Great Team Backend Foundry, Inc. ltd.com
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1 Great Team Backend Foundry, Inc. ltd.com 1
2 A leader of semiconductor packaging and tes?ng services, specialized in power management, small signal, discrete and control ICs packages. 2
3 Date of Founded May/21/2001 Paid in Capital : USD 42.4 Million Major Shareholders: Etron, Pouchen, Hotung Chairman : Max Wu C.E.O. : Craig Tzeng President : Johnson Tzu No. of Employee : 1,000 (Apr 2011) Factory Space : 11,000 Square Meter Current Maximum Capacity : 210KK/month Manufacturing Facility Dong Guan, Guang Dong, China URL : ltd.com 3
4 Increase produc?vity and cost effec?veness to achieve high profitability and maximize total return. Ensure high growth to increase market share in Power management Increase produc?vity and cost effec?veness to achieve high profitability and maximize total return. Establish long term partnership with customer, vendors and employees for mutual gains. 4
5 To provide the total solu?on of development, produc?on, logis?cs and drop ship for packaging and tes?ng service. 5
6 Passed Delphi Manufacturing Capability Assessment Audit Passed Panasonic Automo?ve audit Passed Alpines audit 6
7 Package Jun 2001 Dec 2002 Feb 2003 May 2004 Nov 2005 May 2007 Aug 2007 Aug 2008 Aug 2010 Oct 2010 May 2011 Aug 2011 Technology Aug 2006 Aug 2008 Apr 2009 Aug 2010 Incorporated in BVI Mass produc?on TO 252 package Introduced SOT 89 package Introduced SOT 23 package Introduced SOP 8 package Introduced TO 220 and TSSOP 8 packages Introduced SOT 223 package Introduced TO 220F and PPAK (DFN 5x6) packages Introduced Micro 3 package Introduced DirectFET (customized Package) Introduced TO 247 package Introduced QFN Package New technology AL ribbon mass produc?on. ABC Cu wire bonding IP registered Mass produc?on ABC Cu wire bonding Mass produc?on Full Cu Wire bonding 7
8 Current Products TO series : TO252, TO220/FP, TO263, TO2477 SO series : P/SOP8L, TSSOP8L SOT series : SOT223, SOT89, SOT2X (EIAJ/JEDEC), SC70 DFN : 5x6 PPAK 8L QFN : 2x2, 3x3, 4x4, 5x5 DirectFET: Large(6.95x9.1),Medium(4.9x6.3), Small(3.8x4.8), Tiny(2.9x4.0) 8
9 Wire Bond Die Bond Die Saw Molding Central Isle Pla?ng (Out source) T/F Tes?ng & Packing Rel. Lab. 9
10 Die Ajach Epoxy Solder Eutec?c Wire Bond Au ABC / Cu Al wire & Ribbon MCM LF Base Laminate Base Die ajach : Epoxy + Solder Wire bond : Au/ Cu + Al wire / ribbon Packing Tape & Reel Tube Tray Tes?ng Analogue IC Power Discrete Mix Signal 10
11 Reliability MSL L1 Performance Small Form Factor Solder, Epoxy, Eute;c Bond Ribbon Bond Mul? chip packaging Al wire, Al Ribbon, Cu wire, Au wire Cu Clip QFN + MCM LGA + MCM Flip Chip Thin Wafer Flip Chip WCLSP Low Cost Ribbon Bond Thin Wafer Cycle?me CP Thin Wafer Ready Wafer Thining Back side metal pla;ng
12 Current Products TO series : TO252, TO220/FP, TO263, TO2477 SO series : P/SOP8L, TSSOP8L SOT series : SOT223, SOT89, SOT2X (EIAJ/JEDEC), SC70 DFN : 5x6 PPAK 8L QFN : 2x2, 3x3, 4x4, 5x5 DirectFET: Large(6.95x9.1),Medium(4.9x6.3), Small(3.8x4.8), Tiny(2.9x4.0) 12
13 13
14 High thermal performance Low Rdson High density SOT Series TSSOP SOT 223 SOT 23/25/26 SC70 SOT 89 QFN For wire bonding QFN / LGA MCM SOP Series SOP 8 SOP 14 SOP 16 PSOP 8 MSOP 8 PPAK For ribbon bonding IGBT Module Rail TO Series TO 252 TO220/FP TO263 TO247 TO Series TO247 IPM IPM Auto 1 st half nd half st half nd half ~ 14
15 TSSOP 8 2 to 3 Die MCM QFN Ribbon+Ball bond 2 to 3 Die MCM Lower Resistance PSOP8 2 to 3 Die MCM Ribbon on chip QFN Dr. MOS Copper bond Ribbon bond QFN Buck converter Copper bond Ribbon bond CLIP bond Flip Chip PSOP8/SO8 2 to 3 Die MCM D2PAK/DPAK 2 to 3 Die MCM Power Module SiP Integrate with IGBTs, Diodes and drivers Transfer mold Passive components IGBT Module MCM with cas;ng Vacuum soldering Today 1 st half nd half st half ~ 15
16 To support the market requirements Will heavy invest into high power packages ( IGBTs, IPMs etc,) Improve thermal performance for high temperature MCM applica?ons We offer our customers joint development and modifica?on for New packaging technology development ( MCM & power packages etc. ) Joint test program development for quality improvement For improvement of thermal performance and characteriza?on Dedicated customer lines ( high IP protec?on) Secure Quality due to permanent customer survey at the facility Excellent trained workforce Logis?c : Drop shipment and HUB management 16
17 Great Team Backend Foundry, Inc. B, gbm Park,.Yue Yuen Industrial Estate, Huang Jiang Zhen, Dong Guan City, Guang Dong Province, China Tel , Fax E mail Grace_Wu@gtbf ltd.com ltd.com European Representa?ve HTC Ernst.Weissbach e.k T: eaweissbach@htc weissbach.com weissbach.com 17
18 Our management philosophy is to be truly customer oriented by providing highly reliable product quality and con?nuous improvement in order to achieve total customer sa?sfac?on and cost effec?veness Service is our mojo 18
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