Environmental Management and Materials Information
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1 Environmental Management and Materials Information Product Content Information for: MAX3622CUE+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications Top Lead Free Qualified Yes REACH Yes: RoHS Qualified Yes Green Starting Date Code: Moisture Sensitivity Level L1 Flammability Meets UL 94 (V 0 Rating) Yes Assembler Qualified UTL Package Description Top Package Code U16+2 Package Type TSSOP * Package Description Thin Shrink Small Outline Package Package Option Standard Footprint Area (mm 2 ) 33.4 Body Size 4.4mm Pin Count 16 in Grams Chemical Composition Top Maxim NIA/NIU List (PDF, 24k) CAS Number Aluminum (Al) Antimony (Sb 2 O 3 ) BCB Resin 0 0 Bromine (Br)
2 Carbon (C) Carbon Black Ceramic (BaTiO 3 ) Chromium (Cr) Cobalt (Co) Copper (Cu) Gold (Au) Indium (In) Insulator (Polyimide) 0 0 Iron (Fe) FeO Lead (Pb) Magnesium (Mg) e Manganese (Mn) MnO Nickel (Ni) NiPdAu 0 0 Nickel V (NiV) 0 0 Palladium (Pd) Phosphorus (P) Silica (SiO 2 ) Silicon (Si) Silver (Ag) Solder Mask 0 0 Solder Paste 0 0 Spheron Polymer Passivation 0 0 Sulfur (S) Tin (Sn) Titanium (Ti) Titanium W (TiW) 0 0 Tungsten (W) Vanadium (V) Zinc (Zn) ZnO Zirconium (Zr) Detailed Package Component Data Top 2
3 Bond Wire Components Gold (Au) Aluminum (Al) Die Attach Epoxy Components Die Attach Material Ablebond 8200T Aromatic Amine 0 0 Copper (Cu) Diester 0 0 Epoxy 2e Functionalized Ester 0 0 Functionalized Urethane 0 0 Indium (In) Lactone 0 0 Lead (Pb) Polymeric 0 0 Polyoxypropylenediamine 0 0 Resin Silver Filler (Ag) Tin (Sn) Other 0 0 Lead Finish/Plating Components Lead Finish Plating Assembly Lead Finish Process 100% Tin Lead (Pb)
4 Tin (Sn) NiPdAu Gold (Au) Nickel (Ni) Lead Frame Components Lead Frame Material Copper C Aluminum (Al) 0 0 Carbon (C) 0 0 Chromium (Cr) ND 0 0 Cobalt (Co) 0 0 Copper (Cu) Gold (Au) 0 0 Iron (Fe) ND 0 0 Lead (Pb) 0 0 Magnesium (Mg) 4.2e Manganese (Mn) 0 0 Nickel (Ni) Palladium (Pd) 0 0 Phosphorus (P) 0 0 Silicon (Si) 0 0 Silver (Ag) Sulfur (S) 0 0 Tin (Sn) 0 0 Zinc (Zn) ND 0 0 Zirconium (Zr) Mold Compound Components Mold Material Resin Type Sumitomo G605L Multi Functional
5 Antimony (Sb 2 O 3 ) ND 0 0 Bromine (Br) ND 0 0 Carbon Black 0 0 Epoxy 0 0 Epoxy Cresol Novolac 0 0 Metal Hydroxide 0 0 Phenol Novolac 0 0 Silica (SiO 2 ) Resin Other 0 0 Silicon Chip Components Silicon Chip Substrate Components Substrate Weight Substrate Material 0 Substrate Core Material 0 Bromine Free 0 Copper Gold Nickel Substrate Core Material Solder Mask Triazol 0 0 Other 0 0 5
6 Notes: 1. Lead Form: GW Gull Wing, TH Through Hole. 2. Refer to product data sheet to confirm actual wire diameter. 3. 'ND' means None Detected, negligible amount present. * This package may be remarked. If remarked, the package will contain additional homogeneous materialsinksthat are not listed in contents of this report. + Existing inventory of non Halogen free product will be sold first. Halogen free product is identified by date code only. If you need to confirm delivery of Halogen free product, please contact Customer Service. This part is qualified as lead free. Parts qualified as lead free can be manufactured and supplied as lead free, if and only if, the customer makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website contains information regarding the lead free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead free package tables, and status/qualification plans for particular package types qualified as lead free or in the qualification process). This report was generated on For additional information, please visit the Maxim/Dallas Environmental Management and Materials Information website located at: ic.com/emmi 6
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