SM Angled MT Endface Quality. Mike Hughes US Conec, Ltd March 26, 2007

Transcription

1 SM Angled MT Endface Quality Mike Hughes US Conec, Ltd March 26, 2007

2 SM APC MT Endface Quality: Project Scope Evaluation of MT endface quality on APC MT connectors Arizona Road Dust used for loose debris contaminant Scratches caused by abrasive film SM, Low-loss MT s used to minimize natural product variation. Maximum IL spec of.35db. Primary Goals: 1. Create SM MT acceptance tables for inspection standards or confirm that existing single mode standards are applicable 2. Characterize particle migration 1

3 Why Study? MT Ferrule New Challenges for Endface Quality: Connector Spring Force Connector Spring Force Industry need for SM Angled endface quality studies Industry need for MT endface quality studies Irregular appearance of glass filled polymeric ferrule makes contamination identification beyond fiber difficult Fibers protrude from ferrule surface typically 1-3 microns Potentially less contact force per fiber Fiber tip radius 2-3mm 2

4 Fiber Tip Height and Contact Force Variation Typical Fiber Height and Contact Force Distribution Fiber Height Contact Force Fiber Height (microns) Contact Force (Newtons) Fiber # *Tyco Electronics / US Conec Joint Analysis 0 3

5 Empirical Study Measurement Apparatus Load Cell Monitor Light Source Monitor X, Y, Z Stage Transparent Rigid Plate (Sapphire Flat) Transparent Glass Slide for Illumination Microscope Camera MT Ferrule X-Y Tilting Optical Flat Mount Optical Bench *Tyco Electronics / US Conec Joint Analysis 4

6 Fiber Tip Height Variation Empirical Study Protrusion (microns) Rigid Plate F Fibe r Numbe r F Contact: 2.05 N 10F Contact: 6.36 N Outermost fibers are last to contact and have the lowest contact force 12F Contact: N *Tyco Electronics / US Conec Joint Analysis 5

7 Fiber Tip Contact Zone Spot size due to fiber tip Hertzian Deformation with a 2mm Fiber Tip Radius Approximate Functioning Region for MT ferrules Spot Size (microns) Scaled fibers in contact Fiber tip contact force *Tyco Electronics / US Conec Joint Analysis 6

8 Contamination Experiment Steps 1. IL & RL measured 10 times to establish baseline values on clean DUT and Reference Connector. 2. Clean images recorded for both DUT and Reference connector. 3. Arizona Road Dust (ISO XYZ) used to contaminate DUT. 4. Contaminated DUT image recorded. 5. Contaminated DUT mated to Reference connector (clean initially). 6. IL & RL measured & recorded. 7. DUT unmated from Reference connector. 8. Contaminated DUT and Contaminated Reference connector images recorded. 9. Steps 5-8 repeated for a total of 5 mates 10. IL Failures are values outside average +/- 3σ 11. RL Failures are values outside average +/- 3σ and <55dB 7

9 Contamination Sample A: F2 (DUT) IL - Ave: 0.08dB; Std Dev: 0.016dB; RL- Ave: 58dB; Std Dev: 9dB PRE-MATE IL: 0.02 IL: RL: 72 RL: 57 POST 1 POST 2 IL: 0.60 IL: 0.15 IL: RL: 52 RL: 53 RL: 53 POST 3 POST 4 POST 5 8

10 Contamination Sample A: F2 (Ref) PRE-MATE POST 3 POST 1 POST 4 POST 2 POST 5 9

11 Contamination Sample B: F9 (DUT) IL - Ave: 0.06dB; Std Dev: 0.04dB; RL- Ave: 71dB; Std Dev: 1.3dB IL: 0.04 RL: 71 PRE-MATE IL: 0.06 RL: 70 POST 1 POST 2 IL: 0.05 IL: 0.06 IL: 0.04 RL: 70 RL: 69 RL: 68 POST 3 POST 4 POST 1 10

12 Contamination Sample B: F9 (Ref) PRE-MATE POST 3 POST 1 POST 4 POST 2 POST 5 11

13 Typical Failure Distribution for Non-Catastrophic Debris IL by Channel Insertion Loss (db) dust1 dust2 dust3 dust4 dust 5 R&R1 R&R2 R&R3 R&R4 R&R5 R&R6 R&R7 R&R8 R&R ch1 ch2 ch3 ch4 ch5 ch6 ch7 ch8 ch9 ch10 ch11 ch12 Channel Position 12

14 Sample Occluded Area of Zone A over 5 Cycles Total DUT + REF % Occlusion in Zone A (25 microns) : Post mate : Post mate 2 Total % of Occluded Area : Post mate : Post mate : Post mate F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 Fiber Position 13

15 Scratch Experiment Steps 1. IL & RL measured 10 times to establish baseline values on clean DUT and Reference Connector. 2. Clean images recorded for both DUT and Reference connector. 3. Abrasive polishing film used to scratch DUT. 4. Damaged DUT image recorded. 5. Damaged DUT mated to Reference connector. 6. IL & RL measured & recorded. 7. DUT unmated from Reference connector. 8. Both DUT and Reference connectors cleaned. 9. Steps 5-8 repeated for a total of 5 mates. 10. IL Failures are values outside average +/- 3σ 11. RL Failures are values outside average +/- 3σ and <55dB 14

16 Scratch Magnitude Dependance on Appearance 1.3 μm wide X 40nm deep 15

17 Scratch Image Analysis 16

18 Scratch Sample A L to R F5 IL (db) RL (db) average (10X) clean std deviation average + 3X std dev Scratched (5X)

19 Scratch Sample B L to R F6 IL (db) RL (db) average (10X) clean std deviation average + 3X std dev Scratched (5X)

20 Scratch Sample C L to R F4 IL (db) RL (db) average (10X) clean std deviation average + 3X std dev Scratched (5X)

21 Scratch Sample D L to R F6 IL (db) RL (db) average (10X) clean std deviation average + 3X std dev Scratched (5X)

22 Conclusions SM APC MT connectors are surprisingly tolerant of contamination and scratches for low power applications. Poorest performance tends to be on outermost channels with relatively minimal Zone A occluded area. This suggests loss of PC as a primary failure mode. Light white scratches have little or no effect on performance. Scratch width alone may be a poor indicator of scratch depth and ultimate impact on performance. Current single fiber UPC tables may be extreme for standard MT APC applications. Re-distribution of particles between contaminated matings appear random. 21

23 Current Status & Future Tasks Contamination data points (images + IL, RL performance for each 5 matings) collected and uploaded to inemi FTP site for Arizona Road Dust Contamination. Scratched endface data collection in progress. Some data is available on inemi FTP site Occluded Area analysis, particle migration study started at Celestica (Dr. Berdinskikh; Aron Lau). Need to finalize image analysis. Need to propose tables for IEC Document and any future revision of IPC

24 Contact: Mike Hughes US Conec, Ltd