mil 4 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

7 ONE COMPONENT EPOXY High Temperature Resistant Systems EP17HT-3 & EP17HT Outstanding electrical insulation properties Chemically resistant Excellent strength properties High glass transition temperatures EP17HT-3 EP17HT-3, a snap curing epoxy, fully cures in 2-3 minutes at +250 F to +300 F (+121 C to +149 C). It can cure in sections up to ¼ inch thick. With an unlimited working life, it will not set up at room temperature. EP17HT-3 has excellent electrical insulation characteristics, superior chemical resistance and outstanding physical strength properties. There is a paste version as well as a slightly toughened formulation available. EP17HT EP17HT features superior strength properties, a superb electrical insulation profile and first rate chemical resistance. It can withstand intermittent heat exposure up to 650 F. Its glass transition temperature (T g ) is about C. It features very low exotherm upon curing and can be used in castings and encapsulations well beyond 1 inch in thickness. EP17HT-3 EP17HT 80, ,000 cps 15,000-25,000 cps >10 15 ohm-cm Dielectric constant, 75 F, 60Hz Glass transition temperature, 75 F C C Lap shear strength, aluminum to aluminum, 75 F >2,100 psi >3,200 psi Hardness, 75 F >85 Shore D >80 Shore D Service temperature range -60 F to +400 F -80 F to +650 F Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 5

8 ONE COMPONENT EPOXY Supreme 3HTND-1SM Toughened, fast curing bonding and sealing compound Supreme 3HTND-1SM combines easy processing with excellent physical strength properties and a wide service temperature range. Electrically insulative and thermally conductive Smooth paste-like consistency Withstands thermal and mechanical shocks Commonly used in surface mount applications Wide service temperature range of -100 F to +350 F Thermal conductivity, 75 F Coefficient of thermal expansion, 75 F Lap shear strength, aluminum to aluminum, 75 F 7-8 BTU in/ft 2 hr F [ to W/(m K)] Non-drip, thixotropic >10 15 ohm-cm x 10-6 in/in/ C >1,700 psi Supreme 3HTND-2GT Fast curing glob top epoxy Supreme 3HTND-2GT is a toughened high performance system used widely for glob top applications. It can also be used in other bonding and sealing applications. Electrically insulative and thermally conductive Withstands thermal cycling and shock Dimensionally stable Easy handling Excellent physical strength Thermal conductivity, 75 F Coefficient of thermal expansion, 75 F Lap shear strength, aluminum to aluminum, 75 F BTU in/ft 2 hr F [ to W/(m K)] Thixotropic paste x 10-6 in/in/ C >1,800 psi 6 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

9 ONE COMPONENT EPOXY Supreme 10AOHT Thermal cycling resistant system Supreme 10AOHT produces durable, tough bonds which offer outstanding thermal and mechanical shock resistance. Supreme 10AOHT-LO is the NASA low outgassing approved version. Thermally conductive and electrically insulative High shear and peel strength Cryogenically serviceable Withstands high temperatures Thermal conductivity, 75 F Lap shear strength, aluminum to aluminum, 75 F Hardness, 75 F 9-10 BTU in/ft 2 hr F [ to W/(m K)] Thixotropic paste >2,700 psi >80 Shore D Supreme 10HTS NASA low outgassing approved bonding and sealing compound Supreme 10HTS is an electrically conductive compound which offers excellent thermal cycling resistance with a very wide temperature range. Silver conductive system Exceptionally low volume resistivity High shear strength Excellent durability and dimensional stability Thermal conductivity, 75 F Service temperature range Lap shear strength, aluminum to aluminum, 75 F < ohm-cm >11 BTU in/ft 2 hr F [> W/(m K)] 4K to +400 F [4K to +204 C] >1,200 psi Thick paste Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 7

10 TWO COMPONENT EPOXY EP21TCHT-1 Cryogenic and high temperature resistant bonding and sealing compound EP21TCHT-1 offers a very low CTE with excellent resistance to extremely low as well as high temperatures. Superior electrical insulation and high thermal conductivity Room temperature curing NASA low outgassing approved Excellent thermal shock and chemical resistance Serviceable from 4K to +400 F [4K to +205 C] Thermal conductivity, 75 F Coefficient of thermal expansion, 75 F Lap shear strength, aluminum to aluminum, 75 F 10 BTU in/ft 2 hr F [ W/(m K)] Thixotropic paste >10 12 ohm-cm x 10-6 in/in/ C >1,800 psi EP21FRNS-2 Flame retardant potting, encapsulating and casting compound EP21FRNS-2 is a flame retardant compound with a convenient 1:1 mix ratio. It is serviceable over the wide temperature range of -51 C to +90 C. Room temperature curing Meets UL 94V-0 flame retardant specification Halogen-free filler material Minimal smoke generation Exceptional durability Part A: 40,000-70,000 cps, Part B: 30,000-45,000 cps Dielectric constant, 75 F, 60Hz 4.5 Hardness, 75 F >75 Shore D Tensile strength, 75 F >3,000 psi Coefficient of thermal expansion, 75 F x 10-6 in/in/ C 8 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

11 TWO COMPONENT EPOXY EP21TDC-2LO Highly flexibilized bonding, sealing and potting system EP21TDC-2LO is a highly flexible compound featuring high viscosity, superior toughness and superior thermal shock resistance. Passes NASA low outgassing test Thermally conductive Electrically insulating High peel strength and elongation Thermal conductivity, 75 F 9-10 BTU in/ft 2 hr F [ to W/(m K)] Part A: 35,000-85,000 cps, Part B: 300, ,000 cps T-peel strength, 75 F >15 pli Elongation, 75 F >25% EP21TDCS Silver filled bonding and sealing compound EP21TDCS is an electrically conductive adhesive which offers good thermal cycling resistance. Excellent thermal conductivity Exceptionally low volume resistivity Convenient one to one mix ratio High physical strength properties Thermal conductivity, 75 F T-peel strength, 75 F Lap shear strength, aluminum to aluminum, 75 F <0.001 ohm-cm 11 BTU in/ft 2 hr F [ W/(m K)] >10 pli >850 psi Smooth paste Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 9

12 TWO COMPONENT EPOXY EP21LVSP6 Compound featuring low exotherm and long pot life EP21LVSP6 is well suited for specialty applications where the combination of a long open time and low viscosity are required. Low viscosity Room temperature curing High bond strength Electrically insulative Convenient mix ratio (1:1) Lap shear strength, aluminum to aluminum, 75 F Coefficient of thermal expansion, 75 F Hardness, 75 F Part A: 1,500-3,000 cps, Part B: 5,000-8,000 cps >2,500 psi x 10-6 in/in/ C >70 Shore D EP30AN-1 Compound featuring excellent thermal conductivity EP30AN-1 can be used in bonding, sealing, coating and potting applications. It has a low coefficient of thermal expansion (CTE) with very high thermal conductivity. Thermally conductive and electrically insulative Low viscosity Dimensionally stable Meets NASA low outgassing requirements Thermal conductivity, 75 F Coefficient of thermal expansion, 75 F Lap shear strength, aluminum to aluminum, 75 F 25 BTU in/ft 2 hr F [ W/(m K)] Part A: 10,000-18,000 cps, Part B: cps x 10-6 in/in/ C >900 psi 10 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

13 TWO COMPONENT EPOXY EP29LPSP Cryogenically serviceable bonding, sealing, coating and potting compound EP29LPSP is a modified low temperature heat cured epoxy capable of withstanding cryogenic shocks. Optically clear Electrically insulative Passes NASA low outgassing test Low mixed viscosity Long pot life and low exotherm Coefficient of thermal expansion, 75 F Lap shear strength, aluminum to aluminum, 75 F Tensile strength, 75 F Part A: 10,000-16,000 cps, Part B: cps >10 15 ohm-cm x 10-6 in/in/ C >2,200 psi >8,000 psi EP30LTE-LO Compound with a low coefficient of thermal expansion EP30LTE-LO is ideal for bonding, coating, sealing and encapsulation applications. It has a low coefficient of thermal expansion and exceptionally low linear shrinkage. Excellent dimensional stability NASA low outgassing approved Low viscosity Electrically insulating and thermally conductive Thermal conductivity, 75 F Coefficient of thermal expansion, 75 F Tensile strength, 75 F 8-10 BTU in/ft 2 hr F [ to W/(m K)] Part A: 35,000-70,000 cps, Part B: cps >10 15 ohm-cm x 10-6 in/in/ C >6,000 psi Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 11

14 Highly Flexibilized Specialty Epoxy Compounds EP37-3FLF & EP37-3FLFAO Excellent flowability Cryogenically serviceable down to 4K Electrically insulative Long working life and low exotherm Convenient one to one mix ratio TWO COMPONENT EPOXY EP37-3FLF and EP37-3FLFAO have superior resistance to vibration, impact, shock and thermal cycling. Their low viscosity makes them ideal for potting, encapsulating and casting. Low exotherm minimizes the stress on sensitive electronic components and enables potting in thick cross-sections. Both are used in aerospace, electrical, electronic, opto-electronic, and specialty OEM industries. EP37-3FLF is optically clear whereas EP37-3FLFAO is off-white in color. In addition, EP37-3FLFAO is thermally conductive and meets NASA low outgassing specifications. EP37-3FLF EP37-3FLFAO Thermal conductivity, 75 F 9-10 BTU in/ft2 hr F [ to W/(m K)] Part A: 600-1,200 cps Part B: 600-1,100 cps Part A: 6,000-11,000 cps Part B: 7,000-12,000 cps >10 15 ohm-cm >10 15 ohm-cm Dielectric constant, 75 F, 100Hz Coefficient of thermal expansion, 75 F x 10-6 in/in/ C x 10-6 in/in/ C Lap shear strength, aluminum to >850 psi >750 psi aluminum, 75 F Tensile strength, 75 F >4,000 psi >4,000 psi Color Transparent Off-white in color Refractive index, 75 F Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

15 TWO COMPONENT EPOXY EP79 Conductive silver coated, nickel filled compound EP79 offers high electrical conductivity with superior physical strength properties. Thermally conductive Low volume resistivity Convenient 1:1 mix ratio Very low linear shrinkage <0.005 ohm-cm Thermal conductivity, 75 F BTU in/ft 2 hr F [ to W/(m K)] Linear shrinkage, 75 F <0.1% Lap shear strength, aluminum to aluminum, 75 F >850 psi Smooth paste Supreme 42HT-2 Thermal cycling resistant bonding, sealing and encapsulating compound Supreme 42HT-2 is ideal for applications involving rigorous thermal cycling. Toughened system High temperature resistance Outstanding chemical resistance Fantastic electrical insulation properties Coefficient of thermal expansion, 75 F Lap shear strength, aluminum to aluminum, 75 F Hardness, 75 F Part A: 75, ,000 cps, Part B: cps x 10-6 in/in/ C >2,000 psi >75 Shore D Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 13

16 UV CURABLE UV10TK40 High T g bonding, sealing and coating compound UV10TK40 offers optical clarity, excellent physical strength properties and a high glass transition temperature (T g ). Moderate viscosity Outstanding optical clarity Excellent light transmission Dimensionally stable Electrically insulative 35,000-45,000 cps Glass transition temperature (T g ) 140 C Tensile strength, 75 F >8,000 psi Refractive index, 75 F 1.56 UV15 Low viscosity, spin coatable compound UV15 is an ultra-low viscosity cationic system which is widely used in spin coating applications. Low shrinkage upon cure Exceptional thermal stability with high T g Outstanding optical clarity High strength properties Glass transition temperature (T g ) (when post 125 C for 30 min) cps C Refractive index, 75 F 1.52 Linear shrinkage 1-2% 14 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

17 UV CURABLE UV15-7SP4 Highly flexible bonding, sealing and coating system UV15-7SP4 is a one component, low viscosity system with superb flexibility. It can be cast up to ¼ inch thick. Withstands mechanical and thermal shock Low viscosity Fast cures with UV light source Superior non-yellowing properties 800-1,500 cps Refractive index, 75 F 1.53 Elongation, 75 F >50% Hardness, 75 F Shore D UV15DC80 Dual curing system, heat and UV curable system UV15DC80 is a dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. Low temperature cure for curing shadowed out areas Excellent physical strength properties Bonds well to a variety of substrates Available in a range of different viscosities from low to non-drip 45,000-60,000 cps Glass transition temperature (T g ) (when post cured) >125 C Hardness, 75 F >70 Shore D Refractive index, 75 F 1.52 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 15

18 UV CURABLE UV22 Nanosilica filled bonding, sealing and coating system UV22 is a nanosilica filled cationic curable system featuring superb physical strength characteristics and electrical insulation properties. Outstanding optical clarity Exceptional abrasion resistance Dimensionally stable Very low shrinkage 1,000-8,000 cps Glass transition temperature (T g ) (when post 150 C for 30 min) 135 C Refractive index, 75 F 1.52 Linear shrinkage <1% UV25 Ultra high T g bonding, sealing and coating compound UV25 features superb physical properties, a moderate viscosity and a high glass transition temperature (T g ) over 180 C. Outstanding optical clarity High bond strength Fast curing Dimensionally stable Electrically insulative Glass transition temperature (T g ) 186 C Tensile strength, 75 F Refractive index, 75 F ,000-11,000 cps >7,500 psi 16 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

19 UV CURABLE UV18S Chemically resistant bonding and coating system UV18S features superb chemical resistance, excellent physical strength properties and toughness. High bond strength Good temperature resistance Electrically insulative Very fast cure times Glass transition temperature (T g ) Hardness, 75 F Tensile strength, 75 F 1,200-4,800 cps C Shore D >5,000 psi UV24TKLO NASA low outgassing approved system UV24TKLO offers low outgassing properties which enable it to be used in a wide array of bonding, sealing and coating applications. Moderate viscosity Excellent optical clarity and light transmission High physical strength Superb dimensional stability 30,000-45,000 cps Dielectric constant, 75 C, 60Hz 3.7 Tensile strength, 75 F >8,000 psi Hardness, 75 F Shore D Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 17

20 LED401 Fast Curing System With LED Light LED CURABLE Cures completely at 405 nm wavelength up to ⅛ inch thick Safer alternative to UV light source Tack-free cures without oxygen inhibition Excellent physical strength properties LED401 has outstanding optical clarity, excellent light transmission and is dimensionally stable. Featuring high bond strength, it adheres well to surface treated metals, glass and many plastics. It is electrically insulative and has a high viscosity that maintains flowability. 100, ,000 cps Dielectric constant, 75 F, 60Hz 3.7 Glass transition temperature (T g ) Coefficient of thermal expansion, 75 F Hardness, 75 F Service temperature range C x 10-6 in/in/ C >65-70 Shore D -60 F to +250 F [-51 C to +121 C] Different versions of this product are available: LED401LV A lower viscosity version featuring a viscosity of 60,000-80,000 cps. LED401 White A white colored, thicker version with a viscosity of >350,000 cps. 18 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

21 MASTERSIL SILICONE Highly Flexible Potting & Encapsulation Compound MasterSil 151 Addition cured; no by-products released during cure Optically clear Electrically insulative Low viscosity Long pot life and low exotherm MasterSil 151 is a low viscosity silicone compound with superb electrical insulation properties for high performance potting and encapsulation. It is an addition cured system and does not require exposure to moisture for complete cross-linking. Featuring remarkable flexibility and high temperature resistance, it also withstands severe thermal cycling, vibration and shock. Dielectric strength, 75 F, (1/8 thick test specimen) Coefficient of thermal expansion, 75 F 450 volts/mil x 10-6 in/in/ C Elongation, 75 F % Hardness, 75 F Shore A Dielectric constant, 75 F, 100Hz 2.7 Service temperature range -65 F to +400 F [-54 C to +204 C] Mixing & Curing Viscosity of Part A, 75 F Viscosity of Part B, 75 F Mixing ratio, Parts A to B 2,000-4,000 cps cps 10:1 by weight Cure schedule 75 F hours 200 F 1-2 hours Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 19

22 MASTERSIL SILICONE MasterSil 151AO Thermally conductive potting and encapsulation compound MasterSil 151AO is a low viscosity, highly flexible, addition cured silicone with superior thermal cycling resistance. Low exotherm; very long pot life Excellent electrical insulation properties Cures in thicknesses up to and beyond 1-2 inches Low shrinkage upon cure High temperature resistance Thermal conductivity, 75 F 9-10 BTU in/ft 2 hr F [ to W/(m K)] Part A: 17,000-24,000 cps, Part B: cps Tensile strength, 75 F psi Elongation, 75 F % MasterSil 156 Thermally conductive, flame retardant, potting and encapsulation compound MasterSil 156 is a low viscosity two component silicone system. It features excellent flexibility, high temperature resistance, heat dissipation and flame retardancy. Flame retardant as per UL 94V-0 specifications Excellent electrical insulation properties Cures in thicknesses up to and beyond 1-2 inches thick Low exotherm, very long pot life Thermal conductivity, 75 F 8-9 BTU in/ft 2 hr F [ to W/(m K)] Viscosity Part A, 75 F 15,000-25,000 cps Viscosity Part B, 75 F 4,000-8,000 cps Elongation, 75 F % 20 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

23 MASTERSIL SILICONE MasterSil 705C Carbon filled silicone system MasterSil 705C offers electrical conductivity and an extremely high degree of flexibility with excellent resistance to thermal and mechanical shock. One part compound Moisture cure paste High flexibility and superior temperature resistance Serviceable from -75 F to +400 F ohm-cm Elongation, 75 F 230% Hardness, 75 F 40 Shore A Tensile strength, 75 F 250 psi Paste MasterSil 705TC Thermally conductive bonding and sealing compound MasterSil 705TC is ideal for thermally conductive applications where high flexibility is desired. One part system Moisture curing Non-corrosive cure Electrically insulative High flexibility Thermal conductivity, 75 F >14 BTU in/ft 2 hr F [> W/(m K)] Paste Tensile strength, 75 F 210 psi Elongation, 75 F 70% Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 21

24 MASTERSIL SILICONE MasterSil 705S Electrically conductive, silver filled silicone system Elongation, 75 F 50% Hardness, 75 F Tensile strength, 75 F MasterSil 705S features exceptionally low volume resistivity, a wide service temperature range and excellent thermal and mechanical shock resistance. One part system Moisture curing paste Silver filled Low volume resistivity High flexibility and temperature resistance <0.01 ohm-cm 70 Shore A 280 psi Paste MasterSil 707FR Flame retardant bonding and sealing system Dielectric constant, 75 F, 60Hz 3.2 MasterSil 707FR is a silicone elastomer adhesive with a paste-like consistency that is mainly used in applications where flame retardancy is required. Meets UL 94V-1 & UL 94V-0 requirements One part, moisture curing Very fast cures Non-corrosive High flexibility Elongation, 75 F % Tensile strength, 75 F psi Paste 22 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

25 MASTERSIL SILICONE MasterSil 709 Bonding, sealing and coating compound meeting MIL-A specifications MasterSil 709 is an easy to use high performance silicone elastomer compound which can be used in many applications, including as a conformal coating. One part, moisture curing Fast, room temperature curing Non-corrosive Flowable 30,000-40,000 cps >10 15 ohm-cm Dielectric constant, 75 F, 60Hz 2.5 Elongation, 75 F % Tensile strength, 75 F psi MasterSil 773 Conformal coating silicone compound Dielectric constant, 75 F, 60Hz 3.3 MasterSil 773 is a low viscosity silicone used as a conformal coating agent with excellent electrical insulation properties. It is easily applied by spraying or brushing. One part, moisture curing Ultra low viscosity Fast, tack-free cures Withstands vibration and shock Low stress cps Elongation, 75 F 40-45% Tensile strength, 75 F 50 psi Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 23

26 MASTERSIL SILICONE Outstanding Electrical Insulation Properties MasterSil 711 & 713 One part, moisture curing systems Fast curing Non-corrosive Superb flexibility Translucent MasterSil 711 and MasterSil 713 are easy to use, one component, high performance silicone elastomer compounds for bonding, sealing, coating and formed-in-place gaskets. Both systems bond well to a variety of substrates, including glass, metals and many plastics. The rapidity of the cure depends upon the thickness of the layer and the humidity. Both systems are safe for use in electronics, opto-electronics and similar types of applications. MasterSil 711 is currently the fastest curing silicone on the market. MasterSil 711 also has a higher viscosity compared to MasterSil 713, but is still flowable. MasterSil 713 s low viscosity enables it to be used as a conformal coating. MasterSil 713 has a slightly higher elongation, providing a bit more elasticity. Both have high and low temperature serviceability. MasterSil 711 MasterSil ,000-80,000 cps 2,000-4,000 cps Dielectric constant, 75 F, 60Hz Elongation, 75 F % % Tensile strength, 75 F psi psi Service temperature range -75 F to +400 F [-59 C to +204 C] -75 F to +400 F [-59 C to +204 C] 24 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

27 EPOXY ADHESIVE FILM Outstanding Film Adhesive Systems FL901AO & FL901S Fast cures at elevated temperatures Uniform bond line thickness Convenient handling Easy processing with minimal squeeze out FL901AO and FL901S are one component epoxy adhesive films that provide convenient handling, good storage stability and fast cures at elevated temperatures. They are ideal for use in electronic applications and are available in preformed shapes upon request. Both feature high physical strength properties. FL901AO is most notable for its excellent thermal conductivity and high electrical insulation properties, whereas FL901S, a silver filled adhesive film, has superb electrical conductivity. Although refrigeration is recommended to optimize shelf life, it is not a requirement. FL901AO FL901S < ohm-cm Thermal conductivity, 75 F >9 BTU in/ft 2 hr F [> W/(m K)] >14 BTU in/ft 2 hr F [> W/(m K)] Lap shear strength, aluminum to aluminum, 75 F >1,500 psi >1,200 psi Glass transition temperature (T g ) 90 C 85 C Curing options 250 F 1 hour 1 hour 300 F minutes minutes Standard size 6 x 2 x inches 6 x 2 x inches Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 25

28 EPOXY ADHESIVE FILM B-Staged Film With Superior Toughness FLM36 Tough and flexible Superior temperature resistance properties Thermally conductive, electrically insulative Excellent bond strength properties Uniform bond line thickness Easily cut FLM36 is a special adhesive film featuring incomparable strength properties, high temperature resistance and first class thermal conductivity with superior electrical insulation properties. It possesses far more toughness and flexibility than conventional high temperature resistant epoxies. This toughened system is capable of withstanding rigorous thermal cycling. It is black in color and does not require refrigeration or freezing. Thermal conductivity, 75 F 9-10 BTU in/ft 2 hr F [ to W/(m K)] Dielectric constant, 75 F, 60Hz 4.1 Lap shear strength, aluminum to aluminum, 75 F Tensile strength, 75 F >4,000 psi >2,000 psi Hardness 75 F 80 Shore D 212 F [100 C] 27 Shore D 350 F [177 C] 22 Shore D Elongation, 75 F >50% Cure schedule 350 F 1-2 hours Service temperature range -100 F to +500 F [-73 C to +260 C] 26 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

29 URETHANE MODIFIED EPOXY Soft & Resilient Two Component Compounds Super Gel 9 & Super Gel 9AO Excellent flexibility Dimensional stability Low stress Easy to remove and ideal for retrievability Super Gel 9 is a urethane modified epoxy system that cures readily at room temperature to form a soft, resilient, gel-like system. Its hardness is exceptionally low, less than 5 Shore A. It offers a low viscosity and cures optically clear. Super Gel 9AO is a thermally conductive version of Super Gel 9 with a Shore A hardness of 20 to 30. One can accomplish retrievability with a sharp knife or razor blade with both products. They can be used in a variety of applications, including the encapsulation of sensitive electronic parts, sealing delicate optical components and in acoustical applications where dampening properties may be desirable. Super Gel 9 Super Gel 9AO Thermal conductivity, 75 F BTU in/ft 2 hr F [ to W/(m K)] Part A: 7,000-12,000 cps Part B: cps >10 15 ohm-cm >10 15 ohm-cm Dielectric constant, 75 F, 60Hz Part A: 100, ,000 cps Part B: 4,000-25,000 cps Hardness, 75 F <5 Shore A Shore A Tensile strength, 75 F 400 psi >200 psi Color Clear Light gray Service temperature range -100 F to +200 F [-73 C to +93 C] -100 F to +200 F [-73 C to +93 C] Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 27

30 MB600S Awesome Shielding Effectiveness Water based system Silver conductive Temperature resistance up to 700 F Easy application SILICATE BASED SYSTEM MB600S is an aqueous based sodium silicate system used as a coating in situations where EMI shielding effectiveness is paramount, such as a wide variety of aerospace and electronic applications. Its handling is wonderfully simple and safe. It is easy to brush on, and with the proper equipment, it is also possible to spray this system. If sprayed on, the shielding effectiveness would be even greater than the values provided below. This system has been recently developed to provide the highest electrical conductivity with superior EMI and RFI shielding properties. Surface resistivity, 75 F <0.001 ohm Shielding effectiveness, 75 F 1-2 GHz db 2-3 GHz db 4-18 GHz db Cure schedule 75 F hours 175 F 1-2 hours Specific gravity, 75 F 4.4 Service temperature range Flowable thixotropic 0 F to +700 F [-18 C to +371 C] 28 Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing

31 White Paper LIBRARY Master Bond's research and development team has published a wide variety of white papers regarding the most pertinent topics within the adhesive industry. Our white papers help engineers understand important criteria considerations in adhesive selection. Below is a sample of the white papers we offer: How to Simplify Potting Potting compounds play a vital role in the assembly and long term protection of delicate electronic components. The design tips in this paper will help you navigate the more common dilemmas associated with the selection and application of epoxy potting compounds. Enhancing the Long-Term Reliability of Electronic Assemblies with Conformal Coatings Modern electronics have become part of our daily lives and the sophisticated circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of printed circuit boards. Protecting Chip on Board Devices with Glob Top Encapsulants Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals and thermal conductivity, to name a few. These encapsulants play a critical role in the successful manufacturing of many common consumer and industrial devices. Flip Chip Assemblies with Underfill Encapsulants The development of epoxy based underfill encapsulants marked a turning point for flip chip technology and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications. Visit our white paper library for more of our latest publications Master Bond Inc. - Polymeric Compounds for Electronic Manufacturing 29

32 Helping electronic manufacturing engineers meet specific requirements 154 Hobart Street, Hackensack, NJ USA Phone Fax