Environmental Management and Materials Information
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1 Environmental Management and Materials Information Product Content Information for: MAX44285FAWA+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Other Component Data Qualifications Top Lead-Free Qualified REACH RoHS Qualified Green Moisture Sensitivity Level Flammability Meets UL-94 (V-0 Rating) No Under Assessment No No Not Available - Contact Us No Package Description Top Package Code Package Type Package Option Footprint Area (mm 2 ) Pin Count in Grams Chemical Composition Top Maxim NIA/NIU List (PDF, 24k) CAS Number Aluminum (Al) Antimony (Sb 2 O 3 )
2 BCB Resin Bromine (Br) Carbon (C) Carbon Black Ceramic (BaTiO 3 ) Chromium (Cr) Cobalt (Co) Gold (Au) Indium (In) Insulator (Polyimide) Insulator Film Iron (Fe) FeO Magnesium (Mg) Manganese (Mn) MnO 3 Nickel (Ni) NiPdAu Nickel-V (NiV) Palladium (Pd) Phosphorus (P) Silica (SiO 2 ) Silicon (Si) Silver (Ag) Solder Mask Solder Paste Spheron Polymer Passivation Sulfur (S) Titanium (Ti) Titanium-W (TiW) Tungsten (W) Vanadium (V) Zinc (Zn) ZnO
3 Zirconium (Zr) Detailed Package Component Data Top Backside Laminate Epoxy/Acrylic Resin Base/Lid Components Base Material Lid/Cap Material Base Weight Lid Weight Bond Wire Components Gold (Au) Aluminum (Al) Bump Components Bump Assembler Bump Material 3
4 Insulator (Polyimide) Silver (Ag) UBM (Ti) RDL (Cu) Nickel (Ni) Copper Post Copper Die Attach Epoxy Components Die Attach Material Aromatic Amine Diester Epoxy Functionalized Ester Functionalized Urethane Indium (In) Lactone Polymeric Polyoxypropylenediamine Resin Silver Filler (Ag) Other Die Coat Components 4
5 BCB Resin Heat Slug Components Heat Slug Epoxy Other Laminate Components Gold (Au) Nickel (Ni) Solder Mask Lead Finish/Plating Components Lead Finish Plating Assembly Lead Finish Process NiPdAu Gold (Au) Nickel (Ni) 5
6 Lead Frame Components Lead Frame Material Aluminum (Al) Carbon (C) Chromium (Cr) Cobalt (Co) Gold (Au) Iron (Fe) Magnesium (Mg) Manganese (Mn) Nickel (Ni) Palladium (Pd) Phosphorus (P) Silicon (Si) Silver (Ag) Sulfur (S) Zinc (Zn) Zirconium (Zr) Maxfilm Maxfilm Mold Compound Components Mold Material Resin Type 6
7 Antimony (Sb 2 O 3 ) Bromine (Br) Carbon Black Epoxy Epoxy Cresol Novolac Metal Hydroxide Phenol Novolac Silica (SiO 2 ) Resin Other Silicon Chip Components Silicon Chip 100 Spheron Polymer Passivation Components Spheron Polymer Passivation 100 Insulator Film Components Insulator Film Solder Ball Components Nickel (Ni) 7
8 Silver (Ag) Solder Paste Components Antimony (Sb 2 O 3 ) Indium (In) Silver (Ag) Substrate Components Substrate Weight Substrate Material Substrate Core Material Bromine-Free Copper Gold Nickel Substrate Core Material Solder Mask Triazol Other UBM Components Chromium (Cr) 8
9 Nickel (Ni) Nickel-V (NiV) Titanium (Ti) Titanium-W (TiW) Tungsten (W) Vanadium (V) Other Component Data Top Passive Component 1 Material Type / PN Codes Passive Component 1 Passive Component 2 Material Type / PN Codes Passive Component 2 Passive Component 3 Material Type / PN Codes Passive Component 3 Passive Component 4 Material Type / PN Codes 9
10 Passive Component 4 Capacitor Components Ceramic (BaTiO 3 ) Copper (Electrode) Crystal Components Silver (Ag) Aluminum (Al) Gold (Au) Chromium (Cr) Manganese (Mn) Nickel (Ni) Cobalt (Co) Iron (Fe) Silicon (Si) Zinc (Zn) Silica (SiO 2 ) Diode Components Encapsulant (Phenolic Resin) Gold Wire Leadframe (Copper 194) 10
11 Pellet (Chip) Terminal (SnAgCu) Optocoupler Components Die (Chip) Encapsulant (Phenolic Resin) Epoxy (Ag) Gold Wire Leadframe (Alloy 42) Potting Resin (Silicone) Terminal Plating (Sn) Resistor Components Transformer Components Copper FeO 2 MnO 3 ZnO 11
12 Notes: 1. Lead Form: GW - Gull Wing, TH - Through Hole. 2. Refer to product data sheet to confirm actual wire diameter. 3. 'ND' means None Detected, negligible amount present. This part is qualified as lead-free. Parts qualified as lead-free can be manufactured and supplied as lead-free, if and only if, the customer makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website contains information regarding the lead-free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead-free package tables, and status/qualification plans for particular package types qualified as lead-free or in the qualification process). This report was generated on For additional information, please visit the Maxim/Dallas Environmental Management and Materials Information website located at: 12
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3622CUE+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3674ECM+T Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3637ETM+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
Materials Declaration Form
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Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Materials Declaration Form
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Materials Declaration Form
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Materials Declaration Form
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Materials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
Materials Declaration Form
Materials Declaration Form IPC 1752 Form Type * Distribute Version Sectionals * Material Info Subsectionals * Manufacturing Info * : Required Field 2 A-D Supplier Information Company Name * STMicroelectronics
Materials Declaration Form
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Materials Declaration Form
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Materials Declaration Form
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Atmy Analytical Labs Pvt. Ltd., I-38, DLF Industrial Area, Phase-1, Faridabad, Haryana. Discipline Chemical Testing Issue Date
Last Amended on - Page 1 of 11 I. METAL & ALLOYS 1. Steel (Carbon Steel & Low Alloy Steel) Carbon ASTM E-415: 2014, IS 228 (Part 1): 1997 (RA 2008) 0.01 % to 1.5 % 0.01 % to 1.5 % Silicon ASTM E-415: 2014,
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