Materials Declaration Form

Transcription

1 Materials Declaration Form IPC 1752 Form Type * Distribute Version Sectionals * Material Info Subsectionals * Manufacturing Info * : Required Field 2 A-D Supplier Information Company Name * STMicroelectronics Response Date * Company Unique ID Request Document ID Contact Name * Refer to Supplier comment section Contact Title Contact Phone * Refer to Supplier comment section Contact * Authorized Representative * Yves HALLEZ Representative Title Representative Phone * Refer to Supplier Comment section Representative * Refer to Supplier comment section Refer to Supplier comment section Refer to Supplier Comment section NA IMG Material Declaration Champion Supplier Comment Online Technical Support - STMicroelectronics : Uncertainty Statement While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents. Legal Statement Supplier Acceptance * true Legal Declaration * Standard Legal Statement Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier s liability and the Company s remedies for issues that arise regarding information the Supplier provides in this form.

2 Product Mfr Item Number Mfr Item Name Version Mfr Site Date VB6955CMQ0GH/1 XMGH-955QBBQ A SHENZHEN Amount UoM Unit type ST ECOPACK Grade 479 mg Each ECOPACK 2 Comment ECOPACK 2 is STMicroelectronics trade name for ROHS compliant device without Brominated and Chlorinated compound (900ppm) and without Antimony oxide flame retardant Manufacturing information J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles Not Applicable Not Applicable Not Applicable bulk Solder Termination Terminal Plating Terminal Base Alloy Comment Not Applicable Nickel/Gold (Ni/Au) Copper Alloy Package Designator Size Nbr of instances Shape LGA 7.5 x 7.5 x 4.6 mm 16 bulk solder Comment

3 QueryList : RoHS Directive 2011/65/EU-July 2011 Annex II amended by Directive 2015/863-April 2015 Query Response 1 - Product(s) meets EU RoHS requirement without any exemptions Query : California Prop65 list, dated 27th January 2017 Query 1 - The product does not contain identified substance from California Prop 65 List, no exposure to consumers is foreseen 2 - The product is containing below substance(s) from California Prop 65 List, no exposure to consumers is foreseen FALSE Substance amount in product (mg) Application ppm in product Nickel 6.52 Metalization in Substrate / SMD / VCM driver and VCM QueryList : REACH- 12th January 2017 Query 1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH 2 - Product(s) does not contain REACH Substances Of Very High Concern in any Homogeneous Material above the limits per the definition within REACH Response

4 Material Composition Declaration Mfr Item Name XMGH-955QBBQ Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in homogeneous material (ppm) Concentration in product (ppm) die Other inorganic materials mg supplier die Silicon (Si) mg supplier metallisation Aluminium (Al) mg supplier metallisation Copper (Cu) mg supplier metallisation Tantalum (Ta) mg supplier metallisation Titanium (Ti) mg supplier metallisation Tungsten (W) mg supplier passivation Silicon Nitride (SiN) mg supplier passivation Silicon Oxide mg supplier die polymer coati Polymer resist (color, planar,ulens) Proprietary mg substrate Other Organic Materials mg supplier core material Fiber glass mg supplier core material epoxy resin mg supplier core material Calcium carbonate mg supplier core material Calcium oxide mg supplier core material inorganic filler Proprietary mg supplier Solder mask Barium sulfate mg supplier Solder mask (2-methoxymethylethoxy)propanol mg supplier Solder mask Talc containing no asbestiform fibers mg supplier Solder mask Quartz mg supplier Solder mask Acrylates derivative mg supplier Solder mask Epoxy resin mg supplier Solder mask aromatic hydrocarbon Proprietary mg supplier Solder mask Chlorine mg 20 2 supplier metallisation Copper (Cu) mg supplier metallisation Nickel (Ni) mg supplier metallisation Gold (Au) mg supplier metallisation Palladium (Pd) mg Die attach Other Organic Materials mg supplier glue or tape Epoxy resin Proprietary mg supplier glue or tape Polybutadiene polymer mg supplier glue or tape maleic anhydride mg supplier glue or tape Silane mg supplier glue or tape Tetrafluoroethylene mg Bonding wire Precious metals mg supplier wire Gold (Au) mg Flip chip driver Other inorganic materials mg supplier die Silicon (Si) mg supplier metallization Titanium (Ti) mg supplier metallization Tungsten (W) mg supplier metallization Nickel (Ni) mg supplier metallization Copper (Cu) mg supplier metallization Gold (Au) mg supplier Die passivation Polyimide mg supplier Wafer bump Tin (Sn) mg supplier Wafer bump Silver (Ag) mg supplier Wafer bump Copper (Cu) mg solder paste Solder mg 0 Solder paste Tin (Sn) mg Solder paste Silver (Ag) mg Solder paste Modified Rosin mg Solder paste Rosin mg Solder paste Copper (Cu) mg Irglass Ceramics / Glass mg Glass Inorganic glass mg Glass Phosphorus mg Glass Sulfur mg IR coating Amorphous silica mg IR coating Trititanium pentoxide mg Capacitors Ceramics / Glass mg ceramic Barium Titanate mg metallization Palladium(Pd) mg metallization Nickel (Ni) mg metallization Copper (Cu) mg metallization Tin (Sn) mg Irglass adhesive Other Organic Materials mg glue or tape Proprietary Bismaleimide mg glue or tape Proprietary Filler mg

5 glue or tape Proprietary Vinal Ether Proprietary mg LA Non Conduct Other Organic Materials mg glue or tape 2,2'-[methylenebis(phenyleneoxymethylene)]b mg glue or tape 1,4-bis(2,3-epoxypropoxy)butane mg glue or tape Epoxy resin mg glue or tape Imidazole derivative Proprietary mg glue or tape Carbon Black mg glue or tape Silica, vitreous mg glue or tape PTFE mg glue or tape Polyoxypropylenediamine mg Solder wire Solder mg solder wire Tin (Sn) mg solder wire Silver (Ag) mg solder wire Copper (Cu) mg Lens barrel Other Organic Materials mg Lens Ethylene-tetracyclododecene mg Lens 2 Modified Polycarbonate proprietary mg Barrel Polycarbonate resin mg Spacer PET mg Spacer Acrylic Resin proprietary mg Spacer Wax proprietary mg Spacer Carbon Black mg Spacer Silica mg Spacer Polyethylene terephthalate mg Spacer Urethane resin proprietary mg RETAINER Polycarbonate based on bisphenol A mg VCM Other Organic Materials mg Plate top & botto Copper (Cu) mg Plate top & botto Nickel (Ni) mg Plate top & botto Tin (Sn) mg Plate top & botto Zinc (Zn) mg Plate top & botto Iron (Fe) mg Terminal base Copper (Cu) mg Terminal base Nickel (Ni) mg Terminal base Zinc (Zn) mg Terminal base Manganese (Mn) mg Terminal base Iron (Fe) mg Yoke Iron (Fe) mg Yoke Carbon (C) mg Yoke Manganese (Mn) mg Yoke Nickel (Ni) mg Spacer Polyethylene terephthalate mg Spacer carbon black mg Magnet Iron (Fe) mg Magnet Nd mg Magnet B mg Magnet Dy,Nb,Al,Co,Tb mg Magnet Nickel (Ni) mg Magnet Copper (Cu) mg Coil Cu mg Coil polyurethane Proprietary mg Coil polyamid Proprietary mg Coil phenol Proprietary mg Housing LCP mg Housing glass fiber mg Housing Carbon black mg glue or tape A modified acrylic prepolymer Proprietary mg glue or tape A acrylic monomer mg glue or tape A photoinitiator stabilizer etc mg glue or tape A filler mg glue or tape B Bisphenol A epoxy resin mg glue or tape B Bisphenol F epoxy resin mg glue or tape B Epoxy resin hardener Proprietary mg glue or tape B Silica mg glue or tape B Other components Proprietary mg

6 Solder Copper (Cu) mg Solder Tin (Sn) mg Solder Silver (Ag) mg Baffle Other Organic Materials mg Adhesive Polyester film mg Adhesive Acrylic adhesive mg Adhesive silicone coated polyester film Proprietary mg PET PET mg PET Acrylic Resin Proprietary mg PET Wax Proprietary mg PET Carbon Black mg PET Silica mg Glue fix Other Organic Materials mg Glue Bismaleimide polymer mg Glue Tetrafluoroethylene mg Glue vinal ether Proprietary mg