BOOST HEAT DISSIPATION WITH A THERMAL PYROLYTIC GRAPHITE CORE Presentation at 12 th European ATW on Micropackaging and Thermal Management

Transcription

1 BOOST HEAT DISSIPATION WITH A THERMAL PYROLYTIC GRAPHITE CORE Presentation at 12 th European ATW on Micropackaging and Thermal Management Wei Fan, Ph.D., Xiang Liu, Ph.D., Creighton Tomek, Dawn Krencisz, Peter Schmidt-Sane, and Bruno Balland Engineered Coating Technologies February 01, 2017

2 Outline Company Overview Thermal Management Solutions TPG BN Application Areas Case Study 2

3 Global Leader in Silicones and Advanced Materials ADDITIVES SECTOR FORMULATED PRODUCTS SECTOR Silanes Business Unit Coatings, Adhesives & Sealants Tire & Rubber Industrial High Performance Polymers Specialty Fluids Business Unit Personal & Home Care Agriculture Oil & Gas Textiles, Leather & Nonwoven Industrial Urethane Additives Business Unit Molded Foam Slab Foam Rigid Foam Specialties BASICS SECTOR Basic Fluids Business Unit Coatings Business Unit Hardcoats & Weatherstrip PSA & Release Coatings Elastomers Business Unit LSR Custom Compounds HCR Electronics Business Unit Consumer & Industrial Electronics Optical Sealants Business Unit Consumer Construction QUARTZ & CERAMICS SECTOR Ceramics Business Unit Quartz Business Unit 24 global facilities 5,000 associates 4,500 customers 3

4 Products in the Semiconductor Process CVD Products for Epitaxy Process Tubes and Rods Quartz Solids Supplying products at every step of the semiconductor value chain Crystal Growth Ingot Sliced Into Wafer Wafer Processed in IC Fab Wafer Sliced Into Chips & Used in Electronics Systems Raw Material Single Crystal Ingots Wafers IC s on Wafer Chip Electronics Crystal Growth Crucibles Heaters, Chucks & Heater Assemblies Thermal Management Materials 4

5 Outline Company Overview Thermal Management Solutions TPG BN Applications Areas Case Study 5

6 TPG* Graphite Offers Exceptional Thermal Conductivity TPG graphite is a highly crystalline graphite with well aligned graphene planes. TPG graphite has a thermal conductivity 7x of aluminum, but with 83% of aluminum s weight. Material In-Plane TC (W/m-K) In-Plane CTE (ppm/ºc) Specific Gravity Aluminum Copper AlSiC WCu MoCu TPG Graphite µm TC = thermal conductivity CTE = coefficient of thermal expansion Typical Properties are average data and are not to be used as or to develop specifications. 6 *TPG and TC1050 are trademarks of Momentive Performance Materials Inc.

7 TPG* Graphite can be Encapsulated and Treated as Monolithic Metal Piece Cross Section of TPG Graphite-Metal Composite TPG graphite tile Thermal/mechanical vias Metal shell/rail Typical Features High thermal conductivity Light weight CTE matching Strong Hermetic Reliable Platable Machinable 7 *TPG and TC1050 are trademarks of Momentive Performance Materials Inc.

8 Tailored Thermal Management Products (TMP) to Meet Specific Challenges TC1050* Heat Spreader TMP-EX Heat Sink TPG* Graphite High TC Light weight Board level 2D or 3D design Chip level CTE matching Low profile Flexible TMP-FX Thermal Strap 8 *TPG and TC1050 are trademarks of Momentive Performance Materials Inc.

9 Boron Nitride (BN) Powders are High Performance Additives Key Material Typical Properties Property Theoretical density Typical value 2.25 g/cc Crystal Structure of Hexagonal BN Thermal conductivity 300 W/mK * Volume resistivity W-cm Dielectric constant ~4.0 Mohs hardness ~1.5 Typical properties are average data and are not to be used as or to develop specifications * In-plane conductivity in the a-b plane of the crystal c b a High thermal conductivity High electrical resistivity High thermal stability Low dielectric constant Single-Crystal Platelet Spherical Agglomerate 9

10 Outline Company Overview Thermal Management Product Overview TPG BN Application Areas Case Study 10

11 Critical Heat Removal in Electronics by TPG & BN Composites 1. Thermal Management Products 2. Boron Nitride (BN) Powders TMP-EX CTE-Matched Heat Sink BN-Polymer TIM1 Die TMP-EX BN-Plastic Heat Sink TMP-FX Thermal Strap BN-Plastic Device Housing BN-Polymer TIM2 TMP-FX Heat Sink Fins BN-Polymer PCB TC1050* Heat Spreader TC1050* Heat Spreader Chassis 11 *TC1050 is a trademark of Momentive Performance Materials Inc.

12 Board Level Thermal Management with TC1050* Heat Spreader IR Image of Heat Spreaders Illustration of Measurement Setup Heat cartridge Cooling water 110 o C 23 o C Heat spreader Aluminum Watt heat loading Cooling maintained at 20 o C 54 o C 23 o C 5x heat dissipation power of aluminum TC1050 Note: Test data. Actual results may vary. 12

13 TMP-EX Heat Sink WCu Heat Sink Chip Level Thermal Management with TMP-EX Heat Sink W85Cu Heat Sink TMP-EX Heat Sink T = 28% Experiment showed 30% reduction in thermal resistance Dies could be operated with 60% more power * Used with permission from ZAO Syntez Microsystems Note: Test data. Actual results may vary. 13

14 Tight Space Heat Conduction with TMP-FX Thermal Strap Aluminum IR Image of Heat Spreaders Heater C 6061 Aluminum T max = C Change of Thermal Conductivity After Forming Al 10.0 C Copper C Water-cooled 80 chassis 60 Copper T max = 60 0 C C TPG graphite C 120 TPG TPG* graphite T max = 36 0 C 6x heat dissipation power of aluminum and 3x of copper C Note: Test data. Actual results may vary. 127 x 44 x 2.3 mm 30 watt heater at one end 15 o C water-cooled chassis at other Shaping TPG graphite did not change its high thermal conductivity 14 *TPG is a trademark of Momentive Performance Materials Inc. Copyright 2015 Momentive Performance Materials Inc. All rights reserved.

15 Momentive Thermal Management Solutions in Action Aerospace / Military Satellites Illumination Wafer Processing Wireless Communication Power Electronics 15 Copyright 2015 Momentive Performance Materials Inc. All rights reserved.

16 Outline Company Overview Thermal Management Product Overview TPG BN Application Areas Case Study 16

17 Challenge: How to Improve Output of LED Headlight? Heat Sink Fin Heat Sink Base LED Heat Spreader LED Die Light Bulb: VLEDS 9006 with 2x CREEţ MT-G2 Light Housing: 2000 CHEVROLET SILVERADO 17 ţcree is a trademark of Cree, Inc.

18 Match TPG* Graphite Products with Thermal Management Needs 1. Which components? 2. What TPG dimension? 3. How to integrate? 18 *TPG and TC1050 are trademarks of Momentive Performance Materials Inc.

19 Identify Bottleneck in Heat Flow Experiment Analysis Simulation Note: Test data. Actual results may vary. Ambient Fin Base Spreader Die After the LED die, the largest thermal resistance resides in: 1. Heat sink fin 2. Heat sink base 19

20 Engineer TPG* Graphite Solutions into LED Assembly Design R = 5.9 o C/W Baseline R = 6.4 o C/W Aluminum Fin TPG Fin TPG Fin + TPG Base Integrate TMP-FX Thermal Strap and TC1050* Heat Spreader into the LED headlight assembly using Momentive s proprietary bonding technologies. 20 *TPG and TC1050 are trademarks of Momentive Performance Materials Inc.

21 Significant Temperature Reduction Observed in both Experiment and Simulation Aluminum Fin TPG Fin Note: Test data. Actual results may vary. Total system thermal resistance was reduced by: 1. 27% with TPG* graphite fins 2. 24% with TPG* graphite base TPG Fin + TPG Base 21 *TPG is a trademark of Momentive Performance Materials Inc. Copyright 2015 Momentive Performance Materials Inc. All rights reserved.

22 Benefit Summary of TPG* Graphite Assisted Cooling Image of LED Light Output Baseline MPM Solution 8.8 W 18.6W Ambient Fin Base Spreader Die Note: Test data. Actual results may vary. 2x power capacity to LEDs OR Elimination of electric fans Design freedom Light weight Reliability 22 *TPG and TC1050 are trademarks of Momentive Performance Materials Inc.

23 Summary Aligned with trends: Light weight, high thermal conductivity (TC) and low coefficient of thermal expansion (CTE) are needed to remove critical heat in high power electronics. Broad range of solutions: Momentive has developed a range of products to solve customers thermal management challenges for over 25 years. Better performance: Higher thermal conductivities can enable more power, increase reliability, extend life, and reduce cooling cost. Accelerate growth: Momentive is QS9100 certified and excels at providing custom products and solutions. Let us help solve your thermal management challenges today! 23

24 Thank You! TPG* Graphite BN Powders TC1050* Heat Spreader TMP-EX Heat Sink TMP-FX Thermal Strap CoolFX* Modifiers 24 *TPG and TC1050 are trademarks of Momentive Performance Materials Inc.

25 DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC. AND ITS SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (COLLECTIVELY SUPPLIERS ) ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (I) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (II) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Suppliers products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers Standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right. Momentive and the Momentive logo are trademarks of Momentive Performance Materials Inc. 25