Supporting Information

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1 Supporting Information Vertically Aligned and Interconnected SiC Nanowire Networks Leading to Significantly Enhanced Thermal Conductivity of Polymer Composites Yimin Yao,, Xiaodong Zhu,, Xiaoliang Zeng, *, Rong Sun, *, Jian-Bin Xu, Ching-Ping Wong,, # Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen , China. Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences, Shenzhen , China. Department of Nano Science and Technology Institute, University of Science and Technology of China, Suzhou , China Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong , China. # School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States. * Address corresponding to xl.zeng@siat.ac.cn and rong.sun@siat.ac.cn 1

2 Contents: Figure S1. TEM image of a single slice of SiCNW. Figure S2. Full XPS (a) and Si 2p spectrum (b) of SiCNWs. Figure S3. Typical SEM images of SiCNW junctions at different magnifications. (a) 8000 and (b) Figure S4. SEM images of the assembly unit of SiCNW network at different solid loadings. (a) 1.25 vol% and (b) 2.17 vol%. Figure S5. Cross-sectional morphology of epoxy composite with isotropous SiCNW network. Figure S6. In-plane thermal conductivity of composites as function of SCMC content with filler loadings of 2.17 vol%. Figure S7. (a-b) Surface morphology of 3D Iso-SiC network at different magnifications. (c) Cross-section morphology of 3D Iso-SiC/epoxy composite. Table S1. Comparison of thermal conductivity and enhancement efficiency of our 3D SiCNW/epoxy composite with other thermally conductive and electrically insulating polymer composites. 2

3 Figure S1. TEM image of a single slice of SiCNW. 3

4 Figure S2. Full XPS (a) and Si 2p spectrum (b) of SiCNWs. 4

5 Figure S3. Typical SEM images of SiCNW junctions at different magnifications. (a) 8000 and (b)

6 Figure S4. SEM images of the assembly unit of SiCNW network at different solid loadings. (a) 1.25 vol% and (b) 2.17 vol%. 6

7 Figure S5. Cross-sectional morphology of epoxy composite with isotropous SiCNW network. 7

8 Figure S6. In-plane thermal conductivity of composites as function of SCMC content with filler loadings of 2.17 vol%. 8

9 Figure S7. (a-b) Surface morphology of Iso-SiC network at different magnifications. (c) Cross-section morphology of Iso-SiC/epoxy composite. 9

10 Table S1. Comparison of thermal conductivity and enhancement efficiency of our 3D SiCNW/epoxy composite with other thermally conductive and electrically insulating polymer composites. Filler Matrix Filler loading (vol%) Thermal conductivity (W/mK) efficiency year BNNT Epoxy Fe 3 O 4 -SiC Epoxy Magnetic aligned BN Silicone gel BN-SiC Epoxy AlN Epoxy D BN aerogel Epoxy BNNSs/AgNPs Epoxy sintered Al 2 O 3 Epoxy Si 3 N 4 foam Epoxy M-h-BN/MGF PDMS BNNS SEBS/PP D BNNS aerogel Epoxy D SiCNW Epoxy This work Abbreviations: BNNT, boron nitride nanotubes; BNNS, boron nitride nanosheets; AgNPs, silver nanoparticles; M-h-BN, modified h-bn; MGF, modified graphene foam; SEBS, styrene-(ethylene-co-butylene)-styrene tri-block copolymer; PP, polypropylene. 10

11 REFERENCES 1. Huang, X.; Zhi, C.; Jiang, P.; Golberg, D.; Bando, Y.; Tanaka, T., Polyhedral Oligosilsesquioxane-Modified Boron Nitride Nanotube Based Epoxy Nanocomposites: An Ideal Dielectric Material with High Thermal Conductivity. Adv. Funct. Mater. 2013, 23, Kim, K.; Kim, M.; Kim, J.; Kim, J., Magnetic Filler Alignment of Paramagnetic Fe3o4 Coated Sic/Epoxy Composite for Thermal Conductivity Improvement. Ceram. Int. 2015, 41, Yuan, C.; Duan, B.; Li, L.; Xie, B.; Huang, M.; Luo, X., Thermal Conductivity of Polymer-Based Composites with Magnetic Aligned Hexagonal Boron Nitride Platelets. ACS Appl. Mater. Interfaces 2015, 7, Kim, K.; Ju, H.; Kim, J., Vertical Particle Alignment of Boron Nitride and Silicon Carbide Binary Filler System for Thermal Conductivity Enhancement. Compos. Sci. Technol. 2016, 123, Kim, K.; Kim, J., Magnetic Aligned Aln/Epoxy Composite for Thermal Conductivity Enhancement at Low Filler Content. Composites Part B 2016, 93, Shen, H.; Cai, C.; Guo, J.; Qian, Z.; Zhao, N.; Xu, J., Fabrication of Oriented Hbn Scaffolds for Thermal Interface Materials. RSC Adv. 2016, 6, Wang, F.; Zeng, X.; Yao, Y.; Sun, R.; Xu, J.; Wong, C.-P., Silver Nanoparticle-Deposited Boron Nitride Nanosheets as Fillers for Polymeric Composites with High Thermal Conductivity. Sci. Rep. 2016, 6, Hu, Y.; Du, G.; Chen, N., A Novel Approach for Al 2 O 3 /Epoxy Composites with High Strength and Thermal Conductivity. Compos. Sci. Technol. 2016, 124, Yin, L.; Zhou, X.; Yu, J.; Wang, H.; Ran, C., Fabrication of a Polymer Composite with High Thermal Conductivity Based on Sintered Silicon Nitride Foam. Composites Part A 2016, 90, Fang, H.; Zhang, X.; Zhao, Y.; Bai, S.-L., Dense Graphene Foam and Hexagonal Boron Nitride Filled Pdms Composites with High Thermal Conductivity and Breakdown Strength. Compos. Sci. Technol. 2017, 152, Zhang, D.-L.; Zha, J.-W.; Li, C.-Q.; Li, W.-K.; Wang, S.-J.; Wen, Y.; Dang, Z.-M., High Thermal Conductivity and Excellent Electrical Insulation Performance in Double-Percolated Three-Phase Polymer Nanocomposites. Compos. Sci. Technol. 2017, 144, Chen, J.; Huang, X.; Zhu, Y.; Jiang, P., Cellulose Nanofiber Supported 3d Interconnected Bn Nanosheets for Epoxy Nanocomposites with Ultrahigh Thermal Management Capability. Adv. Funct. Mater. 2017, 27,

Figure S4 Cross-section morphology of the resultant paper prepared by poorly dispersed

Figure S4 Cross-section morphology of the resultant paper prepared by poorly dispersed Supporting Information Highly Thermally Conductive Composite Papers Prepared Based on the Thought of Bioinspired Engineering Yimin Yao,,, Xiaoliang Zeng,,, Rong Sun, *, Jian-Bin Xu, Ching-Ping Wong,, Shenzhen