STRUCTURE OF LED ENCAPSULATION SILICONES

Transcription

1 STRUCTURE OF LED ENCPSULTION SILICONES Structure of LED Chip LED lens (Silicone) S KLM (BLU) KLM (Light) Encapsulate material (Silicone) Gold wire Lead frame phosphor Die bond

2 LED ENCPSULTION SILICONES LED encapsulation silicone: Optimized version for phosphor dispersion and avoiding sedimentation NRI offering for LED encapsulation (Self bonding) Viscosity mix. Shore Transmittance Refractive [mpas] 2h / 150 C [%] (1mm thickness) Index 868 S 1:1 8, > :1 4, > :1 4, > HRI offering for LED encapsulation (Self bonding) Viscosity mix. [mpas] Shore 2h / 150 C Transmittance [%] (1mm thickness) Refractive Index 579 1:1 3, > KLM (BLU) 2:8 4, > KLM (Light) 2:8 3, NRI offering for LED lens molding Viscosity mix. [mpas] Shore 2h / 150 C Transmittance [%] (1mm thickness) Refractive Index 400 1:1 15, > :1 25, > /70 1:1 70, > /80 1:1 100, >

3 LED Lens / 886 /B LED lens LSR: Optimized LSR for molding process 150 Heat ging Test: Transmittance fter Mixing and B (parts by weight) : B 1 : 1 Viscosity catalyzed, at 25 C [mpa s] 25,000 ppearance Hardness, 4h / 150 C Shore 85 Tensile strength [N/mm 2 ] Elongation at break [%] 60 Transmittance (1mm Thickness) [%] > Heat ging Test: Yellow Index

4 HRI LED ENCPSULTION SILICONES Idea Concept : LIGHT SCTTERING WITH 2 PHSE SYSTEM Phosphor 2nd-Phase Conventional Encap. + Phosphor New concept 2-Phase Encap. + Phosphor Basic properties Less amount of phosphor H 2 S gas blocking Property Unit KLM KLM fter Mixing and B BLU Light (parts by weight) : B 2 : 8 2 : 8 Viscosity catalyzed, at 25 C [mpa s] 4,000 3,900 Platinum-catalyst in component ppearance Opaque Opaque Hardness, 2h / 150 C Shore Reflective Index Phosphor Yellow Red lm x y CCT / K CRI KLM KLM Competitor HRI KLM 2-Phase HRI - Light KLM 2-Phase HRI - BLU Wavelength (nm) Optical efficiency (lm) H 2 S storage time (hr) Competitor HRI 2-Phase HRI

5 NRI LED Encapsulation / 868 S /B LED encapsulation silicone: Optimized version for phosphor dispersion and avoiding sedimentation fter Mixing and B (parts by weight) : B 1 : 1 Viscosity catalyzed, at 25 C [mpa s] 8,500 ppearance Hardness, 4h / 150 C Shore 80 Tensile strength [N/mm 2 ] 6.5 Elongation at break [%] 90 Transmittance (10mm Thickness) [%] > Heat ging Test: Transmittance 868 S Heat ging Test: Yellow Index 868 S Initial fter 1 day fter 5 days

6 NRI LED Encapsulation / 871 /B LED encapsulation silicone: Low modulus and low viscosity version fter Mixing and B (parts by weight) : B 1 : 1 Viscosity catalyzed, at 25 C [mpa s] 4,700 ppearance Hardness, 4h / 150 C Shore 65 Tensile strength [N/mm 2 ] 9 Elongation at break [%] 140 Transmittance (10mm Thickness) [%] >90 Transmittance (%) Wavelength (nm) Thickness 1 mm Free Film Heat ging Test: Transmittance 871 Thickness 3mm 1mm Free Film Heat ging Test: Yellow Index

7 NRI LED Encapsulation / 872 /B LED encapsulation silicone: Low modulus and low viscosity version fter Mixing and B (parts by weight) : B 1 : 1 Viscosity catalyzed, at 25 C [mpa s] 4,900 ppearance Hardness, 4h / 150 C Shore 75 Tensile strength [N/mm 2 ] 7 Elongation at break [%] 90 Transmittance (10mm Thickness) [%] >90 Transmittance (%) Wavelength (nm) Thickness 1 mm Free Film Heat ging Test: Transmittance 872 Thickness 3mm 1mm Free Film Heat ging Test: Yellow Index