MIL System Overview EEE Parts

Transcription

1 1 MIL System Overview EEE Parts

2 CONTENT 2 MIL system & DSCC MIL system & documentation MIL-STD example: MIL-STD-883 Screening tests Qualification and Quality Conformance Procedures General Specifications Detail Specifications Quality levels: recapitulation "From QPL to QML" Conclusion and analysis

3 MIL System & DSCC DoD Department of Defense 3 DLA Defense Logistics Agency 4 Supply Centers: DSCP Defense Supply Center, Philadelphia DSCC Defense Supply Center, Columbus DESC Defense Energy Support Center - Standardization & Procurement of military parts for the US Armed Forces, including Space Community (NASA) - MIL system documentation - Manufacturers audits (QPL/QML) DSCR Defense Supply Center, Richmond - Quality levels: based on screening level for active parts / based on reliability performance for passive parts

4 MIL system & Documentation 4 Handbooks: MIL-HDBK -... Guidance (and not requirements) on procedural, technical or design information Military Standards: MIL-STD -... Test methods for qualification and screening General Specifications: MIL-M-..., MIL-PRF-...,... Generic specifications covering requirements and test procedures common to a part family QPL: Qualified Part List QML: Qualified Manufacturer List Detail Specifications: Slash sheets, SMD

5 MIL-STD example: MIL-STD Environmental tests Mechanical tests Electrical tests (Digital) Electrical tests (Linear) Test procedures - TM 5004: Screening Procedures - TM 5005: Qualification & Quality Conformance Procedure

6 MIL-STD example: MIL-STD Cont' 6 Screening tests: Test Method (TM) quality levels (classes): B ("Military") & S ("Space") Refers to test methods. Example: Pind Test, method 2020

7 MIL-STD example: MIL-STD Cont' Qualification and Quality Conformance Procedure - TM groups of tests and inspections: A, B, C, D, E intended for use in initial qualification, requalification (if product or process changes), and periodic testing for retention of qualification (QCI: Qualification Conformance Inspection) 2 classes: class S (Space level) and class B (military level) 7 Performed on each delivery lot (on samples) Performed periodically (3/6months) (not necessarily on delivery lot) Group A Group B Group C Group D Class S &B: Electrical Tests - Table I Class S: Package tests (physical dimensions, Resistance to solvent, solderability, bond strength, seal...) + Life test - Table IIa Class B: Package tests (Resistance to solvent, solderability, bond strength) - Table IIb Class B only: Life test, as already included in table IIa for Class S (group B) - Table III Class B & S: Package tests - Table IV Group E Radiation Hardness Assurance (RHA) tests - Table V

8 General Specifications Old spec : MIL-M-xxx, -C-xxx,... (still applicable for some families) => "New spec": MIL-PRF-xxx PRF = Performance - To reflect acquisition reform : Don t tell the manufacturers how to manufacture their parts, just tell them how you need the parts to perform => from QPL to QML (Qualified Part list / Qualified Manufacturer List) MIL-PRF-38535: "General Specification for Integrated Circuits (Microcircuits) Manufacturing" - Superseding MIL-M Quality levels: classes M, N, T, Q, V (also called QML-N, -M, -T, -Q, -V ) - Refers to MIL -STD-883 Test methods Class M: covered by MIL-PRF appendix A. Class M products require a vendor self certification, not a DSCC certification. DSCC performs verification audit of M level suppliers. Documented in a SMD. Class N: plastic parts. Covered by tables for plastic parts called out in MIL-PRF Class T: Satellite and similar applications: Class T performance is defined in the manufacturer s QM plan and approved by the qualifying activity. Documented in a SMD. Class Q: Hermetic (non plastic) products. Military level covered by MIL-PRF main body + appendixes C, D, E, F, G, H, J. Documented in a SMD. Class V: Space level: class Q + appendix B requirements. Documented in a SMD. Q & V = main used levels QML Q Class B ("Mil") / QML V Class S ("Space") BUT Q & V level devices may have optimization of test (test elimination, lower cost...), due to years of data on production (with DSCC approval). => QML approach. Class M: manufacturer not qualified & certified by DSCC, but "self certified 883B", with DSCC validation audit. No test optimization (all "883B tests" must be performed). 8

9 General Specifications - Cont' 9 MIL-PRF-19500: "General Specification for Semiconductor Devices - Superseding MIL-S Quality levels: classes JAN, JANTX, JANTXV, JANJ, JANS - Refers to MIL -STD-750 Test methods Class JAN: Military level QCI Only Class JANTX: Screening and QCI without Visual inspection Class JANTXV: JANTX with Visual inspection Class JANJ: Space level product as defined in the specification sheet that shall be capable of passing the test and inspections in Appendix E for JANTXV as a minimum. Not available for all semiconductor devices. Class JANS: Highest Space level product

10 Subordinate to generic specifications: Detail Specifications ICs: slash sheets MIL-M-38510/xxx & SMD (Standard Microcircuit Drawing) 5962-yyyy Discrete: MIL-PRF-19500/xxx Passive: MIL-PRF-zzzzz/xxx 10 Give parametrical and functional limits, RHA (Radiation Hardness Assurance) level, test conditions, package dimensions... SMD Example: Driver 90C32 NSC QFA NSC Aeroflex UTMC

11 Quality levels: recapitulation Integrated circuits and discrete parts: based on screening level 11 Part type Generic Specification Military level Space level Integrated circuits MIL-M (old spec.) Class B Class S /883B Integrated circuits MIL-PRF QML Q Class M QML V Hybrid integrated circuits MIL-PRF Class H Class K Discrete parts MIL-PRF JANTXV (= JANTX + internal visual inspection) JANS Passive Parts: based on reliability performance => "Established Reliability" (ER) Definition: "The reliability rating are established on the basis of life tests for Failure Rate Levels (FRL's) ranging from : a. 1.0 percent per 1,000 hours to percent per 1,000 hours in accordance with MIL-STD-690. These FR levels are established at a 60-percent confidence level and are maintained at a 10-percent producer's risk (Exponential distribution). b. 0.1 percent per 1,000 hours to percent per 1,000 hours at a 90-percent confidence level (Weibull distribution)." More used = C & D for Weibull FRL R & S for Exponential FRL

12 "From QPL to QML" 12 QPL: Qualified Part List Old system based on a part by part qualification QML: Qualified Manufacturer List This new system (1991) is process oriented and allows device manufacturers to qualify an entire line TRB system ( Technical Review Board ): periodical data review and management of eventual process changes (design, Technology, screening, QCI...) First QML devices = microcircuits => specified on SMDs - Written by manufacturer Extended to 3 families => 4 QML lists: QML-19500: QML-31032: QML-38534: QML-38535: Semiconductor Devices Printed Circuit Board/Printed Wiring Board Hybrid Microcircuits Advanced Microcircuits Main change: allows flexibility to qualified & certified manufacturers, from the baseline defined in MIL-STD-xxx Test Methods => test optimization

13 Conclusion and analysis 13 MIL system is widely used for EEE parts selection in CNES and European Space Projects Class 1 & 2 projects (low risk): S/V level or JANS Class 3 & 4 projects (risk-cost compromise): B/Q level or JANTXV MIL-STD-883 (ICs) and MIL-STD-750 (discrete) specifications are reference documents for test methods, also in ESCC documents BUT, questions are open concerning quality level of MIL products, compared with ESCC products, mainly for QML Q/V level for which manufacturer is authorized to suppress some tests. Indeed, it is difficult, today, to know which tests have been suppressed...