Environmentally Preferred Products Lead (Pb)-Free, RoHS Compliant Solution May 2006 Customer Communication
Let s get clear about RoHS RoHS (EU Directive 2002/95/EC) The official Directive name is Restriction of the use of certain Hazardous Substances in electronic equipment Directive 2002/95/EC of the European Parliament limits the amount of hazardous content in electronics and electronic equipment. The RoHS directive does not cover transportation vehicles, military or high end telecommunications infrastructure. Elimination of Lead (Pb) is the primary focus for semiconductors Lead (Pb)-Free Package not more than 1000 ppm of Pb within any homogeneous part of the product. Lead (Pb)-Free Termination not more than 1000 ppm of Pb within the external package termination (ball or lead), solder or plating. Freescale has selected the most widely accepted industry solutions for RoHS compliant product conversions: Matte tin (Sn) plating followed by a 1 hour / 150 0 C bake for products with leads. Tin silver copper (SnAgCu) solder balls for ball grid array (BGA) products. Slide 1
China RoHS The China Ministry of Information Industry (MII) propagated its version of the RoHS Directive on February 28, 2006 with implementation scheduled for March 1, 2007. While covering the same six RoHS substances, China introduces various differences. Many of the details are yet to be resolved. China seeks to explicitly list the products covered by the regulation, although the list will be completed later in 2006. China expands the scope to include the packing materials. China will incorporate strict content marking instructions. Key Point: If you're not nervous you're not paying attention. -- Design Chain Associates website, March 28, 2006. Slide 2
RoHS Compliance Strategy Freescale is transitioning its portfolio to RoHS compliant and high temperature attach qualified products for lead (Pb) free board-attach assembly processing. We are shipping RoHS compliant products in advance of the July 1, 2006 deadline. Lead-frame products are migrating to lead (Pb) free packages with matte tin (Sn) plating; migration may require new lead-frames and new mold compound. BGA products are migrating to SnAgCu spheres; migration may require new substrates, epoxy and mold compound. For backward compatibility, Freescale continues to support BGA packages with SnPb spheres. RoHS compliant products are qualified per JEDEC standard Package Peak Temperature with a Moisture Sensitivity Level of 3 or better. Volume production is migrating to RoHS compliant, lead (Pb) free package solutions. Our semiconductor products already meet RoHS requirements for cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants. Silicon Evaluation Systems and Reference Designs are migrating to RoHS Compliance. Guiding principle: Freescale expects rapid transition to RoHS compliant product offerings to drive high product quality and service. We anticipate market forces will drive an industry transition to RoHS compliant, high temperature attach qualified material sets by the end of 2008 across all products. Slide 3 Approved April 25, 2006
Freescale Portfolio Transition Timeline RoHS Compliant Products Products Not Compliant To RoHS Leadframe Packages Packages are qualified and available today to meet RoHS high temperature attached qualified production requirements. New product introductions are RoHS compliant & high temperature attach qualified material sets. Initial Device Migration (GPCN) issued in Dec 2005: 30 June 2006 Last order 31 December 2006 Last shipment Existing products not compliant to RoHS will be supported throughout the transition, using the GPCN process to announce last shipment dates. BGA (Ball Grid Array) Packages Packages are qualified and available today to meet RoHS high temperature attached qualified production requirements. New product introductions have high temperature attach qualified material sets and have RoHS (SnAgCu) sphere options. Existing RoHS non-compliant products will be supported throughout the transition, using the GPCN process to announce last shipment dates. To support backward compatibility, Freescale continues to offer existing BGA products with both RoHS (SnAgCu) and non-rohs (SnPb) packages. New products introduced with high temperature material sets will include non-rohs (SnPb) sphere options. Approved April 25, 2006 Slide 4
Achieving RoHS Compliance To drive towards RoHS compliance, Freescale will: manage conversion timelines with supply chain partners; consolidate product qualifications when appropriate; reflect conversion plans on customer horizon reports, where applicable; use standard portfolio management practices to determine product discontinuance or conversion dates; and, use the GPCN process to announce last shipment dates for non-compliant parts. When supplying devices not compliant to RoHS after July 2006, Freescale reserves the right to: transfer assembly sites and review pricing as necessary; extend lead times as production volumes decline, where applicable; and, Ship all inventory by last ship date for non-compliant products. To generate material content disclosure reports and compliance certification, Freescale supports industry standard formats: inemi / IPC-1752 certification and content declaration; AIAG / Compliance Connect certification and content declaration; and, automated delivery of certification, declaration and manufacturing parameters. Prompt transition to RoHS compliant, high temperature attach qualified products will minimize supply disruptions. Approved April 25, 2006 Slide 5
Portfolio Transition Complexity Complexity of converting portfolio to green products RoHS 5 of 6* Pb-Free <or> Exempt + = RASH** Halogen-Free <Optional> [No, the package is not really green in color.] * 5 of 6 Compliant to all RoHS substances other than Pb solder ** RASH Resistance Against Soldering Heat Exempt Pb in glass, high-pb solder or Flip Chip Halogen Certain elements eliminated when upgrading mold compounds, but not legally required Slide 6
RoHS, Pb-free & Temperature Requirements What customers need to know: For RoHS compliant board assembly, ask for RoHS compliant products AND Package Peak Temperature (PPT) > or = 245 0 C Pb-Free Pb-Free Plating Why the confusion? RoHS compliant does not always mean Pb-free. RoHS Compliant Products containing Pb may be RoHS compliant due to exemptions Freescale semiconductor products may claim exemptions for Pb in flip chips, frit die or high temperature solders. These exemptions are allowed in the RoHS Annex. Pb-free does not always mean RoHS compliant. Some products may also contain Cd, Cr VI, Hg, PBDE or PBB. Freescale s semiconductor products are certified compliant for all substances except Pb, even if they are not classified as Pb-free and RoHS compliant. Pb-free plating or Spheres may not imply a totally Pb-free or RoHS compliant product. Products may contain Pb (exempt or non-exempt) within the package. Some customers ask for 5/6 RoHS compliance, meaning that the products are completely compliant to everything besides Pb in solders. Customer applications may allow this Pb usage. A RoHS Compliant product may not survive the Pb-free board assembly Package Peak Temperature (PPT). Always look for a PPT of greater than 240 o C when using Pb-free board assembly. Slide 7
Product Assembly Temperature Information Lead (Pb) Free Assembly and High Temperature Package Capability Pb-free solder reflows at a higher temperature than SnPb solder. RoHS Compliance + high temperature attach capability = Pb-free board attach processability. RoHS compliant products may only be built with Pb-free board attach processes when the Package Peak Temperature meets JEDEC J-STD-020C standard for nonhermetic surface mount package temperature profiles. Package Peak Temperature for Pb-Free Board Attach Reference: JEDEC J-STD-020C Package Volume & Thickness Volume Volume <350 mm 3 350 ~ 2000 mm 3 Volume >2000 mm 3 Thickness <1.6mm 260 o C 260 o C 260 o C Thickness 1.6mm ~ 2.5mm 260 o C 250 o C 245 o C Thickness >2.5mm 250 o C 245 o C 245 o C Thru-hole packages are robust to Pb-free wavesolder attach temperatures for 10 seconds. The JEDEC standard does not address thru-hole packages. Hence, Freescale does not specify Package Peak Temperature. For more detailed information about the solder profiles, download the complete document from www.freescale.com > Environmental Products > Lead (Pb) Free Initiatives, or access directly via http://www.freescale.com/files/product/doc/env_ PBFREEOV2.pdf. Freescale surface mount products are classified for its Package Peak Temperature. For device level information, perform a Part Number search at www.freescale.com and look for RoHS and PPT data, or contact your sales person. Slide 8
Product Change Complexity Qualification Complexity High Low Pb-free Termination (Balls/Plating) DIP, BGA, SMT Low BGA Substrate, Mold Compound BGA Die Attach, Lead Frame, Mold Compound Compliance Temperature Surface Mount L/Frame High Qual Efforts Assembly site & package Package Peak Temperature Moisture sensitivity Sn whisker Environmental stresses Manufacturing logistics Time & Resource Requirements Slide 9
Quality and Reliability Information Freescale RoHS compliant and high temperature attach capable products are qualified using the same reliability and quality standards as traditional products. Freescale differentiates RoHS compliant products from non-compliant products via distinct part numbers. Part number differentiation allows customers and sales to manage conversions without monitoring date codes. Customers must convert orders to RoHS compliant part numbers in order to receive RoHS compliant material. Labels on reels, trays and boxes will reflect RoHS compliance and Pb-free status. For surface mount products the labels will also include Package Peak Temperature. Reliability Stress Requirements align to JESD47 and/or AEC-Q100 (Stress Test Driven Qual of Integrated Circuits). The stresses run for each package family were based on the complexity of changes made relative to a previously qualified package recipe. The reflow profile and the Package Peak Temperature (PPT) are based on the JEDEC standard, J-STD-020C. Freescale tin whisker stress conditions are currently based on JEDEC (JESD22- A121) and inemi; Freescale is now testing products per JEDEC procedure JESD201, released in March 2006. Slide 10
Robust RoHS Compliant (Pb-Free) Solutions Freescale supports industry standard: Products with Leads - Freescale has optimized its matte Sn plating process to provide high quality performance. A 1-hour, 150 o C bake process provides additional mitigation against tin (Sn) whisker growth. Freescale is working with JEDEC and other industry consortia to define, document and test the reliability of lead (Pb) free plating processes. The Freescale Pb-free finish meets the quality specification for standard products per the Freescale process, 12MSH0556A. BGA Products - SnAgCu replaces the SnPbAg balls for board connections. Board-assembly - Freescale provides RoHS compliant products at a moisture sensitivity level (MSL) of 3 or better and will qualify its RoHS compliant products to support JEDEC peak package temperatures (PPT) of 245 0 C to 260 0 C, depending on package dimensions (per J-STD-020C). Slide 11
Robust RoHS Compliant (Pb-Free) Solutions Declarations of Compliance - Freescale standard declarations of compliance for RoHS and ELV are available on the external web: RoHS: http://www.freescale.com/files/product/doc/env_rohs_std_rsp.pdf ELV: http://www.freescale.com/files/product/doc/env_elv_std_rsp.pdf Material Composition - Freescale provides detailed composition reports for each of its semiconductor products. The reports use the IPC-1752 report format, as jointly developed with inemi. For device level information, perform a Part Number search at www.freescale.com RoHS compliance and PPT data are visible on the initial page, along with RoHS replacements for part numbers that are not RoHS compliant. Click view details and scroll down to the link for Product Content Report Reports appear in a PDF format with a built-in macro to allow download as XML. The XML file can be opened in Microsoft Excel for simple data transfer. Slide 12
Joint Efforts for Freescale and Customer Work together to avoid interruption of service and inventory obsolescence. Freescale Provide device qualification and sample availability dates by device Procure raw materials and capacity to support RoHS compliant production Provide on-line customer crossreferences for standard products Advise customers of cross-reference part numbers on custom products Customer Provide sample, qualification and production ramp timelines by device. Share inventory status and consumption plans for noncompliant products to ensure full consumption Convert orders to RoHS part numbers Slide 13
Freescale's EPP (Environmentally Preferred Products) web site http://www.freescale.com/pbfree Freescale's product specification / content web site http://www.freescale.com (type the part number at the top-right of screen) Freescale's Technical Support web site https://www.freescale.com/webapp/ruhp.login.framework (select EPP and your information request will be routed directly to the EPP team) Freescale's Technical Support phone numbers: Freescale Contacts Region Access Phone Number Office Hours Time Zone Time Zone & Offset Winter (Summer) North and South America USA +1 800 521 6274 6 am - 5 pm MST GMT-7 (-7) Europe France +33 1 69 35 48 48 9 am - 5 pm CET GMT+1 (+2) Germany +49 89 92103 559 9 am - 5 pm CET GMT+1 (+2) UK +44 1296 380 456 9 am - 5 pm CET GMT+1 (+2) Asia China 800 990 8188 9 am - 5 pm HKG GMT+8 (+9) Hong Kong +800 2666 8080 9 am - 5 pm HKG GMT+8 (+9) India 000 800 852 1155 9 am - 5 pm HKG GMT+8 (+9) Japan 0120 191 014 8 am - 5 pm TKY GMT+9 (+10) Sales and Customer Supply Analysts Slide 14
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