X-Series. Cost-effective Pick & Place for high-mix, small batches

Transcription

1 X-Series Cost-effective Pick & Place for high-mix, small batches

2

3 Contents 4 5 Introduction 6 X-Series overview 7 Example of mounted components 8 9 X-Series standard features Opal-X II Topaz-X II Emerald-X II Options and accessories 18 Production enchancements 19 Flexible programming 20 Flexible setup 21 Fast changeover Standard & optional features 24 X-Series specifi cations 25 Installed Base Solutions (IBS) 26 Guaranteed solutions... in a fast-changing world 27 Global vision... for a fast-changing world P 3

4 The fastest way from CAD data to first products Lean manufacturing benefi ts from fast ramp-up of new applications. The Assembléon X-Series provides this. The X-Series modules (Opal-X II, Topaz-X II and Emerald-X II ) complement each other to deliver a cost-effective, Pick & Place platform for lowto medium-volume manufacturing at up to components per hour (cph). Machines are easily optimized for high feeder count, and large boards you simply mix and match modules to suit. If you need to develop and produce new applications quickly, the X-Series speeds up the route from CAD data to fi rst products. New jobs can be set up offl ine or on the machine. And once programs are optimized, data is centrally stored to guarantee the correct program and vision information is loaded each time.

5 Performance guaranteed Assembléon s X-Series placement modules need little introduction in the world of surface-mount assembly. Our top-of-the-range Topaz model has been in production for nearly a decade, having gone through several developments during that time to keep it at the leading edge of surface-mount Pick & Place solutions. Electronics manufacturers throughout the world look upon the Topaz as the workhorse of the electronics assembly industry, impressed by its affordability, reliability, speed and outstanding quality of placement. An installed base of more than 7000 systems worldwide provides proof of the confi dence manufacturers have in the performance of the Topaz and in its ability to keep their production lines running 24/7, year-in, year-out. The latest version, the Topaz-X II has an output of up to components per hour with a chip-placement accuracy of 50 µm and a standard board size of 460 x 440 mm. The even more affordable Opal-X II is basically a scaled-down version of the Topaz-X II with slightly lower component output but with the same placement accuracy and board size. Both systems place everything from components to large CSPs, Flip Chips, BGAs and fi ne pitch QFPs. And for non-standard components, you can choose the Emerald-X II, designed to handle odd-shaped components up to 20 mm tall. P 5

6 X-Series Topaz-X II Opal-X II Speed Emerald-X II Chips ICs Flip chips Odd form Technology Opal-X II Excel today... expand tomorrow 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X with 4 heads) 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X with 8 heads) (0402) - 45 mm sq. (1.8 sq.) Fine Pitch Accuracy: 35 3 sigma 100 mm (4 ) long connectors Centralized network database Max 100 reels & 120 trays On-machine inventory tracking Remote diagnostics Topaz-X II One machine does it all! 15.4k / 20k cph (IPC 9850 / rated) (0402) - 45 mm sq. (1.8 sq.) Fine Pitch Accuracy: 35 3 sigma 100 mm (4 ) long connectors Centralized network database Max 90 reels & 120 trays On-machine inventory tracking Remote diagnostics Emerald-X II Ultra accurate fi ne pitch and odd form placer 5.9k / 6.8k cph (IPC 9850 / rated) (0402) - 54 mm sq. (2.1 sq.) Fine Pitch Accuracy: 30 3 sigma 100 mm (4 ) long connectors, odd form, fl ip chips Centralized network database Max 90 reels & 120 trays On-machine inventory tracking Remote diagnostics

7 Example of mounted components Actual example of: 0201 chips mounted (clearance: 0.1 mm) 0402 chips mounted (clearance: 0.1 mm) 0201 chips mounted (clearance: 0.5 mm) 0402 chips mounted (clearance: 0.5 mm) max 4 long connectors and odd form components Reverse side of CSP (micro BGA) Flip chips Reverse side of BGA P 7

8 X-Series standard features 1 Common platform Because the Opal-XII, Topaz-XII and Emerald-XII share the same frame size, these units can be easily moved in and out of lines, mixing and matching capabilities and speed requirements to suit production requirements. 2 High-rigidity frame High precision monocoque frame Computer aided structural analysis and years of experience Unsurpassed stability for optimal placement accuracy 3 Three stage conveyor Sub-stop, Main stop, and Exit stop Entrance and Exit stop provide buffer function Adjustable stops minimize load and unload times Pick process begins before board is fi xed (precede-pick) 4 Location pins and edge clamping Stable board positioning for maximum placement accuracy Edge clamping eliminates the need for tooling holes in boards Allows component mounting to the extreme edge of the board 5.1 Automatic conveyor width adjustment Mounting program initiated adjustments for fast changeover Servo-controlled board width adjustment Board clamping minimizes board warpage 5.2 Automatic board thickness compensation Servo-controlled board support Magnetic support pins for easy re-confi guration Mounting program initiated adjustments for fast changeover 6 Extremely rigid dual drive Dual synchronized Y axis motors NSk guide rails and ball screws for maximum durability AC servo motors for minimum maintenance Selectable X / Y axis speed per-component type 8 User interface XII machine with standard user interface and optional fl at panel touchscreen display. X axis beam 7 Common feeders Pneumatic feeders for legacy compatibility Single-handed operation for fast setup Alternate feeder pick-up for maximum uptime 9 Feeder lock verifi cation Lasers ensure proper attachment of feeders Helps prevent downtime Improves pick performance

9 10 Fiducial camera Multi-angle white and IR illumination for any PCB material Recognizes regular fi ducials or artwork 4 point fi ducial correction compensates for distorted boards Bad mark recognition and teaching 11 Fiducial recovery function Operator can teach location of damaged fi ducial Eliminates the need to remove and clean the board Keeps production running even through marginal boards 12 High-resolution digital line array camera Mounting accuracy for 0201: 50 micron Mounting accuracy for QFP: -30 micron Multi-angled side illumination for any component background Automatic detection of any missing balls or damaged leads QFP image with multi-angle illumination on line array camera 13 New vision system High speed image processing Camera vision compensates for off-center picking (adaptive pick-up) Comprehensive library of component vision fi les Comprehensive editor to program irregular ball/bump patterns BGA image with side illumination on line array camera 14 Accuracy enhancing features Gantry Mapping compensates for localized non-linearities Automatic Temperature Feedback adjusts for temperature variations 15 On-machine program generation Teach mount locations using fi ducial camera Computer guided placement verifi cation for fi rst article run Import mount and package data via CAD-to-CAD utility Create vision fi les directly in user interface Machine resident optimization package 16 Intuitive graphical Windows NT TM user interface Intuitive graphics simplify operation Easy to navigate User defi ned password for multiple users Multi-language support Easily networkable Program while running Management Information System (MIS) to gather production history data P 9

10 Opal-X II Excel today... expand tomorrow Optimal output per hour 11.6k with 4 heads, 17.7 with 8 heads IPC 9850 output per hour 9.6k with 4 heads, 13.9k with 8 heads Component range (0402) - 45" sq. (1.8" sq.) and 45 x 100 mm (4") Maximum component height 6.5 mm, with area CCD camera 15 mm (0.6") Placing accuracy at 3 sigma 50 micron for chips, 35 micron for QFPs Component feeding Max 100 reels & 120 trays Standard board size (LxW) 460 mm x 440 mm (18.1" x 17.3") Optional board size (LxW) 650 mm x 850 mm (25.6" x 33.5")

11 Start with 4 heads Minimize initial investment 32 mm head pitch for larger QFPs / BGAs expand to 8 heads Maximize output 13.9k / 17.7k cph (IPC 9850 / rated) Expandable Machine top view Opal-X II holding 3 boards Optional LCS Large Component Sequencer (LCS) 120 tray capacity Tray replenishment on-the-fl y Built-in inspection conveyor No impact on board width or feeder slots (LCS) Double shuttle traverser Two components per shuttle Presents tray components to mounting machine Eliminates waiting time for component pick-up 50 pos. 50 pos. Feeder exchange trolley Facilitates fast production run changeover Allows offl ine setup and verifi cation Automatic cable and air connection Heavy duty pneumatic cylinders lift feeder plate Self aligning mechanism provides optimal pick reliability High resolution digital camera 8 inline multi-heads move non-stop over the camera. Nozzle station 20-position nozzle station 6 nozzle types cover the complete component range Custom nozzle positions available P 11

12 Topaz-X II One machine does it all! Optimal output per hour 20k IPC 9850 output per hour 15.4k Component range (0402) - 45" sq. (1.8" sq.) and 45 x 100 mm (4") Maximum component height 6.5 mm, with area CCD camera 15 mm (0.6") Placing accuracy at 3 sigma 50 micron for chips, 35 micron for QFPs Component feeding Max 90 reels & 120 trays Standard board size (LxW) 460 mm x 440 mm (18.1" x 17.3") Optional board size (LxW) 650 mm x 850 mm (25.6" x 33.5")

13 Standard heads (SF) 8 inline heads for high-speed precision mounting CSPs can be placed continuously in sets of eight High resolution digital camera 8 inline multi-heads move non-stop over the camera. Flying Nozzle Change heads (FNC) Four of the eight heads are equipped with nozzle exchange on-the-fl y FNC occurs during return to next pick-position FNC component range: 0201 through SO20 or Machine top view Topaz X II holding 3 boards Optional LCS Large Component Sequencer (LCS) 120 tray capacity Tray replenishment on-the-fl y Built-in inspection conveyor No impact on board width or feeder slots (LCS) Double shuttle traverser Two components per shuttle Presents tray components to mounting machine Eliminates waiting time for component pick-up 50 pos. 20 pos 20 pos Feeder exchange trolley Facilitates fast production run changeover Allows offl ine setup and verifi cation Automatic cable and air connection Heavy duty pneumatic cylinders lift feeder plate Self aligning mechanism provides optimal pick reliability Nozzle station 20-position nozzle station 5 nozzle types cover the complete component range Custom nozzle positions available Nozzles on FNC heads P 13

14 Emerald-X II Ultra accurate fi ne pitch and odd form placer Optimal output per hour 6.8k IPC 9850 output per hour 5.9k Component range (0402) - 54" sq. (2.1" sq.) and 45 x 100 mm (4") Maximum component height 20 mm (0.79") (20 over 20 mm) Placing accuracy at 3 sigma 50 micron for chips, 30 micron for QFPs Component feeding Max 90 reels & 120 trays Standard board size (LxW) 460 mm x 440 mm (18.1" x 17.3") Optional board size (LxW) 650 mm x 850 mm (25.6" x 33.5")

15 Standard heads (SF) Two independently controlled servo-heads High-resolution encoders coupled to each R axis Flying Nozzle Change heads (FNC) Both heads are equipped with nozzle exchange on-the-fl y FNC occurs during return to next pick position FNC component range: 0201 through 54 mm sq. Nozzles on FNC heads or Machine top view Emerald X II holding 3 boards Optional LCS Large Component Sequencer (LCS) 120 tray capacity Tray replenishment on-the-fl y Built in inspection conveyor No impact on board width or feeder slots Double shuttle traverser Two components per shuttle Presents tray components to mounting machine Eliminates waiting time for component pick-up 50 pos. 20 pos. 20 pos. Feeder exchange trolley Facilitates fast production run changeover Allows offl ine setup and verifi - cation Automatic cable and air connection Heavy duty pneumatic cy-linders lift feeder plate Self aligning mechanism provides optimal pick reliability High resolution digital camera 2 inline multi-heads move non-stop over the camera. Nozzle station 24-position nozzle station 6 nozzle types cover the complete component range Custom nozzle positions available P 15

16 Options and accessories Internal tray feeder For one or two trays Mounted inside work envelope of machine No impact on number of feeder positions Manual tray feeder Low cost tray feeder Mounted on rear feeder bar Easily removed from feeder bar Strip component feeder For many small strips of components Mounted between rear feeder bar and rear conveyor rail Signifi cantly increases number of unique components on the machine CL/CLi tape feeders Pneumatic indexing For 8-72 mm tapes 15 reel holders Easy pitch change Optional RFID intelligence JEDEC Stacking tray feeder Easily removable from rear feeder bar Replenishment on-the-fl y Accepts standard JEDEC trays Holds up to 20 thick or 30 thin trays Auto tray stacker Single or dual tray stacker Mounted on rear side of machine Holds a maximum of 20 trays per unit Mounting heads pick directly from trays Large Component Sequencer (LCS) 120 tray capacity Tray replenishment on-the-fl y Built-in inspection conveyor No impact on board width or feeder slots Vibratory feeders Occupies 5 or 6 feeder slots Number of component lanes depends on component type Available in pneumatic and ITF versions Example shown with blank top plate with cut tubes for maximum setup fl exibility Stick feeders Available in pneumatic and ITF versions Belt and vibratory feeder available Number of component lanes depends on component type

17 Board clamping Eliminates the need for board location-holes Allows for robust board positioning Reduces the need for extra support-pins Automatic nozzle holder Larger nozzles Extra nozzles Custom nozzles QFP recovery conveyor Components rejected by vision system accumulate on conveyor belt for inspection Available in pneumatic and ITF versions Feeder exchange trolley Facilitates fast production run changeover Allows offl ine setup and verifi cation Automatic cable and air connection Heavy duty pneumatic cylinders lift feeder plate Self aligning mechanism provides optimal pick reliability Splicing tool For 8-56 mm tapes Provides reliable tape connection Minimizes production interruptions Feeder storage cart Stores up to 100 tape feeders Includes feeder stand for tape loading Available in CL / CLi and ITF versions Fast coplanarity checker Measures the coplanarity of QFPs and BGAs Cost effective 3D vision system solution Checks coplanarity on-the-fl y Area CCD camera Three versions: 32, 45, & 54 mm sq. For optimal mounting accuracy Second line array camera Mounted in rear between two 20-position feeder bars Improves output for components picked from rear feeders Touch screen interface Available for front and rear side Graphical user interface for easy learning and operation Custom nozzles / grippers Any variety of components can be picked and placed Vacuum nozzles and gripper nozzles can be designed Custom automatic exchangeable or on-the-fl y nozzles available Multi-language support Many languages supported All user interface elements presented in native languages, including help screens English, Spanish, German, French, Japanese, Chinese, Russian, Italian and many more P 17

18 Production enhancements Very large board capability Manual loading: 25.5 x 17 single pass or 25.5 x 33.5 double pass Opal-X II system confi guration with head assemblies of Topaz-X II, Emerald-X II, or Opal-X II 40 or 50 feeder positions with very large boards Large Component Sequencer (LCS) 1 x line array, 1 x area CCD and nozzle station Machine can easily be returned to inline 100-feeder-confi guration 650 mm (25.5") 850 mm (33.5") Example of RFID tag on CLi Feeder Smart feeders For compatibility with legacy systems; - Pneumatic CLi feeder Assures fool-proof setup of jobs, offl ine & online Monitors component quantities in real time Pre-empty warning: allows timely operator alerts when feeders are about to run empty. Operator feedback: - Amount of production time left - Amount of components left - Number of boards left that can still be produced Adaptive feeder trolleys Preserves your feeder investment Allows easy migration to the X II platform by utilizing your existing third party feeders When third party feeders wear out, convert your adaptive feeder trollies to accept new Assembléon feeders Example with vendor A feeders Adaptive feeder setup Ease of use Place feeders at random positions rather than pre-defi ned positions Defi ne a maximum increase in cycle time (%) Warn the operator in case the cycle time of the new setup drops by a certain percentage compared to the original program Label feeders Hover-Davis label feeder attaches directly to feeder bar Available in pneumatic and ITF versions Flash memory programming Data IO Proline Roadrunner mounts directly to machine Allows just-in-time programming of fl ash memory prior to placement Reduces inventory of preprogrammed fl ash memory

19 Assembléon Manufacturing Suite (AMS) Optimize your SMT production line s performance AMS is a set of software and hardware modules to optimize the performance of Assembléon Pick & Place solutions by streamlining setup and manufacturing for both new and existing installations. The potential cost savings allow a faster return on investment, while the performance improvements help increase your competitiveness in the global market. AMS delivers: Shorter design-to-production time Faster setup and ramp-up for different products Increased operational effi ciency, giving better profi tability More control at machine and line level Lower defect rates Excellent process visibility, allowing tighter cost management Optimized logistics fl ow Process support 1 5 The AMS software suite supports the SMT manufacturing processes shown in the fi gure above. In each process, one or more of the modules can be applied to optimize performance. 1 Data preparation creating vision fi les, carrying out data conversion and verifying components offl ine to save production time 2 Production scheduling scheduling single machines and balancing complete lines to increase operational effi ciency, minimize changeovers 3 4 Setup verification supporting verifi cation of online and offl ine closed-loop setups to save time and avoid placement errors Line control providing remote line monitoring operation to enable a single-click product changeover 5 Parts library management placement program and component-related data management system, enabling effi cient data preparation and shorter Time-to-Volume 6 7 Traceability tracking parameters like lot changes to improve quality control and to follow Work in Progress Performance analysis uploading performance analysis data to effi ciency monitoring systems 8 Parts warehousing reporting component usage and use of new reels to assist inventory control. P 19

20 Flexible setup Setup optimization Optimized feeder setup for multiple boards (common setup) Eliminates changeover time because all feeders for multiple boards are resident on machine(s) Optimize boards sequentially to reach common setup for all boards or optimize boards together by fi rst combining CAD data of individual boards Offl ine setup verifi cation Verifi cation of feeder setup: - Scan barcode(s) on component reels - Smart feeders automatically verify match between component ID and corresponding feeder slot Gain real-time knowledge of component quantities - Scan and store component quantities - Track component usage in real time - Print barcode representing remaining component quantity for future reel use Offl ine electrical component verifi cation Verifi es components values electrically Done offl ine to eliminate production impact Can verify R, C, & L components down to 0.01 pf capacitor resolution Offl ine vision preparation tool Generate vision fi les offl ine while machine is running Auto-teach function Networkable to machine Guarantees no problem fi rst article run Online setup verifi cation Graphical feeder representation: - Feeder location - Feeder status Tracks component quantities Also tracks number of components in trays Guides feeder setup process Pre-empty warning Monitors component quantities on all feeders in real time Operator feedback: - Amount of production time left - Amount of components left - Number of boards left that can be produced before one or more feeders run empty

21 Fast changeover Feeder exchange trolley Facilitates fast production run changeover Allows offl ine setup and verifi cation Automatic cable and air connection Heavy duty cylinders self align feeder plate for optimal pick reliability Optional battery back-up enables feeder pitch verifi cation offl ine Tray replenishment on-the fl y Tray sequencer has two separate sections While the machine uses components from one section, the operator can simultaneously exchange or replenish the trays in the other section Minimizes changeover time and optimizes production effi ciency Compliant auto SMT tooling system Allows fast changeover by eliminating the need to move support pins or adjust their height Improves mounting quality by ensuring board fl atness Barcode or 2D code triggered changeover Hawkeye or Omron 2D reader directly connected to machine Alternatively, a barcode Example of 2D-QR code reader can be used Reader initiates automatic program changeover Fast changeover is achieved because no operator action is required Automatic board width & board thickness adjustment Conveyor width and board support are servo controlled Mounting program initiates adjustments for fast changeover No operator action required Board clamping Eliminates the need to move board location pins Reduces board cost by eliminating the need for board location-holes Allows for robust board fi xation By sandwiching the board (= clamping the board on top and bottom), the chance for warpage is minimized Turn one production line into two lines with a split conveyor! Allows a line to function as one continuous line or as two separate lines Split conveyor used to join two machines Split conveyor used to separate two machines Board A Board A Board A Board A Board B Board B P 21

22 Standard & optional features Recognition system Feeding PCB positioning/ transport Opal-X II Topaz-X II Emerald-X II Line array camera Second line array camera Area CCD camera including illumination unit Co planarity checker Nozzle exchange station Special order nozzles S S S Fiducial camera Pneumatic tape feeder interface Bulk feeder S S S Stick feeder Large Component Sequencer (LCS) Reject station ATS 20 tray feeder portrait Double ATS 20 tray feeder portrait ATS 20 tray feeder landscape Manual tray feeder Feeder Exchange System (FES 20) Main stopper Locate pin Edge clamp system Z-servo controlled push-up plate Board clamp system Entrance sub-stopper Exit sub-stopper Automatic width adjustment High speed soft-stop conveyor Reverse transfer right to left Ceramic PCBs Special sized PCBs S S S

23 Safety Software Feeder fl oating detection Conveyor entrance/exit covers Safety cover for feeder exchange Dummy feeders Safety specifi cations according CE standards Spare parts kit + tools SMEMA kit Front and rear anti-static covers Signal tower + warning buzzer Windows NT TM graphical user interface Operating monitor LCD front side Operating monitor touch screen front side Second operating monitor Operation panel front side Operation panel rear side Multiple accuracy compensation system Fiducial recovery function Bad mark / Master mark sensing Online teaching Alternative feeder function Automatic program change Variable XY axis speed per component Online help function Management information system Template (pattern matching) Automatic rework cycle Online data generator Opal-X II Topaz-X II Emerald-X II = Standard, = Optional, S = Special order, = Not applicable P 23

24 X-Series specifi cations Opal-X II Topaz-X II Emerald-X II Optimal output per hour 11.6k with 4 heads 17.7k with 8 heads 20k 6.8k IPC 9850 output per hour 9.6k with 4 heads 13.9k with 8 heads 15.4k 5.9k Head design with SF one single beam with 4 super fi ne heads or one single beam with 8 super fi ne heads one single beam with 8 super fi ne heads one single beam with 2 heads with independent Z-servo control Head design with FNC one single beam carrying 4 standard heads and 4 heads with nozzle exchange on-the-fl y one single beam with 2 heads each carrying six nozzles, with nozzle exchange on-the-fl y and independent Z-servo control Placing accuracy at 3 sigma 50 micron for chips 35 micron for QFPs 50 micron for chips 35 micron for QFPs 50 micron for chips 30 micron for QFPs Component range (0402) to 45 X 100 mm (BGA, µbga, CSP, connector, odds) (0402) to 45 x 100 mm (BGA, µbga, CSP, connector, odds) (0402) to 54 x 54 mm, 45 x 100 mm (BGA, µbga, CSP, connector, odds) Maximum component height 6.5 mm, with area CCD camera 15 mm (0.6") 6.5 mm, with area CCD camera 15 mm (0.6") 20 mm (0.79") (20 over 20 mm) Toolbit exchange automatic nozzle or gripper exchange automatic nozzle or gripper exchange on-the-fl y nozzle or gripper exchange Maximum board size (L x W) 460 x 440 mm (18.1 x 17.3") 460 x 440 mm (18.1 x 17.3") 460 x 440 mm (18.1 x 17.3") Minimum board size (L x W) 50 x 50 mm (2.0 x 2.0") 50 x 50 mm (2.0 x 2.0") 50 x 50 mm (2.0 x 2.0") Optional board size (L x W) 650 x 850 mm (25.6 x 33.5") 650 x 850 mm (25.6 x 33.5") 650 x 850 mm (25.6 x 33.5") Board thickness 0.4 to 4.0 mm (0.016 x 0.16") 0.4 to 4.0 mm (0.016 x 0.16") 0.4 to 4.0 mm (0.016 x 0.16") Tape feeding positions (8 mm) 100 (CLi) 90 (CLi) 90 (CLi) Tray feeding LCS tray feeder with 40 pallets (120 trays) LCS tray feeder with 40 pallets (120 trays), single ATS tray feeder with 20 pallets LCS tray feeder with 40 pallets (120 trays), single ATS tray feeder with 20 pallets Other feeder options tape, stick, tray, tube, etc. tape, stick, tray, tube, waffl e pack, etc. tape, stick, tray, tube, waffl e pack, etc. Feeder trolleys 2 x 20 positions (CLi) front side (50 positions (CLi) fi xed rear side) 4 x 20 positions (CLi) 4 x 20 positions (CLi) Alignment principle line array camera, area CCD camera line array camera, area CCD camera, co-planarity check on-the-fl y line array camera, area CCD camera, co-planarity check on-the-fl y Footprint (L x W) 1650 x 1408 mm (5.4 x 4.5 ft) 1650 x 1408 mm (5.4 x 4.5 ft) 1650 x 1408 mm (5.4 x 4.5 ft) Operating system Windows NT Windows NT Windows NT

25 Installed Base Solutions (IBS) Performance Services Knowledge Services Technical Services Installed Base Solutions keeping your lines competitive Installed Base Solutions (IBS) is a unique and wide range of value-added services for existing production lines and even new machines. We offer it as part of our integrated approach to SMT assembly in order to maximize customers value of ownership. In a dynamic manufacturing environment, production requirements will change continuously; IBS is our guarantee that your machine park can be kept operating competitively at all times. IBS offers an integrated solution that combines hardware, software, training, maintenance and application support to provide continuous performance improvement and ongoing operational cost reduction: Maximizing performance continuously by: increasing line output and yield minimizing process changeover times accelerating production line ramp-ups speeding up time-to-volume offering functionality upgrades and application support to enhance machine fl exibility and extend component range. Minimizing ongoing operational costs by: preventive maintenance schemes customer training programs for effi cient use and best practices a feeder maintenance program to increase availability and ensure optimum performance 24/7 availability of spare parts and replacement modules, to minimize downtime. To meet all your needs, IBS services cover three distinct areas: Performance Services maximize machine, line and process performance. We offer added value services, hardware and software upgrades to help you optimize the output, functionality and fl exibility of your production assets. Knowledge Services reduce operating costs and boost staff efficiency. We provide training and support tools to transfer knowledge and skills to your own people. Technical Services maximize uptime and minimize cost of operation. We perform on-site and off-site servicing of your lines, from maintaining machines effectively to improving changeover times. Tailor-made solutions for either on-site or remote services can be drawn up with agreed performance parameters and process guarantees. Performance levels are regularly reviewed for value and effectiveness. In short, IBS is your passport to guaranteed manufacturing performance. And it s implemented globally by highly skilled customer service teams, available 24/7. These teams are always on-hand, living up to our promise: Performance guaranteed. P 25

26 A-Series M-Series X-Series Assembléon Manufacturing Suite Installed Base Solutions Guaranteed solutions... in a fast-changing world Original Equipment Manufacturers, Original Design Manufacturers, Electronic Manufacturing Services. Different production requirements, one common need: the guarantee of absolute reliability. Assembléon has a complete range of solutions designed and built around proven platforms, to ensure long-term reliability and fl exibility for the future. And to keep your production lines running reliably and maximize the value of ownership of your Assembléon equipment, we offer Installed Base Solutions: our unique guarantee, at machine or line level, for the best production performance. Our portfolio offers an integrated approach to SMT assembly. Comprising three lines of Pick & Place machines together with performance-enhancing software and services, our solutions cover the entire manufacturing spectrum, from small to large batch sizes and from low to high product mixes: A-Series The A-Series is an advanced solution for highest Value of Ownership on large batch production lines in high and low product mix environments. It includes remote technical assistance and optimization software to maximize utilization. It is most suitable for high placement rates up to 165k cph with the lowest dpm (defects per million) in the industry. M-Series The M-Series provides an optimum solution for manufacturing flexibility in medium to large batch, high product mix environments. It handles both complex components and odd forms with equal ease. Ideally suited for production tasks needing placement rates between 8.5k cph and 42k cph. X-Series The X-Series is the most cost-effective, all-in-one solution for small to medium batch, high product mix environments where placement rates up to 20k cph are required. It is well suited to production of large boards and the handling of odd-size components. AMS The Assembléon Manufacturing Suite (AMS) optimizes SMT production line performance on all our Pick & Place machines. It comprises hardware and software modules that seamlessly interface with each other to create a single process control environment. IBS Installed Base Solutions (IBS) is a range of value-added services for both existing production lines and new machines. Designed to keep your equipment running competitively at all times, IBS Performance, Knowledge, and Technical Services provide continuous performance improvement and ongoing operational cost reduction. Competence centers For application support, product demonstrations and services such as Installed Base Solutions, there are specialized, trained personnel located at Assembléon Competence Centers in each region of the world.

27 Global vision... for a fast-changing world Assembléon is a world leader in surface-mount Pick & Place solutions for the electronics industry. A 100% subsidiary of Royal Philips Electronics, we design and manufacture SMT assembly equipment for the global market. Our customer base includes some of the world s largest electronics manufacturers. Our market focus covers mainstream electronics industries such as consumer, mobile and automotive, as well as more specialized fi elds such as modules in the semiconductor back-end industry. Solutions through partnership Assembléon s vision is to contribute towards a seamless manufacturing supply chain that deals effi ciently with fast changing market dynamics. We aim to do this by offering fl exible, performance-guaranteed, integrated solutions, combining proprietary technologies with customer-oriented value added services. Backed by signifi cant investments and partnerships in R&D, our cutting-edge technology results from a number of key strategic partnerships, including Philips Applied Technologies and Philips Research. Assembléon s partnership with Yamaha IM is one of the longest running and most successful in the industry. In addition, we maintain associations with the research centers of leading universities across the world. Our worldwide network As a global company, we are never far away when you need support and expertise. Based in Veldhoven, The Netherlands, Assembléon has Competence Centers in all three regions of the world providing core facilities for everything from application support to product demonstrations, training and services such as our Installed Base Solutions. This global sales and service network supports customers in all the world s major electronics manufacturing centers, 24 hours a day, 365 days a year. P 27

28 ASIA-PACIFIC Assembléon Hong Kong Ltd. T: EUROPE Assembléon Netherlands B.V. T: THE AMERICAS Assembléon America Inc. T: assembleon.com Assembléon All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and maybe changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Date of release: April