Materials Declaration Form

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Reynard Julian French
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Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name *

1 Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics Response Date * Contact Name * Refer to " Supplier Comment" section Contact Title Contact Phone * Refer to " Supplier Comment" section Contact * Authorized Representative * Antonella Lanzafame Representative Title Representative Phone * Refer to " Supplier Comment" section Representative * Refer to " Supplier Comment" section Refer to " Supplier Comment" section AMS/IPD Materials Declaration Champion) Refer to " Supplier Comment" section Supplier Comment Online Technical Support - STMicroelectronics : Uncertainty Statement While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents. Legal Statement Supplier Acceptance * true Legal Declaration * Standard Legal Statement Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier s liability and the Company s remedies for issues that arise regarding information the Supplier provides in this form.

2 Product Mfr Item Number Mfr Item Name Version Mfr Site Date FCO7*L289EA6 A BO2A Amount UoM Unit type ST ECOPACK Grade Each ECOPACK 2 Manufacturing information J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles bulk Solder Termination Terminal Plating Terminal Base Alloy Comment Not Applicable ; if coating is used o Nickel/Palladium/Gold (Ni/Pd/Au) Copper Alloy Package Designator Size Nbr of instances Shape DSO 4.90,3.9, gull wing Comment O7 SO JEDEC; MD valid for CP:UC3844BD1, UC3844BD1013TR.

3 QueryList : ROHS directive 2011/65/EU _ July 2011 Product(s) meets EU RoHS requirement without any exemptions Query Response true Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply) Product(s) meets EU RoHS requirements by application of the selected exemption(s) Product(s) does not meet EU RoHS requirements and is not under exemptions Product(s) is obsolete, no information is available Product(s) is unknown, no information is available Exemption Id. Description QueryList :REACH-19 Dec 2012 Query The product does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH Response true CategoryLevel_Name CategoryLevel_Threshold amount in product () Application ppm in product

4 Material Composition Declaration Mfr Item Name FCO7*L289EA Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in homogeneous material (ppm) Concentration in product (ppm) die (s) Other inorganic materials supplier die Silicon (Si) die (s) supplier die Glass : Aluminium Oxide (Al2O3) die (s) supplier die Glass : Boron Trioxide (B2O3) die (s) supplier die Glass : Potassium Oxide (K2O) die (s) supplier die Glass : Sodium Oxide (Na2O) die (s) supplier die Glass: Quartz die (s) supplier metallization Aluminium (Al) die (s) supplier metallization Copper (Cu) die (s) supplier metallization Tantalum (Ta) die (s) supplier metallization Cobalt (Co) die (s) supplier metallization Titanium (Ti) die (s) supplier metallization Tungsten (W) die (s) supplier metallization Palladium (Pd) die (s) supplier metallization Nickel (Ni) die (s) supplier metallization Gold (Au) die (s) supplier metallization Platinum (Pt) die (s) supplier metallization Silver (Ag) die (s) supplier metallization Tin (Sn) die (s) supplier passivation Silicon Nitride (SiN) die (s) supplier passivation Silicon Oxide(SiO2) die (s) supplier passivation Indium Tin oxide ( In203:SnO2 ) die (s) R passivation Lead Oxide (PbO) die (s) supplier passivation Gamma-butyrolactone die (s) supplier passivation Polyhydroxyamide die (s) supplier passivation Alcoxysilane proprietary 0 die (s) supplier passivation Aryl Silicilic Acid proprietary 0 die (s) supplier passivation Esterified polyamid die (s) supplier passivation Tetraethylene glycol dimethacrylate die (s) supplier passivation Alumina die (s) supplier passivation Lead silicate Glass die (s) supplier passivation PZT die (s) supplier back side metallization Aluminium (Al) die (s) supplier back side metallization Copper (Cu) die (s) supplier back side metallization Titanium (Ti) die (s) supplier back side metallization Chromium (Cr) die (s) supplier back side metallization Gold (Au) die (s) supplier back side metallization Nickel (Ni) die (s) supplier back side metallization Vanadium (V) die (s) supplier back side metallization Silver (Ag) die (s) supplier glass coating Glass : Aluminium Oxide (Al2O3) die (s) supplier glass coating Glass : Boron Trioxide (B2O3) die (s) supplier glass coating Glass : Potassium Oxide (K2O) die (s) supplier glass coating Glass : Sodium Oxide (Na2O) die (s) supplier glass coating Glass: Quartz die (s) supplier glass coating Glass: Silicon Dioxide (Si02) die (s) supplier polymer die coating Benzocyclobutene (BCB) die (s) supplier polymer die coating Polymer resist - ASAHI NA 0 die (s) supplier polymer die coating Polymer resist (Black resist)) NA 0 die (s) supplier polymer die coating Polymer resist (color, planar,µlens) NA 0 die (s) supplier polymer die coating Polymer resist (Glue) NA 0 UBM 0 supplier UBM Aluminium (Al) UBM supplier UBM Copper (Cu) UBM supplier UBM Titanium (Ti) UBM supplier UBM Chromium (Cr) UBM supplier UBM Gold (Au) UBM supplier UBM Nickel (Ni) UBM supplier UBM Vanadium (V) UBM supplier UBM Silver (Ag) BUMPS Solder 0 supplier bump Tin (Sn)

5 BUMPS supplier bump Silver (Ag) BUMPS supplier bump Copper (Cu) BUMPS supplier bump Nickel (Ni) BUMPS supplier bump Antimony (Sb) BUMPS R bump Lead (Pb) Lead in solders t 0 Leadframe Copper & its alloys supplier alloy Copper (Cu) Leadframe supplier alloy Iron (Fe) Leadframe supplier alloy Phosphorus (P) Leadframe supplier alloy Iron Phosphide (FeP) Leadframe supplier alloy Nickel (Ni) Leadframe supplier alloy Zinc (Zn) Leadframe supplier alloy Magnesium (Mg) Leadframe supplier alloy Silicon (Si) Leadframe supplier alloy CopperPosphorous (CuP) Leadframe supplier alloy Tin (Sn) Leadframe supplier alloy Cobalt (Co) Leadframe supplier alloy Zirconium (Zr) Leadframe supplier alloy Chromium (Cr) Leadframe supplier alloy Silver (Ag) Leadframe supplier alloy Sulfur (S) Leadframe supplier alloy Manganese (Mn) Leadframe supplier alloy Carbon Leadframe supplier metallization Nickel (Ni) Leadframe supplier metallization Palladium (Pd) Leadframe supplier metallization Gold (Au) Leadframe supplier metallization Silver (Ag) Leadframe supplier metallization Phosphorus (P) xxx 0 supplier ZZZ 0 ZZZ ZZZ Die attach supplier glue or tape Silver (Ag) Die attach supplier glue or tape acrylate Proprietary Die attach supplier glue or tape Methacrylate Proprietary Die attach supplier glue or tape acrylate Proprietary 0 Die attach supplier glue or tape NMP Die attach 0 glue or tape Die attach 2 0 supplier glue or tape 0 0 0

6 Soft solder Solder 0 supplier solder Bonding wire Other inorganic materials supplier wire Gold (Au) Bonding wire supplier wire Copper (Cu) Bonding wire supplier wire Palladium (Pd) Bonding wire supplier wire Platinium (Pt) Bonding wire supplier wire Silver (Ag) Bonding wire Other inorganic materials supplier wire Aluminium (Al) Bonding wire supplier wire Magnesium (Mg) Bonding wire supplier wire Silicium (Si) Underfill 0 supplier resin encapsulation Other Organic Materials supplier mold compound Epoxy Resin Proprietary f encapsulation supplier mold compound Phenol Resin Proprietary encapsulation supplier mold compound Silica, vitreous encapsulation supplier mold compound Carbon black encapsulation supplier mold compound Bismuth (Bi) BBB 0 BBB BBB BBB

7 solder paste Solder 0 solder connections coating Solder 0 supplier solder alloy Tin (Sn) connections coating R solder alloy Lead (Pb) connections coating supplier solder alloy Copper (Cu) connections coating supplier solder alloy Silver (Ag) connections coating supplier solder alloy subelement 0 0 Ceramic isolator subelement Sub element

8 Subelement