Sales Presentation. GoldenTechCircuits Technology Co.LTD 鑫科电路技术有限公司. Professional QTA & HMLV PCB Manufacturer
|
|
- Jayson Barnett
- 5 years ago
- Views:
Transcription
1 GoldenTechCircuits Technology Co.LTD 鑫科电路技术有限公司 Professional QTA & HMLV PCB Manufacturer
2 General Information Established Date: Nov, 2009 Capital: USD 1.5 Million Brazil Office:Travessa Rolante, 40 - Corcunda - CEP: Gravataí RS / Brasil Shenzhen Office :16H Rich business towr, zhongxin Road. shajing, Baoan District, Shenzhen City, China South of china office: 401 Room, XiWanNian business tower, Baoan Garden Road. Baoan district, Shenzhen City, China Factory Location: E-block, DongMen industrial park. DanShui tower, HuiYang District. Huizhou City, China Factory Area: 4500 Square Meter Products Type: D.S. and Multilayer PCBs with QTA & HMLV Production Capacity: 60,000 square feet (6,000 square meters) per month Project Model: 2000 Types per month
3 Our Competitive Advantage Constituted by skilled & experienced specialist on PCB / Electronics Manufacturing;Engineering;QualityAssurance & Marketing. Just-in-time programs provide considerable savingsand guaranteethe delivery of speedy services; Design For Manufacturability (DFM) programs ensure optimum efficiencybased on our professional engineer. One-Stop-Shopping Volume PCB/PCBA/PCB Layout solution Provider. (In Schedule)
4 Our Fast Response Service Sales Presentation Layer Quickest Lead Time Normal Lead Time Double sides 24hrs 96hrs 4 layers 48hrs 120hrs 6 layers 72hrs 144hrs 8 layers 96hrs 168hrs 10 layers 120hrs 192hrs 12 layers 144hrs 216hrs 14 layers 168hrs 240hrs layers Depends on the specific requirements Above 20 layers Depends on the specific requirements Remark : Above Lead time based on EQ finished.
5 Products Sales Presentation Material: FR-4 (Tg ) Rogers Teflon Aluminum Based Polyimide High layer counts (20+ layers) ROHS&REACH Compliance 8:1 aspect ratio Minimum conductor width/spacing: 0.08/0.08mm Minimum drill bit 0.15mm
6 Products Surface Treatment: Lead free HAL/ HAL/OSP / Immersion Ni,Au / Immersion Silver / Immersion Tin /Gold finger Controlled depth drill/profile Sequential lamination Buried and blind via and HDI Heavy Copper PCB s Up to 18oz. Controlled Impedance
7 Technology Capability in Quick Turn Item Standard Sample Layer count 18L 26L Final board thickness mm Aspect rate 8:1 12:1 Impedance Single line +/-10% +/-8% Different line +/-10% +/-8% Line/space Inner layer 3/3mil 2.5/2.5mil Outer layer 3/3mil 3/3mil Min drill bit 8mil 6mil Hole position tolerance +/-3mil +/-3mil PTH hole dimension tolerance +/-3mil +/-2mil NPTH hole dimension tolerance +/-2mil +/-1mil Solder mask Line to solder PAD 4mil 3mil Registration tolerance +/-2mil +/-1.5mil
8 Technology Capability in Quick Turn Peel able mask thickness 5mil 5mil Carbon ink thickness 0.3mil 0.3mil Lead and lead free HASL thickness SMD: u Immersion Au Au thickness 1-5u GND:30-800u Ni thickness u OSP thickness um um Immersion tin thickness Immersion silver thickness um um Profile tolerance Punching +/-8mil +/-5mil Routing +/-4mil +/-2mil Lamination type FR4(Tg ) Halogen free lamination Rogers/Teflon/Aluminum board
9 Reference Working Standards Customer s SPEC IPC-A-600G Acceptability of Printed Boards IPC6011 Generic Performance Specification for Printed Boards IPC-6012B Qualification and Performance Specification for Rigid Printed Boards IPC4101B Specifications for Base Materials for Rigid and Multilayer Printed Boards IPC-D-300 Printed Board Dimensions and Tolerances IPC-SM-840C Qualification and Performance of Permanent Solder Mask ANSI/UL-796 Safety Standard for Printed Wiring Board
10 The USA UL Certification ISO9001:2008 ULFile NO.: E zz
11 Maketing Segment Sales Presentation
12 Product by layer count
13 Sales turnover Sales Presentation USD M
14 Major Equipments List JH-900 separation machine JH-900 automatic Scrubbing machine X-ray drilling Tooling hole CCD parallel expose machine Developer Scrubbing Machine Lamination machine
15 Major Equipments List Sales Presentation SCHMOLL Drilling machine MANIA Drilling machine Automatic plating Etching machine HASL machine X-ray CM-800
16 Major EquipmentsList AOI E-test Fly probe CNC machine
17 Key reliability testing equipment Reliability Testing 100% E-TEST 100% Visual Inspection Outline measurement Micro section Solder ability (245±5ºC; 3-5 sec) Thermal shocking (288±5ºC,10 sec. 3times) Solder mask peeling testing Peeling intensity testing Impedance testing Ionic pollution testing Temp& Humidity test
18 Specail Product introduction PCB Type: Rigid-Flex Layer: 2L Thickness: 0.50mm Outlayer cu: 1 OZ Min.dril: 0.30mm Min.W/D: 0.20/ 0.15mm Surface: ENIG Stackup Layer PCB Type: Rigid-flex Layer: 4L Thickenss: 0.80mm Inner cu: 1OZ Outlayer cu: 1 OZ Min. drill: 0.30mm Min.W/D: 0.15/ 0.15mm Surface : ENIG Stackup Layer
19 Specail Product introduction This is specail heavy copper 210um (12oz) PCB Type: Layer: Thickness: Outlayer cu: Min.dril: Min.W/D: Surface: Power boards 2L 1.60mm 12 OZ (210um) 0.80mm 0.90/ 0.70mm ENIG Speical thickness 0.15mm with 2oz copper PCB Type: MDSIN boards Layer: 2L Thickness: 0.15mm Outlayer cu: 2 OZ (70um) Min.dril: 0.50mm Surface: OSP
20 Specail Product introduction PCB Type: Layer: Thickenss: Inner cu: Outlayer cu: Min. drill: Min.W/D: Surface : Rigid-flex 4L 2.0mm 1OZ 1 OZ 0.30mm 0.15/ 0.12mm ENIG PCB Type: Layer: Thickenss: Inner cu: Outlayer cu: Min. drill: Min.W/D: Surface : Blind&burried 6L 2.0mm 0.5 OZ 1 OZ 0.35mm 0.15/ 0.15mm ENIG PCB Type: Layer: Thickenss: Inner cu: Outlayer cu: Min. drill: Min.W/D: Surface : Blind &burried 4L 0.8mm 1OZ 1 OZ 0.25mm 0.12/ 0.143mm ENIG
21 Specail Product introduction Stackup layer The size 869.6x386mm, the network connect by blind and buried hoes! PCB Type: Layer: Thickenss: Inner cu: Outlayer cu: Min. drill: Min.W/D: Surface : blind and burried 4L 3.20mm 1OZ 1 OZ 0.35mm 0.15/ 0.15mm ENIG PCB Type: blind and burried Layer: 8L Thickenss: 3.20mm Inner cu: 0.5 OZ Outlayer cu: 1 OZ Min.BGA size: 0.22mm Min. drill: 0.10mm Min.W/D: 0.127/ 0.093mm Surface : ENIG Vias pluggdwith Resin
22 GoldenTech CircuitsTechnology Co.,Ltd Fast Response; Superior Quality; Skilled Experience; High Technology Your Flexible QTA & HMLVPCB Supplier! Contact: Thank you!!!
YANTAT PRINTED CIRCUIT (SHENZHEN) CO. LTD.
WWW.YANTAT.COM YANTAT GROUP HK HEAD OFFICE Logistic/Sales YANTAT PRINTED CIRCUIT SHANGHAI SALES OFFICE SHENZHEN SALES OFFICE HONG KONG HEAD OFFICE YANTAT PRINTED CIRCUIT YANTAT PRINTED CIRCUIT YANTAT S
More informationCompany Overview Markets Products- Capabilities
Company Overview Markets Products- Capabilities A Simpler way for PCB production. www.purepcb.co.uk What can Pure do for you? From 1 off Circuit upward, No MOQ/MOV High Mix Production Focus. Fast Turn
More informationManufacturing Capacity
Capability List Manufacturing Capacity QTA & Prototype Layer : 1L ~32 L Impedance Board Ball Grid Array ( BGA ) Blind/ Buried Via Micro Via ( Laser Drilling) Flex /Rigid Flexible PCB Series Orders Layer
More informationTechnology HF-Printed Circuits Rev For latest information please visit
Options and Characteristics Online calculation On explicit enquiry Quantity 1 piece up to 0,4m² total area from 1 piece to mass production Layer quantity 1 to 2 layers Up to 8 layers Material thickness
More informationTechnology Aluminium-IMS-PCBs Rev For latest information please visit
Options and Characteristics Online calculation On explicit enquiry Quantity 1 piece up to 1,0² total area from 1 piece to mass production Layer quantity 1- and 2-layers up to 6 layers Material thickness
More informationSmart PCBs. Work
0 Smart PCBs Service Road, Shaheen Town, near Airport Chowk, Rawalpindi, 4600, PAKISTAN Tel: +92 (0) 51 457 8047, Fax (0) 51 457 8048 www.smartpcbs.com Dear Sir/Madam, SmartPCBs is the leading fabricators
More informationPCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD
NCAB Group Seminars PCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD NCAB GROUP PCB Production Process Introduction to Multilayer PCBs 2 Introduction to multilayer PCB s What is a multilayer
More informationCANDOR Industries Inc. High Quality PCB Manufacturing Solutions
CANDOR Industries Inc High Quality PCB Manufacturing Solutions 1 Our Mission Founded in 1999, Candor is an industry leader in High Technology Printed Circuit Board Fabrication Services. Quick turn services
More informationPCB Fabrication Specification
Original Author: Steve Babiuch Process Owner: Steve Babiuch Page 2 of 8 1.0 Purpose This specification establishes the NEO Tech fabrication requirements for printed circuit boards. The order of precedence
More information- 1 - Contents. Date: Date changed Made by: PCB Technical. Accepted by: Gordon Falconer
- - page of 4 Contents Inner and outer layer features... 2. Description... 2.2 Capability... 2 2 Build-up / Multilayer... 3 2. Common capability... 3 Standard build-up... 3 3 Drilling/Routing/V-cut/Bevel...
More informationGRAPHIC MANUFACTURING CAPABILITY Q217-18
All features are design dependent and may not be achievable in combination Reduced Yield / Special values up ( or down ) to the standard limit are design and application dependent Standard features only
More informationPRODUCTION SERVICE OF PRINTED CIRCUIT BOARDS (PCBS)
PRODUCTION SERVICE OF PRINTED CIRCUIT BOARDS (PCBS) TESAT PCB - Manufacturing PROPRIETARY INFORMATION Tesat-Spacecom GmbH & Co. KG reserves all rights including industrial property rights, and all rights
More informationReady For The Future 2016
Ready For The Future 2016 Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology
More informationHow Printed Circuit Boards are Made. Todd Henninger Field Applications Engineer Midwest Region
PCB 101: How Printed Circuit Boards are Made Todd Henninger Field Applications Engineer Midwest Region Tooling PRE-PRODUCTION ENGINEERING (Tooling) Design Data Package CAD Data (ODB++ or Gerber 274x format)
More informationCorporate Presentation
Corporate Presentation Sales History NA PCB Industry s Peak NA PCB Industry s Trough Company Profile Established 1985 100% Equity Owners / Full-Time Operators 115,000 ft² Facility (15,000 ft² warehouse)
More informationBasic 4-layer manufacturing process
Basic 4-layer manufacturing process Erwin Lemmens - AQC BV 7-11 D&E BE / Booth 1 8-11 D&E NL / Booth 18 AQC (Advanced Quality Control) BV Supplying pcb s, flex, flex-rigids, aluminium, etc - standard and
More informationAxiom Electronics LLC
1 of 8 1.0 PURPOSE and SCOPE This document defines Axiom s requirements for printed circuit board (PCB) fabrication, handling, and storage. Industry standards are referenced where appropriate. This document
More informationActive Sales Associates
1. Introduction Active Sales Associates The combined PCB technologies of Kunshan APEX Electronics of China and Century PCB located in Taiwan 1.1. Purpose The purpose of this specification is to set a basis
More informationAnnular Ring and Feature Clearances. Track to Feature Clearances
Hi-Tech Corporation Technical Capabilities Annular Ring and Feature Clearances Outer Value layer min (mm) A 75 B 125 C 150 Inner Value layer min (mm) A 100 B 150 C 150 Track to Feature Clearances Outer
More informationWelcome to Streamline Circuits Lunch & Learn. Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology
Welcome to Streamline Circuits Lunch & Learn Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology Accurate PCB data is critical to the tooling process. Here are some key items
More informationProcess & Capability Manual (Vol )
Process & Capability Manual (Vol. 12-2015) Seite 1 von 13 1 CHAPTER OVERVIEW 1 CHAPTER OVERVIEW... 2 2 MICROCIRTEC A SHORT PROFILE... 3 2.1 WHO WE ARE... 3 2.2 OBJECTIVES & MARKETS... 3 2.3 DECLARATION
More informationATS Document Cover Page
221-008 Item Rev Status: RELEASED printed 9/20/2017 2:27:42 PM by Les Deenin ATS: OPERATIN PROCEDURE ATS Document Cover Page Responsible Department: Supply Chain This copy is uncontrolled unless otherwise
More informationLow CTE / High Tg FR-4 with High Heat Resistance
Low CTE / High Tg FR-4 with High Heat Resistance Laminate: EM-827 Prepreg: EM-827B 1 Features Tg(DSC) > 170 Z direction CTE < 3.0% (50~260 ) High thermal degradation temperature: Td > 340 Excellent thermal
More information(13) PCB fabrication / (2) Focused assembly
Company Fact Sheet TTM Technologies, Inc. is a world-wide leader in the manufacture of technologically advanced PCBs, backplane and sub-system assemblies. Our Global Presence / Local Knowledge approach
More informationLead Free Assembly: A Practical Tool For Laminate Materials Selection
Lead Free Assembly: A Practical Tool For Laminate Materials Selection Erik J. Bergum David Humby Isola Abstract: The impending European RoHS legislation, restricting the use of lead containing solders,
More informationInsulated Metal Substrates
Insulated Metal Substrates Presented by Les Round of Spirit Circuits ICT Evening Seminar: 15 th September 2010 Venue: Newtown Hotel, Hayling Island Why use Thermal Management The failure rate of an electronic
More informationIMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION
IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Frank Grano, Felix Bruno Huntsville, AL Dana Korf, Eamon O Keeffe San Jose, CA Cheryl Kelley Salem, NH Joint Paper by Sanmina-SCI Corporation EMS, GTS
More informationIntroduction Conductors. Supply Planes. Dielectric. Vias PCB Manufacturing Process Electronic Assembly Manufacturing Process
PCBs/Overview Printed Circuit Boards (PCB) Introduction Conductors. Supply Planes. Dielectric. Vias PCB Manufacturing Process Electronic Assembly Manufacturing Process 29/09/2005 EE6471 (KR) 263 PCBs/Overview
More informationTECHNICAL DATA SHEET 1 P a g e Revised January 9, 2014
1 P age Revised January 9, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationStevenage Circuits Group
Stevenage Circuits Group Incorporating: Stevenage Circuits Tru-Lon Printed Circuits March 2011 The Organisation Stevenage Circuits formed 1971 Tru-Lon integrated into the Stevenage site March 2011 Group
More informationPOWERFUL PRINTED CIRCUIT BOARD MANUFACTURING SOLUTIONS
POWERFUL PRINTED CIRCUIT BOARD MANUFACTURING SOLUTIONS Leading the PCB Industry in Quality & Innovation for over 25 Years Advanced Circuits, Inc. www.4pcb.com ABOUT ADVANCED CIRCUITS Founded in 1989 Third
More informationALTIUMLIVE 2018: FLEX: SOMETHING NEW FOR EVERYONE
ALTIUMLIVE 2018: FLEX: SOMETHING NEW FOR EVERYONE Tara Dunn Omni PCB President San Diego October 5, 2018 Applications That Span Technology Today s Discussion: 1. Basic processing steps for both subtractive
More informationMechanical Reliability A New Method to Forecast Drop Shock Performance
Mechanical Reliability A New Method to Forecast Drop Shock Performance Ronald Frosch Guenther Mayr, Manfred Riedler AT&S Shanghai, China Abstract In light of the recent technological trends within PCB
More informationWhy Flex? Capabilities. Why PCi?
Why Flex? Innovation Flexible circuits give you a unique tool to bring your innovative packaging ideas to market, and to separate your products from the crowd. Flex gives you the ability to create circuitry
More informationCMG: PCB CAM engineering, artwork, laser plotting CIPSA-TEC INDIA: PCB plant manufactoring located in Bangalore INDIC: PCB assembling located in
-completo x fiera-avanz man-2015 PARTNER PARTNER CMG: PCB CAM engineering, artwork, laser plotting CIPSA-TEC INDIA: PCB plant manufactoring located in Bangalore INDIC: PCB assembling located in Bangalore
More informationOption Technologies. Ventec International Group Offshore Masslam Solutions From Prototype To Volume. Drilled Masslam from Taiwan
Option Technologies Ventec International Group Offshore Masslam Solutions From Prototype To Volume Drilled Masslam from Taiwan Manufacturing Capabilities Capabilities Maximum Layer Count 34 Maximum Panel
More informationOption Technologies. Ventec International Group Offshore Masslam Solutions From Prototype To Volume. Drilled Masslam from Taiwan
Option Technologies Ventec International Group Offshore Masslam Solutions From Prototype To Volume Drilled Masslam from Taiwan Manufacturing Capabilities Capabilities Maximum Layer Count 34 Maximum Panel
More informationRO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines
Fabrication Technical Articles Notes RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines These guidelines were developed to provide fabricators basic information on processing core
More informationCOFAN USA. Meeting your Project needs.
COFAN USA Meeting your Project needs www.cofangroup.com PCB Substrate Pre-preg Category SEKISUI Laird T-Clad Denka PCB Substrate Pre-preg Category In the PCB industry, there are a couple major Pre-preg
More information100 WAYS TO REDUCE COST
OPTIMUM DESIGN S 100 WAYS TO REDUCE COST COST SAVING TIPS FOR PCB ASSEMBLY 1 100 Ways to Reduce Cost SUMMARY 57 Ideas For Engineers 16 Things Buyers Can Do Now 32 Ways MFG Can Cut Cost CONTENTS Design...
More informationPractical guidelines for PWB Moisture Sensitivity, Packaging and Handling. Mumtaz Y. Bora Peregrine Semiconductor San Diego, CA, USA
Practical guidelines for PWB Moisture Sensitivity, Packaging and Handling Mumtaz Y. Bora Peregrine Semiconductor San Diego, CA, USA Agenda and Overview Industry Standards for Moisture Sensitivity Packages
More informationFLEXIBLE & RIGID-FLEX CIRCUITS TECHNICAL ENGINEERING GUIDE. Delivering Quality Since 1952.
FLEXIBLE & RIGID-FLEX CIRCUITS TECHNICAL ENGINEERING GUIDE Delivering Quality Since 1952. DELIVERING QUALITY SINCE 1952. Epec Engineered Technologies designs and manufactures customized, built-to-print,
More informationFlexible Printed Circuits Design Guide
www.tech-etch.com/flex Flexible Printed Circuits Design Guide Multilayer SMT Assembly Selective Plating of Gold & Tin-Lead Fine Line Microvias Cantilevered & Windowed Leads 1 MATERIALS CONDUCTOR Copper
More informationSmartphone. Big Data Robot
Wearable Smartphone Cloud 5G Autonomous Vehicle Big Data Robot Machine Learning HISTORY AI, 5G, IoT, Cloud, Robot First Production of Color TV Production of Electronic Tube Black and White TV Passed 34Million
More informationAerospace. l Automotive l Defense l Gaming l High-Precision Scales. l Membrane Switches l Medical l RF-Microwave l Telecommunications
GROWTH & FINANCIAL STRENGTH Production & Prototype Saturn Electronics Corporation, is a Top 30 domestic PWB Fabricator managing the nuances between Quick-Turn Prototype Boards and High-Volume PCB Production
More informationADVANCED CONNECTION TECHNOLOGY. Vietnam Incorporation
ADVANCED CONNECTION TECHNOLOGY Vietnam Incorporation Ho Chi Minh Tan Son Nhat International Airport (SGN) 7 Kilometers Ho Chi Minh City Centre (CBD) HO CHI MINH CITY 6 Kilometers Vinh Thanh Co.,Ltd. An
More informationALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION
ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION Chris Hunrath Insulectro, VP of Technology San Diego October 4 Outline 1 PCB Material Overview 2 What is the Dielectric Constant of
More informationFlex-Rigid Design Guide
DESIGN GUIDE Version 1.2 / March 2018 Flex-Rigid Design Guide The trend to miniaturization in electronics continues. Integrated circuit board solutions are becoming more and more popular as a means of
More informationTAIYO INK (SUZHOU) CO.,LTD. PSR-4000 G23K/ CA-40 G23K
No.26 Taishan Rord,Suzhou New District, Suzhou City, Jiangsu Province,P.R.China TAIYO INK (SUZHOU) CO.,LTD. Tel: +86-512-6665-5550 Fax: +86-512-6665-5015 Dual-component, alkaline developable Liquid photo
More informationc/bach, 2-B Pol. Ind Foinvasa Montcada i Reixac (Barcelona) SPAIN Tel FAX
1- What is 2- How does it work? 3- How do we make it? 4- Applications 5- Processing? WHAT IS? Thick aluminium based substrate, cladded in ED copper foil. Designed for an effective thermal dissipation and
More informationThe Anatomy of a PCB SINGLE-SIDED BOARD
Published on Online Documentation for Altium Products (https://www.altium.com/documentation) 主页 > The Board Using Altium Documentation Modified by Jason Howie on Apr 11, 2017 Open up just about any electronic
More informationFABRICATING HIGH CURRENT, HEAVY COPPER PCBS
Royal Circuit Solutions 21 Hamilton Ct, Hollister, CA 95023 (831) 636-7728 www.royalcircuits.com FABRICATING HIGH CURRENT, HEAVY COPPER PCBS INTRODUCTION All printed circuit boards (PCBs) carry current
More information!"#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0! **)
!"#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0!7.5853-09**) B 2 IT is a Toshiba Process Technology 1. Conductive Ag bumps are printed on a sheet of Cu foil. 2. Prepreg is pierced through by the bumps 3. Another
More informationInterconnection Evaluation Technology for Printed Wiring Boards
Interconnection Evaluation Technology for Printed Wiring Boards Mitsuhiko Sugane Yoshihiro Morita (Manuscript received December 28, 2009) As a developer of world-class products including server and network
More information優康控股有限公司. Company & Product Presentation
優康控股有限公司 Company & Product Presentation Profile Content Company Information Good Points LED Product & Service PCB Product & Service Metal Sheet Build Product & Service Eucon Group Introduction Eucon Group
More informationEquipment & Processes
Equipment & Processes The Circuits facility was designed for defect-free manufacturing of ex and rigid-ex printed circuit boards exclusively. The equipment and processes were chosen to minimize the handling
More informationIPC-2221B APPENDIX A Version 2.0 June 2018
IPC-2221B APPENDIX A Version 2.0 June 2018 A.1 INTRODUCTION This appendix was developed by the IPC 1-10c Test Coupon and Artwork Generation Task Group and is included in this current document revision
More informationPBA Qualification Guideline
EDM-Q-001 Rigid Printed Circuit Board Qualification Version 1.0 July 2017 Contact Geert Willems Phone: +32 16 288962 Mobile: +32 498 91 94 64 Geert.Willems@imec.be IMEC Kapeldreef 75 B3001 Heverlee Verantwoordelijke
More informationPINGYORK INTERNATIONAL INC. - PCB LAYOUT/PRODUCTION - SMT/DIP/PRODUCT ASSEMBLY PRODUCTION - SAFETY APPROVAL TEST PRESENTATION. Updated June, 2013
PINGYORK INTERNATIONAL INC. - PCB LAYOUT/PRODUCTION - SMT/DIP/PRODUCT ASSEMBLY PRODUCTION - SAFETY APPROVAL TEST PRESENTATION Updated June, 2013 PRESENTATION SUMMARY - PCB Factory Information Layout Design
More informationDeepen your knowledge
FLEX & RIGID-FLEX PRINTED CIRCUIT BOARDS Deepen your knowledge What are Flex & Rigid-flex Printed Circuit Boards? What are their similarities and differences? Their capabilities? And the design rules.
More informationFlex and Rigid-Flex Printed Circuit Design
Flex and Rigid-Flex Printed Circuit Design Old Content - visit altium.com/documentation Modified by on 29-Nov-2016 Related Videos Bending Lines Enhanced Layer Stack Management Layer Stack Regions A rigid-flex
More informationOptimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
Abstract Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve Taylor, Garry Wexler. The Bergquist Company Prescott,
More informationTECHNICAL DATA SHEET 1 P a g e Revised August, 2014
1 P a g e Revised August, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationQuestion: Are RO4000 materials compatible with lead-free processes? Answer:
Question: Are RO4 materials compatible with lead-free processes? Answer: RO4 cores and prepregs are among the most temperature stable products available. They easily meet or exceed all expectations for
More informationSpace product assurance
-Q-70-11A EUROPEAN COOPERATION FOR SPACE STANDARDIZATION Space product assurance Procurement of printed circuit boards Secretariat ESA-ESTEC Requirements & Standards Division Noordwijk, The Netherlands
More informationOptimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
Abstract Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve Taylor, Garry Wexler. The Bergquist Company Prescott,
More informationUL PCB Recognition what is it & why do you need to know about it
UL PCB Recognition what is it & why do you need to know about it Presented by Emma Hudson NCAB Customer Event March 2015 UL and the UL logo are trademarks of UL LLC 2015 Agenda What is UL and what are
More informationTECHNICAL DATA SHEET 1 P a g e Revised June, 2015
1 P a g e Revised June, 2015 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationFreescale Semiconductor Tape Ball Grid Array (TBGA) Overview
Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Revision 0 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the
More informationQualification and Performance Specification for High Frequency (Microwave) Printed Boards
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Developed by the High Speed/High Frequency Board Performance Subcommittee (D-22) of the High Speed/High Frequency
More informationQualification and Performance Specification for Flexible Printed Boards
Qualification and Performance Specification for Flexible Printed Boards Developed by the Flexible Circuits Performance Specifications Subcommittee (D-12) of the Flexible Circuits Committee (D-10) of IPC
More informationImplementation of IECQ Capability Approval using the IPC-6010 series of Standards
Page 1 of 13 INTERNATIONAL ELECTROTECHNICAL COMMISSION QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) DOCUMENT NUMBER: OD 301 DOCUMENT TYPE: Operational Document VERSION: Version 1 TITLE: Implementation
More informationIPC-6012DA with Amendment 1. Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
A with Amendment 1 Automotive Applications Addendum to Qualification and Performance Specification for Rigid s FINAL DRAFT FOR INDUSTRY REVIEW MAY 2018 0.1 Scope This addendum provides requirements to
More informationInterconnection Reliability of HDI Printed Wiring Boards
Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council APEX and Designers Summit 05 Interconnection Reliability of HDI Printed Wiring Boards Tatsuo Suzuki Nec Toppan Circuit Solutions,
More informationLinking You to a World of Printed Circuit Boards
Linking You to a World of Printed Circuit Boards www.epc-elreha.com Since 1995 is EPC ELREHA located in the metropolitan region Rhein Neckar in Mannheim, Germany. Company Profile Through worldwide production
More informationTAIYO THP-100DX1 USA-SP (UL Name: THP-100DX)
TAIYO THP-100DX1 USA-SP (UL Name: THP-100DX) THP-100DX1 USA-SP after copper plating. THP-100DX1 USA-SP in 1 and 5 kg container. Available in a 1 and 5 kg container One-component Thermally Cured Hole Fill
More informationCRYSTAL SPECIFICATION
CRYSTAL SPECIFICATION Product Code : C7M1356020AFSAF0-QE04 Description : Quartz Crystal Revision History Rev. Date Reason Issued By 0 29/12/2014 szom_xiaopei Hong Kong X'tals Limited CRYSTAL SPECIFICATION
More informationNP-180R NAN YA PLASTICS CORPORATION ELECTRONIC MATERIALS DIVISION. COPPER CLAD LAMINATE DEPARTMENT NO TUNG HWA N. ROAD, TAIPEI, TAIWAN.
New: 2014/04/30 flame retardant copper clad laminate NP-180R High Tg 175 (DSC) Excellent dimensional stability through-hole reliability Excellent electrical, chemical and heat resistance properties IPC-4101C
More informationTAIYO PSR-2000 ECLiPSE
Revised December 2011 TAIYO PSR-2000 ECLiPSE Revised August 2013 LIQUID PHOTOIMAGEABLE SOLDER MASK Screen Print or Spray Application A low-cost alternative to PSR-4000 RoHS Compliant Halogen-Free Compatible
More informationOptimizing Immersion Silver Chemistries For Copper
Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted
More informationNCAB Group PCB Specification
NCAB Group Seminar no. 9 NCAB Group PCB Specification NCAB GROUP NCAB Group PCB Specification 14 key features for durable and reliable PCB s NCAB GROUP NCAB Group PCB Specification 2 Are all PCB s created
More informationCurrent Standards Flex-Rigid
Current Standards Flex-Rigid Würth Elektronik Circuit Board Technology Webinar April 17th, 2018 Speaker: Andreas Schilpp www.we-online.com page 1 19.04.2018 agenda 1 2 3 4 WHY Flex-Rigid? Hierarchy of
More informationPRINTED CIRCUITS HANDBOOK
PRINTED CIRCUITS HANDBOOK Clyde F. Coombs, Jr. Sixth Edition Me Graw New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto CONTENTS List
More informationOptimizing Immersion Silver Chemistries For Copper
Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted
More informationPSR-2000 CE800 / CA-25 CE80
No. 26 Taishan Road Suzhou New District Suzhou Jiangsu P.R. China ZTAIYO INK (SUZHOU) CO., LTD. Tel: +86-512-6665-5550 Fax: +86-512-6665-5057 Dual-component, alkaline developable Liquid photo imageable
More informationBuilding HDI Structures using Thin Films and Low Temperature Sintering Paste
Building HDI Structures using Thin Films and Low Temperature Sintering Paste Catherine Shearer, James Haley and Chris Hunrath Ormet Circuits Inc. - Integral Technology California, USA chunrath@integral-hdi.com
More informationInnovative PCB Solutions. Win time and flexibility benefit from Swiss quality. THE PCB CHALLENGE Doing it together
Innovative PCB Solutions Win time and flexibility benefit from Swiss quality THE PCB CHALLENGE Doing it together INDIVIDUAL CUSTOMER SOLUTIONS from a reliable partner 2 Optiprint offers consulting, development
More informationTechnology by MOS PRINTED CIRCUIT BOARD TECHNOLOGY FOR THE FUTURE
Technology by MOS PRINTED CIRCUIT BOARD TECHNOLOGY FOR THE FUTURE Technology by MOS 10th edition, Date of issue: July 2016 Table of contents Table of contents About MOS 8-9 Final surfaces / Coatings 33-35
More informationCharacterizing the Lead-Free Impact on PCB Pad Craters
Characterizing the Lead-Free Impact on PCB Pad Craters Brian Roggeman and Wayne Jones Advanced Process Lab Universal Instruments Corp. Binghamton, NY 13902 Abstract Pad cratering in Printed Circuit Boards
More informationPart One Introduction
j1 Part One Introduction Evolvable Designs of Experiments: Applications for Circuits. Octavian Iordache Copyright Ó 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim ISBN: 978-3-527-32424-8 j3 1 Printed
More informationNiP Resistor Manufacturing Overview
0 NiP Resistor Manufacturing Overview Thin film NiP resistive alloy material is made by electrodepositing of the NiP alloy onto copper foil (RESISTOR-CONDUCTOR MATERIAL) which is then laminated to a dielectric
More informationConductive Hole Plugging Product
TAIYO SCHP-7901 Board Thickness = 62mils Board Thickness = 62mils Hole Diameter = 8 mils Hole Diameter = 14 mils Silver Conductive hole fill material Single-Component this is Thermally Cured Fills holes
More informationMACDERMID ENTHONE ELECTRONICS SOLUTIONS BLACKHOLE/ECLIPSE
MACDERMID ENTHONE ELECTRONICS SOLUTIONS BLACKHOLE/ECLIPSE DEC, 2016 OUTLINE Mechanism of Blackhole / Eclipse Blackhole / Eclipse process - Sequence - Process Equipment enhancement Performance test method
More informationOMIKRON IMMERSION WHITE TIN. Florida CirTech, Inc. Greeley, Colorado USA. Revised 2/19/98
OMIKRON TM IMMERSION WHITE TIN Revised 2/19/98 Florida CirTech, Inc. C T Florida CirTech, Inc. 1309 North 17th Avenue Greeley, CO 80631 Telephone: 1-800-686-6504 Fax: (970) 346-8331 Table of Contents Pages
More informationVT-45PP VT-47PP VT-447PP
& Prepreg General Information Ventec provides a series of and Prepregs with different glass style and resin content. These products have good bonding and thermal performance in applications of heat sink
More informationFine Pitch P4 Probe Cards
Fine Pitch P4 Probe Cards Photolithographic Pattern Plating Process June 1998 By Toshi Ishii, Hide Yoshida Contents What is a P4 probe card? Specification Some test results Tip cleaning RF performance
More informationPSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV)
PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE SOLDER MASK Spray and Curtain Coat Application Designed to work on the latest DI equipment Aqueous Developing Solder Mask RoHS Compliant
More information