CMG: PCB CAM engineering, artwork, laser plotting CIPSA-TEC INDIA: PCB plant manufactoring located in Bangalore INDIC: PCB assembling located in

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Transcription:

-completo x fiera-avanz man-2015

PARTNER

PARTNER CMG: PCB CAM engineering, artwork, laser plotting CIPSA-TEC INDIA: PCB plant manufactoring located in Bangalore INDIC: PCB assembling located in Bangalore MITEC: RF layout and engineering, RF packaging

welcome to

WHO WE ARE

REFERENCE POINT FOR HIGH TECHNOLOGY PCB

FIRM ORGANIZATION CHAIRMAN Franco Pigato GENERAL MANAGER Sandro Pigato QUALITY MANAGER Gianluca Lovato SALES MANAGER Eugenia Fornaro SALES AND TECH. MANAGER Andrea Pigato PRODUCTION MANAGER Peter Saccardo PRODUCTION PLANNING Gabriele Giacomin ADMINISTRATIVE OFFICE Anna Capozzo PURCHASE OFFICE Francesca Dal Lago

PRODUCTS SINGLE SIDED DOUBLE SIDED MULTILAYERS FLEXIBLES RIGID FLEX TEFLON HIGH FREQUENCY MATERIALS HIGH TG MATERIALS ALLUMINIUM METAL BACK METAL CORE SAMPLES IN 2-3 DAYS

PRODUCTION LAYERS 4L 2L 6L 1L 8L 10L >10L 1L 2L 4L 6L 8L 10L >10L 10

PRODUCTION MATERIALS rigid-flex other kapton teflon high Tg fr4 fr4 high Tg teflon kapton rigid-flex other 11

PRODUCTION other medical lighting military broadcasting automotive APPLICATIONS industrial industrial automotive broadcasting military lighting medical other 12

CERTIFICATIONS UL FILE: E146387 ISO 9001:2008

TURNOVER and INVESTMENT Year Turnover Investment 2005 5.700.000 530.000 2006 7.000.000 760.000 2007 6.700.000 490.000 2008 7.500.000 250.000 2009 5.650.000 200.000 2010 8.150.000 300.000 2011 8.740.000 350.000 2012 7.700.000 300.000 2013 6.850.000 350.000 2014 6.740.000 320.000 2015 6.600.000 310.000

STANDARD PRODUCTION MINIMUM HOLE 100 µ MINIMUM TRACK 100 µ MINIMUM ISOL. 100 µ NUMBER OF LAYERS 20 BOARD THICKNESS 0.2 5 mm COPPER THICKNESS 17 150 µ MULTILAYER MAX BOARD 810x500 mm PLUGGED VIAS (drill on pad)

TECNOLOGYCAL CARACTERISTICS MINIMUM HOLE 50 µ MINIMUM TRACK 50 µ MINIMUM ISOL. 50 µ NUMBER OF LAYERS 30 BOARD THICKNESS 0.05 6 mm COPPER THICKNESS 5 500 µ MULTILAYER MAX BOARD 900x600 mm PRESSFIT BLIND AND BURIED VIAS CONTROLLED IMPEDENCE

ENGINEERING SYSTEMS and FILE FORMATS BARCO WORKSTATIONS CAM 350 WORKSTATION BARCO LASER PLOTTERS BARCO SCANNER EXTENDED GERBER 274X DPF (BARCO) ODB++ HPGL DXF DWG EAGLE PROTEL ORCAD TANGO

WORKED MATERIALS FR4 BT POLYMIDE TEFLON (PTFE) DUROID HIGH TG MAT. CERAMIC THERMAL CLAD KAPTON MYLAR PET PEN

FINAL PROTECTIONS FOTOGRAPHIC SOLDER SERIGRAPHIC SOLDER SPECIAL SOLDER FOR FLEX VIAS FILLED COMPONENT SILKSCREEN INK JET LEGEND PEELABLE KAPTON COVER LAYER

SURFACE FINISHINGS IMMERSION GOLD ELECTROLITIC GOLD GOLD BOND H.A.L. TIN LEAD PASSIVATED COPPER IMMERSION TIN IMMERSION SILVER GRAPHITE

MECHANICAL FINISHING MILLING SCORING PUNCHING SOFT PUNCHING FOR FLEX

SUPPLIERS MAS KL LAMINATES ARLON NELCO POLYCLAD TACONIC DUPONT ROGERS ITEQ VON ROLL ISOLA KREMPEL ALPHAMETALS ALFACHIMICI CIMATEC COATES ELGA ENTHONE OMI MAC DERMID SHIPLEY SIRPI UNION TOOL ATOTECH

PRODUCTS 24

MULTILAYERS

MULTILAYERS

FLEX

RIGID-FLEX

RIGID-FLEX

METAL CORE

HIGH FREQUENCY AND MICROWAVE APPLICATIONS 31

USED MATERIALS 32

BROADCAST APPLICATIONS 33

MICROWAVE 34

RADAR 35

RF APPLICATION 36

RF+METAL CORE 37

RF + METAL CORE 38

INSULATED METAL SUBSTRATE (IMS) 39

BASE MATERIALS Bergquist Thermal Clad Aismalibar Cobritherm Laird Tlam Ventec DBC (Direct Bonded Copper) - Allumina (Al2O3) - Nitruro di Alluminio (AIN) Hard Alluminium & High conductive PP Epoxy (made by ) Bendable Material Thermal conductivity: 1.1-7 W/m K 40

METAL BACK 41

METAL BACK 42

BENDABLE-FLEX MATERIALS

PRODUCTION

ENGINEERING-LASERPLOTTER

DRILLING-MILLING

PLASMA DESMEARING & DIRECT PLATING

DRY FILM LAMINATION

EXPOSING-Laser Direct Imaging

DRY FILM DEVELOPING

ELECTROPLATING

STRIPPING-ETCHING

AOI CONTROL

MULTILAYERS PRESS

SOLDER RESIST-LEGEND

SURFACE FINISHING

CNC SCORING

ELECTRICAL TEST

ANALYSIS MICROSCOPE WITH CAMERA SPETTROFOTOMETER ATOMIC ABSORPION METALLOGRAFIC ANALYSIS CHEMICAL ANALYSIS METALLIC THICKNESS AND HOLE MEASUREMENTS THERMAL STRESS FISCHER X-RAY IONIC CONTAMINATION CONTROL IMPEDENCE

Where we are going?

Where we are going Ø vias 50 µ Bilnd and buried vias Track-isolation of 50 µ 36 layers Special materials Special finishings Samples in 1 day Production in 3-5 days

TECNOMEC WHERE WE ARE IN ITALY

via Melaro 11, 36041 Alte di Montecchio Maggiore (VI) - ITALY Tel. 0039 0444 694333 Fax 0039 0444 68322 Info@pcb-tecnomec.com - www.pcb-tecnomec.com