Low Pressure Molding Overview. Henkel Electronics

Size: px

Start display at page:

Download "Low Pressure Molding Overview. Henkel Electronics"

Austin May
6 years ago
Views:

1 Low Pressure Molding Overview Henkel Electronics

2 Agenda 1 Technology 2 Process 3 Solutions 2 February 25, 2016 Low Pressure Molding Overview

3 Agenda TECHNOMELT Low Pressure Molding 1. Overview of Technology Definition Value Proposition Applications 2. Processing Equipment Mold sets Parameters 3. Products overview General Specialty Products 3 February 25, 2016 Low Pressure Molding Overview

TECHNOMELT Solution Brief Description Low

designed for electronic components Its low

allows for unique design beyond the Form-Fit-

Benefits Complete watertight encapsulation

94-V0 rated Short cycle time Green technology

4 TECHNOMELT Solution Brief Description Low Pressure Molding Hot melt polyamide material designed for electronic components Its low pressure and high speeds are suitable for sensitive electronic components in manufacturing environments The technology allows for unique design beyond the Form-Fit- Function of traditional materials. Benefits Complete watertight encapsulation Temperature and solvent resistant materials UL 94-V0 rated Short cycle time Green technology No VOC and minimal waste Significantly Lowers TCOO 4 February 25, 2016 Low Pressure Molding Overview

5 What is TECHNOMELT Molding? TECHNOMELT Molding = Low Pressure Injection Molding of Adhesives An environmentally-friendly process positioned between potting and injection molding technologies A process to over or partially mold components pre-inserted in a mold set, like PCBs, sensors, switches, batteries, connectors, etc. pressure Injection Molding TECHNOMELT Molding To protect them from environmental issues like moisture, temperature, chemicals, etc. cycle time Potting 5 February 25, 2016 Low Pressure Molding Overview

oils) No harmful fumes from the molding process Long shelf life (2+

6 A Sustainable Solution High performance polyamide hotmelts Solvent free, no safety labels 80% of raw materials are based on renewables (vegetable oils) No harmful fumes from the molding process Long shelf life (2+ years) RoHS and REACH complaint 6 February 25, 2016 Low Pressure Molding Overview

7 Low Pressure Molding Technology Value Proposition Electrical Insulation Contact Strain Relief Vibration Corrosion Waterproof Environmental Influences 7 February 25, 2016 Low Pressure Molding Overview

8 LPM typical Applications Encapsulating, sealing & protecting Electronic assembly Sealing connectors and providing strain relief Switches, automotive electronic and medical sensors LED Lighting 8 February 25, 2016 Low Pressure Molding Overview

9 Agenda 1 Technology 2 Process 3 Solutions 9 February 25, 2016 Low Pressure Molding Overview

Application Development TECHNOMELT Solution 1 2 3 4 TECHNOMELT Water proof Chemical

Minimal Footprint Versatility Mold Design Less Weight Smaller Footprint Design

Experience Process Optimization Versatile Sustainable Form, Fit & Function Reliable

10 Application Development TECHNOMELT Solution TECHNOMELT Water proof Chemical Resistant Impact & Vibration Strain Relief Equipment Low Capital Fast Cycle time Minimal Footprint Versatility Mold Design Less Weight Smaller Footprint Design Flexibility Prototyping Application Engineering Product Design Input Material Experience Process Optimization Versatile Sustainable Form, Fit & Function Reliable Partnerships with Equipment Vendors to Support Development 10 February 25, 2016 Low Pressure Molding Overview

11 Low Pressure Molding Process Insert Electronics Over-mold sec Ready to handle & test 11 February 25, 2016 Low Pressure Molding Overview

12 Equipment Partners Supply Molding Product Customer Supply System Hotmelt Adhesives Technical Support Molding Machines Mold Sets Melting Unit Supplier Supply Melting Unit 12 February 25, 2016 Low Pressure Molding Overview

13 Examples of Automated Molding Machines Process Flow of applications are developed 13 February 25, 2016 Low Pressure Molding Overview

harder metal parts Upper mold-half Runner & Gate Cavity Lifetime Very long, as

14 Mold Tools Material Usually aluminum Lower mold-half Easy to mill, drill and etch Good release of the molded pieces Steel inserts recommended in contact areas with harder metal parts Upper mold-half Runner & Gate Cavity Lifetime Very long, as TECHNOMELT is not abrasive nor corrosive 14 February 25, 2016 Low Pressure Molding Overview

15 Injection temperature (Deg C) Process Conditions Pressure & Temperature Low Pressure Molding Traditional Plastic Injection Molding Injection Pressure (bar) Engineering PA: PA6, PA66, PA11 15 February 25, 2016 Low Pressure Molding Overview

8 C 200 100 Workpiece Filled (size dependency ex. USB stick) 0 10 20 30 40 50 60 70 80 90 100 110 120 Temperature on PCB 79.

16 Degrees F Process Conditions Temperature & Injection Time Temperature Profile during Injection, Typical Un-encapsulated Injection temperature: 425F, mold-set temperature: 70F Cylindrical overmold of PCB: 0.5 dia by 2.5 long C C C Workpiece Filled (size dependency ex. USB stick) Temperature on PCB 79.5 C Seconds Temperature 1mm from surface 48.9 C 27.0 C Encapsulated in TECHNOMELT Overmolding with TECHNOMELT shows no adverse affects in solder joint reliability 16 February 25, 2016 Low Pressure Molding Overview

17 Process Overview & Comparisons Traditional Potting Process Flow Mold Plastic Housing Parts to Assembly Insert Electronics Parts Preheating Potting Dispense Vacuum or Settle Oven Cure Parts for Test Low Pressure Molding Process Insert Parts Over Mold (LPM) Parts ready for Test 17 February 25, 2016 Low Pressure Molding Overview

Cost Savings Calculator Application Case History Potted Water Sensor: Cylinderical part with mounting tabs and

PCB in housing Dispense Cure Lid attach Secure lid Potting Density =1.

300,000 pts/yr Potting Cost of potted part = $0.

18 Cost Savings Calculator Application Case History Potted Water Sensor: Cylinderical part with mounting tabs and exiting cables Dimensions ~35 mm, height ~15 mm Process Steps Material Consumption Throughput Cost Savings Potting PCB in housing Dispense Cure Lid attach Secure lid Potting Density =1.06 g/cc 58 cc empty space 65 grams potting material required Potting One shift capacity (5 days x 8 hours) = 300,000 pts/yr Potting Cost of potted part = $0.97/pt LPM Insert into mold set and mold LPM 11 grams/shot LPM One shift capacity = 405,000 pts/yr LPM Cost of molded part = $0.78/pt Total Savings >25% material cost savings Per YEAR 18 February 25, 2016 Low Pressure Molding Overview

Minimal maintenance Production Space Savings Decreased

19 Low Pressure Molding Benefits Cost Savings Molds Skylining No cure Time Savings Fast cycle times Simple and clean process Minimal maintenance Production Space Savings Decreased equipment footprint 19 February 25, 2016 Low Pressure Molding Overview

20 Colors Henkel s standard colors are amber or black Via colored master batches you can achieve almost every color you need 20 February 25, 2016 Low Pressure Molding Overview

21 Printing It s possible to print a marking directly onto the molded assembly Pad printing Laser printing 21 February 25, 2016 Low Pressure Molding Overview

22 Agenda 1 Technology 2 Process 3 Solutions 22 February 25, 2016 Low Pressure Molding Overview

23 Material Properties TECHNOMELT Molding Temperature resistance, short term exposure <= 185 C Flexibility, Elongation at rupture <= 800 % Cold flexibility >= -50 C Good chemical resistance related to automotive fluids, short term exposure. Good chemical resistance regarding non-polar liquids like oil, long term exposure. Water absorption 0.2 to 2.0 %, 24 h at 22 C Flame retardant properties UL-listing, mainly UL 94 V-0 and RTI certified 23 February 25, 2016 Low Pressure Molding Overview

Technology Overview Molding Resins Thermoplastic materials, UL 94 V-0

Application viscosity from 1,000 10,000 cps Application Pressure from

Excellent adhesive properties to variety of substrates Amber, Black,

24 Technology Overview Molding Resins Thermoplastic materials, UL 94 V-0 Naturally occurring raw materials No toxic fumes due to cure Application viscosity from 1,000 10,000 cps Application Pressure from 20 to 500 psi Performance temperatures from -40 degc to 170 degc Excellent adhesive properties to variety of substrates Amber, Black, White and Transparent material solutions 24 February 25, 2016 Low Pressure Molding Overview

25 TECHNOMELT Product Review Product PA 633/638 PA 641/646 PA 652/657 PA 673/678 MM 6208/6208S Key Property Generalist product High Strength & hardness High Adhesion & cold flexibility High working Temp Elevated UL RTI rating (95 C) Outdoor performance (f2) Working Temp. -40 to 130 o C -40 to 130 o C -40 to 100 o C -40 to 140 o C -40 to 100 o C Hardness A 90 A 92 A 77 A A Strength 5.2 N/mm2 11 N/mm2 2.7 N/mm2 5.7 N/mm2 3.4 N/mm2 Specialty products: PA 648: Improved UV resistance PA 341: Blaze orange color for Electric vehicles PA 658: Hydrolysis resistant for improved 85/85 performance MM 2384: Increased hardness and improved alcohol resistance AS 4226: Transparent TECHNOMELT for LED encapsulation PA 668: UV Stabilized White for LED applications. PA 2692: High Temperature, 150C Subgroup into market areas. LED/light (PA 668, PA 648, AS 4226) Industrial Components UV exposure (PA 6208S, PA 648, PA 649, PA 6344) Automotive/Sensors (PA 341, PA 658, PA 2384, PA February 25, 2016 Low Pressure Molding Overview

26 Henkel Innovations White Polyamide TECHNOMELT PA 668 TECHNOMELT PA 668 white Properties UV stabilised Good mechanical properties Suitable for LED applications -40 up to 105 C UV resistance, does not yellow over time 26 February 25, 2016 Low Pressure Molding Overview

(1h) Temperature Exposure Test 1000h/85 C Temperature Exposure

27 Henkel Innovations Transparent Hotmelt Adhesive TECHNOMELT AS 4226 High transmittance % Temperature Shock Test 10 x 85 C/-40 C (1h) Temperature Exposure Test 1000h/85 C Temperature Exposure Test 1000h/-40 C 27 February 25, 2016 Low Pressure Molding Overview

28 % Transmittance % Transmittance Henkel Innovations Optically Clear TECHNOMELT AS 4226 Optically clear acrylic High transmittance % Thermoplastic -40 C to 85 C operating range UV Stability Thermal Stability Days Hours wavelength (nm) wavelength (nm) February 25, 2016 Low Pressure Molding Overview

PA 6208 vs PA 2384 mechanicals before and after IPA exposure 7 day submersion test 8 week submersion

29 Henkel Innovations Solvent/Chemical resistant TECHNOMELT PA 2384 PA 2384 is a solvent and chemically resistant material Polar solvent and hydrocarbon resistant High hardness High operating temperature PA 6208 vs PA 2384 mechanicals before and after IPA exposure 7 day submersion test 8 week submersion test IPA treated Treated Not treated Not treated 13.61g 29 February 25, 2016 Low Pressure Molding Overview

30 Henkel Innovations Thermally Conductive TECHNOMELT TC 50 Highest thermally conductive TECHNOMELT Standard TECHNOMELT resin is insulating with ~0.2 W/mK TC 50 allows heat transfer through molded encapsulate TC 50 produces >0.5 W/mK performance Additional formulas targeted: >1 W/mK and >1.5W/mK allows for heat dissipation through the molded encapsulant layer 30 February 25, 2016 Low Pressure Molding Overview

31 Thank You! This material has been visually improved with the help of our team at the Graphic Design Center in SSC Manila. To know more about this service, please visit in the Henkel portal.

TECHNOMELT Products Low Pressure Molding for CBP Low Pressure Molding High

Resistant UV Resistant Specialty Technologies Amber Black Amber Black Blaze

633 PA 638 PA 341 PA 641 PA 646 PA 2384 PA 668 PA 6344 AS 4226 AS 5375 PA 682

32 TECHNOMELT Products Low Pressure Molding for CBP Low Pressure Molding High Temperature Resistance Adhesion to Plastics Increased Hardness Solvent Resistant UV Resistant Specialty Technologies Amber Black Amber Black Blaze Orange Amber Black Amber White Black Transparent Opaque White PA 673 PA 678 PA 633 PA 638 PA 341 PA 641 PA 646 PA 2384 PA 668 PA 6344 AS 4226 AS 5375 PA 682 PA 687 PA 652 PA 657 PA 2692 PA 6208 PA 6208 BLACK 32 February 25, 2016 Low Pressure Molding Overview

Low Pressure Molding Overview. Henkel Electronics

Low Pressure Molding Overview. Henkel Electronics Low Pressure Molding Overview Henkel Electronics Agenda 1 Technology 2 Process 3 Solutions 2 Agenda Low Pressure Molding Overview of Technology Definition Value Proposition Applications Processing Equipment