TECHNICAL REQUIREMENTS FOR ELECTRONIC PARTS, MATERIALS, AND PROCESSES USED IN SPACE VEHICLES

Transcription

1 SMC Standard SMC-S April Supersedes: SMC-S-010 (2009) Air Force Space Command SPACE AND MISSILE SYSTEMS CENTER STANDARD TECHNICAL REQUIREMENTS FOR ELECTRONIC PARTS, MATERIALS, AND PROCESSES USED IN SPACE VEHICLES APPROVED FOR PUBLIC RELEASE; DISTRIBUTION IS UNLIMITED

2 Report Documentation Page Form Approved OMB No Public reporting burden for the collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington VA Respondents should be aware that notwithstanding any other provision of law, no person shall be subject to a penalty for failing to comply with a collection of information if it does not display a currently valid OMB control number. 1. REPORT DATE 12 APR REPORT TYPE N/A 3. DATES COVERED - 4. TITLE AND SUBTITLE SMC-S-010 (2013) Parts, Materials, and Processes Technical Requirements for Space Vehicles 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 6. AUTHOR(S) 5d. PROJECT NUMBER 5e. TASK NUMBER 5f. WORK UNIT NUMBER 7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) USAF Space and Missile Systems Center 8. PERFORMING ORGANIZATION REPORT NUMBER 9. SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSOR/MONITOR S ACRONYM(S) 12. DISTRIBUTION/AVAILABILITY STATEMENT Approved for public release, distribution unlimited 13. SUPPLEMENTARY NOTES 14. ABSTRACT 15. SUBJECT TERMS 11. SPONSOR/MONITOR S REPORT NUMBER(S) 16. SECURITY CLASSIFICATION OF: 17. LIMITATION OF ABSTRACT UU a. REPORT unclassified b. ABSTRACT unclassified c. THIS PAGE unclassified 18. NUMBER OF PAGES a. NAME OF RESPONSIBLE PERSON Standard Form 298 (Rev. 8-98) Prescribed by ANSI Std Z39-18

3 FOREWORD 1. This standard defines the Government's requirements and expectations for contractor performance in defense system acquisitions and technology developments. 2. This revised SMC standard comprises the text of The Aerospace Corporation report number TOR-2006(8583)-2336 REV B, dated March 6, 2013, entitled Technical Requirements for Electronic Parts, Materials, and Processes Control Program Used In Space Vehicles. 3. Beneficial comments (recommendations, changes, additions, deletions, etc.) and any pertinent data that may be of use in improving this standard should be forwarded to the following addressee using the Standardization Document Improvement Proposal appearing at the end of this document or by letter: Division Chief, SMC/ENE SPACE AND MISSILE SYSTEMS CENTER Air Force Space Command 483 N. Aviation Blvd. El Segundo, CA This standard has been approved for use on all Space and Missile Systems Center/Air Force Program Executive Office- Space development, acquisition, and sustainment contracts. ~~ Mr. David Davis, GG-15, DAF SMC Chief Systems Engineer

4 Contents 1. Scope Purpose Baseline Performance Quality Order of Precedence Application of the Document PMP Management Reference Documents Reference Documents Government Documents Non-Government Documents Definitions General Requirements Application Requirements Electrical Derating End-of-Life Aging Sensitivity Sealed Packages Registered (Reliability Suspect) PMP and Prohibited PMP Handling Marking Outgassing Requirements Alternate QCI Test/Sampling Plan PMP Requirements New Technology Insertion Requirements Parts and Materials Transfer PMP Design, Construction, and Procurement Design Material Hazards Surface Finishes and Solder Attachments Processes and Controls Rework During Manufacture of Electronic Parts Bimetallic Bonds Part Quality Assurance Provisions In-Process Controls Screening (100 Percent) Lot Conformance Tests (or Quality Conformance Inspection) Destructive Physical Analysis (DPA) Qualification Tests Material Quality Assurance Provisions In-Process Controls Screening (100 Percent) Lot Conformance Tests (or Quality Conformance Inspection): Sampling or Periodic Qualification Tests Packaging Electrostatic-Sensitive Items....25

5 4.8 Data and Record Retention Detailed Requirements Section 100 Boards, Printed Wiring Section 110 Flex and Rigid-Flex Printed Wiring Boards Section 120 RF (Microwave) Boards, Printed Wiring Section 200 Capacitors, General Section 210 Multilayer Ceramic Capacitors (MIL-PRF-123) Section 211 Single Layer Ceramic Capacitors (MIL-PRF-49464) Section 215 Ceramic Capacitors, High Voltage (HVR) (MIL-PRF-49467) Section 216 Stacked Ceramic Capacitors (SM) (MIL-PRF-49470, T-LEVEL) Section 217 Ceramic Capacitor Arrays for Filter Connectors Section 230 Metallized Film Capacitors (CRH) (MIL-PRF-83421) Section 232 Metallized Film Capacitors (CHS) (MIL-PRF-87217A) Section 240 Glass Dielectric Capacitors (CYR) (MIL-PRF-23269) Section 250 Fixed MICA Capacitors (CMS) (MIL-PRF-87164A(3)) Section 255 Fixed, High-Voltage, Reconstituted MICA Capacitors Section 260 Fixed Tantalum Foil Capacitors (CLR 25, 27, 35, AND 37) (MIL-PRF-39006) Section 270 Solid Tantalum Capacitors (CSS) (MIL-PRF-39003/10) Section 275 Solid Tantalum Chip Capacitors (CWR) (MIL-PRF-55365) Section 280 Fixed Tantalum-Tantalum Capacitor, Sintered Wet Slug, Tantalum Case (CLR79, CLR81, CLR90 & CLR91)(MIL-PRF-39006/22, /25, /30 & /31) Section 300 Connectors Section 310 Connectors, Filtered Section 400 Quartz Crystals (MIL-C-49468, cancelled) Section 410 Crystal Oscillators & Crystal Filters Section 500 Diodes Section 510 RF Diodes (MIL-PRF-19500) Section 600 EMI and RFI Filters (FS) (MIL-PRF-28861, Class S) Section 700 Fuses Section 800 Magnetic Devices (MIL-STD-981) Section 900 Microcircuits Section 910 Integrated Circuits Section 960 Hybrids (MIL-PRF-38534, Class K) Section 1000 Relays (Current Ratings Of 25 Amperes or Less)

6 Section 1100 Resistors Section 1110 Fixed Composition, Insulated, Carbon Composition (RCR) (MIL-R-39008) Section 1120 Fixed Film Resistors (RLR) (MIL-PRF-39017) Section 1125 Fixed Film Resistor Chips (RM) (MIL-PRF-55342, S Failure Rate and T-level, and MIL-PRF-32159, T-level) Section 1130 Fixed Metal Film Resistors (RNC/RNR) (MIL-PRF-55182) Section 1140 Variable, Non-Wirewound Resistors (RJR) (MIL-PRF-39035) Section 1150 Variable, Wirewound Resistors (RTR) (MIL-PRF-39015) Section 1160 Wirewound, Accurate, Resistors (RBR) (MIL-PRF-39005) Section 1170 Wirewound, Power-Type Resistors (RWR) (MIL-PRF-39007) Section 1180 Wirewound, Chassis-Mounted Resistors (RER) (MIL-PRF-39009) Section 1190 Fixed Film Resistor Network (RZ) (MIL-PRF-83401) Section 1195 Thermistors (RTH) (MIL-PRF AND MIL-PRF-32192) Section 1200 Switches Section 1210 Sensitive And Push (Snap Action) Switches (MIL-PRF-8805) Section 1220 Thermal Switches (MIL-PRF-24236) Section 1230 Pressure Switches (MIL-DTL-9395) Section 1300 Active RF and Microwave Devices Section 1350 Surface Acoustical Wave Devices Section 1360 Coaxial Ceramic Resonators Section 1400 Semiconductors Section 1500 Wire And Cable Section 1600 Photonics Section 1700 Mechanical Piece Parts Section 2000 Materials Requirements Section 2100 Metals Section 2110 Aluminum and Aluminum Alloys Section 2120 Beryllium Section 2130 Magnesium Section 2140 Steels Section 2150 Titanium Section 2160 Other Metals Section 2200 Polymeric Materials Section 2210 Elastomers Section 2220 Foamed Plastics...296

7 Section 2230 Lubricants Section 2240 Adhesives, Sealants, Coatings, & Encapsulants Section 2250 Composites Section 2260 Ceramics Section 2270 Sandwich Assemblies Section 3000 Processes Section 3100 Adhesive Bonding Section 3200 Welding Section 3300 Brazing Section 3400 Fastener Installation Section 3500 Printed Circuit Assembly

8 Appendices Appendix A Radiation Hardness Assurance Requirements A.1. Scope A.2. Referenced Documents A.3. Environments A.3.1 Radiation Environments A.3.2 Radiation Design Margin (R DM ) A.4. Design Requirements and Characterization A.4.1 Neutron/Proton Induced Displacement Damage (DD) and Total Ionizing Dose (TID) Damage. 310 A.4.2 Part Selection Criteria A Characterization Test A Derivation of Radiation Degradation Limits for TID and/or Neutron A Standard Normal Distribution A Log Normal Distribution A Combining Neutron and TID Damage A Applicability and Exceptions A.4.3 Single Event Effects (SEE) and Prompt Dose A SEE Characterization Test A Prompt Dose Upset and Survival Characterization Test A.5. Production Acceptance Test A.5.1 Radiation Wafer Lot Acceptance Testing (RWLAT) A.5.2 Conditions for exemption from RWLAT A.5.3 Deleted A.5.4 PMP Hardness Assurance Program Plan A.5.5 Test Documentation A.6. MATERIALS SELECTION A.7 Radiation Hardness Assurance Requirements for Hybrid Microcircuits and Multichip Modules.315 A.7.1 Scope A.7.2 Essential Characteristics A.7.3 Design Requirements A Circuit Design Margin A Definition of Radiation Design Margin (RDM) A Radiation Design Margin Requirements A Temperature and Voltage Margin

9 A Aging Margin A Parameter s EOL Value A Selection of Monolithic Microcircuit and/or Semiconductor Component Elements A Selection constraints for TID and/or DD A Selection Constraints for Single Event Phenomena (SEP) A Dose Rate Effects A Stress Derating A.7.4 Radiation Characterization A Displacement Damage (DD) and TID A SEP Characterization Test A.7.5 Degradation limits A Sampling Statistics - Normal Distribution A Sampling Statistics - Log Normal Distribution A Combining DD and TID Degradation A.7.6. RHA Baseline A Change control procedures A.7.7. Verification methods A Worst Case Circuit Analysis (WCCA) A SEP Analysis A Performance requirements for RHA devices A Radiation hardness assurance (RHA) levels A Implementation of this appendix A.7.8 Production acceptance A Radiation Wafer Lot Acceptance Testing (RWLAT) A Traceability A Acceptance Criteria A ELDRS Acceptance Criteria A Acceptance Test Precedence A Radiation test reports A Test report Appendix B Rescreening/Quality Conformance Inspection Requirements B.1. Scope B.2. Application B.3. Class B/QML Q Microciruit Upscreening/Lot Acceptance Testing B.4. Class H Hybrid Upscreening/Lot Acceptance Testing

10 B.5. JANTXV Transistor and Diode Upscreening/Lot Acceptance Testing Appendix C Alternate QCI Test/Sampling Plan C.1. Scope C.2. Application C.2.1 Supplier C.2.2 Product C.2.3 Microcircuits per MIL-PRF C Reduced Group B Sample Size C Reduced Group D Sample Size C.2.4 Diodes and Transistors per MIL-PRF C Reduced Group B Sample Size C Reduced Group C Sample Size Appendix D Notes D.1. Intended Use D.2. Tailoring D.2.1 Tailored Application D.2.2 Tailoring To Contract Phase D.2.3 Tailoring Part Specifications D.3. Data Items

11 Figures Figure 4-1. Typical electrical stress vs temperature derating scheme Figure Deliverable Coupon Placement Figure Voltage versus Temperature Derating for Glass Capacitors Figure Voltage versus temperature derating for mica capacitors Figure Voltage versus temperature derating for tantalum-foil capacitors Figure Voltage versus temperature derating for solid tantalum capacitors Figure Voltage versus temperature derating for tantalum-tantalum (sintered wet slug) capacitor Figure ESR versus ac frequency Figure Power derating for carbon composition resistors Figure Power derating for film resistors Figure Power derating for metal film resistors Figure Power derating for variable, non-wirewound resistors Figure Power derating requirements for variable, wirewound resistors Figure High temperature derating curves for accurate wirewound resistors Figure Power derating requirements for wirewound (power-type) resistors Figure Typical maximum pulse power versus time for RWR 81 (1-watt) resistors Figure Typical maximum pulse power versus time for RWR 89 (3-watt) resistors Figure Typical maximum pulse power versus time for RWR 84 (7-watt) resistors Figure Derating curve for negative coefficient thermistors Figure Switch current rating versus temperature for a typical switch (not applicable for thermostatic type) Figure Wafer requirements Figure Reliability assurance program elements

12 Tables Table Capacitor Styles Included in Section Table Modifications to Group A of MIL-PRF Table Additions and Modifications to Group B OF MIL-PRF Table Group A Requirements Table Group B Requirements Table Group A Requirements Table Group A Requirements Table Group B Requirements Table Modifications to Group A for Tantalum Foil Capacitors Table Group B Tests for Tantalum Foil Capacitors Table Additional Tests When Source Impedance Is <0.1 Ω/Volt Table Additional Tests When Source Impedance Is <0.1 Ω/Volt 2/ Table Group A for Wet Tantalum Slug Capacitors Table Group B for Wet Tantalum Slug Capacitors Table Group A Requirements for Emi Filter Connectors with Ceramic Arrays Table Percent Screening Requirements for Quartz Crystals Table Lot Conformance Tests Table Fuse Derating in Vacuum At +25 C Table Percent Screening Requirements for Hollow Body, Wire Element Fuses Table Chip Fuse Group B Testing Table Additions to Group B Lot Conformance Table Digital Microcircuits Derating Table Linear Microcircuits Derating Table Linear Voltage Regulator Microcircuit Derating Table Electron-Migration Failure Mechanism Table Corrosion Failure Mechanism Table Time-Dependent Dielectric Breakdown (TDDB) Failure Mechanism

13 Table More Physics of Failure Table Microcircuit Die Evaluation Requirements Table Semiconductor Die Evaluation Requirements Table Element Evaluation Requirements for Passive Parts Table Percent Screening Requirements Table Resistor Types Table Maximum Continuous DC Working Voltages Table Group A Tests for Rlr Style Fixed Film Resistors Table Modifications to Group A Tests for Variable, Non-Wirewound Resistors Table MIL-STD-199 Rated Voltages Table Group A Tests for Variable, Wirewound Resistors Table Resistance Tolerance and Required Derating Table Group A Tests for Fixed, Wirewound, Accurate Resistors Table Group A Tests for Wirewound (Power Type) Resistors Table Group A Tests for Wirewound, Power-Type, Chassis-Mounted Resistors Table Manufacturer s Element Power, Network Power, and Voltage Ratings Table Percent Group A Tests for Fixed-Film Resistor Networks Table Group A Tests for Thermistors Table Modifications to Group B Tests for Thermistors Table Switch Types Table Percent Screening Requirements Table Percent Screening Requirements for Thermal Switches Table Percent Screening Requirements for Pressure Switches Table Lot Conformance Tests for Pressure Switches Table Derating Factors for Transistors Table Derating Factors for MMICS Table Derating Factors for IMPATTS Table Quality Assurance

14 Table Wafer Fabrication Table Assembly Table Screening Table Failure Mechanisms for Active RF Devices Table Required Electrical Parameters Table Registered (Reliability Suspect) PMP Table Electrical Test Criteria for Radio Frequency and Microwave Transistors Table Derating Factors for Transistors Table Derating Factors for Diodes Table General Derating Criteria Table Screening Plan for Packaged Devices Table A. Conformance Inspection (CI) and Periodic Inspection (PI) for Packaged Laser Devices Table B. Conformance Inspection (CI) and Periodic Inspection (PI) FOR Packaged Laser Devices Table C. Special Requirements for Fiber Pigtailed and Connectorized Packaged Devices Table A. Typical Electro/Optical Characterization Tests for Laser Diodes. ** Table B. Typical Electro/Optical Characterization Tests for Laser Modules. * Table VC. Typical Electro/Optical Characterization Tests for Leds. ** Table D. Typical Electro/Optical Characterization Tests for Photodiodes. ** Table MTBF Calculation Example Table A.7-1. Verification Method Table A.7-2. RHA Levels Table B-1A. MIL-PRF Class B/QML Q Microcircuit Upscreening (Test 100 percent), Test Methods of MIL-STD Table B-1B. MIL-PRF Class B/QML Q Microcircuit Lot Acceptance Testing, (Sample as Specified), Test Methods of MIL-STD Table B-1C. MIL-PRF Class B/QML Q Microcircuit Destructive Physical Analysis (DPA)

15 Table B-2A. MIL-PRF Class H Hybrid Upscreening (Test 100 percent ), Test Methods of MIL-STD Table B-2B. MIL-PRF Class H Hybrid Lot Acceptance Testing, (Sample as Specified), Test Methods of MIL-STD Table B-2C. MIL-PRF Class H Hybrid Destructive Physical Analysis (DPA) Table B-3A. MIL-PRF JANTXV Transistor and Diode Upscreening (Test 100 Percent), Test Methods of MIL-STD Table B-3B MIL-PRF JANTXV Transistor and Diode Lot Acceptance Testing, (Sample As Specified), Test Methods of MIL-STD Table B-3C. MIL-PRF JANTXV Transistor and Diode Destructive Physical Analysis (DPA) Table C-1. Reduced Group B Sample Size Table C-2. Reduced Group D Sample Size 1/

16 Foreword The requirements of this document were developed for the successful operations of long mission life and/or high reliability space equipment. Attention to every detail is required at every level of assembly throughout development, manufacture, qualification, and testing, starting with the parts, materials, and processes used. Launch vehicle program requirements for PMP are detailed in SMC-S- 011 Revision B - Parts, Materials and Processes Control Program for Expendable Launch Vehicles, while experimental/demonstration programs may choose to tailor this document to better align with the programs' objectives and missions. This document supersedes Aerospace Technical Operating Report TOR-2006(8583)-5236 Revision A, titled Technical Requirements for Electronics Parts, Materials, and Processes Used in Space and Launch Vehicles, and shall be used for all space program PMP procurements. The objective of this document is to specify the technical baseline in the selection, application, procurement, control and standardization of parts (electrical and mechanical), materials, and processes for space programs. This TOR is intended to be used in conjunction with TOR-2006(8583) (Parts, Materials, and Processes Control Program for Space) in order to achieve a high reliability space vehicle. Every effort was made to utilize standard document format, but this document retains the separately called out technical sections (starting with Section 100) to focus the user industry on the unique space quality items that are paramount for mission success in each technical section. The Referenced Documents Section includes active, inactive, or canceled specifications and standards. When no superseding document is called out, or the superseding document is believed not to include the necessary requirements, then the inactive or canceled specification is listed with the last known revision letter and annotated as either inactive or canceled. When the Acquisition Activity agrees to the use of superseding documents not specifically called out in Section 2, the prime contractor shall be responsible for the continued support to industry organizations responsible for publishing and maintaining the documents, and for active participation in the review and coordination of changes, that occur after contract award, to ensure continued compliance to the original intents of the referenced inactive/canceled documents. NOTE: Aerospace TOR-2006(8583)-5235 Rev B [PMP Control Plan] is also published as SMC-S-009 (2013).

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18 1. Scope 1.1 Purpose. This document establishes the minimum technical requirements for electronic parts, materials, and processes (electronic PMP) used in the design, development, and fabrication of space vehicles. Application information, design and construction information, and quality assurance provisions are provided herein. All electronic PMP selected for use in space vehicles shall meet the requirements specified herein, unless otherwise approved by the program. Either the contractor or its subcontractors may accomplish these requirements. However, the prime contractor has the responsibility for ensuring all requirements are met. 1.2 Baseline Performance. This document establishes the baseline performance requirements for electronic PMP and the quality and reliability assurance requirements, which shall be met for their acquisition. Detailed requirements, specific characteristics of electronic PMP, and other provisions which are sensitive to the particular intended use shall be specified within the device specification. 1.3 Quality. Quality assurance requirements outlined herein are for all electronic PMP built or performed on a manufacturing line that is controlled through a manufacturer's Quality Management (QM). Several levels of product assurance including Radiation Hardness Assurance (RHA) are provided for in this specification. 1.4 Order of Precedence. In the event of conflict between the text of this document and the references cited herein (except for device specifications), the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1.5 Application of the Document. This document is intended for use in acquisition of space vehicles. This document should be cited in the contract statement of work and may be tailored by the acquisition activity for the specific application or program. 1.6 PMP Management. Implementation and changes, or modifications to the requirements of this document shall be accomplished in accordance with TOR-2006(8583)-5235 (Parts, Materials, and Processes Control Program for Space Vehicles), the provisions and authority of the PMP Management, and the requirements of the program. 1

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20 2. Reference Documents 2.1 Reference Documents Government Documents.Unless otherwise specified, the following specifications, standards, and handbooks of the issue listed in the current version of the Department of Defense Index of Specifications and Standards (DoDISS) specified in the solicitation form a part of this document to the extent specified herein Military Specifications MIL-W-22759E(2) MIL-DTL-17 MIL-PRF-27 MIL-C-50D MIL-PRF-123 MIL-PRF-3098 MIL-DTL-5015 MIL-H-6088G(1) MIL-PRF-6106 MIL-H-6875H MIL-C-7438 MIL-S-7742D(1) MIL-B-7883B MIL-PRF-8805 MIL-W-8939A MIL-T-9047G(1) MIL-DTL-9395 MIL-PRF MIL-PRF MIL-PRF MIL- A-21180D(1) MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-DTL Wire, Electric, Fluoropolymer-Insulated, Copper or Copper Alloy (CANCELED) Cables, Radio Frequency, Flexible and Semirigid, General Specification for Transformers and Inductors (Audio, Power, and High Power Pulse), General Specification for Copper Alloy Number 260 (Cartridge Brass, 70 Percent); Sheet, Strip, Plate, Bar, and Discs (CANCELED) Capacitors, Fixed, Ceramic Dielectric, (Temperature Stable and General Purpose), High Reliability, General Specification for Crystal Units, Quartz, General Specification For Connector, Electrical, Circular Threaded, AN Type, General Specification for Heat Treatment of Aluminum Alloys (CANCELED) Relays, Electromagnetic, General Specification for Heat Treatment of Steels, Process for (CANCELED) Core Material, Aluminum, For Sandwich Construction Screw Threads, Standard, Optimum Selected Series, General Specification for (INACTIVE) Brazing of Steels, Copper, Copper Alloys, Nickel Alloys, Aluminum and Aluminum Alloys (CANCELED) Switches and Switch Assemblies, Sensitive and Push (Snap Action), Basic, Limit, Push Button and Toggle Switches, General Specification for Welding, Resistance, Electronic Circuit Modules (CANCELED) Titanium and Titanium Alloy Bars (Rolled or Forged) and Reforging, Forging Stock Aircraft Quality (CANCELED) Switches, Pressure, (Absolute, Gage and Differential), General Specification for Coil, Fixed and Variable, Radio Frequency, General Specification for Semiconductor Devices, General Specification for Transformer, Pulse, Low Power, General Specification for Aluminum-Alloy Castings, High Strength (CANCELED) Capacitors, Fixed, Glass Dielectric, Established Reliability, General Specification for Fuse Cartridge, Instrument Type, General Specification for Resistors Thermal (Thermistor), Insulated, General Specification for Switches, Thermostatic, (Metallic And Bimetallic), General Specification for Connector, Electrical, Rectangular, Non-environmental Miniature Polarized Shell, Rack and Panel, General Specification for 3

21 MIL-DTL-26074F MIL-DTL MIL-DTL-27500H(1) NOT 1 MIL-C MIL-PRF MIL-PRF MIL-PRF MIL-DTL MIL-PRF MIL-PRF MIL-PRF MIL-DTL MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-R MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-DTL MIL-I-46058C(7) MIL-S Coatings, Electroless Nickel Requirements for (CANCELED) Connectors, Electrical, (Circular, Miniature, Quick Disconnect, Environment Resisting, Receptacles and Plugs, General Specification for Cable, Power, Electrical and Cable Special Purpose, Electrical Shielded and Unshielded, General Specification For (CANCELED) Connectors, Electrical, Modular, and Component Parts General Specification for Filters and Capacitors, Radio Frequency/Electromagnetic Interference Suppression, General Specification for Connectors, Electrical, Plugs and Receptacles, Coaxial, Radio Frequency, High Reliability, for Flexible and Semirigid Cables, General Specification for Printed Circuit Board/ Printed Wiring Board, General Specification for Connectors, Electrical, Rectangular, Nanominiature, Single Row, Plug, Polarized Shell, Pin Contacts, Crimp Type, General Specification for Resistors, Chip, Fixed, Film, Zero Ohm, Industrial, High Reliability, Space Level, General Specification for Hybrid Microcircuits, General Specification for Integrated Circuits (Microcircuits) Manufacturing, General Specification for Connector, Electrical, Circular, Miniature, High Density, Quick Disconnect (Bayonet, Threaded, and Breach Coupling), Environment Resistant, Removable Crimp and Hermetic Solder Contacts, General Specification for Capacitors, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for Resistor, Fixed, Wirewound, (Accurate), Non-established and Established Reliability, General Specification for Capacitors, Fixed, Electrolytic (Nonsolid Electrolyte), Tantalum, Established Reliability, General Specification for Resistor, Fixed, Wirewound (Power Type), Non-established Reliability, Established Reliability and Space Level, General Specification for Resistor, Fixed, Composition (Insulated), Established Reliability, General Specification for Resistor, Fixed, Wirewound (Power Type, Chassis Mounted), Non-established Reliability, Established Reliability, General Specification for Coil, Fixed, Radio Frequency, Molded, Established Reliability and Non-established Reliability, General Specification for Connectors, Coaxial, Radio Frequency, General Specification for Resistors, Variable, Wirewound (Lead Screw Actuated), Non-established Reliability and Established Reliability, General Specification for Relays, Electromagnetic, Established Reliability, General Specification for Resistor, Fixed Film, (Insulated) Non-established Reliability and Established Reliability, General Specification for Resistor, Variable, Non-wirewound (Adjustment Type), Non-established and Established Reliability, General Specification for Resistors, Chip, Thermal (Thermistor), General Specification for Gold Plating, Electrodeposited Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) (INACTIVE) Adhesive-Sealants, Silicone, RTV, One-Component 4

22 MIL-A MIL-PRF MIL-PRF MIL-C-49468(1) MIL-PRF MIL-P-50884D(2) MIL-PRF-55110G MIL-PRF MIL-DTL MIL-PRF MIL-PRF MIL-PRF MIL-PRF MIL-T-55631(2) MIL-DTL MIL-T MIL-PRF MIL-P-81728A MIL-F-83142A(4) MIL-PRF Adhesive Sealants, Silicone, RTV, Non-corrosive (For Use With Sensitive Metals and Equipment) Connector, Triaxial, Radio Frequency General Specification for Capacitors, Fixed, Ceramic, Multilayer, High Voltage, (General Purpose), Established Reliability, General Specification for Crystal Units, Quartz, Precision, General Specification for (CANCELED) Capacitor, Fixed, Ceramic Dielectric, Switch Mode Power Supply (General Purpose and Temperature Stable), Standard Reliability and High Reliability, General Specification for Printed Wiring, Flexible, or Rigid-Flex, General Specification for (INACTIVE) Printed Wiring Boards, General Specification for (INACTIVE) Resistors, Fixed, Film, Non-Established Reliability, Established Reliability, and Space Level, General Specification for Connector, Printed Circuit Subassembly and Accessories Oscillator, Crystal Controlled, General Specification For Adapters, Connectors, Coaxial, Radio Frequency, (Between Series and within Series), General Specification for Resistor, Chip, Fixed, Film, Established Reliability, General Specification for Capacitor, Electrolytic Fixed Tantalum, Established Reliability and Non-established Reliability, General Specification for Transformer, Intermediate Frequency, Radio Frequency, and Discriminator, General specification for (INACTIVE) Wire, Electric, Polyimide-Insulated, Copper or Copper Alloy Titanium and Titanium Alloys, Extruded Bars, and Shapes Aircraft Quality Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable Plating, Tin-Lead, Electrodeposited (CANCELED) Forging, Titanium Alloys, For Aircraft and Aerospace Applications (INACTIVE) Resistor Networks, Fixed, Film and Capacitor-Resistor Networks, Ceramic Capacitor and Fixed, Film, Resistors, General Specification for MIL-PRF MIL-PRF MIL-DTL MIL-PRF MIL-A-83577B MIL-DTL MIL-PRF Capacitors, Fixed, Metallized, Plastic Film Dielectric, (DC, AC, or DC and AC), Hermetically Sealed in Metal Cases, or Ceramics Cases, Established Reliability, General Specification for Coils, Radio Frequency, Chip, Fixed or Variable, General Specification for Connectors, Electrical, Rectangular, Microminiature, Polarized Shell, General Specification for Relays, Electromagnetic, Established Reliability, 25 Amperes and Below, General Specification for Assemblies, Moving Mechanical, for Space and Launch Vehicles, General Specification for (CANCELED) Connector, Electrical, (Circular, Environment Resisting), Receptacle and Plugs, General Specification for Relays, Hybrid and Solid-state, Time Delay, General Specification for 5

23 MIL-DTL MIL-PRF-87164A(3) MIL-PRF-87217A Connector, Electrical, Miniature, Rectangular Type, Rack to Panel, Environment Resisting, 200 C Total Continuous Operating Temperature, General Specification for Capacitors, Fixed, Mica Dielectric, High Reliability, General Specification for (CANCELED) Capacitors, Fixed, Supermetallized Plastic Film Dielectric, Direct Current for Low Energy, High Impedance Applications, Hermetically Sealed in Metal Cases, High Reliability, General Specification for (CANCELED) Federal Standards FED-STD-101C FED-STD-209E A-A QQ-P-35C QQ-N-290A QQ-B-613D Test Procedures for Packaging Materials (CANCELED) Airborne Particulate Cleanliness Classes in Clean Rooms and Clean Zones (CANCELED) Terminals, Feedthru (Insulated) and Terminals, Stud (insulated and Non-insulated) Passivation Treatments For Corrosion-Resistant Steel (CANCELED) Nickel Plating, Electrodeposited (CANCELED) Brass, Leaded And Nonleaded: Flat Products (Plate, Bar, Sheet, And Strip) (CANCELED) Military Standards MIL-HDBK-5J Metallic Materials and Elements for Aerospace Vehicle Structures (CANCELED) MIL-HDBK-17 Composite Materials Handbook (Volumes 1 through 5) MIL-HDBK-23A(3) MIL-STD-130 MIL-HDBK-198 MIL-STD-199E MIL-STD-202 MIL-HDBK-217 MIL-HDBK-263 MIL-HDBK-339 MIL-STD-403C MIL-HDBK-454 MIL-STD-750 Structural Sandwich Composites (CANCELED) Identification Marking of U.S. Military Property Capacitor, Selection and Use of Resistors, Selection and Use of (CANCELED) Test Method Standard, Electronic and Electrical Component Parts Reliability Prediction of Electronic Equipment Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies, and Equipment (Excluding Electrically Initiated Explosive Devices) Custom Large Scale Integrated Circuit Development and Acquisition for Space Vehicles Preparation for and Installation of Rivets and Screws, Rocket and Missile Structures (INACTIVE) General Guidelines for Electronic Equipment Test Method Standard for Semiconductor Devices 6

24 MIL-HDBK-814 MIL-HDBK-815 MIL-STD-866 MIL-STD-883 MIL-STD-889 MIL-STD-975M MIL-STD-981 MIL-STD-1276 MIL-HDBK-1331 MIL-STD-1346C MIL-STD-1353B(4) MIL-STD-1580 MIL-STD-1686 MIL-STD-1835 MIL-STD-2154(1) MIL-STD-2175A MIL-STD-2219 MIL-STD-3010 MIL-HDBK MIL-HDBK Ionizing Dose and Neutron Hardness Assurance Guidelines for Microcircuits and Semiconductor Devices Dose Rate Hardness Assurance Guidelines Grinding of Chrome Plated Steel and Steel Parts Heat Treated to 180,000 psi or Over Test Methods and Procedures for Microelectronics Dissimilar Metals NASA Standard Electrical, Electronic, and Electromechanical (EEE) Parts List (CANCELED) Design, Manufacturing, and Quality Standards for Custom Electromagnetic Devices for Space Applications Leads for Electronic Component Parts Parameters To Be Controlled for the Specification of Microcircuits, Handbook for Relays, Selection and Application of (CANCELED) Electrical Connectors Plug-in Sockets and Associated Hardware, Selection and Use of (CANCELED) Department of Defense Test Methods Standard, Destructive Physical Analysis for Electrical, Electronic, and Electromagnetic Parts Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) Electronic Component Case Outlines Inspection, Ultrasonic, Wrought Metals, Process for (CANCELED) Castings, Classification and Inspection of (CANCELED) Fusion Welding for Aerospace Applications Test Procedures for Packaging Materials Adhesive Bonding (Structural) for Aerospace and Other Systems, Requirements For General Handbook for Space Vehicle Wiring Harness Design and Testing Air Force Wright Aeronautical Laboratories (AFWAL) ADD436124L ADD436125L DOD/NASA Structural Composites Fabrication Guide Volume I DOD/NASA Structural Composites Fabrication Guide Volume II DOD/NASA Advanced Composite Design Guide, Volumes I IV 7

25 NASA Publications GSFC S-311-P-4 Connectors (and Contacts), Electrical, Rectangular, for Space Flight Use, General Specification for GSFC S-311-P-822 Connectors, PWB, 2 mm cpci TM Style, High Reliability, General Requirements for MSFC 40M38277 MSFC 40M38298 MSFC 40M39569 JSC-SP-R-0022A MSFC-SPEC-250 MSFC-STD-355 MSFC-SPEC-469 MSFC-SPEC-522 MSFC-STD-3029 NASA-SP-8063 NASA-STD NASA-STD NASA-STD NASA-STD NASA TM X SSQ Marshall Space Flight Connectors Marshall Space Flight Connectors Marshall Space Flight Connectors and Hardware General Specifications, Vacuum Stability Requirements of Polymeric Materials for Spacecraft Applications Protective Finishes for Space Flight Vehicle Structures and Associate Flight Equipment, General Specification for Radiographic Inspection of Electronic Parts Titanium and Titanium Alloys, Heat Treatment of Design Criteria for Controlling Stress Corrosion Cracking Guidelines for the Selection of Metallic Materials for Stress Corrosion Cracking Resistance in Sodium Chloride Environments Lubrication, Friction, and Wear Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies (CANCELED) Workmanship Standard for Surface Mount Technology (CANCELED) Soldered Electrical Connections Crimping, Interconnecting Cables, Harnesses, and Wiring Guidelines for the Selection and Application of Tantalum Electrolytic Capacitors In Highly Reliable Equipment Connectors And Accessories, Electrical, Circular, Miniature, IVA/EVA Compatible, Space Quality, General Specification for (Application for copies should be addressed to: Marshall Space Flight Center/ Document Repository (AS24D), Huntsville, AL 35812) NASA Documents can be obtained via Copies of specifications, standards, handbooks, drawings, and publications required by contractors in connection with specified acquisition functions should be obtained from the contracting activity or as directed by the contracting officer. 8

26 DLA/Land and Maritime (DSCC) DSCC Connector, Electrical, Coaxial, Radio Frequency, Shroud 2 Hole Pin and Adapter, Electrical, Coaxial, RF, Socket Contact, Series SMP to SMP DSCC Connector, Electrical, Coaxial, Radio Frequency, Socket Contact Series SMP for.047 and.086 Semirigid Cable DLA/Land and Maritime (DSCC) documents can be obtained at: or Non-Government Documents. The following documents form a part of this document to the extent specified herein. Unless otherwise indicated, the issue in effect on the date of release of this document shall serve as the applicable revision for all listed non-government specifications/standards Aerospace TOR TOR-2006(8583)-5235 Parts, Materials, and Processes Control Program for Space Vehicles (Application for copies should be addressed to: The Aerospace Corporation, Library, Circulation Desk, P.O. Box 92957, M1-199, Los Angeles, CA ) American Society for Testing Material ASTM-B-211 ASTM-B-221 ASTM-B-322 ASTM-B-488 ASTM-B-571 ASTM-B-733 ASTM-D-257 ASTM-D ASTM-D-1000 ASTM-E-595 Aluminum and Aluminum-Alloy Bar, Rod, and Wire Aluminum And Aluminum-Alloy Extruded Bars, Rods, Wire, Profiles, And Tubes Metals cleaning, prior to electroplating Gold for Engineering Uses, Electrodeposited Coatings of Coating, Metallic, Qualitative Adhesion Testing of Metal, Autocatalytic Electroless Nickel-Phosphorus Coatings On Resistance DC or Conductance of Insulating Materials Adhesive Bonds, Peel or Stripping Strength of Tapes Pressure-Sensitive Adhesive-Coated Used For Electrical And Electronic Applications Standard Test Method for Total Mass Loss and Collected Volatile Condensable Material From Outgassing in a Vacuum Environment (Application for copies should be addressed to: American Society for Testing Materials, 1916 Race Street, Philadelphia, PA 19111, 9

27 Electronics Industries Association EIA-455 EIA-477 EIA-557 Fiber Optic Fibers, Cables, Transducers, Sensors, Connecting and Terminating Devices, and Other Fiber Optic Components Cultured Quartz Statistical Process Control Systems (Application for copies should be addressed to: Electronic Industries Association, 2001 Pennsylvania Ave, N.W., Washington, D.C International Electrotechnical Commission CEI/IEC CEI/IEC Ed. 3 Third edition Sampling Plans And Procedures For Inspection By Attributes International Electrotechnical Commission: Synthetic Quartz Crystal Specification And Guide To The Use (Application for copies should be addressed to: American National Standards Industries, 1430 Broadway, New York, NY IPC Association Connecting Electronic Industries IPC-SM-840 IPC-CC-830 IPC-TM-650 IPC-CF-152 J-STD-033 J-STD-020 J-STD-006 J-STD-002 J-STD-001ES IPC 2221 IPC 2222 IPC 2223 IPC 2252 Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards Qualification and Performance of Electrical Insulation Compound for Printed Wiring Assemblies Test Methods Manual Composite Metallic Material Specification for Printed Wiring Boards Handling, Packaging, Shipping and Use of Moisture/Reflow Sensitive Surface Mounted Devices Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Solderability Tests for Component Leads, Terminations, Lugs Terminals and Wires Requirements for Soldered Electrical and Electronic Assemblies Generic Standard for Printed Board Design Sectional Design Standard for Rigid Organic Printed Boards Sectional Design Standard for Flexible Printed Boards Design Guide for RF/Microwave Circuit Boards 10

28 IPC 4101 IPC 4103 IPC 4202 IPC 4203 IPC 4204 IPC 6012 IPC 6013 IPC 6018 Specification for Base Materials for Rigid and Multilayer Printed Boards Specification for Base Materials for High Speed/ Frequency Applications Flexible Base Dielectric for Use in Flexible Printed Circuitry Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Bonding Films Flexible Metal Clad Dielectric for Use in Fabrication of Flexible Printed Circuitry Qualification and Performance Specification for Rigid Printed Boards Qualification and Performance Specification for Flexible Printed Boards Microwave End Product Board Inspection and Test (Application for copies should be addressed to: IPC 3000 Lakeside Drive, 309 S. Bannockburn, IL 60015) National Aerospace Standards NASM 1312 NASM 1515 Fastener, Test Methods Fastener Systems for Aerospace Applications Society of Automotive Engineers SAE-AMS-QQ-P-35 SAE-AMS-QQ-N-290 SAE-AMS-QQ-A-367 SAE-AMS-STD-1595 SAE-AS-1933 SAE-AMS-2404 SAE-AMS-2418 SAE-ARP-5316 SAE-AMS-F-7190 SAE-AS-8879 SAE-AMS-T-9046 Passivation Treatments For Corrosion-Resistant Steel Nickel Plating, Electrodeposited Aluminum Alloy Forgings Qualification of Aircraft, Missile and Aerospace Fusion Welders Hose Containing Age-Sensitive Elastomeric Material, Age Controls for Nickel, Electroless, Plating Copper Plating Seals Assemblies Which Include An Elastomer Element Prior To Hardware Assembly, Storage of Elastomer Seals and Forging, Steel, for Aircraft/Aerospace Equipment and Special Ordnance Applications Screw Threads, UNJ Profile inch controlled Radius Root With Increased Minor Diameter, General Specification for Titanium and Titanium Alloy, Sheet, Strip and Plate 11

29 SAE-AMS-S SAE-AMS-A SAE-AMS-C SAE-AS SAE-AMS-H SAE-AS SAE-AMS-P SAE-AS Shot Peening of Metal Parts Aluminum. Alloy Forgings, Heat Treated Coatings, Electroless Nickel, Requirements for Contacts, Electrical Connector, General Specification For Heat Treatment of Titanium and Titanium Alloys Connectors, Electric, Circular, Miniature, Rack and Panel or Push-Pull Coupling, Environment Resisting Plating, Tin-Lead, Electrodeposited Connector Accessories, Electrical, General Specification For ASME/ANSI/IEEE ANSI/IEEE ASME/ANSI B M ANSI/EOS/ESD S AWS-C3.4 AWS-C3.5 AWS-C3.6 AWS-C3.7 IEEE Standard on Piezoelectricity Inspection and Quality Assurance for General Purpose Fasteners Surface Resistance Measurements of Static Dissipative Planar Materials Torch Brazing Induction Brazing Furnace Brazing Aluminum Brazing 12

30 3. Definitions The following definitions describe terms used throughout this document. Acquisition Activity Case Temperature Contracting Officer COTS Parts and Materials Derating Destructive Physical Analysis (DPA) Defect Electronic Parts End-of-Life Design Limit Hot-Welded Can Inspection Lot Kirkendall Voids The acquisition activity is the Government office or contractor procuring the equipment, system, or subsystem for which this document is being contractually applied. The case temperature is the hottest temperature on the external surface of the device s package, and for Surface Mount Devices (SMD), the external surface is the case. A contracting officer is a person with the authority to enter into, administer, or terminate contracts and make related determinations and findings. The term includes authorized representatives of the contracting officer acting within the limits of their authority as delegated by the contracting officer. Commercial-Off-The-Shelf (COTS) parts and materials are those that (a) have been developed and produced to commercial designs and specifications, (b) are readily available from a manufacturer as a catalog item and without additional testing, (c) are typically intended for consumer electronics, and (d) are controlled solely by the supplier of the item. Derating of a part is the intentional reduction of its applied stress, with respect to its rated stress, for the purpose of providing a margin between the applied stress and the demonstrated limit of the part s capabilities. Maintaining this derating margin reduces the occurrence of stress-related failures and helps ensure the part s reliability. A Destructive Physical Analysis (DPA) is a systematic, logical, detailed examination of parts during various stages of disassembly, conducted on a sample of completed parts from a given lot, wherein parts are examined for a wide variety of design, workmanship, and processing problems that may not show up during normal screening tests. The purpose of these analyses is to maintain configuration control and determine those lots of parts, delivered by a vendor, which have anomalies or defects such that they could, at some later date, cause degradation or catastrophic failure of a system. A defect is any nonconformance from specified requirements which affects form, fit, function, or the long-term life/reliability performance of the part or material. The term electronic is used in a broad sense in this document and includes electrical, electromagnetic, electromechanical, and electro-optical (EEEE) devices. Connectors are also classified as electronic parts. The end-of-life design limits for an item are the expected variations in its electrical parameters over its period of use in its design environment. The parameter variations are expressed as a percentage change beyond the specified minimum and maximum values. A Hot-Welded Can is a cap sealed component utilizing thermocompression attachment of the cap to the base of the device. The bond is a brazed attachment of the nickelplated cap to the nickel-plated base, with nickel acting as a brazing agent. Unless otherwise specified in the applicable detailed military specification, an inspection lot is defined as a group of parts of the same design, the same part number, manufactured on the same product line using the same materials, processes and equipment, of the same date code submitted for inspection at one time. Intermetallic growth results from the diffusion of one material into another via crystal vacancies made available by defects, contamination, impurities, grain boundaries and mechanical stress. Diffusion rates vary with different materials. For example, the diffusion rate of Au into Al is different than that for Al into Au. These rates are a function of temperature. If one material overwhelms the other in volume, and diffusion occurs rapidly enough, the minority material can appear to have been completely "consumed" by the majority material. Rapid diffusion of one material into another can cause crystal vacancies to form in the bulk material. These vacancies attract each other which results in the creation of voids. These voids are called Kirkendall voids. Excessive Kirkendall voids can result in out-of-tolerance wire bond resistance and weakened wire bonds. 13