Material Composition Information:

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1 Product Information Date/Time Revision Manufacturing site Product Number: Product Name: T1700 Malaysia HFBR-59xxxxx; QFBR-59xxL Multi-Mode LC SFF Product Mass to gram (min, max) Product Note: Material Composition Information: Sub part ref This product (weight and materials) information applies to Multi-Mode LC SFF. RoHS compliant versions carry suffix 'Z'; Terminal Finish e3; MSL1; Qual JEDEC020C, Max Temp 260 o C Sub-part Name Material Material Trade Name Material SPA Cover Cartridge Brass tin reflow, Tin reflow C2600R-H, Tin Reflow Plating Material product(%) Avago Technologies Product Stewardship Page 1 Format rev August product(%) % 40.62% SPB Nose Metal Zinc Alloy % 13.59% SPC Port plug Silicone Rubber Silicone rubber % 13.36% SPD Nose shield Metal SUS 304 1/2 H % 8.75% SPE Internal shield SPTE JIS G % 7.74% SPF PCB Epoxy Resin, Chemical, Metal FR4, Ink, Copper, Gold % 6.45% SPG Port POLYETHERIMIDE % 3.32% SPH RX / TX headers Alloy, Kovar, Glass, Ni, Au Alloy 42, NiCo2918, KS 51, Electroless Ni, Au % 3.11% SPI Encapsulant, Adhesive Chemical na % 1.18% SPJ Solder Metal solder % 1.00% SPK Flat window can Kovar, Glass, Ni-P NiCO2918, SCHOTT 8250, Electroless Ni % 0.72% SPL Active device NonMetal NonPolymer Electronic crystal % 0.50% SPM Lens plastics Ultem % 0.45% SPN Passive device Ceramic, Metal Alumina, Ag Thick film, RuO2 Thick film, Epoxy resin, Nickel, Tin & Lead Sub part SPA Sub-part Name & Substance Sub-part Substance CAS# Substance Note Substance Cover % 0.34% Substance Subpart(%) Subpart(%) SPA1 Copper na % 71.49% SPA2 Zinc na % 31.10% SPA3 Iron na % 0.05% SPA4 Lead na % 0.05% SPA5 Tin na % 0.02% SPA6 Copper flash NA na % 0.01%

2 SPB Nose SPB1 Zn na % 93.60% SPB2 Al na % 4.10% SPB3 Cu na % 2.85% SPB4 Ni na % 1.00% SPC Port plug SPC1 Octamethylcyclotetrasiloxane na % % SPD Nose shield SPD1 Iron NA % 72.73% SPD2 Chromium NA % 20.00% SPD3 Nickel NA % 10.50% SPD4 Manganese NA % 2.00% SPD5 Silicon NA % 1.00% SPD6 Carbon NA % 0.08% SPD7 Phosphorus NA % 0.05% SPD8 Sulfur NA % 0.03% SPE Internal shield SPE1 Iron NA % 99.69% SPE2 Manganese NA % 0.24% SPE3 Carbon NA % 0.05% SPE4 Phosphorus NA % 0.01% SPE5 Sulfur NA % 0.01% SPF PCB SPF1 Copper na % 50.04% SPF2 Fibrous Glass Fabric na % 22.67% SPF3 Epoxy Resin na % 19.27% SPF4 Inert Filler NA na % 8.45% SPF5 Gold na % 1.04% SPF6 Glycol Ether Solvent na % 0.88% SPF7 Modified Epoxy Resin na % 0.79% SPF8 Pigment na % 0.63% SPF9 Respirable Fibrous Glass na % 0.57% SPF10 Zinc na % 0.18% SPF11 Aromatic solvent na % 0.18% SPF12 Photo initiator na % 0.17% SPF13 N,N-Dimethylformamide na % 0.06% SPF14 Additive NA na % 0.05% SPF15 Arsenic na % 0.04% SPF16 Cu I/O pins % 1.03% SPF17 Sn I/O pins % 0.08% SPF18 P I/O pins % 0.00% SPF19 OTHERS Proprietary I/O pins % 0.01% SPF20 Ni I/O pins % 0.01% SPF21 a1 SN/PB p/n without suffix 'Z' % 0.02% Avago Technologies Product Stewardship Page 2 Format rev August 2006

3 SPF21 b1 SPG SN p/n with suffix 'Z' % 0.02% Port SPG1 Polyetherimide n.a % 85.00% SPG2 Glass n.a % 25.00% SPH RX / TX headers SPH1 Fe na % 53.21% SPH2 Ni na % 41.46% SPH3 Glass Proprietary Information na % 3.57% SPH4 Co na % 2.07% SPH5 Mn na % 0.91% SPH6 Si na % 0.29% SPH7 Au na % 0.26% SPH8 Ag Braze Material % 0.18% SPH9 P na % 0.16% SPH10 Cu Braze Material % 0.07% SPH11 C na % 0.05% SPH12 S na % 0.00% SPI Encapsulant, Adhesive SPI1 Silver na % 58.59% SPI2 Modified epoxy resin Registered na % 11.72% SPI3 Silica, Microcrystalline Propertary na % 8.44% SPI4 Propertary Propertary na % 8.30% SPI5 SPI6 Ethanol, 2-(2-ethoxyehoxy)-, acetate p-(2,3-epoxypropoxy)-n,nbis(2,3-epoxypropyl)aniline na % 5.47% na % 5.47% SPI7 Bisphenol A type epoxy resin na % 3.91% SPI8 SPI9 SPI10 Dimethyl siloxane monotrimethoxysiloxy-terminated Dimethyl siloxane, trimethoxysilyloxy-terminated Bisphenol A Epoxy Diacrylate na % 3.13% na % 3.13% Propertary na % 2.81% SPI11 Silica na % 1.56% SPI12 Hydroxyethylmethacrylate Propertary na % 1.41% SPI13 Trimethylated silica na % 1.17% SPI14 Dicyanodiamide na % 0.78% SPI15 Polydimethylsiloxane na % 0.78% SPI16 Diisopropoxy di(ethoxyacetoacetyl) titanate na % 0.39% SPI17 Methyltrimethoxysilane na % 0.39% Avago Technologies Product Stewardship Page 3 Format rev August 2006

4 SPJ Solder SPJa1 Tin p/n without suffix 'Z' % 70.00% SPJa2 Lead p/n without suffix 'Z' % 40.00% SPJb1 Tin p/n with suffix 'Z' % 95.80% SPJb2 Copper p/n with suffix 'Z' % 3.50% SPJb3 Silver p/n with suffix 'Z' % 0.70% SPK Flat window can SPK1 Fe na % 50.13% SPK2 Ni na % 33.00% SPK3 Co na % 17.64% SPK4 Glass Proprietary Information na % 3.00% SPK5 Mn na % 0.49% SPK6 P na % 0.40% SPK7 Si na % 0.29% SPK8 C na % 0.05% SPL Active device SPL1 Ga n.a % 99.00% SPL2 As n.a % 1.00% SPL3 Al n.a % 1.00% SPL4 Ag, Au , die attach, wirebond % 1.00% SPM Lens SPM1 Polyetherimide N.A % % SPN Passive device SPN1 BaTiO3 na N/A % 53.30% SPN2 Al2O N/A % 24.50% SPN3 Cu N/A % 10.54% SPN4 Ni N/A % 5.11% SPN5 CERAMIC Proprietary N/A % 2.42% SPN6 Ag N/A % 1.21% SPN7 SiO N/A % 0.95% SPN8 Epoxy Resin na N/A % 0.28% SPN9 PbO N/A % 0.26% SPN10 MgO N/A % 0.20% SPN11 Au N/A % 0.10% SPN12 B2O N/A % 0.10% SPN13 RuO N/A % 0.08% SPN14 Others na proprietary % 0.06% SPN15 Pd N/A % 0.02% SPN16 TiW N/A N/A % 0.00% SPN17 V N/A % 0.00% a1 a2 b1 Sn p/n without suffix 'Z' % 3.85% Pb p/n without suffix 'Z' % 2.62% Sn p/n with suffix 'Z' % 6.47% Avago Technologies Product Stewardship Page 4 Format rev August 2006

5 Note Percentages are calculated from mass data declared. Material Trade names are not applicalble to some common materials of constant composition. When CAS is unavailable is assigned. Absence of Hazardous Substances Our material composition policy is to declare all substances intentionally added in our products. Additionally we confirm the following regulated substances known to be in electronics are not intentionally added or knowingly present in our semiconductor products: Asbestos, Azo Colorants, Cadmium and its compounds, Hexavalent Chromium and its compounds, Mercury and its compounds, Ozone Depleting Substances (CFCs, HCFCs, HBFCs, carbon tetrachloride, etc.), Tributyl Tin Oxide (TBTO), Tributyl Tin (TBT) and Triphenyl Tin (TPT), Polychlorinate Biphenyls (PCBs), Polychlorinate Terphenyls (PCTs), Polychloronated Naphthalenes (more than 3 chlorine atoms), Short chain Chlorinated Paraffins (SCCPs), Polybrominated biphenyls (PBBs), Polybrominated diphenylethers (PBDEs) and Radio-active Substances Dopants Some of the commonly used dopant elements are toxic, but they are only required in very small amounts, well below the one part per billion [1ppb] level. None of our devices contain these toxic materials as "free elements". All such substances are combined during processing with other elements and become constituents of either the compoundsemiconductor materials, the semiconductor devices, or of the metal alloys that are used as contact materials. Product Life Cycle Information Our devices are often incorporated into printed circuit boards and then assembled with other parts into electronic systems. In the U.S.A., end-of-life printed circuit boards (waste), are considered scrap metal by the Environmental Protection Agency (EPA) when they are recycled (USEPA Mgt. memo, Regulatory Status of Printed Circuit Boards, August 26,1992). If any of our products are disposed of as part of a printed circuit board, the entire board assembly is treated as scrap metal. Approved printed circuit board recycling companies either have the proper facilities or have access to secondary metal smelters and refiners which can safely recycle scrap electronic components or assemblies. Lead-free RoHS Compliance Avago Technologies has a full range of lead-free products compliant with the RoHS directive. Certain product families are exempted from lead restrictions in the RoHS Directive - these products may contain compliant lead in accordance with the exemptions. Standard products do not contain any intentionally added RoHS substances above permitted maximum thresholds. Product families with no lead in the table of material composition are by definition both lead-free and compliant with RoHS lead restrictions. For product availability and compliance information, please contact Avago Technologies distributors or Avago Technologies Sales & Marketing via RoHS.Enquiry-SPG@avagotech.com. For product technical information (termination finish, temperature profile, product substance content etc.) please contact: Pbfree.SPG@avagotech.com The information presented in this document is believed accurate and reliable. Data is the most current available to Avago Technologies at the time of preparation and is issued as a matter of information only. No warranty as to accuracy or completeness is expressed or implied. The information in this document is subject to change without notice. Copyright Avago Technologies, Reproduction, adaptation, or translation without prior written permission is prohibited except as allowed under copyright laws. Avago Technologies Product Stewardship Page 5 Format rev August 2006