ZENIGATA LED User's guide

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1 ZENIGATA LED User's guide

2 Outline SHARP high-powered ZENIGATA LED, comprising LED chips mounted on an 18mm-square ceramic substrate, ensures broad luminous flux, high light-emitting efficiency and radiation performance, and achieves high reliability. Z ENIGATA LED is suitable for lighting apparatuses shown below. Incandescent lamp Spotlight Downlight Pendant light Landscape light Road lighting Since the light emission from ZENIGATA LED includes less infrared light (heat ray) than that from a conventional incandescent lamp, ZENIGATA LED is adaptable to the lighting of commodities susceptible to damages caused by temperature rise. It is also suitable for the lighting of goods of concern Comparison of power consumption for bad influences due to ultraviolet ray, including discoloration, since the light from ZENIGATA LED is 20W free from ultraviolet ray. In these days, amid mounting environment concerns, light sources having broader luminous flux per electric power and longer service life leading to less 10W replacement intervals are required. LEDs, having features such as superior light emitting effi ciency and 4W longer life allowed by high reliability, are expected to make contributions to environmental conservation, including energy-saving and reduction of wastes. ZENIGATA LED, combining favorable features of LEDs, such as high light-emitting effi ciency and longer life, has potential of an environmental-friendly key lighting device in a new era. Incandescent lamp power supply officiency. LED Power consumption decreased to approx. one fifth * It is estimated only by LED device, not including This guide introduces characteristics of ZENIGATA LED and describes some notes on use showing reference case examples. Environmental performance 1 ZENIGATA LED, contributing to reduction of CO 2 consumption arise from lighting, is free from lead, mercury, and cadmium, and observes ROHS Directive.

3 ZENIGATA LED Lineup Four types of colors are available in 3.6W and 6.7W. Power consumption (Forward voltage, forward current) 3.6W (10.2V 360mA) 6.7W (10.5V 640mA) Color Color temp. (TYP.) Luminous flux (TYP.) Average color rendering index (Ra TYP.) Model White 5 000K 280 lm 60 GW5BWC15L02 Warm White 2 800K 200 lm 70 GW5BDC15L02 High CRI 5 000K 190 lm 90 GW5BNC15L02 High CRI 6 500K 190 lm 90 GW5BNC15L12 White 5 000K 540 lm 60 GW5BWF15L00 Warm White 2 800K 400 lm 70 GW5BDF15L00 High CRI 5 000K 350 lm 90 GW5BNF15L00 High CRI 6 500K 350 lm 90 GW5BNF15L10 * The case temperature Tc, 25 C, is the value measured 20ms after rated current is applied. * The values of forward voltage, luminous flux, and average color rendering index Ra are references, and are not guaranteed. Comparison of hue between White, High CRI and Warm White White High CRI Warm White 2

4 Confi guration and wiring of ZENIGATA LED ZENIGATA LED comprises 30 pcs. (3.6W) or 48 pcs. (6.7W) of LED chips mounted on an 18mm-square ceramic substrate. For 3.6W type, three LED chips in series and ten in parallel are arranged. For 6.7W type, three LED chips in series and sixteen LED chips in parallel are arranged, as shown in the internal circuit drawing below. Anode (Connection terminal) (2 φ2.7) (φ22.0) Fixing screw position M2.6 screw head dia.:4.5 mm or less Fluorescent material area (emission area) (0.75) (16.26) (11.5) 18.0± (1.4) (11.5) 18.0±0.15 Cathode (Connection terminal) (1.5) (0.5) Internal circuit Anode 3.6W Cathode 3 series 10 parallel=30 pcs. chips Anode 6.7W Cathode 3 series 16 parallel=48 pcs. chips 3

5 Characteristics of ZENIGATA LED The characteristics shown below are the values measured at Tc = 25 C. They are references, and as for the distribution of the characteristics, consult us. Forward current-luminous flux characteristics (Tc=25 C) 120% 100% 3.6W Type 80% 60% 6.7W Type 40% Relative brightness 20% 0% Forward current IF (ma) Forward voltage VF (V) Forward current-forward voltage characteristics W Type (Tc=25 C) 6.7W Type Forward current IF (ma) Directional characteristics Direction y Relative brightness (%) Direction x

6 Temperature characteristics of ZENIGATA LED Since the luminous flux, forward voltage and color of LED fluctuate depending on the temperature, temperature (range) in actual use must be recognized for design. Be sure to design it so that the temperature is within the range shown in page7. Relative brightness Increase in temperature or current may accelerate degradation of LED, and lead reduction of light emission and effi ciency, and fl uctuation in color temperature. Thus, operation of LED in high temperature is unfavorable, and suffi cient provision of radiation design by heat sink is recommended. Case temperature Tc-Luminous flux characteristics (3.6W: IF=360mA) (6.7W: IF=640mA) 120% 110% 3.6W Type 100% 90% 6.7W Type 80% 70% 60% 50% Case temperature Tc ( C) Forward current VF (V) Case temperature Tc-Forward voltage characteristics (High CRI type) (3.6W: IF=360mA) (6.7W: IF=640mA) 6.7W Type Case temperature Tc ( C) 3.6W Type Color temperature Tc (K) Case temperature Tc-Color temperature characteristics (3.6W: IF=360mA) (6.7W: IF=640mA) W Type 3.6W Type Case temperature Tc ( C) y Case temperature Tc-Color range characteristics W Type 90 C 90 C 60 C 60 C (3.6W: IF=360mA) (6.7W: IF=640mA) 25 C 25 C 30 C 0 C 30 C 0 C 3.6W Type x 5

7 Reliability of ZENIGATA LED As ZENIGATA LED is developed for lighting, ceramic substrate and resin are adopted for ZENIGATA LED to prevent of reduction in brightness during use in a long period. The graph below shows fluctuations in luminous flux. As shown in the graph below, the luminous flux is restrained for a long period, and it proves high reliability of the ZENIGATA LED. Long term operating test IF = 400mA Tc = 90 C 110 Relative Luminous Intensity [%] operating time [h] 6

8 Heat design of ZENIGATA LED Operation temperature of ZENIGATA LED is detected at the soldering pad position as case temperature Tc. When mounting ZENIGATA LED, case temperature Tc must be controlled within the forward current reduction curve. Case temperature measuring point + Forward current IF (ma) Forward current reduction curve W 3.6W Case temperature Tc ( C) Since ceramic is an insulating substrate, ZENIGATA LED can be directly mounted on a heat sink. To make sure heat radiation, radiation silicone paste or radiation sheet must be insulted between ZENIGATA LED and heat sink. The drawing left below shows the mounting status. Viewing through thermography, it shows temperature of ceramic substrate portion is close to that of heat sink. It means heat generated from LED translates to heat sink smoothly. ZENIGATA LED Screw Radiation sheet Heat sink T~25 C after 30min. 360mA operation. 50mm h30mm 7 Solution with Ryosan Company, Limited

9 Optical design of ZENIGATA LED Light from ZENIGATA LED can be controlled by using lens or refl ector. Heat such as downlight, requires higher lighting intensity underneath, the following lens or refl ector can be useful. Heat radiation can be also ensured by adopting an aluminum refl ector. For an application such as light bulb, glass ball diffuser enables soft lighting lx 500 lx 30 No reflector Reflector Type-2 Distribution of lighting intensity measured at the point from light source by 1m when using 3.6W White ZENIGATA lx 600 lx lx 250 lx 250 lx 500 lx 600 lx 90 Refl ector type1 1 Lens type1 1 Lens type2 2 Glass ball diffuser Beam Spot Beam Shape *1: Solution with Diffractive Optics Ltd. *2: Solution with IDEALED S.R.L 8

10 Chromaticity distribution (Chromaticity coordinates) BW:Normal White BN:High CRI 5 000K BD:Warm White BN:High CRI 6 500K Circuit Design ZENIGATA LED is used for applications such as bulb, dawn light and street light by optimum circuit design. Constant voltage power supply runs off more than specified current amount due to lowered VF caused by temperature rise. Constant current power supply is recommended to drive. In designing a circuit, please make sure not to give reverse voltage to the LEDs at any time. When ZENIGATA LEDs are connected in series, adapt protection device like zener for each ZENIGATA LED. Make sure to be confident of the safety standards or regulations in each location and area. Featured Application 9

11 Precautions Usage conditions The products are not designed for the use under any of the following conditions. Please confirm their performance and reliability well enough if you use under any of the following conditions; In a place with a lot of moisture, dew condensation, briny air, and corrosive gas (C1, H 2 S, NH 3, SO 2, NO X, etc.). Under the direct sunlight, outdoor exposure, and in a dusty place. In water oil, medical fl uid, and organic solvent. Installation Material of board is alumina ceramic.if installed inappropriately, trouble of no radiation may occur due to board crack.please take particular notice of install method. Further information on installation, refer to the following cautions. Apply ether screws or adhesives, or both of them when installed to heat radiator. In case of applying adhesive only, check the effectiveness before fi xing. In case of screw, apply thread locker in order to prevent loosening. If LED comes off from the heat radiator, unusual temperature rise entails hazardous phenomena including device deterioration coming off of solder at leads and emitting smoke. Screw torque:within 0.2Nm If it is ineffi cient to tighten screws, apply locker to prevent loosening. It is recommended to apply screws which use low corrsive materials such as Stainless steel. Avoid applying fl at-head screws, which cause board crack due to applying stress to screw holes. Avoid convexly uneven boards. Those convex boards are subject to crack when tightening screws. It is recommended to apply thermal conductive sheet or grease with adhesiveness and heat radiatingadhesives, because of thermal and mechanical combination between module and heat radiator. However, depending on their thickness, board crack may be entailed by warped board, which is caused when tightening screws.so please check your actual conditions carefully as for the screw torque. Connecting method In case of solder connecting method, apply solder to the leads by soldering iron with thermo controller(tip temperature380 C), within 10seconds per one place. Put the board on materials whose conductivity is poor enough not to radiate heat of soldering. Avoid touching yellow phosphor with soldering iron. This product is not designed for refl ow and fl ow soldering. Safety Looking directly at LEDs for a long time may result in hurt your eyes. In case that excess current(over ratings)are supplied to the device, hazardous phenomena including abnormal heat generation, emitting smoke, or catching fi re can be caused. Take appropriate measures to excess current and voltage. In case of solder connecting method, there is a possibility of fatigue failure by heat. Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact. Please confi rm the safety standards or regulations of application devices. 10

12 Electro Components Web site (Notice) In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. The contents of this catalog as of November 2008 [Ref. No. LED-GM08111]

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