ON Semiconductor Packaging and Labeling Guidelines

Transcription

1 ON Semiconductor Packaging and Labeling Guidelines Table of Contents Ver Table of Contents...1 Changes and Actions Requires...1 Definitions...3 MPN Label...3 Shipping Label...4 CPN Label...5 Dry Pack Labeling...6 Packaging and Graphics...7 Packing List & Certificate of Compliance...9 CHANGES and ACTIONS REQUIRED Change: ON Semiconductor s standard packaging and labeling will begin to replace AMI Semiconductor (AMIS) packaging and labeling as early as November The full transition to ON Semiconductor s packaging and labeling will go into full effective February 28, Actions Required: No actions are required by customers. We simply want to make you aware that the products you order from ON Semiconductor that were acquired from AMIS will begin to be delivered in boxes with ON Semiconductor logos and labeling.

2 DEFINITIONS MPN Label: A bar code label containing the ON Semiconductor Manufacturer Part Number of the device and other traceability information. Label dimensions are 1.625" x 4.9" (41.3 mm X mm). CPN Label: A bar code label containing the Customer part number of the device and other traceability information. Label dimensions are 1.625" x 4.9" (41.3 mm X mm). Intermediate Box: The box that houses the reel or tube(s) containing product. Each Intermediate Box will have an MPN Label and a CPN Label when required. Shipping Label: A bar coded label used to identify the contents of a shipping container. This also contains a "ship to" name and address. Label dimensions are 4.5 X 6.5 (114.3 mm X mm) Overpack Box: The box that contains one or more Intermediate Boxes. Each Overpack box will have a Shipping Label.

3 LABELS MPN Label Each Intermediate Box will have a standard ON Semiconductor MPN Label. The label consists of the following elements: Field Name MPN (1P) * LOT (IT) * DTE (9D) * Quality (Q) * SERIAL NBR(S) * Assy in CS Custom Source Pb Free Logo 2LI e category RoHS=Y MS LEvel Temp Hours Sealed * -- Bar Coded Fields Description Manufacturer Part Number Lot Number Date Code(s) Quality in a container Unique serial comprised of two-digit site code, two-digit year, and fivedigit incremental number. Country of assembly Two-digit country code of wafer fabrication Indicates if material is Pb free (lead free) Indicates type of second level interconnect plating Indicates if material complies with Europe RoHs Moisture Sensitivity Data Temperature Hours Sealed Date Sample MPN Label

4 Shipping Label Each Overpack will have a standard ON Semiconductor shipping label. The label consists of the following elements: Field Name FROM SHIP TO MPN FO (3S) PKG ID * (K) TRANS ID * (P) CUSTOMER PROD ID * (Q) QUALITY * (13Q) PKAGE COUNT * (S) Serial # * (No Header) COO Assy (No Header) * -- Bar Coded Fields Description ON Semiconductor return address Customer Name and Address Manufacturer Part Number Factory Order Number; Line Item; Factory Order Sub Job ON Semiconductor UCC code, packing List number and three-digit package number Purchase Order Number Customer Part Number Package Quantity Which package out of the total number of packages in the shipment. Packaging List number + which package out of the total number of packages in the shipment Various Environmental Logos [see below for logo definitions] Country of Origin based on Assembly, with the two-digit ISO Country Code. If there are multiple countries of origin, the word MULT will be printed in this space Customer Code Sample Shipping Label: ON Semiconductor Internal Use

5 CPN Label Some Intermediate Boxes may have a standard ON Semiconductor CPN Label. The label consists of the following elements: Field Name CPN (P) * QTY (Q) * VDR (2V) * DTE (9D) * MPN * -- Bar Coded Fields Description Customer Part Number Quantity of container UCC Vendor Code for ON Semiconductor Date Code(s) Manufacturer Part Number Sample CPN Label:

6 DRY PACK LABELING For product requiring dry packing, CPN labels will be included per the following process: CPN Label 1 will be permanently affixed on the outside of the dry pack bag above the MPN label. CPN Label 2 will be a REMOVABLE (peel and stick) label that will be placed on the outside of the dry pack bag CPN Label 3 will be permanently affixed on the outside of the intermediate carton Sample Dry Pack Labels and Example:

7 Packaging and Graphics Shipments from ON Semiconductor will follow the company s standard packaging process. The Overpack box may contain multiple Intermediate boxes of a single product. For each line item on an order that is shipped, there will be at least one Overpack Box [more if the quantity of Intermediate Boxes exceeds the capacity of the overpack box]. Any Overpack Box will contain one and only one part number, but may contain varying lots and date codes based on the content of the Intermediate Boxes. In Q1 2009, ON Semiconductor will integrate AMIS ERP systems and convert inventory. Throughout Q and Q1 2009, ON Semiconductor will be converting the Intermediate Box Packaging to ON Semiconductor Standards with ON Logos and Graphics. Subsequently, there will be a variety of packaging, labeling, graphics and device marking combinations as outlined in the two matrices below: Before System s Integration Overpack Box Logo None None None None Overpack Shipping Label AMIS AMIS AMIS AMIS Intermediate Box Logo None None ON ON Intermediate Box Label AMIS MPN/CPN AMIS MPN/CPN AMIS MPN/CPN AMIS MPN/CPN Primary Package Label AMIS MPN/CPN AMIS MPN/CPN AMIS MPN/CPN AMIS MPN/CPN Device Marking AMIS ON AMIS ON After Systems Integration Overpack Box Logo None None None None Overpack Shipping Label ON ON ON ON Intermediate Box Logo None None ON ON Intermediate Box Label ON MPN ON MPN ON MPN ON MPN Primary Package Label ON CPN ON CPN ON CPN ON CPN Device Marking AMIS ON AMIS ON Future Steady State

8 Samples ON Semiconductor Intermediate Boxes showing Graphics: Tube Box Pizza Box

9 Packing List and Certificate of Compliance The primary Overpack box will contain a packing list detailing the contents of all Overpack boxes in the order. The Packing List contains ON s standard Certificate of Compliance. The label consists of the following elements: Bar Code and Text Text Field Name Ship From Ship T o Bill To Customer code End Customer PO No. S/B F/O S/J L/L Purchase Order Date Customer Req. Date Manufacturer P.D. Date CSD FOB TERMS Ship VIA PKG# Weight Waybill Number Lot Number Quantity Date Code Assembly Location Die Origin (2V) Vendor ID (11K) Packing List (4S) Package ID (K) Transit ID (P) Customer Prod ID (1P) Manufacturer Part Number (Z) Parcels (2Q) Total Weight in KG (Q) Qty This Shipment (13D) Date Code Description ON Semiconductor Return Address Customer s Name and Address Customer s Billing Address ON Semiconductor designated customer identifier Issuing Customer purchase order number Pick Bank (formerly called Source Bank) Sales Order (formerly called Factory Order) Sub Job (3 maximum sub jobs, then prints multiple) Sales Delivery (formerly called Line/Line) (3 maximum deliveries, then prints multiple) Purchase Order Issuance Date Customer Required Date Manufacturer Planned Delivery Date Customer Schedule Date Freight On Board Customer takes possession at the location specified Freight shipping terms (who pays the freight) Carrier or Freight Forwarder Shipment package number Package weight in pounds and kilograms Shipper identification number for that shipment used for tracking Product manufacturing lot number Manufacturing lot quantity Manufacturing dates Manufacturing Location Die Fabrication Location ON Semiconductor UCC number or Customer assigned Vendor Code Packing List number (ON Semi pickref) Vendor ID and packing list number Customer's purchase order number Customer Part Number ON Semiconductor Part Number Total box count Total Package weight of shipment in kilograms (weight in pounds listed above kg) Package Quantity Product dated code(s)

10 Sample Packing List: Certificate of Compliance