Materials Declaration Form

Transcription

1 Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics Response Date * Contact Name * Authorized Representative * Giovanni Giacopello Representative Title Representative Phone * Refer to Supplier Comment section Representative * Supplier Comment Refer to Supplier Comment section Online Technical Support - STMicroelectronics : Refer to Supplier Comment section ADG & SGP MD CHAMPION Refer to Supplier Comment section Uncertainty Statement While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents. Legal Statement Supplier Acceptance * true Legal Declaration * Standard Legal Statement Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier s liability and the Company s remedies for issues that arise regarding information the Supplier provides in this form.

2 Product Mfr Item Number Mfr Item Name Version Mfr Site Date SPWF04SA A0UQ*WIFI009 A Microtel Amount UoM Unit type ST ECOPACK Grade mg Each ECOPACK 2 Manufacturing information J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles NAC NAC NAC bulk Solder Termination Terminal Plating Terminal Base Alloy Comment NAC NAC NAC Comment Package Designator Size Nbr of instances Shape Mounted BOARD 26.9x15.4x0.8 NAC flat

3 QueryList : ROHS directive 2011/65/EU _ July 2011 Query 1 - Product(s) meets EU RoHS requirement without any exemptions 2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply) 3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s) 4 - Product(s) does not meet EU RoHS requirements and is not under exemptions 5 - Product(s) is obsolete, no information is available 6 - Product(s) is unknown, no information is available Exemption Id. Description 7c-I Response Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound true QueryList : REACH-20th June 2016 Query Response 1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product Lead monoxide (lead oxide) 1000 ppm true

4 Material Composition Declaration Mfr Item Name A0UQ*WIFI Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in homogeneous material (ppm) Concentration in product (ppm) PCB Other inorganic materials mg supplier alloy Copper (Cu) mg PCB supplier substrate Epoxy resin mg PCB supplier substrate Fiber glass mg PCB supplier substrate Baruim sulfate mg PCB supplier substrate Acrylated epoxy resin proprietary mg PCB supplier metallization Nickel (Ni) mg PCB supplier metallization Gold (Au) mg STM32F439ZI Other inorganic materials mg supplier die Silicon (Si) mg STM32F439ZI supplier metallization Aluminium (Al) mg STM32F439ZI supplier metallization Copper (Cu) mg STM32F439ZI supplier metallization Tantalum (Ta) mg STM32F439ZI supplier metallization Cobalt (Co) mg 33 1 STM32F439ZI supplier metallization Titanium (Ti) mg STM32F439ZI supplier metallization Tungsten (W) mg STM32F439ZI supplier passivation Silicon Nitride (SiN) mg STM32F439ZI supplier passivation Silicon Oxide(SiO2) mg STM32F439ZI supplier Alloy Ti mg STM32F439ZI supplier Alloy Cu mg STM32F439ZI supplier Polymer 4-Butyrolactone mg STM32F439ZI supplier Polymer Polyamide Proprietary mg STM32F439ZI supplier Polymer 1-Methoxy-2-propyl acetate mg STM32F439ZI supplier Alloy Cu mg STM32F439ZI supplier Polymer 4-Butyrolactone mg STM32F439ZI supplier Polymer Polyamide Proprietary mg STM32F439ZI supplier Polymer 1-Methoxy-2-propyl acetate mg STM32F439ZI supplier Alloy Cu mg STM32F439ZI supplier Solder Sn mg STM32F439ZI supplier Solder Ag mg STM32F439ZI supplier Solder Cu mg STM32F439ZI supplier Solder Ni mg 67 1 STM32F439ZI supplier Polymer Polybutylene terephthalate (PBT) mg STM32F439ZI supplier Polymer Silica Proprietary mg STM32F439ZI supplier Polymer Proprietary Material-Other Epoxy resins Proprietary mg STM32F439ZI supplier Polymer Proprietary Material-Other Acrylic resins Proprietary mg SN74LVC125ARGYR Other inorganic materials mg supplier die Silicon mg SN74LVC125ARGYR supplier frame alloy Copper (Cu) mg SN74LVC125ARGYR supplier frame alloy Tin (Sn) mg SN74LVC125ARGYR supplier frame alloy Zinc (Zn) mg SN74LVC125ARGYR supplier frame alloy Chromium (Cr) mg SN74LVC125ARGYR supplier frame metallisation Nickel (Ni) mg SN74LVC125ARGYR supplier frame metallisation Palladium (Pd) mg SN74LVC125ARGYR supplier frame metallisation Gold (Au) mg 31 1 SN74LVC125ARGYR supplier Die Attach Adhesive Silicon Oxide mg 94 2 SN74LVC125ARGYR supplier Die Attach Adhesive Silver (Ag) mg SN74LVC125ARGYR supplier Die Attach Adhesive Epoxy Proprietary mg SN74LVC125ARGYR supplier Bond wire Copper (Cu) mg SN74LVC125ARGYR supplier Mold compound Fused Silica mg SN74LVC125ARGYR supplier Mold compound Carbon Black mg SN74LVC125ARGYR supplier Mold compound Epoxy Proprietary mg LVC2T45GD Other inorganic materials mg supplier die Silicon mg LVC2T45GD supplier frame alloy Nickel (Ni) mg LVC2T45GD supplier frame alloy Palladium (Pd) mg LVC2T45GD supplier frame alloy Gold (Au) mg LVC2T45GD supplier Die Attach Adhesive 4-Methyl-2-Phenyl-1 H-Imidazole mg LVC2T45GD supplier Die Attach Adhesive C18-Unsatured fatty acids dimers diglycidyl est mg LVC2T45GD supplier Die Attach Adhesive Poly(Propyleneglycol)diamine mg LVC2T45GD supplier Die Attach Adhesive 1.4-Butanediol Diglycidil Ether mg LVC2T45GD supplier Die Attach Adhesive Bisphenol-F/Diclycidyl ether resin mg LVC2T45GD supplier Bond wire Gold (Au) mg

5 74LVC2T45GD supplier Bond wire Palladium (Pd) mg LVC2T45GD supplier Mold compound Additive Proprietary mg LVC2T45GD supplier Mold compound Silica fused mg LVC2T45GD supplier Mold compound Carbon Black mg LVC2T45GD supplier Mold compound Epoxy resin Proprietary mg LVC2T45GD supplier Mold compound Phenolic resin Proprietary mg STLQ50C18R Other inorganic materials mg supplier Silicon die Silicon (Si) mg STLQ50C18R supplier Passivation Gamma-butyrolactone mg STLQ50C18R supplier Passivation Polyhydroxyamide mg STLQ50C18R supplier Back side metallization Nickel (Ni) mg STLQ50C18R supplier Back side metallization Gold (Au) mg STLQ50C18R supplier Alloy Copper mg STLQ50C18R supplier Alloy Iron mg STLQ50C18R supplier Alloy Iron Phosphide(FeP) mg STLQ50C18R supplier Alloy Zinc mg STLQ50C18R supplier Coating Nickel mg STLQ50C18R supplier Coating Palladium mg STLQ50C18R supplier Glue Silver mg STLQ50C18R supplier Glue Carbocyclic Acrylates proprietary mg STLQ50C18R supplier Glue Bismaleimide resin proprietary mg STLQ50C18R supplier Glue 2-preponoic acid, 2-methyl mg STLQ50C18R supplier Glue Additive proprietary mg STLQ50C18R supplier Bonding wire Gold (Au) mg STLQ50C18R supplier Molding compound Epoxy resin-1 Proprietary mg STLQ50C18R supplier Molding compound Epoxy resin-2 Proprietary mg STLQ50C18R supplier Molding compound Phenol resin Proprietary mg STLQ50C18R supplier Molding compound Silica mg STLQ50C18R supplier Molding compound Carbon Black mg CW110001UBTM Other inorganic materials mg supplier die Silicon (Si) mg CW110001UBTM supplier metallisation Aluminium (Al) mg CW110001UBTM supplier metallisation Copper (Cu) mg CW110001UBTM supplier metallisation Nickel (Ni) mg 57 1 CW110001UBTM supplier metallisation Tantalum (Ta) mg CW110001UBTM supplier metallisation Titanium (Ti) mg CW110001UBTM supplier metallisation Tungsten (W) mg 57 1 CW110001UBTM supplier Passivation Silicon Nitride (SiN) mg CW110001UBTM supplier passivation Silicon Oxide mg CW110001UBTM supplier die polymer coating PBO mg 57 1 CW110001UBTM supplier RDL Copper (Cu) mg CW110001UBTM supplier bumps Tin (Sn) mg CW110001UBTM supplier bumps Silver (Ag) mg CW110001UBTM supplier bumps Copper (Cu) mg CW110001UBTM supplier resin silica vitreous mg CW110001UBTM supplier resin Epoxy resin Proprietary mg CW110001UBTM supplier resin Acrylic polymer Proprietary mg CW110001UBTM supplier resin Bis-phenol A diglycidyl ether mg CW110001UBTM supplier resin carbon black mg CW110001UBTM supplier resin Iron compound mg CW110001UBTM supplier resin Zinc compound mg LFB182G45SG9B740 Other inorganic materials mg supplier Ceramic Nd2O mg LFB182G45SG9B740 supplier metallisation Copper (Cu) mg Antenna Other inorganic materials mg supplier Ceramic Aluminium oxide mg Antenna supplier Ceramic Silicon dioxide mg Antenna SVHC Ceramic Lead oxide c-I-Electrical and e mg Antenna supplier Ceramic Calcium Oxide mg Antenna supplier Electrode termination Silver (Ag) mg Crystal 1 Other inorganic materials mg supplier Cover Iron mg Crystal 1 supplier Cover Nickel mg Crystal 1 supplier Cover Cobalt mg Crystal 1 supplier Cover Manganese mg Crystal 1 supplier Cover Silicon mg 307 1

6 Crystal 1 supplier Cover Nickel mg Crystal 1 supplier Base Alminium oxide mg Crystal 1 supplier Base Manganese oxide mg Crystal 1 supplier Base Silicon dioxide mg Crystal 1 supplier Base Molybdenum oxide mg Crystal 1 supplier Base Magnesium Oxide mg Crystal 1 supplier Base Molybdenum mg Crystal 1 supplier Base Nickel mg Crystal 1 supplier Base Cobalt mg Crystal 1 supplier Base Gold mg Crystal 1 supplier Base Iron mg Crystal 1 supplier Base Nickel mg Crystal 1 supplier Base Cobalt mg Crystal 1 supplier Base Silver mg Crystal 1 supplier Base Copper mg Crystal 1 supplier Electro conductive adhesive Silver mg Crystal 1 supplier Electro conductive adhesive Silicon dioxide mg Crystal 1 supplier Electro conductive adhesive Quartz mg Crystal 1 supplier Evaporation Gold mg Crystal 1 supplier Evaporation Chromium mg Capacitors 1 Other inorganic materials mg supplier Ceramics Zirconium oxide mg Capacitors 1 supplier Ceramics Calcium oxide mg Capacitors 1 supplier Copper alloys Copper mg Capacitors 1 supplier Glass diboron trioxide; bor mg Capacitors 1 supplier Electrolytic Nickel Plating Nickel mg Capacitors 1 supplier Electrolytic Tin plating Tin mg Capacitors 2 Other inorganic materials mg supplier Copper alloys Zirconium oxide mg Capacitors 2 supplier Copper alloys Calcium oxide mg Capacitors 2 supplier Nickel /Other Nickel alloy Nickel mg Capacitors 2 supplier Copper alloys Copper mg Capacitors 2 supplier Glass diboron trioxide; bor mg Capacitors 2 supplier Glass Silicon dioxide mg Capacitors 2 supplier Electrolytic Nickel Plating Nickel mg Capacitors 2 supplier Electrolytic Tin plating Tin mg Capacitors 3 Other inorganic materials mg supplier Ceramics Barium oxide, obtain mg Capacitors 3 supplier Ceramics Titanium dioxide mg Capacitors 3 supplier Copper alloys Copper mg Capacitors 3 supplier Glass diboron trioxide; bor mg Capacitors 3 supplier Glass Silicon dioxide mg Capacitors 3 supplier Nickel plating Nickel mg Capacitors 3 supplier Nickel and Nickel alloys Nickel mg Capacitors 3 supplier Tin plating Tin mg Capacitors 4 Other inorganic materials mg supplier Ceramics Barium oxide, obtain mg Capacitors 4 supplier Ceramics Titanium dioxide mg Capacitors 4 supplier Copper alloys Copper mg Capacitors 4 supplier Glass diboron trioxide; bor mg Capacitors 4 supplier Glass Silicon dioxide mg Capacitors 4 supplier Nickel plating Nickel mg Capacitors 4 supplier Nickel and Nickel alloys Nickel mg Capacitors 4 supplier Tin plating Tin mg Inductor 1 Other inorganic materials mg supplier Ceramics Silver mg Inductor 1 supplier Glass Silicon dioxide mg Inductor 1 supplier Nickel plating Nickel mg Inductor 1 supplier Tin plating Tin mg Inductor 1 supplier Glass Silica mg Inductor 1 supplier Glass Aluminum oxide mg Inductor 1 supplier Glass diboron trioxide mg Inductor 2 Other inorganic materials mg supplier Ceramic Silicon dioxide mg Inductor 2 supplier Ceramic Magnesium oxide mg Inductor 2 supplier Ceramic Alminium oxide mg Inductor 2 supplier Ceramic Diboron-trioxide mg

7 Inductor 2 supplier pigment Manganese ferrite mg Inductor 2 supplier conductor Silver mg Inductor 2 supplier Nickel plating Nickel mg Inductor 2 supplier Tin plating Tin mg Inductor 3 Other inorganic materials mg supplier Ferrite Nickel Oxide mg Inductor 3 supplier Ferrite Copper Oxide mg Inductor 3 supplier Ferrite Diiron trioxide mg Inductor 3 supplier Ferrite Zinc Oxide mg Inductor 3 supplier electrode Silver mg Inductor 3 supplier electrode Glass Frit Proprietary mg Inductor 3 supplier Electrode II Silver mg Inductor 3 supplier Electrode II Phenolic Resin mg Inductor 3 supplier Electrode II Biphenol F-type epoxy resin mg Inductor 3 supplier Electrode under plating Nickel mg Inductor 3 supplier Electrode finish plating Tin mg Inductor 3 supplier Winding wire Copper mg Inductor 3 supplier Insulation Coating Polyuretane Foams mg Inductor 3 supplier Exterior part with ferrite Bismuth oxide mg Inductor 3 supplier Ceramics Nickel oxide mg Inductor 3 supplier Ceramics Copper oxide mg Inductor 3 supplier Ceramics Bisphenol A Epichlorohydrin resin mg Inductor 3 supplier Electrode Diiron trioxide mg Inductor 3 supplier Electrode Zinc Oxide mg Inductor 3 supplier Paste Phenolic resin mg Inductor 3 supplier Resistive Element Epoxy resin amine adduct mg Inductor 3 supplier Resistive Element Epoxy resin Proprietary mg Inductor 3 supplier Nickel Plating Catalyst Proprietary mg Resistors 1 Other Organic Materials mg supplier Substrate Aluminium Oxide mg Resistors 1 supplier Substrate Silicon Dioxide mg Resistors 1 supplier Substrate Magnesium Oxide mg Resistors 1 supplier Inner electrode Silver mg Resistors 1 supplier Inner electrode Silver mg Resistors 1 supplier Inner electrode Ruthenium dioxide mg Resistors 1 supplier Termination Nickel mg Resistors 1 supplier Termination Tin mg Resistors 1 supplier Primary Glass Glass Frit mg Resistors 1 supplier Overcoat II Epoxy Resin mg Shield Other Organic Materials mg supplier alloy Copper (Cu) mg Shield supplier alloy Zinc (Zn) mg Shield supplier alloy Nickel (Ni) mg Shield supplier alloy Iron (Fe) mg