Physical Structure
|
|
- Tiffany Clarke
- 6 years ago
- Views:
Transcription
1 Microelectronic Circuits, Kyung Hee Univ. Sring, Physical Structure n junction structure -tye semiconductor n-tye semiconductor metal contact for connection 1 Figure 1.35: Simlified hysical structure of the n junction. (Actual geometries are given in Aendix A.) As the n junction imlements the junction diode, its terminals are labeled anode and cathode.
2 Microelectronic Circuits, Kyung Hee Univ. Sring, Oeration with Oen-Circuit Q: What is state of n junction with oen-circuit terminals? A: -tye material contains majority of holes these holes are neutralized by equal amount of bound negative charge n-tye material contains majority of free electrons these electrons are neutralized by equal amount of bound ositive charge 2
3 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Bound charge charge of oosite olarity to free electrons / holes of a given material neutralizes the electrical charge of these majority carriers does not affect concentration gradients 3
4 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: What haens when a n-junction is newly formed aka. when the -tye and n-tye semiconductors first touch one another? A: See following slides 4
5 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Ste #1: The -tye and n-tye semiconductors are joined at the junction -tye semiconductor filled with holes junction n-tye semiconductor filled with free electrons Figure: The n junction with no alied voltage (oen-circuited terminals). 5
6 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Ste #1A: Bound charges are attracted (from environment) by free electrons and holes in the -tye and n-tye semiconductors, resectively. They remain weakly bound to these majority carriers; however, they do not recombine. negative bound charges ositive bound charges Figure: The n junction with no alied voltage (oen-circuited terminals). 6
7 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Ste #2: Diffusion begins. Those free electrons and holes which are closest to the junction will recombine and, essentially, eliminate one another. Figure: The n junction with no alied voltage (oen-circuited terminals). 7
8 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Ste #3: The deletion region begins to form as diffusion occurs and free electrons recombine with holes. The deletion region is filled with uncovered bound charges who have lost the majority carriers to which they were linked. Figure: The n junction with no alied voltage (oen-circuited terminals). 8
9 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: Why does diffusion occur even when bound charges neutralize the electrical attraction of majority carriers to one another? A: Diffusion current, as shown in (1.43) and (1.44), is effected by a gradient in concentration of majority carriers not an electrical attraction of these articles to one another. 9
10 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Ste #4: The uncovered bound charges effect a voltage differential across the deletion region. The magnitude of this barrier voltage (V 0 ) differential grows, as diffusion continues. No voltage differential exists across regions of the n-junction outside of the deletion region because of the neutralizing effect of ositive and negative bound charges. voltage otential barrier voltage (V o ) location (x) 10
11 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Ste #5: The barrier voltage (V 0 ) is an electric field whose olarity ooses the direction of diffusion current (I D ). As the magnitude of V 0 increases, the magnitude of I D decreases. diffusion (I D ) current drift current (I S ) Figure: The n junction with no alied voltage (oen-circuited terminals). 11
12 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Ste #6: Equilibrium is reached, and diffusion ceases, once the magnitudes of diffusion and drift currents equal one another resulting in no net flow. Once equilibrium is achieved, no net current flow exists (I net = I D I S ) within the n-junction while under oen-circuit condition. diffusion (I D ) current drift current (I S ) -tye deletion region n-tye 12
13 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 The Drift Current I S and Equilibrium In addition to majority-carrier diffusion current (I D ), a comonent of current due to minority carrier drift exists (I S ). Secifically, some of the thermally generated electrons and holes in the -tye and n-tye materials move toward and reach the edge of the deletion region. There, they exerience the electric field (V 0 ) in the deletion region and are swet across it. Unlike diffusion current, the olarity of V 0 reinforces this drift current. 13
14 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Because these holes and free electrons are roduced by thermal energy, I S is heavily deendent on temerature Any deletion-layer voltage, regardless of how small, will cause the transition across junction. Therefore I S is indeendent of V 0. drift current (I S ) is the movement of these minority carriers. 14
15 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 n-junction built-in voltage (V 0 ) is the equilibrium value of barrier voltage Generally, it takes on a value between 0.6 and 0.9V for silicon at room temerature This voltage is alied across deletion region, not terminals of n junction Power cannot be drawn from V 0 V0 = barrier voltage VT = thermal voltage NA = accetor doing concentration N D = donor doing concentration ni = concentration of free electrons......in intrinsic semiconductor NN A D (eq3.22) V0 = VT ln 2 ni 15
16 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Note that the magnitude of drift current (I S ) is unaffected by level of diffusion and / or V 0. It will be, however, affected by temerature. diffusion (I D ) current drift current (I S ) Figure: The n junction with no alied voltage (oen-circuited terminals). 16
17 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: Is the deletion region always symmetrical? As shown on revious slides? A: The short answer is no. Q: Why? A: Because, tyically N A > N D. When the concentration of doing agents (N A, N D ) is unequal, the width of deletion region will differ from side to side. The deletion region will extend deeer in to the less doed material, a requirement to uncover the same amount of charge. x = width of deletion -region x n = width of deletion n-region 17
18 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 The deletion region will extend further in to region with less doing. However, the number of uncovered charges is the same. 18
19 Microelectronic Circuits, Kyung Hee Univ. Sring, : Oeration with Oen-Circuit Terminals Width of and Charge Stored in the Deletion Region the question we ask here is, what haens once the oen-circuit n junction reaches equilibrium??? because concentration of tyically N A > N D doing agents (N A, N D ) is minority carrier concentrations at equilibrium (no voltage unequal, charge alied) the is equal, width are of denoted but by n 0 and deletion region will differ n0 dv/dx is deendent of Q/W from width side to is different side the deletion region will extend deeer in to the less doed material, a requirement to uncover the same amount of charge x = width of deletion -region x n = width of deletion n-region Oxford University Publishing Microelectronic Circuits by Adel S. Sedra and Kenneth C. 19
20 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: How is the charge stored in both sides of the deletion region defined? A: Refer to equations to right. Note that these values should equal one another. Q x n magnitude of charghe on n-side of junctionp q= magnitude of electric chargep A= cross-sectional area of junctionp = enetration of deletion region into n-sidep N = concentration of donor atomsp + = D (eq3.23) Q qax N (eq3.24) Q + = - A Q- = magnitude of charghe on n-side of junctionp q= magnitude of electric charge P A= cross-sectional area of junctionp x = enetration of deletion region into -sidep N = concentration of accetor atomsp A = n qax N D 20
21 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: What information can be derived from this equality? A: In reality, the deletion region exists almost entirely on one side of the n-junction due to great disarity between N A > N D. qax N xn = qax N (eq3.25) = x A n D N N A D 21
22 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Note that both x and x n may be defined in terms of the deletion region width (W). W= width of deletion regionp εs = electrical ermiability of silicon (11.7ε0 = 1.04E 12 F / cm) P q= magnitude of electron chargep NA = concentration of accetor atomsp ND = concentration of donor atomsp V 0 = barrier / junction built-in voltagep (eq3.26) 2ε S 1 1 W = xn + x = + V q NA ND 0 (eq3.27) N A xn = W N A + N D (eq3.28) N D x = W N A + N D 22
23 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Note, also, the charge on either side of the deletion region may be calculated via (1.47) and (1.51). (eq3.29) NN A D QJ = Q ± = Aq W NA + ND NN A D (eq3.30) QJ = A 2ε Sq V NA + ND 0 23
24 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: What has been learned about the n-junction? A: comosition The n junction is comosed of two silicon-based semiconductors, one doed to be -tye and the other n-tye. A: majority carriers Are generated by doing. Holes are resent on -side, free electrons are resent on n-side. 24
25 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: What has been learned about the n-junction? A: bound charges Charge of majority carriers are neutralized electrically by bound charges. A: diffusion current I D Those majority carriers close to the junction will diffuse across, resulting in their elimination. 25
26 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: What has been learned about the n-junction? A: deletion region As these carriers disaear, they release bound charges and effect a voltage differential V 0. A: deletion-layer voltage As diffusion continues, the deletion layer voltage (V 0 ) grows, making diffusion more difficult and eventually bringing it to halt. 26
27 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: What has been learned about the n-junction? A: minority carriers Are generated thermally. Free electrons are resent on -side, holes are resent on n-side. A: drift current I S The deletion-layer voltage (V 0 ) facilitates the flow of minority carriers to oosite side. A: oen circuit equilibrium I D = I S 27
28 Microelectronic Circuits, Kyung Hee Univ. Sring, Qualitative Descrition of Junction Oeration Figure to right shows n-junction under three conditions: (a) oen-circuit where a barrier voltage V 0 exists. (b) reverse bias where a dc voltage V R is alied. (c) forward bias where a dc voltage V F is alied. Figure 1.38: The n junction in: (a) equilibrium; (b) reverse bias; (c) forward bias. 28
29 Microelectronic Circuits, Kyung Hee Univ. Sring, ) no voltage alied 1) negative voltage alied 2) voltage differential 2) voltage differential across deletion zone across deletion zone (a) oen-circuit where a barrier voltage V 0 exists. is V (b) 0 is V 0 + V R reverse bias where a dc voltage V R is alied. 3) I(c) D = forward I S bias where a 3) dc I D voltage < I S V F is alied. 1) ositive voltage alied 2) voltage differential across deletion zone is V 0 - V F Figure to right shows n-junction under three conditions: 3) I D > I S Figure 3.11: The n junction in: (a) equilibrium; (b) reverse bias; (c) forward bias. 29
30 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 reverse bias case the externally alied voltage V R adds to (aka. reinforces) the barrier voltage V 0 increase effective barrier this reduces rate of diffusion, reducing I D if V R > 1V, I D will fall to 0A the drift current I S is unaffected, but deendent on temerature result is that n junction will conduct small drift current I S forward bias case the externally alied voltage V F subtracts from the barrier voltage V 0 decrease effective barrier this increases rate of diffusion, increasing I D k the drift current I S is unaffected, but deendent on temerature result is that n junction will conduct significant current I D - I S minimal current flows in reverse-bias case 30 significant current flows in forward-bias case
31 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Reverse-Bias Case Observe that increased barrier voltage will be accomanied by (1) increase in stored uncovered charge on both sides of junction (2) wider deletion region Width of deletion region shown to right. (eq3.31) W= width of deletion regionp εs = electrical ermiability of silicon (11.7ε0 = 1.04E 12 F / cm) P q= magnitude of electron chargep N A = concentration of accetor atomsp ND = concentration of donor atomsp V 0 = barrier / junction built-in voltagep V = externally alied reverse-bias voltagep R 2ε 1 1 W = x + x = + ( V + V ) n S 0 R q NA ND action: relace V with V + V NN A D (eq3.32) QJ = A 2ε Sq ( V0 + VR) NA + ND action: J relace V with V + V 0 Q = magnitude of charge stored on either side of deletion regionp 0 R 0 0 R 31
32 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Forward-Bias Case Observe that decreased barrier voltage will be accomanied by (1) decrease in stored uncovered charge on both sides of junction (2) smaller deletion region Width of deletion region shown to right. W= width of deletion regionp εs = electrical ermiability of silicon (11.7ε0 = 1.04E 12 F / cm) P q= magnitude of electron chargep NA = concentration of accetor atomsp ND = concentration of donor atomsp V = barrier / junction built-in voltagep V = externally alied forward-bias voltagep 0 F 2ε 1 1 W = x + x = + ( V V ) J n S 0 F q NA ND action: relace V with V V NN Q = A 2 ε q ( V V ) J S A D 0 F NA + ND action: relace V0 with V V F 0 Q = magnitude of charge stored on either side of deletion regionp 0 0 F 32
33 Microelectronic Circuits, Kyung Hee Univ. Sring, The Current-Voltage Relationshi of the Junction Q: What haens, exactly, when a forward-bias voltage (V F ) is alied to the n-junction? ste #1: Initially, a small forward-bias voltage (V F ) is alied. It, because of its olarity, ushes majority carriers (holes in -region and electrons in n-region) toward the junction and reduces width of the deletion zone. Note, however, that this force is oosed by the builtin voltage built in voltage V 0. 33
34 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 ste #1: Initially, a small forward-bias voltage (V F ) is alied. It, because of its olarity, ushes majority (holes in -region and electrons in n- region) toward the junction and reduces width of the deletion zone. V F Note that, in this figure, the smaller circles reresent minority carriers and not bound charges which are not considered here. Figure: The n junction with alied voltage. 34
35 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 ste #2: As the magnitude of V F increases, the deletion zone becomes thin enough such that the barrier voltage (V 0 V F ) cannot sto diffusion current as described in revious slides. V F Note that removing barrier voltage does not facilitate diffusion, it only removes the electromotive force which ooses it. Figure: The n junction with alied voltage. 35
36 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 ste #3: Majority carriers (free electrons in n-region and holes in -region) cross the junction and become minority charge carriers in the nearneutral region. V F diffusion current (I D ) drift current (I S ) Figure: The n junction with alied voltage. 36
37 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 ste #4: The concentration of minority charge carriers increases on either side of the junction. A steady-state gradient is reached as rate of majority For carriers the oen-circuit crossing the condition, junction equals minority that carriers of recombination. are evenly distributed throughout the non-deletion regions. This concentration is defined as Veither F n 0 or n0. minority carrier concentration location (x) Figure: The n junction with alied voltage. 37
38 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 ste #4: The concentration of minority charge carriers increases on either side of the junction. A steady-state gradient is reached as rate of majority carriers crossing the junction equals that of recombination. V F minority carrier concentration location (x) Figure: The n junction with alied voltage 38
39 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 ste #5+: Diffusion current is maintained in site low diffusion lengths (e.g. microns) and recombination by constant flow of both free electrons and holes towards the junction. recombination V F flow of diffusion current (I D ) flow of holes flow of electrons Figure: The n junction with alied voltage 39
40 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 The key asect of (1.57) is that it relates the minority-charge carrier concentration at the junction boundary in terms of majority-charge carrier on the oosite side. Q: How is the relationshi between forward-bias voltage alied (V. ) and minority-carrier holes and electrons defined? ste #1: Emloy (1.57). This function describes maximum minority carrier concentration at junction. ste #2: Subtract n0 from n (x) to calculate the excess minority charge carriers. T 40 (eq3.7) n0 n( xn) = concentration of holes in n-region as function of xnp n 0 = thermal equilibrium concentrationp V = alied foward-bias voltagep V = thermal voltagep (eq 3.34 ) = V / VT (eq3.33) ( x ) = e n N 2 i A n n n0 excess = e concentration V / VT n0 n0 excess (eq3.34) = e concentratio n V / VT n0( 1)
41 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: How is the relationshi between forward-bias voltage alied (V. ) and minority-carrier holes and electrons defined? ste #3: Refer to (1.59). This function describes the minority carrier concentration as a function of location (x), boundary of deletion region (x n ), and diffusion length (L ). ( x ) = concentration of holes in n-region as function of x, = thermal equilibrium concentration x = oint of interest, x edge of deletion region, L = diffusion length n n n n0 n= P ( x xn)/ L (eq3.35) n( xn) = n0 + ( excess concentrati on) e (eq3.35) ( x n n0 V / VT ( e 1) = + e e V / VT n) n0 n0( 1) ( x x )/ L n 41
42 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 steady-state minority carrier concentration on both sides of a n-junction for which N A >> N D 3.5.2: The Current-Voltage Relationshi of the Junction base concentration excess concentration Oxford University Publishing Microelectronic Circuits by Adel S. Sedra and Kenneth C. Smith ( ) 42
43 Microelectronic Circuits, Kyung Hee Univ. Sring, : The Current-Voltage Relationshi of the Junction These excess concentrations effect steady-state diffusion current. However, how is this diffusion current defined? Oxford University Publishing Microelectronic Circuits by Adel S. Sedra and Kenneth C. Smith ( ) 43
44 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: For forward-biased case, how is diffusion current (I D ) defined? ste #1: Take derivative of (1.59) to define comonent of diffusion current attributed to flow of holes. ste #2: Note that this value is maximum at x = x n. Oxford University Publishing Microelectronic Circuits by Adel S. Sedra and Kenneth C. Smith ( ) 44 action: take derivative of n ( x) dn( x) d = [ n0 ] + dx dx 0 d V / V ( x xn)/ L T + n0( e 1) e dx L n0 V / VT ( x xn)/ L ( e 1) e n0 V / VT (eq3.36) ( 1) L action: substitute in value from above ( x xn)/ L J = qd e e dn ( x) dx action: calculate maximum max D V / V ( J ) 0( T = q n e 1) L
45 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: For forward-biased case, how is diffusion current defined? ste #3: Define the comonent of maximum diffusion current attributed to minority-carrier electrons in method similar above. (eq3.37) maximum hole - diffusion concentration: J D V / VT ( + xn) = q n0 ( e 1) L (eq3.38) maximum electron - diffusion concentration: J D n V / VT n( x) = q n0 ( e 1) Ln 45
46 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: For forward-biased case, how is diffusion current defined? ste #4: Define total diffusion current as sum of comonents attributed to free electrons and holes. total current ( I) through junction is equal to area ( A) times maximum hole ( J ) and electron-diffusion ( J ) current densities n I= A J( + xn) + Jn( x) D Dn V / VT I= A q n0 + q n0 ( e 1) L Ln action: subtitute in values for J ( + x ) and J (- x ) n n D 2 Dn V / VT I = Aqni + ( e 1) LN D LN n A V / VT I= IS ( e 1) action: subtitute 2 D Dn Is= Aqni + LN D L nn action: subtitute 2 2 = n / N and n = n / N n0 i D 0 i A A 46
47 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: For forward-biased case, how is diffusion current (I D ) defined? A: This is an imortant equation which will be emloyed in future chaters. D D 40) ) 2 n V / VT V / VT (eq3. I = Aqni + ( e 1) = IS ( e 1 LN D LN n A I S 47
48 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 Q: Why is diffusion current (I D ) deendent on the concentration gradient of minority (as oosed to majority) charge carriers? A: Essentially, it isn t. Equation (1.57) defines the minority-charge carrier concentration in terms of the majority-charge carrier concentrations in other region. As such, the diffusion current (I D ) is most deendent on two factors: alied forward-bias voltage (V F ) and doing. 48
49 Microelectronic Circuits, Kyung Hee Univ. Sring, 2016 saturation current (I S ) is the maximum reverse current which will flow through n-junction. It is roortional to cross-section of junction (A). Tyical value is A. V / V (eq3.40) I= I ( T S e 1) Figure 1.40: The n junction I V characteristic. 49
Semiconductor Devices
Semiconductor Devices - 2014 Lecture Course Part of SS Module PY4P03 Dr. P. Stamenov School of Physics and CRANN, Trinity College, Dublin 2, Ireland Hilary Term, TCD 20 th of Jan 14 M-S and p-n Junctions
More informationSize independence of UHPC ductility
Size indeendence of UHPC ductility E. Chuang & F.J. Ulm Massachusetts Institute of Technology, Cambridge, Massachusetts, U.S.A. ABSTRACT: This aer examines the size effects in UHPC tensile behavior. It
More informationME 432 Fundamentals of Modern Photovoltaics. Discussion 30: Contacts 7 November 2018
ME 432 Fundamentals of Modern Photovoltaics Discussion 30: Contacts 7 November 2018 Fundamental concepts underlying PV conversion input solar spectrum light absorption carrier excitation & thermalization
More informationPHYSICSOF SOLARCELLS. Jenny Nelson. Imperial College, UK. Imperial College Press ICP
im- PHYSICSOF SOLARCELLS Jenny Nelson Imperial College, UK ICP Imperial College Press Contents Preface v Chapter 1 Introduction 1 1.1. Photons In, Electrons Out: The Photovoltaic Effect 1 1.2. Brief History
More informationINVESTIGATION ON THE RELATIONSHIP BETWEEN FLOW PATTERN AND AIR AGE
INVESTIGATION ON THE RELATIONSHIP BETWEEN FLOW PATTERN AND AIR AGE Xianting LI, Xin WANG, Xiaofeng LI and Ying LI Deartment of Thermal Engineering, Tsinghua University Beiing, 184, P.R. China ABSTRACT
More informationMaterials of Engineering ENGR 151 ELECTRCIAL PROPERTIES
Materials of Engineering ENGR 151 ELECTRCIAL PROPERTIES ELECTRON ENERGY BAND STRUCTURES Atomic states split to form energy bands Adapted from Fig. 18.2, Callister & Rethwisch 9e. 2 BAND STRUCTURE REPRESENTATION
More informationDESIGN AND OPERATING PRINCIPLES OF III- V SOLAR CELLS
DESIGN AND OPERATING PRINCIPLES OF III- V SOLAR CELLS ANTHONY MELECO CAPSTONE ADVISER: DR. IAN SELLERS TABLE OF CONTENTS Abstract... 3 Introduction... 3 Procedure... 4 Photomask... 4 Modeling... 5 IV curve...
More informationChapter 18: Electrical Properties
Chapter 18: Electrical Properties What are the physical phenomena that distinguish conductors, semiconductors, and insulators? For metals, how is conductivity affected by imperfections, T, and deformation?
More informationEE 330 Lecture 12. Devices in Semiconductor Processes
EE 330 Lecture 12 Devices in Semiconductor Processes Review from Lecture 9 Copper Interconnects Limitations of Aluminum Interconnects Electromigration Conductivity not real high Relevant Key Properties
More informationLezioni di Tecnologie e Materiali per l Elettronica
Lezioni di Tecnologie e Materiali er l Elettronica Danilo Manstretta danilo.manstretta@univ.it microlab.univ.it Outline Passive comonents Resistors Caacitors Inductors Printed circuits technologies Materials
More informationCHEMICAL ENGINEERING LABORATORY CHEG 4137W/4139W. Osmotic Separations: Reverse Osmosis (RO) Supplemental Theory
HEMIAL ENGINEERING LABORATORY HEG 4137W/4139W Osmotic Searations: Reverse Osmosis (RO) Sulemental Theory The goal of RO desalination is to extract significant quantities of otable water from saltwater
More informationChapter 18: Electrical Properties
Chapter 18: Electrical Properties ISSUES TO ADDRESS... How are electrical conductance and resistance characterized? What are the physical phenomena that distinguish conductors, semiconductors, and insulators?
More informationSemiconductor Very Basics
Semiconductor Very Basics Material (mostly) from Semiconductor Devices, Physics & Technology, S.M. Sze, John Wiley & Sons Semiconductor Detectors, H. Spieler (notes) July 3, 2003 Conductors, Semi-Conductors,
More informationSIMULATION OF LCM PROCESSES USING CELLULAR AUTOMATS
SIMULATION OF LCM PROCESSES USING CELLULAR AUTOMATS M. Henne 1 and G.A. Barandun 1 1 University of Alied Science Raerswil HSR, Institute for Material Science and Plastic Processing, Oberseestrasse 10,
More informationFatigue life prediction for finite ratchetting of bellows at cryogenic temperatures
LHC Project Note 012 1995-11-14 (skoczen@cernvm.cern.ch) Fatigue life rediction for finite ratchetting of bellows at cryogenic temeratures B. Skoczen, T. urtyka, J.C. Brunet, A. Poncet, A. Jacquemod MT/ESH
More informationResolve issues with process capability indexes, business metrics
3.4 Per Million BY Forrest W. Breyfogle III Insight or Folly? Resolve issues with rocess caability indexes business metrics In lean Six Sigma much training effort is sent on conveying the imortance of
More informationFinite Element Analysis of Plasticity- Induced Fatigue Crack Closure with Singular Element
American Journal of Alied ciences 4 (6): 357-361, 27 IN 1546-9239 27 cience Publications Finite Element Analysis of Plasticity- Induced Fatigue Crack Closure with ingular Element 1 Rahgozar R., 1 affari
More informationStairs and Access Ramps between Floors in Multi-storey Buildings
ENG.BULL.0001 1 Reort to the Royal Commission Stairs and Access Rams between Floors in Multi-storey Buildings 1.0 Background Des Bull Adjunct Professor University of Canterbury The Darfield earthquake
More informationHigh Speed Devices and Circuits Prof K. N. Bhat Department of Electrical Engineering Indian Institute of Technology, Madras
High Speed Devices and Circuits Prof K. N. Bhat Department of Electrical Engineering Indian Institute of Technology, Madras Lecture 4 Ternary Compound Semiconductors and their Applications Last time we
More informationThermal Experiments in Direct Metal Laser Sintering
Thermal Exeriments in Direct Metal Laser Sintering Mr. C. Martin Taylor, rof. Thomas H.C. Childs School of Mechanical Engineering, University of Leeds, Leeds LS 9JT, UK Email: mencmt@leeds.ac.uk; Tel.
More informationFINITE ELEMENT ANALYSIS OF HASTELLOY C-22HS IN END MILLING
Journal of Mechanical Engineering and Sciences (JMES) ISSN (Print): 89-4659; e-issn: 3-8380; Volume,. 37-46, December 0 Universiti Malaysia Pahang, Pekan, Pahang, Malaysia DOI: htt://dx.doi.org/0.58/jmes..0.4.0004
More informationINVESTIGATION OF ELECTORSTATIC PRECIPITATOR CHAR COLLECTOR DESIGNS USING COMPUTATIONAL FLUID DYNAMICS.
Seventh International Conference on CFD in the Minerals and Process Industries CSIRO, Melbourne, Australia 9-11 December 2009 INVESTIGATION OF ELECTORSTATIC PRECIPITATOR CHAR COLLECTOR DESIGNS USING COMPUTATIONAL
More informationThis is an author-deposited version published in : Eprints ID : 9011
OATAO is an oen access reository that collects the work of Toulouse researchers and makes it freely available over the web where ossible. This is an author-deosited version ublished in : htt://oatao.univ-toulouse.fr/
More informationGRAIN BOUNDARY RECOMBINATION PROCESSES AND CARRIER TRANSPORT IN POLYCRYSTALLINE SEMICONDUCTORS UNDER OPTICAL ILLUMINATION
CHAPTER V GRAIN BOUNDARY RECOMBINATION PROCESSES AND CARRIER TRANSPORT IN POLYCRYSTALLINE SEMICONDUCTORS UNDER OPTICAL ILLUMINATION 5.1 INTRODUCTION P olycrystalline semiconductors are potential candidates
More informationWelding Penetration Control for Aluminum Pipe Welding Using Omnidirectional Vision-based Monitoring of Molten Pool *
[ 溶接学会論文集第 7 巻第 号.7s -s(9)] Welding Penetration Control for Aluminum Pie Welding Using Omnidirectional Vision-based Monitoring of Molten Pool * by Ario Sunar Baskoro **, Rui Masuda**, Masashi Kabutomori**
More informationFatigue based structural design optimization implementing a generalized Frost-Dugdale crack growth law
Proceedings of the 2007 WSEAS International Conference on Comuter Engineering and Alications, Gold Coast, Australia, January 17-19, 2007 490 Fatigue based structural design otimization imlementing a generalized
More informationMeasurement of the electrical conductivity of open-celled aluminium foam using non-contact eddy current techniques
NDT&E International 38 (2005) 359 367 www.elsevier.com/locate/ndteint Measurement of the electrical conductivity of oen-celled aluminium foam using non-contact eddy current techniques X. Ma a, *, A.J.
More informationMicrostructure-Properties: I Lecture 5B The Effect of Grain Size. on Varistors
1 Microstructure-Properties: I Lecture 5B The Effect of on 27-301 October, 2007 A. D. Rollett 2 This lecture is concerned with the effects of grain size on properties. This is the second of two examples:
More informationChapter 5: Atom and Ion Movements in Materials
Slide 1 Chapter 5: Atom and Ion Movements in Materials 5-1 Slide 2 Learning Objectives 1. Applications of diffusion 2. Stability of atoms and ions 3. Mechanisms for diffusion 4. Activation energy for diffusion
More informationSEMICONDUCTORS R. A. SMITH CAMBRIDGE AT THE UNIVERSITY PRESS. M.A., PH.D. Head of the Physics Department Royal Radar Establishment Malvern J 959
SEMICONDUCTORS BY R. A. SMITH M.A., PH.D. Head of the Physics Department Royal Radar Establishment Malvern CAMBRIDGE AT THE UNIVERSITY PRESS J 959 CONTENTS Chapter 1. The Elementary Properties of Semiconductors
More informationQuantity Uncertainty and Demand: The Case of Water Smart Reader Ownership. Aaron Strong and Christopher Goemans. May 2012.
Quantity Uncertainty and Demand: The Case of Water Smart Reader Onershi Aaron Strong and Christoher Goemans May 2012 Abstract: There are a number of instances hen consumers have imerfect information regarding
More informationTheoretical Evaluation of Ejector- Based Heat Pump Cycles for cold climates
- 1 - Theoretical Evaluation of Ejector- Based Heat Pum Cycles for cold climates Ridha Ben Mansour 1 a,*, Mohamed Ouzzane 2 a, Zine Aidoun 3 a a CanmetENERGY, Natural Resources Canada, 1615 Lionel Boulet
More informationQuality. Mokhtari. for improving. characteristic, to an out- select the. in-control. of quality. in a. classical. .iust.ac.ir/
International Journal Industrial Engineering & Production Research (16 Setember 16, Volume 7, Number 3. 75-85 htt://ijiepr..iust.ac.ir/ Simultaneous Otimization Production and Deterioration Process Quality
More informationFamily Plans: Market Segmentation by Bundling Consumers
amily Plans: Market Segmentation by Bundling Consumers Bo Zhou Preliminary & Incomlete Draft June 013 Bo Zhou (bo.zhou@duke.edu) is a PhD student in Marketing at the uua School of Business, Duke University,
More informationThe 33rd Progress In Electromagnetics Research Symposium (PIERS 2013), Taipei, Taiwan, March 2013.
Title Multiphysics modeling and understanding for plasmonic organic solar cells Author(s) Sha, WEI; Choy, WCH; Chew, WC Citation The 33rd Progress In Electromagnetics Research Symposium (PIERS 2013), Taipei,
More informationMaterials, Electronics and Renewable Energy
Materials, Electronics and Renewable Energy Neil Greenham ncg11@cam.ac.uk Inorganic semiconductor solar cells Current-Voltage characteristic for photovoltaic semiconductor electrodes light Must specify
More informationAnalysis of vertical load-bearing capacity of a single pile
Engineering manual No. 13 Udated: 06/2018 Analysis of vertical load-bearing caacity of a single ile Program: File: Pile Demo_manual_13.gi The objective of this engineering manual is to exlain how to use
More informationICE JET TECHNOLOGY MARKO JERMAN 1, ANDREJ LEBAR 1,2, IZIDOR SABOTIN 1, PAVEL DRESAR 1, JOSKO VALENTINCIC 1
ICE JET TECHNOLOGY MARKO JERMAN 1, ANDREJ LEBAR 1,, IZIDOR SABOTIN 1, PAVEL DRESAR 1, JOSKO VALENTINCIC 1 1 University of Ljubljana, Faculty of Mechanical Engineering, Slovenia University of Ljubljana,
More informationOn the demand distributions of spare parts
DePaul University From the SelectedWorks of Nezih Altay Aril, On the demand distributions of sare arts A A Syntetos, University of Salford M Z Babai, King Saud University Nezih Altay, DePaul University
More informationCriteria for Mixed-Mode Fracture Prediction in Ductile Material
Criteria for Mixed-Mode Fracture rediction in Ductile Material N. Recho, S. Ma, X.B. Zhang University of Blaise ascal, IUT of Montluçon. B2235, Av. A. Briand, 03100, Montluçon, France recho@moniut.univ-bclermont.fr
More informationLinkage Disequilibrium. Biostatistics 666
Linkage Disequilibrium iostatistics 666 Logistics: Office Hours Office hours on Mondays at 4 m. Room 4614 School of Public Health Tower Previously asic roerties of a locus llele Frequencies Genotye Frequencies
More informationBEER & WINE LASER CUTTING FOOD PROCESSING GAS ASSIST INJECTION MOLD- CHEMICAL PROCESSING. PSA Nitrogen Generators
BEER & WINE LASER CUTTING FOOD PROCESSING GAS ASSIST INJECTION MOLD- CHEMICAL PROCESSING BLANKETING HEAT TREATING PHARMACEUTICAL LASER & PLASMA CUTTING PSA Nitrogen Generators Common Alications Beer &
More informationAPPLICATION OF A COAL COMBUSTION MODEL IN THE DESIGN OF BLAST PARAMETERS FOR AN IRONMAKING BLAST FURNACE
Fifth International Conference on CFD in the Process Industries CSIRO, Melbourne, Australia 3-5 December 006 APPLICATION OF A COAL COMBUSTION MODEL IN THE DESIGN OF BLAST PARAMETERS FOR AN IRONMAKING BLAST
More informationECE 440 Lecture 27 : Equilibrium P-N Junctions I Class Outline:
ECE 440 Lecture 27 : Equilibrium P-N Junctions I Class Outline: Fabrication of p-n junctions Contact Potential Things you should know when you leave Key Questions What are the necessary steps to fabricate
More informationMODELLING OF MATERIAL BEHAVIOUR FOR INCONEL 718 SUPERALLOY USING EXPERIMENTAL DATA 1. INTRODUCTION
Journal of Machine Engineering, Vol. 17, No. 3, 217 Received: 3 January 217 / Acceted: 1 June 217 / Published online: 28 Setember 217 modeling, machining, constitutive model Piotr NIESLONY 1* Wit GRZESIK
More informationPlanning and Design of Flex-Route Transit Services
Transortation Research Record 1791 59 Paer No. 2-2324 Planning and Design of Flex-Route Transit Services Liing Fu A theoretical investigation is resented of various issues involved in the lanning and design
More informationEquilibrium Constant in a Reaction rate in a PFR Reactors By Robert P. Hesketh Spring 2006
Equilibrium Constant in a eaction rate in a F eactors By obert. Hesketh Sring 6 In this session you will learn how to use equilibrium constants within a reaction rate exression. Alication of Chemical Equilibrium
More informationShape control of SMA embedded GFRP beam using continuous sliding mode controller
Indian Journal of Engineering & Materials Sciences Vol. 22, February 2015,. 7-13 Shae control of SMA embedded GFRP beam using continuous sliding mode controller P Senthilkumar*, S Jayasankar, Satisha &
More informationP.-A. Eggertsen a,b, Kjell Mattiasson a,b, Mats Larsson c,d
A COMPREHENISVE ANALYSIS OF BENCHMARK 4: PRE-STRAIN EFFECT ON SPRINGBACK OF D DRAW BENDING P.-A. Eggertsen a,b, Kjell Mattiasson a,b, Mats Larsson c,d a Div. of Material and Comutational Mechanics, Det.
More informationSocial Trust as a solution to address sparsity-inherent problems of Recommender systems
Social Trust as a solution to address sarsity-inherent roblems of Recommender systems Georgios Pitsilis Q2S, NTNU O.S. Bragstads lass 2E NO-7491, Trondheim, Norway +47 735 92743 itsilis@q2s.ntnu.no Svein
More informationEffect of grain boundaries on photovoltaic properties of PX-GaAs films
Indian Journal of Pure & Applied Physics Vol. 48, August 2010, pp. 575-580 Effect of grain boundaries on photovoltaic properties of PX-GaAs films M K Sharma & D P Joshi* Principal, Govt Sr Sec School Kolar,
More informationFINITE ELEMENT ANALYSIS OF HASTELLOY C-22HS IN END MILLING
Journal of Mechanical Engineering and Sciences (JMES) e-issn: 3-8380; Volume,. 37-46, December 0 FKM, Universiti Malaysia Pahang FINITE ELEMENT ANALYSIS OF HASTELLOY C-HS IN END MILLING K. Kadirgama, M.M.
More informationA discrete event model for the control and analysis of complex automated warehouse systems
2011 IEEE Conference on Automation Science and Engineering Trieste, Italy - Augus4-27, 2011 ThB2.1 A discrete event model for the control and analysis of comlex automated warehouse systems F. Basile and
More information* Ravi Gor 1 and Ashok Patel 2. * Author for Correspondence
A SINGLE PERIOD MODEL WHERE THE LOST SALES RECAPTURE IS A FUNCTION OF log m 1 r Ravi Gor 1 and Ashok Patel 2 1 Dr. Baba Saheb Ambedkar Oen University, Gujarat 2 P.S. Science and H. D Patel Arts College,
More informationSlide 1. Slide 2. Slide 3. Chapter 19: Electronic Materials. Learning Objectives. Introduction
Slide 1 Chapter 19: Electronic Materials 19-1 Slide 2 Learning Objectives 1. Ohm s law and electrical conductivity 2. Band structure of solids 3. Conductivity of metals and alloys 4. Semiconductors 5.
More informationPI Control of a Continuous Bio-Reactor
PI Control of a Continuous Bio-Reactor Rudy Agustriyanto Deartment of Chemical Engineering, Faculty of Engineering, University of Surabaya (UBAYA), Surabaya, Indonesia; *Corresonding Author: rudy.agustriyanto@staff.ubaya.ac.id.
More informationAssignment Questions
HIGH SPEED DEVICES AND CIRCUITS Assignment Questions 1) Why Silicon Semiconductors are widely used in the VLSI applications? Hint: Refer Video on Introduction to Basic Concepts 2) What are the parameters
More information3 Diode Model - Level 500
April 2007 Diode Model - Level 500 3 Diode Model - Level 500 25 Diode Model - Level 500 April 2007 3.1 Introduction The Diode level-500 model provides a detailed description of the diode currents in forward
More informationOptimisation of WSA technology - Integration of energy and adaptation to the Chinese market
Otimisation of WSA technology - Integration of energy and adatation to the Chinese market Annette Wendt Deartment of Chemical Engineering, Lund University Abstract The aim of this Master thesis was to
More informationCondensed Matter in a Nutshell
PHYS 342/555 Condensed Matter in a Nutshell Instructor: Dr. Pengcheng Dai Professor of Physics The University of Tennessee (Room 407A, Nielsen, 974-1509) (Office hours: TR 1:10PM-2:00 PM) Lecture room
More informationMicrowave heating in a pressurized chamber
Microwave heating in a ressurized chamber John F. Hunt, P.E., Research Mechanical Engineer Hongmei Gu, Post Doc. Research Associate Jerrold E. Winandy, Research Suervisory Engineer Phili Walsh, General
More informationInfluence of Shape of Cohesive Zone on Gas Flow and Permeability in the Blast Furnace Analyzed by DEM-CFD Model
ISIJ International, Vol. 55 (2015), ISIJ International, No. 6 Vol. 55 (2015), No. 6,. 1232 1236 Influence of Shae of Cohesive Zone on Gas Flow and Permeability in the Blast Furnace Analyzed by DEM-CFD
More informationNUMERICAL SIMULATION OF WATER MIST SUPPRESSION OF TUNNEL-FIRE SCENARIOS
Third International Conference on CFD in the Minerals and Process Industries CSIRO, Melbourne, Australia 10-12 December 2003 NUMERICAL SIMULATION OF WATER MIST SUPPRESSION OF TUNNEL-FIRE SCENARIOS HART,
More informationDistributed Control of a Grid-connected PV-battery System for Constant Power Generation
Journal of Energy Management Technology (JEMT) Vol. 3, Issue 3 14 Distributed Control of a Grid-connected PV-battery System for Constant Power Generation Parviz Talebi 1 Mohammad Hejri 1,* 1 Deartment
More informationThe Effect of Job Satisfaction of the Talented Employees on Organizational Commitment: A Field Research
Available online at www.sciencedirect.com Procedia - Social and Behavioral Sciences 58 ( 2012 ) 322 330 8 th International Strategic Management Conference The Effect of Job Satisfaction of the Talented
More informationAgenda o Semiconductor Materials o Crystal Growth o Intrinsic Semiconductors o Extrinsic Semiconductors
E84 Lecture 3/6/14 K. Candler Agenda o Semiconductor Materials o Crystal Growth o Intrinsic Semiconductors o Extrinsic Semiconductors Introduction A semiconductor is a material that has electrical conductivity
More informationThe B.E. Journal of Economic Analysis & Policy
The BE Journal of Economic Analysis & Policy Contributions Volume, Issue 0 Article 50 Cometitive Mixed Bundling of Vertically Differentiated Products Illtae Ahn Kiho Yoon Chung-Ang University, illtae@cauackr
More informationSymmetry Breaking of In-Plane Order in Confined Copolymer Mesophases
Iowa State University From the SelectedWorks of Eric W. Cochran Aril, 2007 Symmetry Breaking of In-Plane Order in Confined Coolymer Mesohases G. E. Stein Eric W. Cochran K. Katsov G. H. Fredrickson E.
More informationMicroelectronics Devices
Microelectronics Devices Yao-Joe Yang 1 Outline Basic semiconductor physics Semiconductor devices Resistors Capacitors P-N diodes BJT/MOSFET 2 Type of Solid Materials Solid materials may be classified
More informationAnalysis of Unbonded Prestressed Concrete T-type Beam s Dynamic Characteristics
Analysis of Unbonded Prestressed Concrete T-tye Beam s Dynamic Characteristics Yingge Wang Deartment of Civil Engineering, Jiaying University Meizhou 514015, Guangdong, China E-mail: summerc9@16.com Abstract
More informationThe story so far: Isolated defects
The story so far: Infinite, periodic structures have Bloch wave single-particle states, labeled by a wavenumber k. Translational symmetry of the lattice + periodic boundary conditions give discrete allowed
More informationEconomics of Strategy (ECON 4550) Maymester 2015 Review of Relevant Principles of Economics
Economics of Strategy (ECON 455) Maymester 215 Review of Relevant Princiles of Economics Definitions and Concets: Economics is the social science that studies decision making in the face of scarcity, and
More informationProceedings of the ASME nd International Conference on Ocean, Offshore and Arctic Engineering OMAE2013 June 9-14, 2013, Nantes, France
Proceedings of the ASME 3 3nd International Conference on Ocean, Offshore and Arctic Engineering OMAE3 June 9-4, 3, Nantes, France OMAE3-5 INVESTIGATION TO AIR COMPRESSIBILITY OF OSCILLATING WATER COLUMN
More informationComparison of ANFIS and ANN for Estimation of Biochemical Oxygen Demand Parameter in Surface Water
Comarison of AFIS and A for Estimation of Biochemical Oxygen Demand Parameter in Surface Water S. Areerachakul Abstract owadays, several techniques such as; Fuzzy Inference System (FIS) and eural etwork
More informationWe are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists. International authors and editors
e are IntechOen, the world s leading ublisher of Oen Access books Built by scientists, for scientists 4,000 116,000 120M Oen access books available International authors and editors Downloads Our authors
More informationINTRODUCTION TO VLSI FABRICATION MATERIALS & PROCESSES. Primary Chip Ingredients
INTRODUCTION TO VLSI FABRICATION MATERIALS & PROCESSES Primary Chi Ingredients 1) Silicon crystalline Near erfect crystal (atoms organized in a regular, ordered lattice) Semiconductor not a conductor or
More informationTHERMODYNAMICAL RESEARCH OF USING SOLAR ENERGY FOR DESALINATION OF SEAWATER
THERMODYNAMICAL RESEARCH OF USING SOLAR ENERGY FOR DESALINATION OF SEAWATER by Marjan R. ARSOVIĆ a*, Radivoje M. TOPIĆ b, Mirko S. KOMATINA b, Milan GOJAK b a Doosan Hydro Technology, Tama, Florida, United
More informationReputation Based Buyer Strategy For Seller Selection For Both Frequent and Infrequent Purchases
Reutation Based Buyer Strategy For Seller Selection For Both Frequent and Infrequent Purchases Abstr. Previous research in the area of buyer strategies for choosing sellers in ecommerce markets has focused
More informationRetail Pricing and Day-Ahead Demand Response in Smart Distribution Networks
Intelligence Systems in Electrical Engineering, 4 th year, No. 4, Winter 2014 23 Retail Pricing and Day-Ahead Demand Resonse in Smart Distribution Networks Shaghayegh Yousefi 1 and GholamReza Yousefi 2
More informationLab IV: Electrical Properties
Lab IV: Electrical Properties Study Questions 1. How would the electrical conductivity of the following vary with temperature: (a) ionic solids; (b) semiconductors; (c) metals? Briefly explain your answer.
More informationFairchild Semiconductor Application Note June 1983 Revised March 2003
Fairchild Semiconductor Application Note June 1983 Revised March 2003 High-Speed CMOS (MM74HC) Processing The MM74HC logic family achieves its high speed by utilizing microcmos Technology. This is a 3.5
More informationCoupled Coating Formation Simulation in Thermal Spray Processes using CFD and FEM
www.cfdl.issres.net Vol. 3 (2) June 2011 Couled Coating Formation Simulation in Thermal Sray Processes using CFD and FEM J. Prehm C, L. Xin, K. Möhwald, Fr.-W. Bach Institute of Materials Science, Leibniz
More informationManufacturer-Retailer Pricing Competition Across Multiple Product Categories: An Equilibrium Framework
Manufacturer-Retailer Pricing Cometition Across Multile Product Categories: An Equilibrium Framework Benjamin Kartono Nanyang Technological University This aer investigates ricing cometition between manufacturers
More informationDirect Inelastic Earthquake Design Using Secant Stiffness
Direct Inelastic Earthquake Design Using Secant Stiffness Honggun Park and Taesung Eom ABSTRACT A new earthquake design method erforming iterative calculations with secant stiffness was develoed. Since
More informationMoisture Risks in Multi-layered Walls - Comparison of COMSOL Multiphysics and WUFI PLUS Models with Experimental Results
Moisture Risks in Multi-layered Walls - Comarison of COMSOL Multihysics and WUFI PLUS Models with Exerimental Results A. Ozolins 1*, A. Jakovics 1, A. Ratnieks 1 1 Laboratory for Mathematical Modelling
More informationPrivate Information and Endogenous Matching in Supply Chains: Theory and Experiments
Private Information and Endogenous Matching in Suly Chains: Theory and Exeriments Andrew M. Davis Samuel Curtis Johnson Graduate School of Management, Cornell SC Johnson College of Business, Cornell University,
More informationMultistage Cross-Sell Model of Employers in the Financial Industry
Paer 4-8 Multistage Cross-Sell Model of Emloyers in the Financial Industry Kwan Park and Steve Donohue The Princial Financial Grou ABSTRACT This aer details the stes to develo a multistage cross-sell model
More informationEasy teaching of numerical simulation of welding with COMSOL
Easy teaching of numerical simulation of welding with COMSOL I. Tomashchuk* 1, P. Sallamand 1, J.-P. Chateau-Cornu 1 Laboratoire Interdiscilinaire Carnot de Bourgogne UMR CNRS 633, Université de Bourgogne
More informationASSESSMENT OF THE EFFECTS OF THE OPERATION OF POWER UNITS ON SLIDING-PRESSURE
Gerard KOSMAN Henryk ŁUKOWICZ Krzysztof NAWRAT Wojciech KOSMAN ASSESSMENT OF THE EFFECTS OF THE OPERATION OF POWER UNITS ON SLIDING-PRESSURE In the article the results of an analysis of the erformance
More informationPROBABILITY OF FAILURE ANALYSIS AND CONDITION ASSESSMENT OF CAST IRON PIPES DUE TO INTERNAL AND EXTERNAL CORROSION IN WATER DISTRIBUTION SYSTEMS
PROBABILITY OF FAILURE ANALYSIS AND CONDITION ASSESSMENT OF CAST IRON PIPES DUE TO INTERNAL AND EXTERNAL CORROSION IN WATER DISTRIBUTION SYSTEMS by Hamidreza Yaminighaeshi B.Sc, Iran University of Science
More informationThree-dimensional design against fatigue failure and the implementation of a genetic algorithm
K. Krishnaillai and R. Jones Three-dimensional design against fatigue failure and the imlementation of a genetic algorithm K. KRISHNAPILLAI and R. JONES CIEAM, Deartment of Mechanical Engineering Monash
More informationElectronic circuit model for proton exchange membrane fuel cells
Journal of Power Sources 142 (2005) 238 242 Short communication Electronic circuit model for proton exchange membrane fuel cells Dachuan Yu, S. Yuvarajan Electrical and Computer Engineering Department,
More informationCold Formed Steel Structures
49 Cold Formed Steel Structures J. Rhodes University of Strathclyde N.E. Shanmugam National University of Singaore 49.1 Introduction to Cold-Formed Steel Sections Manufacturing Methods Alications of Cold-Formed
More information4/14/2016. Intermediate Microeconomics W3211. Lecture 18: Equilibrium with Firms 2. Today. The Story So Far. Quantity Taxes.
1 Intermediate Microeconomics W3211 Lecture 18: Equilibrium with Firms 2 Introduction Columbia University, Sring 2016 Mark Dean: mark.dean@columbia.edu 2 The Story So Far. 3 Today 4 Last lecture we talked
More informationA Sequential Method for Determining Optimal Stripper Pressure and Terminal Pressure in CO 2 Capture and Liquefaction Process Using MEA
Prerint, 11th IFAC Symosium on Dynamics and Control of Process Systems, including Biosystems A Sequential Method for Determining Otimal Strier Pressure and Terminal Pressure in CO 2 Cature and Liquefaction
More informationAIST, 2 CREST/AIST, 3 Univ. Of Tsukuba
A. Traoré 1, A. Nakajima 1, T. Makino 1,2, D. Kuwabara 1,2,3, H. Kato 1,2, M. Ogura 1,2, D. Takeuchi 1,2, and S. Yamasaki 1,2,3 1 AIST, 2 CREST/AIST, 3 Univ. Of Tsukuba aboulaye.traore@aist.go.jp Diamond
More informationPerformance of Appended Wire Mesh Packing in Sieve Tray Distillation Column of Ethanol-Water System
Modern Alied Science; Vol. 9, No. 7; 015 ISSN 1913-1844 E-ISSN 1913-185 Published by Canadian Center of Science and Education Performance of Aended Wire Mesh Packing in Sieve Tray Distillation Column of
More informationModelling for Industrial Sustainability
Modelling for Industrial Sustainability Dr Rick Greenough De Montfort University 19 th January 2015 Definition of industrial sustainability... concetualization, design and manufacture of goods and services
More informationThermal fatigue life prediction
Thermal fatigue life rediction VERIFICATION OF COFFIN - MANSON S LAW IN THE RANGE Of α γ TRANSFORMATION ON FERRITE MATRIX DUCTILE CAST IRON ABSTRACT MORIHITO HAYASHI Deartment of Mechanical Engineering,
More informationModeling Nanoindentation using the Material Point Method
Moeling Nanoinentation using the Material Point Metho Cha C. Hammerquist an John A. Nairn Woo Science an Engineering, Oregon State University, Corvallis, OR 97330, USA 1. SUPPLEMENTAL MATERIAL The ublishe
More information