Precision Thick Film Chip Resistors ERJ G: 0201 ERJ R: 0402, 0603, 0805 ERJ E : 0603, 0805, 1206, 1210, 1812, 2010, 2512

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1 Precision Thick Film Chip esistors J G: J : 4, 6, 5 J : 6, 5, 6,,,, 5 Type: J G J,, 6 J, 6,, 4,, T n Features l Small size and lightweight For PCB size reduction and lightweight products l High reliability Metal glaze thick film resistive element and three layered electrode results in high reliability. l Matching with placement machines Bulk, Taping and magazine packagings for automatic placement machines l Solderability Suitable for both reflow soldering and flow soldering l Low esistance Tolerance JG,,, 6,, 4,, T Series... ±% J,, 6 Series... ±.5% l eference Standards IC 65-, JIS C 5- n xplanation of Part Numbers l J,, 6 Series, ±.5 % type J B D Product Code Thick Film Chip esistors Size, Power ating Type: inches Power. : 4.6 W : 6.6 W 6 : 5. W Code H B K T.C.. Marking T.C.. ±5 Ð6 /ûc(ppm/ûc) () ±5 Ð6 /ûc(ppm/ûc) (, 6) ± Ð6 /ûc(ppm/ûc) () ± Ð6 /ûc(ppm/ûc) (, 6) esistance Tolerance Code Tolerance D ±.5 % Packaging Methods Code Packaging X esistance alue mm pitch () (, 6) The first two or three digits are significant figures of resistance and the last one denotes number of zeros following. xample: kw kw

2 l JG Series, ± % type J G F C Product Code Thick Film Chip esistors Size, Power ating Type : inches Power. G :.5 W esistance Tolerance Code Tolerance F ± % esistance alue The first two or three digits are significant figures of resistance and the last one denotes number of zeros following. Packaging Methods Code Packaging Pressed Carrier Taping C mm pitch, 5 pcs. l J,, 6,, 4,, T Series, ± % type J N F Product Code Thick Film Chip esistors Size, Power ating Type: inches Power. : 4.6 W : 6. W 6 : 5.5 W : 6.5 W 4 :.5 W :.5 W :.5 W T : 5 W Code K N S Marking Marking No marking (, ) 4 digit marking (6,, 4,, T) 4 digit marking [( inches)] esistance Tolerance Code Tolerance F ± % esistance alue The first three digits are significant figures of resistance and the 4th one denotes number of zeros following. Packaging Methods Code Packaging X U mm pitch () (, 6, ) mbossed Carrier Taping (4,, T) n Construction Protective coating n Dimensions in mm (not to scale) a L W Alumina substrate lectrode (Inner) t Thick film resistive element lectrode (Between) lectrode (Outer) Type Dimensions (mm) Mass (Weight) (inches) L W a b t [g/ pcs.] JG ().6 ±.. ±.. ±.5.5 ±.5. ±..5 J (4). ±.5.5 ±.5. ±..5 ±.5.5 ±.5. J.6 ± Ð.5. ±.. ±.5.45 ±. J6. ±..5 ±..4 ±..4 ±..6 ±. 4 JK J6N JN (6) J4N () JN () JS () JTN (5).6 ± ±.. ±.5.45 ±. Ð.5. ±..5 ±..4 ±..4 ±..6 ± ±..5 ±..6 ±. Ð. b Ð.5. ±..5 ±..5 ±..5 ±..6 ± ±.. ±..5 ±..5 ±..6 ± ±..5 ±..6 ±..6 ±..6 ± ±.. ±..65 ±..6 ±..6 ±. 45

3 n atings <±.5 %> Type (inches) Power ating at 7 C (W) Limiting lement oltage (Maximum CW) () () Maximum Overload oltage () () esistance Tolerance (%) esistance anges (W) T.C.. [ -6 /ûc (ppm/ûc)] Category Temperature ange (Operating Temperature ange) ( C) JH to K (4).6 5 ±.5 ±5-55 to +5 to 97.6 JK.6 5 ±.5 k to (4) M JB to K.6 5 ±.5 ±5-55 to +5 to 97.6 J.6 5 ±.5 k to M J6B to K. 5 ±.5 ±5-55 to +5 to 97.6 J6. 5 ±.5 k to M <± %> Type Limiting lement Maximum Overload esistance esistance T.C.. Category Temperature Power ating oltage (Maximum anges [ -6 ange (Operating /ûc (inches) at 7 C (W) CW) () () oltage () () Temperature ange) Tolerance (%) (W) (ppm/ûc)] ( C) JG ().5 5 ± ± -55 to +5 JK (4).6 5 ± JK. 5 ± ± -55 to +55 J6N to. M.5 5 ± ± -55 to +55 JN to. M (6).5 4 ± ± -55 to +55 J4N ().5 4 ± JN ().5 4 ± JS ().5 4 ± JTN (5) 4 ± () ated Continuous Working oltage (CW) shall be determined from CW= ÖPower ating esistance alues, or Limiting lement oltage (max. CW) listed above, whichever less. () Overload (Short-time Overload) Test oltage (SOT) shall be determined from SOT=.5 Power ating or max. Overload oltage listed above whichever less. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the right figure. ated Load (%) Ð55 C 6 4 Ð6 7 C, 6, G,,, 6 4,, T 55 C 5 C Ð4 Ð Ambient Temperature ( C)

4 n Packaging Methods (Taping) l Standard Quantity JG Pressed Carrier Taping 5 pcs./reel mm JH, JK pcs./reel J, JK J6, J6N JN J4N JN JS JTN Type Kind of Taping Pitch (P) Quantity mbossed Carrier Taping 4 mm 5 pcs./reel 4 pcs./reel l Carrier Tape (Unit : mm) Pressed Carrier Punched Carrier mbossed Carrier fd P P P B W F T T T A P ( mm pitch) fd (Only mboss) Type A B W F P P P fd T fd JG. ±.5.6 ±.5.4 ±.5 _. ±. JH, JK.7 ±.5. ±.5.5 ±.5 _ J, JK. ±..9 ±.. ±..7 ±.5.5 _ ±.5 J6, J6N.65 ±.5.5 ±. _.4 ±.5 JN. ±.5.6 ±..75 ±.. ±.5 4. ± _ J4N. ±..5 ±.. ±. 4. ±.. +. JN.5 ±. 4. ±.. ±. JS. ±. 5. ±.. ±. 5.5 ±..5 min. JTN.6 ±. 6.9 ±. - - l Taping eel fa fc T W fb (Unit : mm) Type fa fb fc W T JG JH, JK J, JK J6, J6N 9. ±..4 ±. JN min.. ±. J4N JN JS. ±. 5.4 ±. JTN

5 n ecommended Land Pattern In the case of flow soldering, the land width must be smaller than the Chip esistor width to control the solder amount properly. Generally, the land width should be.7 to. times (W) of the width of chip resistor. In the case of reflow soldering, solder amount can be adjusted, therefor the land width should be set to. to. times chip resistor width (W). a b Chip esistor c Type (inches) Dimensions (mm) a b c JG (). to.4. to.9.5 to.5 J (4).5 to.6.4 to.6.4 to.6 J, K.7 to.9 to.. to J6, 6N to.4. to..9 to.4 JN (6) to to 5. to. J4N () to to 5. to. JN (). to to 6.5. to.5 JS ().6 to 4 6. to 7. to. JTN (5) 5 to to.6. to.5 n ecommended Soldering Conditions ecommendations and precautions are described below. l ecommended soldering conditions for reflow áeflow soldering shall be two times maximum. áplease contact us for additional information when you use in conditions other than those specified. áplease measure a temperature of terminations and study solderability every kind of solder and board, before actual use. Peak For solder (xample : Sn/Pb) Temperature Time Preheating 4 C to 6 C 6 s to s Main heating Above C s to 4 s Peak 5 ± 5 C max. s Temperature Preheating Heating For lead-free solder (xample : Sn/Ag/Cu) Temperature Time Preheating 5 C to C 6 s to s Main heating Above C s to 4 s Peak max. 6 C max. s Time l ecommended soldering conditions for flow For solder For lead-free solder Temperature Time Temperature Time Preheating 4 C to 6 C 6 s to s 5 C to C 6 s to s Soldering 45±5 C s to s max. 6 C max. s Cautions for Safety The following are precautions for individual products. Please also refer to the precautions common to Fixed esistors shown on page of this catalog.. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip esistors (hereafter called the esistors) so as not to damage their electrodes and protective coatings.. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the esistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the esistors may be impaired.. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the esistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the esistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 5 C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the esistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply a shock to the esistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the esistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bend of printed circuit boards in order to protect the esistors from abnormal stress.

6 Caution for Safety (Common precautions for Fixed esistors) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. Do not use the products beyond the specifications described in this catalog. This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ] Systems equipped with a protection circuit and a protection device ] Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault () Precautions for use These products are designed and manufactured for general purpose and standard use in general electronic equip ment (e.g. A equipment, home electric appliances, office equipment, information and communication equipment) These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used.. In liquid, such as water, oil, chemicals, or organic solvent. In direct sunlight, outdoors, or in dust. In salty air or air with a high concentration of corrosive gas, such as Cl, HS, NH, SO, or NO 4. In an environment where strong static electricity or electromagnetic waves exist 5. In an environment where these products cause dew condensation 6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the perfor mance or reliability of the products. Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. () Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 5 C and a relative humidity of 45 % to 5 %. ven within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.. In salty air or in air with a high concentration of corrosive gas, such as Cl, HS, NH, SO, or NO. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in nglish.

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Resistance Tolerance Code J. Marking. Value Marking on Y black side Nil No marking. Resistance Value

Resistance Tolerance Code J. Marking. Value Marking on Y black side Nil No marking. Resistance Value Thick Film Chip Resistors 15, 21, 42, 63, 85, 126, 121, 1812, 21, 2512 : R XG, 1G, 2G, 3G, 6G, 8G, 14, 12, 12Z, 1T Features Small size and lightweight High reliability Metal glaze thick fi lm resistive