RONOVEL C AUROSPEED CVD

Size: px
Start display at page:

Download "RONOVEL C AUROSPEED CVD"

Transcription

1 RONOVEL C AUROSPEED CVD COBALT-ALLOYED ELECTROLYTIC GOLD For Electronic Finishing Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION Ronovel C and Aurospeed CVD electrolytic gold products are totally versatile cobalt-alloyed, hard-gold electroplating products are designed for high-speed selective plating applications, such as reel-to-reel connector plating, strip or strip plating, automatic printed circuit tab plating and deep tank circuit plating. Ronovel C electrolytic gold should be used where a highly-even thickness distribution across the plated part is desired. Processes using Ronovel C and Aurospeed CVD electrolytic gold can be tailored to suit different plating heads/cells simply by adjusting the following parameters: Gold metal concentration, cobalt metal concentration, temperature and ph. ADVANTAGES Total flexibility of operation Low initial cost of make-up Low gold metal inventory Low dragout losses Increased line speeds and extended production DEPOSIT PROPERTIES Purity: % Cobalt Hardness: Knoop Deposit Density: 17.5 g/cc Deposits meet Mil-G45204C Type I and II, Grade C specifications. RONOVEL C BATH MAKE-UP Barrel Controlled Jet Chemicals Required Metric (U.S.) Aurospeed CVD Make-up Liquid 750 ml/l (75% v/v) Ronovel Additive 30 ml/l (3% v/v) Aurospeed Cobalt Concentrate As required As required 2009 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole or part, without the express permission of Rohm and Haas Electronic Materials. 1. Add Aurospeed CVD Make-up Liquid to a clean tank. 2. Add Ronovel Additive. Mix thoroughly. 3. Add Aurospeed Cobalt Concentrate. Mix thoroughly. 4. Dissolve separately in warm water and add to tank. Mix thoroughly. 5. Dilute to final volume with deionized water. Mix thoroughly. 6. Check ph, specific gravity, cobalt concentration and gold concentration. Adjust, if necessary. AUROSPEED CVD BATH MAKE-UP Controlled Depth Chemicals Required Aurospeed CVD Make-up Liquid Aurospeed Cobalt Concentrate Jet Chemicals Required Aurospeed CVD Make-up Liquid Aurospeed Cobalt Concentrate Metric (U.S.) 750 ml/l (75% v/v) 30 ml/l (3% v/v) As required Metric (U.S.) 750 ml/l (75% v/v) 40 ml/l (4% v/v) As required 1. Add Aurospeed CVD Make-up Liquid. 2. Add Aurospeed Cobalt Concentrate. Mix thoroughly. 3. Dissolve separately in warm water and add to tank. Mix thoroughly. 4. Dilute to final volume with deionized water. Mix thoroughly. 5. Check ph, specific gravity, cobalt concentration and gold concentration. Adjust, if necessary. PF04N015, Rev. 2 March 2009

2 2 RONOVEL C BATH OPERATION LOW-SPEED RACK-AND-BARREL OPERATION Metric Gold Concentration g/l 4.0 g/l CONTROLLED DEPTH SELECTIVE CELL OPERATION Metric Gold Concentration g/l 8.0 g/l Cobalt Concentration g/l 0.75 g/l Cobalt Concentration g/l 1.0 g/l ph Specific Gravity Temperature C 35 C Specific Gravity Temperature C 45 C Barrel movement plus solution movement Rapid solution combined with cathode strip movement Current Density A/dm 2 Current Density 5 50 A/dm mg/amp min mg/amp min. Deposition Rate microns/minute at 0.5 A/dm 2 Deposition Rate 0.05 microns/second at 10 A/dm 2 LOW-SPEED RACK-AND-BARREL OPERATION U.S. CONTROLLED DEPTH SELECTIVE CELL OPERATION U.S. Gold Concentration toz./gal. 0.5 toz./gal. Gold Concentration toz./gal. 1.0 toz./gal. Cobalt Concentration 500 1,000 ppm 750 ppm Cobalt Concentration 750 1,500 ppm 1,000 ppm ph Temperature F 100 F ph Temperature F 115 F Barrel movement plus solution movement Rapid solution combined with cathode strip movement Current Density 1 30 A/ft % Deposition Rate 50 microinches/minute at 5 A/ft 2 Current Density A/ft % Deposition Rate 2.0 microinches/second at 100 A/ft 2

3 3 JET AGITATION SELECTIVE CELLS Metric Gold Concentration 6 16 g/l 12.0 g/l Cobalt Concentration g/l 1.2 g/l Specific Gravity Temperature C 52 C High-speed solution jetting Current Density 5 75 A/dm mg/amp min. Deposition Rate microns/second at 50 A/dm 2 AUROSPEED CVD BATH OPERATION CONTROLLED DEPTH SELECTIVE CELL OPERATION Metric Gold Concentration g/l 12.0 g/l Cobalt Concentration g/l 0.75 g/l Specific Gravity Temperature C 45 C Rapid solution combined with cathode strip movement Current Density 5 20 A/dm mg/amp min. Deposition Rate 0.06 microns/second at 10 A/dm 2 JET AGITATION SELECTIVE CELLS U.S. Gold Concentration toz./gal. 1.6 toz./gal. Cobalt Concentration 750 1,500 ppm 1,200 ppm Temperature F 125 F High-speed solution jetting Current Density A/ft % Deposition Rate 7.0 microinches/second at 500 A/ft 2 CONTROLLED DEPTH SELECTIVE CELL OPERATION U.S. Gold Concentration toz./gal. 1.5 toz./gal. Cobalt Concentration 500 1,000 ppm ph ppm Temperature F 115 F Rapid solution combined with cathode strip movement Current Density A/ft % Deposition Rate 2.5 microinches/second at 100 A/ft 2

4 4 JET AGITATION SELECTIVE CELLS Metric Gold Concentration g/l 16.0 g/l Cobalt Concentration g/l 1.0 g/l Specific Gravity Temperature C 52 C High-speed solution jetting Current Density A/dm mg/amp min. Deposition Rate 0.2 microns/minute at 30 A/dm 2 JET AGITATION SELECTIVE CELLS U.S. Gold Concentration toz./gal. 2.0 toz./gal. Cobalt Concentration 500 1,500 ppm 1,000 ppm Aurospeed Cobalt Concentrate Aurospeed Cobalt Concentrate contains 25.0 g/l cobalt metal. It is primarily used for make-up but can be used when increases in cobalt concentration are necessary. A 1 ml/l addition of Aurospeed Cobalt Concentrate will raise the cobalt concentration by g/l (25 ppm). Ronovel Additive Ronovel Additive is the key additive in the process using Ronovel C electrolytic gold. With a given gold concentration, ph and temperature, the Ronovel Additive produces a selective drop in current density at the high current density areas, which helps provide an even thickness distribution across the plated part. As a result, no burning is experienced during proper operation. Additions of Ronovel Additive may only be necessary when: Excessive dragout is experienced After heavy carbon treatments Long periods of time without using Ronovel C Unit Replenisher Ronovel Additive can be analyzed by UV spectrophotometry or by the Rohm and Haas Electronic Materials laboratory. ph Temperature F 125 F High-speed solution jetting Current Density A/ft % Ronovel C Unit Replenisher Under normal conditions, cobalt metal and all additives are replenished by additions of Ronovel C Unit Replenisher. For every troy ounce of gold metal replenished, add 38.0 ml/l of Ronovel C Unit Replenisher. Using Replenisher is highly recommended and regular use will ensure adequate concentrations of Additive and cobalt. Deposition Rate 8.0 microinches/second at 300 A/ft 2 BATH MAINTENANCE For the process using Ronovel electrolytic gold, gold metal is replenished by additions of Potassium Gold Cyanide. Replenishment is carried out on the basis of analysis or on ampere minute schedule confirmed by analysis. Add 1.0 troy ounce of gold metal every ampere minutes dependent on cathode efficiency. For the process using Aurospeed CVD electrolytic gold, gold metal is replenished by additions of Potassium Gold Cyanide. Replenishment is carried out on the basis of analysis or on ampere minute schedule confirmed by analysis. Add 1.0 troy ounce of gold metal every ampere minutes dependent on cathode efficiency. ph ph should be measured daily and maintained in the recommended range by additions of Aurospeed Acid Salt or potassium hydroxide. At a given gold concentration, decreasing the solution ph will increase the effect of Ronovel Additive in the working solution causing a selective decrease in cathode efficiency at high current density. Increasing the ph will have the opposite effect. 5.0 g/l Aurospeed Acid Salt will lower ph by 0.1 units 5.0 g/l potassium hydroxide will raise ph by 0.1 units Specific Gravity Specific gravity should be measured daily and maintained in the recommended range by additions of Aurospeed Complexer Salt g/l Aurospeed Complexer Salt will raise the specific gravity by 0.01 SG (1 Baumé).

5 5 Effects of Varying Solution Parameters Color Current Density % Nickel in Cathode Range Deposit Efficiency Gold Concentration Increase Richer Higher Lower Higher Decrease Paler Lower Higher Lower Cobalt Concentration Increase Paler Wider Higher Lower Decrease Richer Narrower Lower Higher ph Increase Richer Narrower Lower Higher Decrease Paler Wider Higher Lower Temperature Increase Richer Higher Lower Higher Decrease Paler Wider Higher Lower Cobalt Chelate Cobalt Ratio Increase Richer Higher Lower Higher Decrease Paler Wider Higher Lower Effects of Metallic Impurities Maximum Concentration Effect Lead 10 ppm Low current density dullness Copper 100 ppm Reduced cathode efficiency/ low current density dullness Iron 200 ppm Reduced cathode efficiency/ low purity deposits Zinc 200 ppm Reduced cathode efficiency/ low purity deposits 1. Add Aurospeed CVD Make-up Liquid to clean tank. 2. Add Ronovel Additive. Mix thoroughly. 3. Add Aurospeed Cobalt Concentrate. Mix thoroughly. 4. Dissolve separately in warm deionized water and add to tank. 5. Adjust to final volume with deionized water. 6. Check ph and specific gravity. Adjust if necessary. STRIKE PROCESS FOR RONOVEL C AND AUROSPEED CVD ELECTROLYTIC GOLD Low-efficiency Gold Strike Process A low-efficiency gold strike process designed to produce an initial thin highly adherent gold electrodeposit on the components to be plated with Ronovel C or Aurospeed CVD electrolytic gold. RONOVEL C STRIKE BATH MAKE-UP Chemicals Required Metric (U.S.) Aurospeed CVD Make-up Liquid 500 ml/l (50% v/v) Ronovel Additive 30 ml/l (3% v/v) Aurospeed Cobalt Concentrate 10 ml/l (1.0 v/v) As required AUROSPEED CVD STRIKE BATH MAKE-UP Chemicals Required Metric (U.S.) Aurospeed CVD Make-up Liquid 500 ml/l (50% v/v) Aurospeed Cobalt Concentrate 10 ml/l (1.0 v/v) As required 1. Add Aurospeed CVD Make-up Liquid to clean tank. 2. Add Aurospeed Cobalt Concentrate. Mix thoroughly 3. Dissolve separately in warm deionized water and add to tank. 4. Adjust to final volume with deionized water. 5. Check ph and specific gravity. Adjust if necessary.

6 6 RONOVEL BATH OPERATION C AND AUROSPEED FOR RONOVEL CVD C AND AUROSPEED CVD STRIKE Metric Gold Concentration 1 3 g/l 2 g/l Cobalt Concentration g/l ph g/l RONOVEL C PURE GOLD STRIKE BATH MAKE-UP Chemicals Required Metric (U.S.) Aurospeed CVD Make-up Liquid 750 ml/l (75% v/v) Ronovel Additive 30 ml/l (3% v/v) Pure Gold Brightener 5 ml/l (0.5 v/v) Specific Gravity Temperature C 25 C As required Rapid solution and mechanical Current Density A/dm mg/amp min. Deposition Rate microns/minute at 0.2 A/dm 2 BATH OPERATION FOR RONOVEL C AND AUROSPEED CVD STRIKE U.S. Gold Concentration Cobalt Concentration ppm toz./gal toz./gal. ph ppm Specific Gravity 7 13 Baumé 10 Baumé Temperature F 75 F Rapid solution and mechanical Current Density 1 50 A/ft % Deposition Rate 1.5 microinches/minute at 2 A/ft 2 1. Add Aurospeed CVD Make-up Liquid to clean tank. 2. Add Ronovel Additive. Mix thoroughly. 3. Add Pure Gold Brightener. Mix thoroughly. 4. Dissolve separately in warm deionized water and add to tank. 5. Adjust to final volume with deionized water. 6. Check ph and specific gravity. Adjust if necessary. AUROSPEED CVD PURE GOLD STRIKE BATH MAKE-UP Chemicals Required Metric (U.S.) Aurospeed CVD Make-up Liquid 750 ml/l (75% v/v) Pure Gold Brightener 5 ml/l (0.5% v/v) As required 1. Add Aurospeed CVD Make-up Liquid to clean tank. PURE GOLD STRIKE PROCESS Low-efficiency Gold Strike Process A low-efficiency gold strike process designed to produce an initial think, highly-adherent gold electrodeposit on the components to be plated with Ronovel C or Aurospeed CVD electrolytic gold. To be used where a pure 24 kt underplate is desired or specified. 2. Add Pure Gold Brightener. Mix thoroughly. 3. Dissolve separately in warm deionized water and add to tank. 4. Adjust to final volume with deionized water. 5. Check ph and specific gravity. Adjust if necessary.

7 7 BATH OPERATION FOR RONOVEL C AND AUROSPEED CVD PURE GOLD STRIKE Metric PURE GOLD BRIGHTENER For every troy ounce gold metal replenished, add 38.0 ml Pure Gold Brightener. Gold Concentration 1 6 g/l ph Specific Gravity Temperature C 48 C Dependent on mode of operation Rapid solution and mechanical Current Density A/dm mg/amp min. EQUIPMENT Tanks: Anodes: Heaters: Filtration: Polypropylene Platinized (titanium, tantalum or columbium) Silica sheathed or PTFE-coated immersion micron filters with pump capacity for four turnovers per hour Deposition Rate 0.05 microns/minute at 0.2 A/dm microns/second at 5.0 A/dm 2 BATH OPERATION FOR RONOVEL C AND AUROSPEED CVD PURE GOLD STRIKE Metric Gold Concentration toz./gal. Dependent on mode of operation ph Specific Gravity Baumé 12 Baumé Temperature F 120 F BATH MAINTENANCE Gold Metal Rapid solution and mechanical Current Density 1 50 A/ft % Deposition Rate 2.0 microinches/minute at 2 A/ft microinches/second at 50 A/ft 2 Gold metal is replenished by addition of Potassium Gold Cyanide. Replenishment is carried out on the basis of analysis or on an ampere minute schedule confirmed by analysis. Add 1 troy oz. gold metal every ampere minutes dependent on cathode efficiency. EQUIPMENT PREPARATION Prior to make-up, the process tank and ancillary equipment should be thoroughly cleaned as outlined below. This procedure is particularly important for new equipment or equipment previously used for other processes. I. Cleaning Solution a) Trisodium phosphate: 15 g/l (2 oz./gal.) b) Sodium hydroxide: 15 g/l (2 oz./gal.) II. III. Leaching Solution Aurospeed Acid Salt: 50 g/l (5% w/v) Procedure a) Thoroughly wash down tank and ancillary equipment with clean water. b) Recirculate water through the complete system to remove water soluble materials. c) Discard water. d) Add cleaning solution to the tank, heat to C ( F) and recirculate through the complete system for a minimum of 8 hours. e) Discard cleaning solution. f) Recirculate water through the complete system. g) Discard rinse water. h) Add leaching solution and recirculate the complete system. i) Leave leaching solution in tank for a minimum of 8 hours. j) Discard leaching solution. k) Recirculate water through the complete system. l) Discard rinse water.

8 8 PRODUCT DATA For the specific Product Data values, please refer to the Certificate of Analysis provided with the shipment of the product(s). ASSOCIATED PRODUCTS Aurospeed CVD Make-up Liquid Aurospeed Cobalt Concentrate Ronovel C Unit Replenisher Aurospeed Acid Salt Aurospeed Complexer Salt Ronovel Additive Pure Gold Brightener HANDLING PRECAUTIONS Before using this product, consult the Material Safety Data Sheet (MSDS)/Safety Data Sheet (SDS) for details on product hazards, recommended handling precautions and product storage. WARNING! DO NOT ACIDIFY this product or working bath containing this product below specified operating ph range, or below ph 7 if no range is specified. Acidification may release highly toxic cyanide gas, which can be fatal if swallowed, inhaled or absorbed through the skin. CAUTION! Keep combustible and/or flammable products and their vapors away from heat, sparks, flames and other sources of ignition including static discharge. Processing or operating at temperatures near or above product flashpoint may pose a fire hazard. Use appropriate grounding and bonding techniques to manage static discharge hazards. CAUTION! Failure to maintain proper volume level when using immersion heaters can expose tank and solution to excessive heat resulting in a possible combustion hazard, particularly when plastic tanks are used. STORAGE Store products in tightly closed original containers at temperatures recommended on the product label. DISPOSAL CONSIDERATIONS Dispose in accordance with all local, state (provincial) and federal regulations. Empty containers may contain hazardous residues. This material and its container must be disposed in a safe and legal manner. It is the user's responsibility to verify that treatment and disposal procedures comply with local, state (provincial) and federal regulations. Contact your Rohm and Haas Electronic Materials Technical Representative for more information. Aurospeed, Ronoval, Rohm and Haas, and Rohm and Haas Electronic Materials are trademarks of Rohm and Haas Company, Philadelphia, PA, USA, or its affiliates. UNITED STATES Marlborough, MA Tel: Fax: JAPAN Tokyo Tel: Fax: ASIA Hong Kong Tel: Fax: EUROPE Paris, France Tel: Fax: Freeport, NY Tel: Fax: For Industrial Use Only. This information is based on our experience and is, to the best of our knowledge, true and accurate. However, since conditions for use and handling of products are beyond our control, we make no guarantee or warranty, expressed or implied, regarding the information, the use, handling, storage or possession of the products, or the applications of any process described herein or the results sought to be obtained. Nothing herein shall be construed as a recommendation to use any product in violation of any patent rights.

SOLDERON ST-200 For Electronic Finishing Applications

SOLDERON ST-200 For Electronic Finishing Applications SOLDERON ST-200 For Electronic Finishing Applications Regional Product Availability N.America Japan/Korea Asia Europe 5. Solderon ST-200 6. Solderon AO-52/Solderon RD Concentrate *Dependent on region DESCRIPTION

More information

SOLDERON MHS-W MATTE TIN AND TIN-LEAD PROCESS

SOLDERON MHS-W MATTE TIN AND TIN-LEAD PROCESS SOLDERON MHS-W MATTE TIN AND TIN-LEAD PROCESS For Electronic Finishing Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION Solderon MHS-W is a high-speed, non-foaming

More information

PALLAMET 500 Palladium-Nickel

PALLAMET 500 Palladium-Nickel Technical Data Sheet PALLAMET 500 Palladium-Nickel For Electronic Finishing Applications Regional Product Availability Description North America Asia-Pacific The PALLAMET 500 Palladium-Nickel electrolyte

More information

AURALL 305M Electrolytic Gold For Electronic Finishing Applications

AURALL 305M Electrolytic Gold For Electronic Finishing Applications Technical Data Sheet AURALL 305M Electrolytic Gold For Electronic Finishing Applications Regional Product Availability Description Advantages North America AURALL 305M Electrolytic Gold produces semibright,

More information

SOLDERON BLS For Electronic Finishing Applications

SOLDERON BLS For Electronic Finishing Applications SOLDERON BLS For Electronic Finishing Applications DESCRIPTION Solderon BLS is a low-speed tin-lead plating process designed to produce bright deposits from an organic sulfonate electrolyte. Fully-solderable

More information

PALLADURE 200 Pure Palladium Process

PALLADURE 200 Pure Palladium Process Technical Data sheet PALLADURE 200 Pure Palladium Process For Electronic Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America Asia The PALLADURE TM 200 Process is characterized by

More information

SOLDERON SC Process. For Electronic Finishing Applications. Deposits meet or exceed Military Specification Method 202F, Method 208F.

SOLDERON SC Process. For Electronic Finishing Applications. Deposits meet or exceed Military Specification Method 202F, Method 208F. Technical Data sheet SOLDERON SC Process For Electronic Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America Japan/Korea Asia Europe SOLDERON SC is a low-foaming, organic sulfonate

More information

PALLAMERSE SMT 2000 For PWB Metallization Applications

PALLAMERSE SMT 2000 For PWB Metallization Applications PALLAMERSE SMT 2000 For PWB Metallization Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION The Pallamerse SMT 2000 is an autocatalytic palladium process designed

More information

NICKEL GLEAM BR 220 BRIGHT NICKEL PROCESS

NICKEL GLEAM BR 220 BRIGHT NICKEL PROCESS NICKEL GLEAM BR 220 BRIGHT NICKEL PROCESS For Industrial Finishing Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION Nickel Gleam BR 220 is a bright nickel plating

More information

SILVERON TM GT-101 Bright Silver Cyanide-Free Bright Electrolytic Silver For Electronic, Decorative and Industrial Finishing Applications

SILVERON TM GT-101 Bright Silver Cyanide-Free Bright Electrolytic Silver For Electronic, Decorative and Industrial Finishing Applications Technical Data Sheet SILVERON TM GT-101 Bright Silver Cyanide-Free Bright Electrolytic Silver For Electronic, Decorative and Industrial Finishing Applications Regional Product Availability Description

More information

COPPER GLEAM RG 11 Acid Copper Plating Process

COPPER GLEAM RG 11 Acid Copper Plating Process Technical Data sheet COPPER GLEAM RG 11 Acid Copper Plating Process For Industrial Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America COPPER GLEAM RG 11 Acid Copper Plating Process

More information

TINGLO CULMO Bright Acid Tin Electroplating (with Starter/Brightener 2.5X) For Electronic Finishing Applications

TINGLO CULMO Bright Acid Tin Electroplating (with Starter/Brightener 2.5X) For Electronic Finishing Applications Technical Data Sheet TINGLO CULMO Bright Acid Tin Electroplating (with Starter/Brightener 2.5X) For Electronic Finishing Applications Regional Product Availability North America Description Advantages

More information

SILVER GLO 3KBP. With SILVER GLO 33BP Silver Plating Process For Electronic Finishing Applications. Silver M etal as Silver: Cyanide (80.

SILVER GLO 3KBP. With SILVER GLO 33BP Silver Plating Process For Electronic Finishing Applications. Silver M etal as Silver: Cyanide (80. Technical Data sheet SILVER GLO 3KBP With SILVER GLO 33BP Silver Plating Process For Electronic Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America SILVER GLO 3KBP Process is designed

More information

PREPOSIT Etch 748. For PWB Metallization Applications. For use in the CIRCUPOSIT 3000 Process. Bath Make-up Metric (for 100 liters)

PREPOSIT Etch 748. For PWB Metallization Applications. For use in the CIRCUPOSIT 3000 Process. Bath Make-up Metric (for 100 liters) Technical Data sheet PREPOSIT Etch 748 For PWB Metallization Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America Japan/Korea Asia For use in the CIRCUPOSIT 3000 Process. PREPOSIT Etch 748

More information

UV5 POSITIVE DUV PHOTORESIST For Microlithography Applications

UV5 POSITIVE DUV PHOTORESIST For Microlithography Applications UV5 POSITIVE DUV PHOTORESIST For Microlithography Applications DESCRIPTION UV5 positive DUV photoresist has been optimized to provide vertical profile imaging of isolated and semidense features for device

More information

INTERVIA BPP-10 Photoresist

INTERVIA BPP-10 Photoresist Technical Data Sheet INTERVIA BPP-10 Photoresist For Advanced Packaging Applications Description Regional Product Availability Advantages INTERVIA BPP-10 Photoresist is a general-purpose, multi-wavelength

More information

NIPOSIT PM-980 W Semi-Bright Electroless Nickel Process For Industrial Finishing Applications

NIPOSIT PM-980 W Semi-Bright Electroless Nickel Process For Industrial Finishing Applications Technical Data Sheet NIPOSIT PM-980 W Semi-Bright Electroless Nickel Process For Industrial Finishing Applications Regional Product Availability Description North America The NIPOSIT PM-980 W process is

More information

CHROME GLEAM 3C Jet Black Trivalent Chromium Plating Process

CHROME GLEAM 3C Jet Black Trivalent Chromium Plating Process Technical Data sheet CHROME GLEAM 3C Jet Black Trivalent Chromium Plating Process For Industrial Finishing Applications Regional Product Availability Description N. America Japan/Korea Asia Europe CHROME

More information

SILVER GLO 3K Silver Process

SILVER GLO 3K Silver Process Technical Data sheet SILVER GLO 3K Silver Process For Electronic Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America The Dow bright silver process 3K is a simplified process designed

More information

CIRCUPOSIT 71 Full Build Electroless Copper Nitrate Bath (Generic Concentrates) For Electronic Finishing Applications

CIRCUPOSIT 71 Full Build Electroless Copper Nitrate Bath (Generic Concentrates) For Electronic Finishing Applications CIRCUPOSIT 71 Full Build Electroless Copper Nitrate Bath (Generic Concentrates) For Electronic Finishing Applications Regional Product Availability Description N. American Asia CIRCUPOSIT 71 Full Build

More information

CIRCUPOSIT Neutralizer 3313 For PWB Metallization Applications

CIRCUPOSIT Neutralizer 3313 For PWB Metallization Applications CIRCUPOSIT Neutralizer 3313 For PWB Metallization Applications Regional Product Availability Description N. American Asia CIRCUPOSIT Neutralizer 3313 has been developed as a replacement for the Sulfuric-Peroxide

More information

NB SEMIPLATE AG 100 Ag electroplating process

NB SEMIPLATE AG 100 Ag electroplating process NB SEMIPLATE AG 100 Ag electroplating process INTRODUCTION NB SEMIPLATE AG 100 is an alkaline, non-cyanide electroplating formulation, which produces satin bright silver deposits. Deposits from the NB

More information

Tinmac Stannolyte Bright Acid Tin Solution

Tinmac Stannolyte Bright Acid Tin Solution Tinmac Stannolyte Bright Acid Tin Solution # EU86305 Tinmac Stannolyte is a bright acid tin solution that is effective for the production of bright electroplated tin deposits which have applications in

More information

CIRCUPOSIT Electroless Copper (USING CUPOSIT Z AND Y-1) For PWB Metallization Applications

CIRCUPOSIT Electroless Copper (USING CUPOSIT Z AND Y-1) For PWB Metallization Applications Technical Data Sheet CIRCUPOSIT 3350-1 Electroless Copper (USING CUPOSIT Z AND Y-1) For PWB Metallization Applications Regional Product North America Availability Description CIRCUPOSIT 3350-1 Electroless

More information

Metal Finishing Products and Service META-MATE ZINCATE 40 "A CONCENTRATED LIQUID ZINCATE FORMULATION FOR THE PRETREATMENT OF ALUMINUM AND ITS ALLOYS"

Metal Finishing Products and Service META-MATE ZINCATE 40 A CONCENTRATED LIQUID ZINCATE FORMULATION FOR THE PRETREATMENT OF ALUMINUM AND ITS ALLOYS Metal Chem,inc. Metal Finishing Products and Service 29 Freedom Court Greer, SC 29650 864.877.6175 Fax 864.877.6176 DATA SHEET META-MATE ZINCATE 40 "A CONCENTRATED LIQUID ZINCATE FORMULATION FOR THE PRETREATMENT

More information

ELECTROPOSIT 1100 B-2 Acid Copper Additive

ELECTROPOSIT 1100 B-2 Acid Copper Additive Technical Data Sheet ELECTROPOSIT 1100 B-2 Acid Copper Additive For PWB Metallization Applications Regional Product Availability Description Asia The Dow Electronic Materials ELECTROPOSIT 1100 B-2 Acid

More information

TINPOSIT LT-26 IMMERSION TIN For PWB Metallization Applications

TINPOSIT LT-26 IMMERSION TIN For PWB Metallization Applications TINPOSIT LT-26 IMMERSION TIN For PWB Metallization Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION Tin is deposited onto copper, copper-based alloys and tin/lead

More information

PavCoTing. Chromium appearance and corrosion resistance Ease of plating bath control Wide current density range

PavCoTing. Chromium appearance and corrosion resistance Ease of plating bath control Wide current density range is an environmentally friendly alternative to chromium electroplating. is a cobalt alloy that, when plated over nickel, has the appearance and corrosion resistance of decorative chromium. is diverse enough

More information

Use vigorous air agitation while adding the components in the order shown: 2.7% by volume CIRCUPOSIT LC-9100C Electroless Copper

Use vigorous air agitation while adding the components in the order shown: 2.7% by volume CIRCUPOSIT LC-9100C Electroless Copper Technical Data Sheet CIRCUPOSIT LC-9100 Electroless Copper For PWB Metallization Applications Regional Product Availability Description Asia-Pacific CIRCUPOSIT LC-9100 Electroless Copper is an integral

More information

Lumina. Bright, leveled deposits in less time Excellent ductility Good chromium reception Very low additive consumption rate. Nickel Plating System

Lumina. Bright, leveled deposits in less time Excellent ductility Good chromium reception Very low additive consumption rate. Nickel Plating System is the ultimate fast leveling bright nickel electroplating system, specially designed for low thickness deposits, while being unparalleled for high spec nickel plating as well. Existing nickel baths can

More information

UV6 POSITIVE DUV PHOTORESIST For DUV Applications

UV6 POSITIVE DUV PHOTORESIST For DUV Applications UV6 POSITIVE DUV PHOTORESIST For DUV Applications DESCRIPTION UV6 Positive DUV Photoresist has been optimized to provide vertical profile imaging of dense and semi-isolated features for device production

More information

Ultrex CAA Product Code: Revised Date: 10/09/2006. Ultrex CAA Heavy Duty Alkaline Product Derusting - Descaling - Activation

Ultrex CAA Product Code: Revised Date: 10/09/2006. Ultrex CAA Heavy Duty Alkaline Product Derusting - Descaling - Activation Ultrex CAA Heavy Duty Alkaline Product Derusting - Descaling - Activation Ultrex CAA is a powdered, highly alkaline product, blended with selected sequestrants and alkaline agents. It's unique formulation

More information

HAVALLOY Z-C ACID CHLORIDE ZINC / COBALT PROCESS

HAVALLOY Z-C ACID CHLORIDE ZINC / COBALT PROCESS ACID CHLORIDE ZINC / COBALT PROCESS provides a bright, ductile electro-deposited zinc-cobalt alloy containing from 0.1% to 0.5% cobalt that is evenly distributed at low, mid and high current densities.

More information

ROPAQUE OP-96 All-Purpose Pigment Engineered to Improve Waterborne Coatings

ROPAQUE OP-96 All-Purpose Pigment Engineered to Improve Waterborne Coatings Technical Data Sheet Engineered to Improve Waterborne Coatings Introduction is a non-film-forming synthetic pigment engineered to improve the economics of waterborne coatings. differs from its predecessor

More information

UV5 POSITIVE DUV PHOTORESIST For DUV Applications

UV5 POSITIVE DUV PHOTORESIST For DUV Applications UV5 POSITIVE DUV PHOTORESIST For DUV Applications DESCRIPTION UV5 positive DUV photo resist has been optimized to provide vertical profile imaging of isolated and semidense features for device production

More information

NB SEMIPLATE AU 100 TH Bright Au electroplating process, sulfite-based, arsenic-free

NB SEMIPLATE AU 100 TH Bright Au electroplating process, sulfite-based, arsenic-free NB SEMIPLATE AU 100 TH Bright Au electroplating process, sulfite-based, arsenic-free INTRODUCTION NB SEMIPLATE AU 100 TH is an alkaline, non-cyanide electroplating formulation which produces a bright,

More information

NB SEMIPLATE AU 100 Bright Au electroplating process, sulfite based, arsenic grain refiner

NB SEMIPLATE AU 100 Bright Au electroplating process, sulfite based, arsenic grain refiner NB SEMIPLATE AU 100 Bright Au electroplating process, sulfite based, arsenic grain refiner INTRODUCTION NB SEMIPLATE AU 100 is an alkaline, non-cyanide electroplating formulation based on arsenic grain

More information

Manufactured for North America exclusively by Automated Chemical Solutions, Inc E. Roeser Road Phoenix, Arizona 85040

Manufactured for North America exclusively by Automated Chemical Solutions, Inc E. Roeser Road Phoenix, Arizona 85040 NICKEL 5000 BRIGHT NICKEL INTRODUCTION The Nickel 5000 process has been developed to produce fully bright, highly leveled, ductile nickel deposits. The process can be used for rack or barrel plating. BENEFITS

More information

HyProTec. Hexavalent free RoHS, ELV and WEEE compliant. HyPro System

HyProTec. Hexavalent free RoHS, ELV and WEEE compliant. HyPro System HyPro System is a high performance, trivalent passivate for zinc and zinc-nickel electrodeposits. will provide outstanding performance of corrosion resistance per ASTM B 117. Exceeds 120 hours to white

More information

Ultrex EDM Product Code: Revised Date: 07/26/2006. Ultrex EDM Heavy Duty Alkaline Product Derusting - Descaling - Activation

Ultrex EDM Product Code: Revised Date: 07/26/2006. Ultrex EDM Heavy Duty Alkaline Product Derusting - Descaling - Activation Ultrex EDM Heavy Duty Alkaline Product Derusting - Descaling - Activation Ultrex EDM is a powdered, highly alkaline product, blended with selected sequestrants and alkaline agents. It's unique formulation

More information

Alkzinc 818. Mirror bright finish Good zinc deposit distribution Very good adhesion and ductility Excellent chromate receptivity

Alkzinc 818. Mirror bright finish Good zinc deposit distribution Very good adhesion and ductility Excellent chromate receptivity Zinc Plating Systems Pavco s process is an alkaline zinc brightener system that offers mirror bright deposits that do not dull or fade during high temperature baking. The deposit easily accepts all chromate

More information

Zinc Alloy Plating Ziniloy

Zinc Alloy Plating Ziniloy Zinc Alloy Plating Ziniloy Ziniloy is an alkaline zinc/nickel alloy plating process offering exceptional corrosion resistance. Ziniloy produces bright deposits of a zinc/nickel alloy with exceptional distribution

More information

NITEC CRYSTAL 1. Elektrolyt to achieve uniform and non reflective Nickel deposits

NITEC CRYSTAL 1. Elektrolyt to achieve uniform and non reflective Nickel deposits Postfach 169 CH-9545 Wängi TG 25.07.2014 NITEC CRYSTAL 1 Elektrolyt to achieve uniform and non reflective Nickel deposits In contrast to bright nickel, the NITEC CRYSTAL electroplating process produces

More information

ELECTROPOSIT 1100 Acid Copper

ELECTROPOSIT 1100 Acid Copper Technical Data Sheet ELECTROPOSIT 1100 Acid Copper For PWB Metallization Applications Regional Product Availability Description North America Asia-Pacific The Dow Electronic Materials ELECTROPOSIT 1100

More information

Deruster 11 J Product Code: Revised Date: 01/26/2009. Deruster 11 J

Deruster 11 J Product Code: Revised Date: 01/26/2009. Deruster 11 J Deruster 11 J DESCRIPTION Deruster 11 J is a powdered, cyanide-free, highly alkaline water soluble product used to remove rust, heat scale, weld scale, smuts, certain fabrication oils, and to strip paint

More information

-.O oz/gal. It is again desirable to have some means of mechanical agitation.

-.O oz/gal. It is again desirable to have some means of mechanical agitation. . THE ALDOA COMPANY 12727 WESTWOOD 0 DETROIT, MICHIGAN 4822 NOVALYTE 421-D CYANIDE FREE, ALKALINE ZINCATE PLATING PROCESS INTRODUCTION Novalyte 421-D is a completely cyanide free system, utilizing only

More information

4831 S. Whipple Avenue Chicago IL Phone: Fax:

4831 S. Whipple Avenue Chicago IL Phone: Fax: ACCU-LABS INC. 4831 S. Whipple Avenue Chicago IL 60632 Phone: 773.523.3100 Fax: 773.523.4008 www.accu-labs.com A2LA Accredited ISO/IEC 17025:2005 Certificate # 2558.01 377 Electroless Nickel-Boron Process

More information

DURNI-COAT DNC

DURNI-COAT DNC RIAG Oberflächentechnik AG Postfach 169 CH-9545 Wängi TG 25.04.2014 DURNI-COAT DNC 520-12-50 Electroless plating nickel bath for high wear and corrosion resistant applications DNC 520-12-50 is a process

More information

Luster-On Products. Technical Data Sheet LUSTER-ON CADMIUM SPECIAL

Luster-On Products. Technical Data Sheet LUSTER-ON CADMIUM SPECIAL Luster-On Products Technical Data Sheet LUSTER-ON CADMIUM SPECIAL I. GENERAL DESCRIPTION Luster-On Cadmium Special is a high performance brightener system designed to achieve maximum luster from a cyanide

More information

E-Brite 30/30. Non-Cyanide Alkaline Copper Plating

E-Brite 30/30. Non-Cyanide Alkaline Copper Plating E-Brite 30/30 Non-Cyanide Alkaline Copper Plating E-Brite 30/30 plates directly on steel, copper, brass, stainless steel, zincated aluminum, electroless nickel and most high quality properly prepared zinc

More information

Ziniloy Zinc Alloy Plating

Ziniloy Zinc Alloy Plating Ziniloy 3028 Zinc Alloy Plating Ziniloy 3028 is an alkaline zinc/nickel alloy plating process offering exceptional corrosion resistance. Ziniloy 3028 produces bright deposits of a zinc/nickel alloy with

More information

TECHNICAL BULLETIN IMMERSION SILVER - IS150

TECHNICAL BULLETIN IMMERSION SILVER - IS150 C T Florida CirTech, Inc. 1309 North 17th Avenue Greeley, CO 80631 Telephone: (970) 346-8002 Fax: (970) 346-8331 www.floridacirtech.com TECHNICAL BULLETIN IMMERSION SILVER - IS150 I. Description This is

More information

Alkaline Non-Cyanide Zinc Plating Process

Alkaline Non-Cyanide Zinc Plating Process Alkaline Non-Cyanide Zinc Plating Process E-Brite Ultra Alk E-Brite Ultra Alk is a thoroughly tested, stable and production proven zinc plating brightener process. It is suitable for either rack or barrel

More information

RHOPLEX TP-257 Polymer Emulsion for Waterborne Traffic Marking Paints

RHOPLEX TP-257 Polymer Emulsion for Waterborne Traffic Marking Paints Technical Data Sheet RHOPLEX TP-257 Polymer Emulsion for Waterborne Traffic Marking Paints Regional Product Availability Description Advantages of Paints Based on RHOPLEX TP-257 North America RHOPLEX TP-257

More information

NON-CYANIDE ZINC NICKEL PROCESS

NON-CYANIDE ZINC NICKEL PROCESS NON-CYANIDE ZINC NICKEL PROCESS PHYSICAL PROPERTIES: ZINNI AL 451: Dark-blue liquid ZINNI AL 452: Transparent violet liquid ZINNI AL 453: Transparent yellowish liquid DESCRIPTION: The process is an alkaline

More information

Non-Cyanide Alkaline Silver Plating

Non-Cyanide Alkaline Silver Plating on-cyanide lkaline Silver Plating -Brite 50/50 -Brite 50/50 is an alkaline, cyanide free plating solution, which can plate bright silver for electronic, industrial and decorative uses. -Brite 50/50 eliminates

More information

TriPass ELV 1500LT Iridescent Trivalent Chromium Passivate

TriPass ELV 1500LT Iridescent Trivalent Chromium Passivate TriPass ELV 1500LT Iridescent Trivalent Chromium Passivate Version 6.2 # 187396 Description TriPass ELV 1500LT is a trivalent passivate based upon trivalent chromium, for use with electroplated zinc and

More information

AUTONIC MX, 440. AUTONIC MX Matrix 440 PROCESS: FEATURES: Stapleton Technologies Inc, Rev /99 Page 1 of 8

AUTONIC MX, 440. AUTONIC MX Matrix 440 PROCESS: FEATURES: Stapleton Technologies Inc, Rev /99 Page 1 of 8 AUTONIC MX, 440 MID PHOSPHORUS, FUNCTIONAL MATRIX ELECTROLESS NICKEL PROCESS: AUTONIC MX is a functional, midphosphorus (7-9.5 %P) electroless nickel process designed for high production processing in

More information

NB SEMIPLATE CU 200 Copper electroplating process

NB SEMIPLATE CU 200 Copper electroplating process NB SEMIPLATE CU 200 Copper electroplating process INTRODUCTION The NB SEMIPLATE CU 200 process is an acid copper plating formulation engineered for wafer plating applications including copper bump plating,

More information

PARALOID EXL 2314 Impact Modifier

PARALOID EXL 2314 Impact Modifier Technical Data Sheet PARALOID EXL 2314 Impact Modifier Weatherable Impact Modifier For Engineering Resins Regional Product Availability Introduction North America Japan/Korea Asia Europe PARALOID EXL 2314

More information

Enerox Nickel Additive E 66 Product Code: Revised Date: 02/28/2012. Enerox Nickel Additive E 66 High End Rack Plating

Enerox Nickel Additive E 66 Product Code: Revised Date: 02/28/2012. Enerox Nickel Additive E 66 High End Rack Plating Enerox Nickel Additive E 66 High End Rack Plating INSTRUCTIONS FOR BRIGHT NICKEL PLATING USING ENEROX NICKEL ADDITIVES The Enerox Bright Nickel E-66 Plating Process is designed and formulated to produce

More information

Direct Copper Metalization of Aluminum: Elimination of Zincate

Direct Copper Metalization of Aluminum: Elimination of Zincate June 2018 Direct Copper Metalization of uminum: Elimination of Zincate Richard DePoto, Business Development Doug Duda, Laboratory Manager Uyemura International Corporation Southington CT rdepoto@uyemura.com

More information

Enerox Nickel Additive E 44 Product Code: Revised Date: 09/26/2007

Enerox Nickel Additive E 44 Product Code: Revised Date: 09/26/2007 Enerox Nickel Additive E 44 INSTRUCTIONS FOR BRIGHT NICKEL PLATING USING ENE NICKEL ADDITIVES The Ene Bright Nickel Plating Process is designed and formulated to produce high quality bright nickel deposits.

More information

Luster-On Products. Technical Data Sheet LUSTER-FOS 2900 CALCIUM MODIFIED, FINE GRAINED ZINC PHOSPHATE

Luster-On Products. Technical Data Sheet LUSTER-FOS 2900 CALCIUM MODIFIED, FINE GRAINED ZINC PHOSPHATE Luster-On Products I. GENERAL DESCRIPTION Technical Data Sheet LUSTER-FOS 2900 CALCIUM MODIFIED, FINE GRAINED ZINC PHOSPHATE Luster-Fos 2900 is a calcium modified, liquid zinc phosphate material primarily

More information

ACTANE 341 Liquid concentrate

ACTANE 341 Liquid concentrate Liquid concentrate ACTANE 341 is a liquid concentrate when dissolved in water produces an acid solution designed to replace most mineral acid pickling and activating solutions used in electroplating, phosphating,

More information

Laser EX 50 Product Code: Revised Date: 03/17/2009. Laser EX 50

Laser EX 50 Product Code: Revised Date: 03/17/2009. Laser EX 50 DESCRIPTION Laser EX 50 Laser EX 50 is a peroxide-based chemical polishing product that will provide a high luster on brass and most copper alloys. In many cases the Laser EX 50 will give a chemical alternative

More information

SurTec 717 Alkaline Zinc/Nickel Electroplating Process (Electrolyte based on Sodium)

SurTec 717 Alkaline Zinc/Nickel Electroplating Process (Electrolyte based on Sodium) SurTec 717 Alkaline Zinc/Nickel Electroplating Process (Electrolyte based on Sodium) Properties tolerates higher temperatures superior metal distribution produces Zn/Ni alloy deposits containing 12-15

More information

COMPLETE BARREL. ZINC PLATING SYSTEMS ZCl K3 MAINTENANCE

COMPLETE BARREL. ZINC PLATING SYSTEMS ZCl K3 MAINTENANCE Zinc Plating Systems ZCl K 3 MAINTENANCE is a single add replenishment component for barrel ZCl K 3 systems. Using simplifies the maintenance of the ZCl K 3 process. ZCl K 3 Maintenance Complete Barrel

More information

TECHNICAL DATA SHEET CUPROBRITE Revolutionary & New generation Bright Acid Copper Plating Process

TECHNICAL DATA SHEET CUPROBRITE Revolutionary & New generation Bright Acid Copper Plating Process TECHNICAL DATA SHEET CUPROBRITE 3006 Revolutionary & New generation Bright Acid Copper Plating Process Cuprobrite 3006 is a bright acid copper plating process which produces highly levelled, brilliant,

More information

PARALOID EXL-2655 Impact Modifier For Thermoset Applications

PARALOID EXL-2655 Impact Modifier For Thermoset Applications Technical Data Sheet PARALOID EXL-2655 Impact Modifier For Thermoset Applications Regional Product Availability Description Benefits Typical Properties Packaging Asia-Pacific PARALOID EXL-2655 Impact Modifier

More information

E-Brite Ultra Cu-Mg. Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating

E-Brite Ultra Cu-Mg. Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating E-Brite Ultra Cu-Mg Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating E-Brite Ultra Cu-Mg plates copper directly on zincated magnesium casting (AZ91) resulting in excellent adhesion and corrosion

More information

High Throw Bright Acid Copper for Rack and Barrel Plating

High Throw Bright Acid Copper for Rack and Barrel Plating E-Brite 203 High Throw Bright Acid Copper for Rack and Barrel Plating E-Brite 203 produces ductile and low-stress deposits over the entire recommended brightener range. The bath exhibits excellent brightness

More information

PARALOID AU-1033 Acrylic Polyol with Low Isocyanate Demand For Coatings on Recreational Equipment and Fleet Refinishing

PARALOID AU-1033 Acrylic Polyol with Low Isocyanate Demand For Coatings on Recreational Equipment and Fleet Refinishing Technical Data Sheet PARALOID AU-1033 Acrylic Polyol with Low Isocyanate Demand For Coatings on Recreational Equipment and Fleet Refinishing Introduction Features and Benefits Typical Physical Properties

More information

SurTec 759 Acidic Bright Zinc Process

SurTec 759 Acidic Bright Zinc Process Protection upgraded SurTec 759 Acidic Bright Zinc Process Properties produces very bright and ductile zinc layers highly concentrated additives, very economic consumption excellent covering and throwing

More information

PARALOID EXL-2690 IMPACT MODIFIER

PARALOID EXL-2690 IMPACT MODIFIER Technical Data Sheet EXL-269 IMPACT MODIFIER For Polycarbonate and Polycarbonate Blends Regional Availability Asia Pacific EMEA North America Description EXL-269 Impact Modifier is a methyl methacrylate-butadiene-styrene

More information

SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation

SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation Protection upgraded SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation (Electrolyte based on Potassium) Properties excellent metal distribution (only about 25 % of variance on a

More information

AVANSE ST-410 Acrylic Emulsion

AVANSE ST-410 Acrylic Emulsion Technical Data Sheet Environmentally-advanced Technology for Semitransparent Deck and Siding Stains For Industrial Coating Applications Regional Product Availability Description Features and Benefits of

More information

Bright Tin CULMO 20. Bright Tin CULMO 20 is extraordinary stable and easy to handle.

Bright Tin CULMO 20. Bright Tin CULMO 20 is extraordinary stable and easy to handle. Bright Tin CULMO 20 Brigt Tin CULMO 20 is based upon sulphuric acid, free from formalin and deposits bright tin layers. These layers are resistant to fingerprints and show good solderability, even after

More information

SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation

SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation Protection upgraded SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation (Electrolyte based on Sodium) Properties excellent metal distribution (only about 25 % of variance on a 1

More information

DE-88K. Ammonia free Temperature tolerance up to 110 F (43 C), reducing cooling costs. Zinc Plating System

DE-88K. Ammonia free Temperature tolerance up to 110 F (43 C), reducing cooling costs. Zinc Plating System is a two component, ammonia free, water soluble zinc plating system suitable for either rack or barrel plating operations. is characterized by ease of control, consistent day to day operation, and excellent

More information

Black-Magic RT S 30 Product Code: Revised Date: 01/11/2013. Black-Magic RT S 30

Black-Magic RT S 30 Product Code: Revised Date: 01/11/2013. Black-Magic RT S 30 Black-Magic RT S 30 DESCRIPTION Room temperature blackening solution for powdered metal and steel with minimal smut generation FEATURES AND BENEFITS Smut: low to none formed Works well with Activation

More information

NiClipse. Zinc Alloy Plating NiClipse

NiClipse. Zinc Alloy Plating NiClipse Zinc Alloy Plating Systems NiClipse NiClipse is an acid zinc/nickel plating process that offers exceptional corrosion resistance, along with bright deposits, exceptional distribution and covering power.

More information

ZINC PLATING SYSTEMS NH4 Zn/Co

ZINC PLATING SYSTEMS NH4 Zn/Co Zinc Plating Systems is an acid zinc cobalt electroplating process which produces a zinc alloy containing 0.3 0.9% (by weight) cobalt. Deposits from the process provide corrosion resistance unmatched by

More information

Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating

Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating E-Brite Ultra Cu-Pb Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating E-Brite Ultra Cu-Pb plates copper directly onto lead resulting in excellent adhesion and appearance. It eliminates the necessity

More information

SurTec 712 Alkaline Cyanide-Free Zinc/Iron Process

SurTec 712 Alkaline Cyanide-Free Zinc/Iron Process Protection upgraded SurTec 712 Alkaline Cyanide-Free Zinc/Iron Process (Electrolyte based on Potassium) Properties for rack and barrel plating, with excellent metal distribution good covering and throwing

More information

SurTec 881 Trivalent Decorative Chromium Process

SurTec 881 Trivalent Decorative Chromium Process Protection upgraded SurTec 881 Trivalent Decorative Chromium Process (Anti Salts Type) Properties environmentally friendly, hexavalent chromium free plating process high corrosion protection against calcium

More information

NB SEMIPLATE CU 150 Copper electroplating process

NB SEMIPLATE CU 150 Copper electroplating process NB SEMIPLATE CU 150 Copper electroplating process INTRODUCTION The NB SEMIPLATE CU 150 process is an acid copper plating formulation engineered for wafer plating applications including copper bump plating,

More information

Technical Process Bulletin

Technical Process Bulletin Type of Bulletin: Technical Process Bulletin Product Title: ANOSEAL 9000 Product View: ANOSEAL 9000 Description: Mid Temperature Seal for Anodized Aluminum (low foam) Status: complete Technical Process

More information

NiClipse C. Ammonium chloride free

NiClipse C. Ammonium chloride free NiClipse C NiClipse C is an acid zinc/nickel plating process that offers exceptional corrosion resistance, uniform alloy distribution and covering power, especially over cast substrates. NiClipse C deposits

More information

NON-CYANIDE ZINC-IRON PROCESS ZI NF E R S

NON-CYANIDE ZINC-IRON PROCESS ZI NF E R S NON-CYANIDE ZINC-IRON PROCESS ZI NF E R 5 9 0 S PHYSICAL PROPERTIES: ZINFER 591: Brown Liquid ZINFER 595: Yellowish Liquid ZINFER 596: Clear Liquid ZINFER 597: Brown Liquid DESCRIPTION: The ZINFER 590

More information

RHOPLEX SG-10M 100% Acrylic Emulsion For Interior/Exterior Semigloss Latex Paints

RHOPLEX SG-10M 100% Acrylic Emulsion For Interior/Exterior Semigloss Latex Paints Technical Data Sheet RHOPLEX SG-10M 100% Acrylic Emulsion For Interior/Exterior Semigloss Latex Paints Introduction RHOPLEX SG-10M Acrylic Emulsion is a versatile 100% copolymer that was designed for use

More information

ZINC PLATING SYSTEMS ZCL NH4

ZINC PLATING SYSTEMS ZCL NH4 Zinc Plating Systems ZCL NH 4 is a two component, water soluble, low ammonia zinc plating system suitable for either rack or barrel plating operations. is characterized by ease of control, consistent day

More information

OPERATING INSTRUCTIONS FOR TCCG & TCACG 267 & 1000 ML HEATED HULL CELLS (110 VOLT)

OPERATING INSTRUCTIONS FOR TCCG & TCACG 267 & 1000 ML HEATED HULL CELLS (110 VOLT) WARNING!!! PLEASE BE ADVISED THAT KOCOUR 110 VOLT HULL CELLS ARE ONLY RATED FOR USE WITH 110 VOLT AC POWER SUPPLY. DAMAGE TO THE HULL CELL AND/OR FIRE CAN OCCUR! 220 VOLT HULL CELLS ARE AVAILABLE! OPERATING

More information

is a two component, water soluble, low ammonia zinc plating system suitable for either rack or barrel plating operations. ZCl NH 4

is a two component, water soluble, low ammonia zinc plating system suitable for either rack or barrel plating operations. ZCl NH 4 Zinc Plating System is a two component, water soluble, low ammonia zinc plating system suitable for either rack or barrel plating operations. is characterized by ease of control, consistent day to day

More information

SurTec 717 R Alkaline Zinc/Nickel Process

SurTec 717 R Alkaline Zinc/Nickel Process Protection upgraded SurTec 717 R Alkaline Zinc/Nickel Process Properties optimized for rack plating tolerates higher temperatures with high burning limit achieves superior metal distribution produces uniform

More information

Lead-free electroless plating nickel bath for high wear and corrosion resistant applications

Lead-free electroless plating nickel bath for high wear and corrosion resistant applications RIAG Oberflächentechnik AG Postfach 169 CH-9545 Wängi TG 24.08.2009 DURNI-COAT DNC 571 Lead-free electroless plating nickel bath for high wear and corrosion resistant applications DNC 571 is a process

More information

ROPAQUE Ultra E Opaque Polymer

ROPAQUE Ultra E Opaque Polymer Technical Data Sheet Ultra E Opaque Polymer For Formulation Cost Savings and Improved Coating Performance Regional Product Availability Description EMEA Ultra E is one of the most advanced polymeric opacifiers

More information

4831 S. Whipple Avenue Chicago IL Phone: Fax:

4831 S. Whipple Avenue Chicago IL Phone: Fax: ACCU-LABS INC. 4831 S. Whipple Avenue Chicago IL 60632 Phone: 773.523.3100 Fax: 773.523.4008 www.accu-labs.com A2LA Accredited ISO/IEC 17025:2005 Certificate # 2558.01 855 Electroless Copper Plating Process

More information

Immersion Tin SN 30 1

Immersion Tin SN 30 1 Immersion Tin SN 30 1 Immersion Tin SN 30 1 is a process for the electroless deposition of tin on copper and copper alloys in charge exchange. The process is so also be suitable to brighten lead- or tin-lead

More information

Plating Systems Hex - A - Gone

Plating Systems Hex - A - Gone Plating Systems Hex-A-Gone Hex - A - Gone is a decorative trivalent chromium electroplating system which produces a finish comparable in color to a hexavalent chromium deposit. Hex - A - Gone offers exceptional

More information