Vectron Thin Film Filters BUILD TO PERFORMANCE RF Customized Ceramic Thin Film Filters Anton Buchleitner, Vectron International
VECTRON Thin Film Filters bandwidth / MHz Features: 1 1 1 1 1 1.1.1.1.1.1.1 L-C Filters Discrete Crystal Filters Monolithic Crystal Filters Prec. High-Loss SAW Loss-Reduced SAW Low-Loss SAW Thin Film Filters 1 1 1 1, 1, 1, center frequency / MHz Small and mid-volume for e.g. Military & Space applications Extension of VECTRON s filter portfolio up to 35GHz Synergy with VECTRON s SAW-grade process technology Designed & manufactured in Europe 1% ITAR-free
VI Thin Film Filters - Strengths Thin Film Filters, Strengths: Small size Temperature stable Excellent design model accuarcy, good first pass success Excellent RF repeatability Excellent to manufacture: batch processed, no tuning of resonators
VI Thin Film Filters - Strengths Propietary ceramic substrate: High dielectric permittivityε r Low thermal coefficient of dielectric constant TCε r Improved matching of thermal expansion coefficient with PCB material Material Dielectric constant ε r to alumina based dielectric constant TCε r Size relative Thermal coefficient of filter design /ppmk -1 CF 25, 63% CG 67, 38% Alumina 9,9 1% 12 Material Coefficient of thermal expansion CTE /ppmk -1 CTE to RO 435B /ppmk -1 CF 9, -5, CG 9, -5, Alumina 6,5-7,5 RO 435B 14,
VI Thin Film Filters - Strengths Temperature stabilty compared to conventional ceramic substrate Shift of filter center frequency ~ 1x better than with alumina substrate Temperature Measurement: CF Material Temperature Measurement: Alumina -5-5 magnitude [db] -15-25 -4 C C C 2 C 4 C 6 C 8 C magnitude [db] -15-25 -4 C C C 2 C 4 C 6 C 8 C 4 45 5 55 6 65 frequency [MHz] 26 28 3 32 34 36 38 4 42 44 46 frequency [MHz]
Frontend: Clean room class 1K SAW-grade e-beam deposition technology Metalization systems: Standard Ti/Au Various alternatives qualified Highly accurate photo-lithography processes Excellent film thickness and line-width control and reproducibility No trimming processes required VI Thin Film Filters - Technology
VI Thin Film Filters - Technology Backend / Package solutions Customized / application-defined, e.g. Surface-mount: Filter chip is soldermounted and -connected Hybrid assembly: adhesive mounting / wire-bonding Connector- or through-hole type package solutions Shielded CSP-solutions for SMA and wire-bond S21 /db -4-5 -6-7 -8 12 12,5 13 13,5 14 14,5 15 15,5 16 16,5 17 17,5 18 frequency /GHz -5-15 -25-35 -4 S11 /db
VI Thin Film Filters - Design Design techniques Analytical draft Network simulation tools Electromagnetic Simulation Good knowledge of material parameters Dielectric permittivity Anisotropy Metal conductance Filter topologies Interdigital Edge coupled End coupled Edge / end coupled, V-shape Hairpin Dual mode resonator
VI Thin Film Filters - Design Design example Band pass filter 5.4 GHz Interdigital topology 7 poles S21 /db -4-5 -6-7 BPF 5,4 GHz +/- 7 MHz -5-15 -25-35 S11 /db -8-4 2 3 4 5 6 7 8 9 frequency /GHz
VI Thin Film Filters - Design Design example Band pass filter 1.6 GHz Interdigital topology 7 poles S21 /db BPF 1,62 GHz -5-15 -4-5 -25-6 -7-35 -8-4 1,2 1,3 1,4 1,5 1,6 1,7 1,8 1,9 2 frequency /GHz S11 /db
VI Thin Film Filters - Design Design example BPF 4,3 GHz Band pass filter 4.3 GHz Hair pin topology -5 7 poles -15 2nd harmonic supression S21 /db -4-5 -25 S11 /db -6-7 -35-8 -4-9 -45-5 2 2,5 3 3,5 4 4,5 5 5,5 6 6,5 7 7,5 8 8,5 9 9,5 1 frequency /GHz
VI Thin Film Filters - Design Design example Band pass filter 14,95 GHz Edge coupled topology V-shape 7 poles I/O 5 Ohm match S21 /db -4 BPF 14,95 GHz -5-15 S11 /db -5-25 -6-7 -35-8 -4 12 12,5 13 13,5 14 14,5 15 15,5 16 16,5 17 17,5 18 frequency /GHz
VI Thin Film Filters - Design Design example Band pass filter 3,5 GHz End coupled topology BPF 3,5 GHz -5 7 poles -15-4 S21 /db -5-6 -25 S11 /db -7-35 -8-4 -9-45 -5 26 27 28 29 3 31 32 33 34 35 36 frequency /GHz
VI Thin Film Filters - Mounting Mounting Techniques: Wire Bond Technique (recommended for frequency > 15 GHz) PC board RF (I/O) RF filter RF (I/O) wirebond housing floor conductive epoxy Filter Top Side Detail A Detail A Filter Top Side I/O bond pad Filter Bottom Side
Mounting Techniques (continued) Surface Mount Technology VI Thin Film Filters - Mounting
Mounting Techniques (continued) Surface Mount Technology (continued) VI Thin Film Filters - Mounting
VI Thin Film Filters - Shielding Filter Packaging and Shielding Printed Wire Board Covers (e.g. Rogers Material), for SMT mounting only Sheet metal cover, for SMT and wire bond technique as well (recessed to expose I/O) Shielding is left to the customer (next level of assembly) Printed wire board cover Sheet metal cover Customer shielding
VI Thin Film Filters - Shielding Effect of cover height Cover closer to substrate surface reduces bandwidth and increases insertion loss BPF 4,8875-5 -15 S21 /db -4-5 -6-25 S11 /db -7-35 -8-4 -9-45 -5 4 4,1 4,2 4,3 4,4 4,5 4,6 4,7 4,8 4,9 5 5,1 5,2 5,3 5,4 5,5 5,6 5,7 5,8 5,9 6 frequency /GHz
VECTRON Thin Film Filters Low-pass, high-pass, band-pass and band-stop (notch) filters available Center frequencies:.5 35GHz Relative bandwidth: 1 5% Technological approach similar to DLI s filters use of DLI s ceramic competence Excellent temperature stability: typical <5ppm/ C Extreme aging stability SPACE-grade solutions available ITAR Free! Design and Manufacturing in Germany!