Low CTE / High Tg FR-4 with High Heat Resistance Laminate: EM-827 Prepreg: EM-827B 1
Features Tg(DSC) > 170 Z direction CTE < 3.0% (50~260 ) High thermal degradation temperature: Td > 340 Excellent thermal stability: T 300 > 15 min. Moisture absorption rate < 0.5% (by PCT treated 5 Hr.) 2
Z CTE Performance 1.6 mm unclad 3
Thermal Degradation by TGA 100 95 1.6 mm unclad EM-220 305 EM-827 350 Weight (%) 90 85 80 75 70 65 0 100 200 300 400 500 600 700 800 Temperature () EM-827 increased thermal degradation resistance 4
T 288 by TMA 1.6 mm unclad Material EM-220 Dicy Tg 170 EM-827 Time (min.) 0.88 1.44 26.77 5
T 300 by TMA T 300 : 17min. 6
Comparison of Water Absorption 0.80 Regular FR-4 (EM-220) 1.6 mm unclad Moisture Absorption (%) 0.70 0.60 0.50 0.40 0.30 0.20 Tg 150 Dicy Cured (EM-220 (5)) Tg 170 Dicy Cured (N Company) Tg 150 PN Cured (EM-320(5)) Tg 170 PN Cured (EM-320) Tg 150 PN Cured with Filler (EM-825) 0.10 1 2 3 4 5 PCT Treated Time (Hr.) Tg 170 PN Cured with Filler (EM-827) 7
Typical Laminate Properties (1) Items Tg (DSC ) CTE ( Z-axis, TMA ) Decomposition ( TGA ) Solder Dip Solder dip ( clad ) PCT Water absorption Water absorption Unit ppm / ppm / % Cycle min Hrs % % Condition IPC-TM-650 2.4.25C Tg Tg 50 ~ 260 5 W.L 288 / 10 sec D-288 DEL dip 288 / 20 PCT 2 atm/2hrs E-1/105 + D-24/23 EM-220 135 320 4.2 305 > 10 3.5 0.45~0.50 0.12 60 2 1.6mm unclad EM-320 EM-827 178 175 55 45 280 260 3.2 2.8 350 350 > 10 > 20 20 20 2 3 0.23~0.26 0.22~0.25 0.10 0.08 8
Typical Laminate Properties (2) 1.6mm unclad Items Unit Condition EM-220 EM-320 EM-827 Peel strength ( Cu 1 oz ) Lb / in As received 11 ~ 13 8 ~ 10 8 ~ 10 Dielectric constant ( HP-4291 ) 1 MHz 1 GHz C-40/23/50 4.7 4.3 4.7 4.3 4.8 4.4 Dissipation factor ( HP-4291 ) 1 MHz 1 GHz C-40/23/50 0.015 0.020 0.015 0.020 0.015 0.020 Volume resistivity M-cm C-96/35/90 > 10 10 > 10 10 > 10 10 Surface resistivity M C-96/35/90 > 10 10 > 10 10 > 10 10 9
Recommend Press Cycle for EM-827 Kiss pressure: 3.5 ~ 7 kgf / cm 2 Heat rate: 1.8 ~ 2.2 / min Full pressure : 25 ~ 32 kgf / cm 2 Apply full pressure at: 80 ~ 100 Curing condition: >190 / 60 min (Minimum peak temperature with curing condition: 210) *The heating rate higher will be better for peeling strength and inner layer pattern filling, while the lower will be better for press flow. Please contact us for setting suitable press cycle if necessary. 10
Recommend PCB Process for EM-827 Process Condition Surface Clean Std. Practice A.O.I. Std. Practice Oxide treatment Std. Black or Brown Oxide Bake 120 40min Stress relief ( high layers count ) Bake 180 2 ~ 3 hrs Hole diameter ( mm ) 0.3 0.4 0.5 Spindle Speed ( Krpm ) 150 120 100 In Feed ( inch / min ) 90 75 65 Chip Load ( mil / rev ) 0.6 0.62 0.65 Number of Hits 1500 1500 1500 Sweller ( Uyemura ) Vertical 80 for 8 min. KMnO 4 ( Uyemura ) Vertical 80 for 15 min. 11
Additional Suggestion during Processing For improving material moisture absorbed in processing, post-baked treated would be suggested as several processing: 1. Finished board before packing 1-1 HASL: 150 degree C for 4 hours 1-2 ENIG finished: 120 degree C for 4 hours 1-3 Before OSP: 150 degree C for 4 hours 2. Solder mask re-work or WIP over 2 weeks 150 degree C for 4 hours 12
Test Results of Drilling -Construction- - Test result- 0.5 oz 7628*1 0.039 1/1 (7628*5) 7628*1 0.5 oz Layer count 4 Thickness 1.6 mm Drill diameter Ø 0.3 mm Roughness < 1.0 mil 13
Test Results of Desmear Before After No smear on glass fiber 1.6 mm unclad Weight loss control at 0.05 ~ 0.20 mg/cm 2 14
IR-Reflow Test for High Layer Count Construction of Specimen 18µm Copper 7628 Core t 0.1 1/1 1080 +2116 Core t 0.1 1/1 1080 +1080 Core t 0.1 1/1 1080 +1080 Core t 0.1 1/1 1080 +2116 Core t 0.1 1/1 7628 18µm Copper Layer count 12 Thickness 1.9 mm Drill diameter Ø 0.3 mm No Delamination 15
Lead-Free IR-Reflow Profile 16
Lead-Free IR-Reflow Test Result 255 + 5 / - 0 Peak Temperature Profile Laminate IR Hole to Hole ( mm ) Delamination ( N = 30 ) 5 0.70 0 % EM-827 10 5 0.70 0.45 0 % 0 % 10 0.45 0 % 5 0.70 0 % EM-320 10 5 0.70 0.45 0 % 0 % 10 0.45 12 % 17
Test Result 18
PCB Field Evaluation 8 layers, 1.0mm multilayer 19
PCB Field Evaluation Evaluation Test Item 1. 288 x 10s x 3 cycles 2. Lead- free of IR Reflow (250 peak) x 1 cycle 3. Lead- free of IR Reflow (250 peak) x 3 cycle 20
Test Result Test Item Thermal Stress Lead-free IR Reflow Lead-free IR Reflow Condition 288/ 10s/ 3 times 255 Peak/ 1 cycle 255 Peak/ 3 cycle Test Result No Delam/ No crack No Delam/ No crack 1.0mm BGA Hole Pitch Pass 0.8mm BGA Hole Pitch Crack 0.8mm BGA Hole Pitch Crack No Delam/ No Crack after 3 cycle IR Reflow with 1.0 BGA Hole Pitch 21
Applications Tg ( DSC ) Low CTE LCD Automobile Lead Free Items Back panel High thermal resistance Normal FR-4 140 EM-827 175 Excellent: ; Acceptable: ; poor: 22
Product Line-up Laminate 0.002 ~ 0.059 ( Sheet or Panel form ) CCL Sheet 36 x 48 40 x 48 Size 42 x 48 Copper Foil 12 to 175 um HTE 12 to 70 um RSTF Prepreg Roll or Panel form Glass Type 106108021161506 7628etc. 23