Reference Only. Chip Ferrite Bead BLM31 SH1L Murata Standard Reference Specification [AEC-Q200]

Transcription

1 P.1/9 Chip Ferrite Bed BLM31 SH1L Murt Stndrd Reference Specifiction [AEC-Q200] 1. Scope This reference specifiction pplies to Chip Ferrite Bed for Automotive Electronics BLM31_SH Series bsed on AEC-Q Prt Numbering (ex.) BL M 31 PG 601 S H 1 L (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (4)Chrcteristics (7)Ctegory (for Automotive Electronics) (2)Type (5)Typicl Impednce t 100MHz (8)Numbers of Circuit (3)Dimension (L W) (6)Performnce (9)Pckging (L:Tping) 3. Rting Customer Prt Number MURATA Prt Number Impednce ( ) (t 100MHz,Under Stndrd Testing Condition) (*1) (refer to below comment) Typicl Rted Current (ma) (*2) DC Resistnce ( ) mx. (*1) (refer to below comment) Initil Vlues Vlues After Testing BLM31PG330SH1L 33±25% BLM31PG500SH1L 35 min BLM31PG121SH1L 120±25% BLM31PG391SH1L 390±25% BLM31PG601SH1L 600±25% ESD Rnk 5B:12kV 6:25kV BLM31AJ601SH1L 600±25% B Operting Temperture: -55 C to +125 C Storge Temperture: -55 C to +125 C (*1) Stndrd Testing Conditions Unless otherwise specified In cse of doubt Temperture : Ordinry Temp. (15 C to 35 C ) Temperture : 20 C±2 C Humidity : Ordinry Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kP to 106kP 6 (*2) In cse of Rted current is more thn 1A, Rted Current is derted s right figure depending on the operting temperture. Rted Current (A) x Describe the Rted current s x[a] in cse of more thn 1A. Operting Temperture ( C) 4. Style nd Dimensions 3.2± ±0.2 Equivlent Circuit 0.7± ±0.2 :Electrode Resistnce element becomes ( dominnt t high frequencies. ) Unit Mss (Typicl vlue) 0.030g

2 5. Mrking No mrking. P.2/9 6. Specifictions 6-1. Electricl No. Item Specifiction Test Method Impednce Meet item 3. Mesuring Frequency : 100MHz±1MHz Mesuring Equipment : Agilent 4291A or the equivlent Test Fixture : Agilent 16192A or the equivlent DC Resistnce Meet item 3. Mesuring Equipment : Digitl multi meter 6-2. Mechnicl Performnce (bsed on Tble 13 for FILTER EMI SUPPRESSORS/ FILTERS) AEC-Q200 Rev.D issued June AEC-Q200 Murt Specifiction / Devition No. Stress Test Method 3 High Temperture Exposure 1000hours t 125 deg C Set for 24hours t room temperture, then mesured. 4 Temperture Cycling 1000cycles -55 deg C to +125 deg C Set for 24hours t room temperture, then mesured. 5 Destructive Physicl Anlysis Per EIA469 No electricl tests 7 Bised Humidity 1000hours t 85 deg C, 85%RH Apply mx rted current. Tble A Appernce No dmge Impednce Chnge Within ±30% (t 100MHz) DC Meet item 3. Resistnce No defects 8 Opertionl Life Apply 125 deg C 1000hours Set for 24hours t room temperture, then mesured If the rted current of prts exceed 1A, the operting temperture should be 85 deg C. 9 Externl Visul Visul inspection No bnormlities 10 Physicl Dimension Meet ITEM 4 (Style nd Dimensions) No defects 12 Resistnce to Solvents Per MIL-STD-202 Method Mechnicl Shock Per MIL-STD-202 Method 213 Condition F: 1500g s(14.7n)/0.5ms/ Hlf sine 14 Vibrtion 5g's(0.049N) for 20 minutes, 12cycles ech of 3 orienttions Test from Hz. Not Applicble

3 P.3/9 AEC-Q200 No. Stress Test Method 15 Resistnce Solder temperture to Soldering Het 260C+/-5 deg C Immersion time 10s Murt Specifiction / Devition Pre-heting:150C +/-10 deg,60s to 90s 17 ESD Per AEC-Q ESD Rnk: Refer to Item 3. Rting 18 Solderbility Per J-STD-002 Method b : Not Applicble 95% of the termintions is to be soldered. 19 Electricl Mesured : Impednce No defects Chrcteriztion 20 Flmmbility Per UL-94 Not Applicble 21 Bord Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time 22 Terminl Strength Per AEC-Q No defects 30 Electricl Trnsient Conduction Per ISO Not Applicble

4 P.4/9 7. Specifiction of Pckging 7-1. Appernce nd Dimensions (8mm-wide plstic tpe) 3.5± ± ± ± ± ± ± ± ± ± Direction of feed *Dimension of the Cvity is mesured t the bottom side. (1) Tping Products shll be pckged in the ech embossed cvity of 8mm-wide, 4mm-pitch nd plstic tpe continuously nd seled by cover tpe. (2) Sprocket hole : Sprocket hole shll be locted on the left hnd side towrd the direction of feed. (3) Spliced point : The cover tpe hs no spliced point. (4) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greter, nd re not continuous. The specified quntity per reel is kept Tpe Strength (1) Pull Strength Plstic tpe 5N min. Cover tpe 10N min. (2) Peeling off force of Cover tpe 0.2N to 0.7N (Minimum vlue is typicl.) *Speed of Peeling off:300mm/min 165 to 180 degree 7-3. Tping Condition (1) Stndrd quntity per reel Quntity per 180mm reel : 3000 pcs. / reel (2) There shll be leder-tpe (cover tpe only nd empty tpe ) nd triler- tpe (empty tpe) s follows. (3) Mrking for reel The following items shll be mrked on lbel nd the lbel is stuck on the reel. (Customer prt number, MURATA prt number, Inspection number ( 1), RoHS mrking ( 2), Quntity, etc) 1) «Expression of Inspection No.» OOOO (1) (2) (3) (1) Fctory Code (2) Dte First digit : Yer / Lst digit of yer Second digit : Month / Jn. to Sep. 1 to 9, Oct. to Dec. O, N, D Third, Fourth digit : Dy (3) Seril No. 2) «Expression of RoHS mrking» ROHS Y ( ) (1) (2) (1) RoHS regultion conformity prts. (2) MURATA clssifiction number (4) Outside pckge These reels shll be pcked in the corrugted crdbord pckge nd the following items shll be mrked on lbel nd the lbel is stuck on the box. (Customer nme, Purchsing order number, Customer prt number, MURATA prt number, RoHS mrking ( 2), Quntity, etc) F Cover tpe Plstic tpe

5 P.5/9 (5) Dimensions of reel nd tping (leder-tpe, triler-tpe) Triler 160 min. 2.0±0.5 Lbel 190 min. Leder 210 min. Empty tpe Cover tpe ± ± ±0.8 Direction of feed Specifiction of Outer Cse H W D Lbel Outer Cse Dimensions Stndrd Reel Quntity in Outer Cse (mm) (Reel) W D H Above Outer Cse size is typicl. It depends on quntity of n order. 8.! Cution 8-1. Rting Do not use products beyond the Operting Temperture Rnge nd Rted Current Surge current Excessive surge current (pulse current or rush current) thn specified rted current pplied to the product my cuse criticl filure, such s n open circuit, burnout cused by excessive temperture rise. Plese contct us in dvnce in cse of pplying the surge current Fil Sfe Be sure to provide n pproprite fil-sfe function on your product to prevent from second dmge tht my be cused by the bnorml function or the filure of our products Limittion of Applictions Plese contct us before using our products for the pplictions listed below which require especilly high relibility for the prevention of defects which might directly cuse dmge to the third prty's life, body or property. (1)Aircrft equipment (6)Disster prevention / crime prevention equipment (2)Aerospce equipment (7)Trffic signl equipment (3)Underse equipment (8)Trnsporttion equipment (trins, ships, etc.) (4)Power plnt control equipment (9)Applictions of similr complexity nd /or relibility requirements (5)Medicl equipment to the pplictions listed in the bove

6 P.6/9 9. Notice This product is designed for solder mounting. Plese consult us in dvnce for pplying other mounting method such s conductive dhesive Lnd pttern designing Stndrd lnd dimensions (Flow nd Reflow soldering) < BLM31 series (except BLM31PG type) > Chip Ferrite Bed to5.2 Solder Resist Pttern < For BLM31PG type > Chip Ferrite Bed to 5.2 Solder Resist Pttern Type Rted Current (A) Lnd pd thickness nd dimension 18µm 35µm 70µm 1.5/ BLM31PG *The excessive het by lnd pds my cuse deteriortion t joint of products with substrte. Lnd dimensions on Flow soldering for 2.5mm pitch mounting Chip Ferrite Bed *As for BLM31PG type, tking lnd pd thickness nd rted current into ccount. b c d e to mm pitch c d e b e c *The pttern shll be designed to bove drwing to prevent cusing the solder bridge when products re mounted by 2.5mm pitch flow soldering. e b e d Solder Resist Pttern

7 P.7/ Soldering Conditions Products cn be pplied to reflow nd flow soldering. (1) Flux,Solder Flux Use rosin-bsed flux, but not highly cidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use wter-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Stndrd thickness of solder pste : 100 µm to 200 m (2) Soldering conditions Pre-heting should be in such wy tht the temperture difference between solder nd ferrite surfce is limited to 150 mx. Also cooling into solvent fter soldering should be in such wy tht the temperture difference is limited to 100 mx. Insufficient pre-heting my cuse crcks on the ferrite, resulting in the deteriortion of product qulity. Stndrd soldering profile nd the limit soldering profile is s follows. The excessive limit soldering conditions my cuse leching of the electrode nd / or resulting in the deteriortion of product qulity. (3) soldering profile Flow soldering profile Temp. ( ) 265 ±3 250 Limit Profile 150 Heting Time Stndrd Profile 60s min. Time.(s) Stndrd Profile Limit Profile Pre-heting s min. Heting 250 4~6s 265 ±3 5s mx. Cycle of flow 2 times 2 times Reflow soldering profile Temp. ( ) ± Limit Profile 30s~60s Stndrd Profile 60s mx. 90s±30s Time. (s) Stndrd Profile Limit Profile Pre-heting 150~180 C 90s±30s Heting bove 220 C 30s~60s bove 230 C 60s mx. Pek temperture 245±3 C 260 C, 10s Cycle of reflow 2 times 2 times

8 P.8/ Reworking with soldering iron Pre-heting: 150 C, 1 min Soldering iron output: 80W mx. Tip temperture: 350 C mx. Tip dimeter: φ3mm mx. Soldering time : 3 (+1, -0) seconds. Times : 2times mx. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crck on the ferrite mteril due to the therml shock Solder Volume Solder shll be used not to be exceed s shown below. Upper Limit t Recommendble 1/3T t T (T: Chip thickness) Accordingly incresing the solder volume, the mechnicl stress to product is lso incresed. Exceeding solder volume my cuse the filure of mechnicl or electricl performnce Attention regrding P.C.B. bending The following shll be considered when designing nd lying out P.C.B.'s. (1) P.C.B. shll be designed so tht products re not subject to the mechnicl stress for bord wrpge. <Products direction> Poor exmple Good exmple b Products shll be locted in the sidewys direction (Length: b) to the mechnicl stress. (2) Products loction on P.C.B. seprtion. Products (A, B, C, D) shll be locted crefully so tht products re not subject to the mechnicl stress due to wrping the bord. Becuse they my be subjected the mechnicl stress in order of A C B D. b Sem A B Slit D C Length: b 9-6. Mounting density Add specil ttention to rditing het of products when mounting the inductor ner the products with heting. The excessive het by other products my cuse deteriortion t joint of this product with substrte Operting Environment Do not use this product under the following environmentl conditions, on deteriortion of the Insultion Resistnce of the Ferrite mteril nd/or corrosion of Inner Electrode my result from the use. (1) in the corrodible tmosphere (cidic gses, lkline gses, chlorine, sulfur gses, orgnic gses nd etc.) (2) in the tmosphere where liquid such s orgnic solvent, my splsh on the products. (3) in the tmosphere where the temperture / humidity chnges rpidly nd it is esy to dew Resin coting The impednce vlue my chnge nd/or it my ffect on the product's performnce due to high cure-stress of resin to be used for coting / molding products. So plese py your creful ttention when you select resin. In prior to use, plese mke the relibility evlution with the product mounted in your ppliction set.

9 P.9/ Clening Conditions Products shll be clened on the following conditions. (1) Clening temperture shll be limited to 60 C mx. (40 C mx. for IPA.) (2) Ultrsonic clening shll comply with the following conditions, voiding the resonnce phenomenon t the mounted products nd P.C.B. Power:20W/ mx. Frequency:28kHz to 40kHz Time:5 min mx. (3) Clener 1.Alterntive clener Isopropyl lcohol (IPA) 2.Aqueous gent PINE ALPHA ST-100S (4) There shll be no residul flux nd residul clener fter clening. In the cse of using queous gent, products shll be dried completely fter rinse with de-ionized wter in order to remove the clener. (5) Other clening Plese contct us Hndling of substrte After mounting products on substrte, do not pply ny stress to the product cused by bending or twisting to the substrte when cropping the substrte, inserting nd removing connector from the substrte or tightening screw to the substrte. Excessive mechnicl stress my cuse crcking in the product. Bending Twisting Storge Conditions (1) Storge period Use the products within 6 months fter delivered. Solderbility should be checked if this period is exceeded. (2) Storge conditions Products should be stored in the wrehouse on the following conditions. Temperture : -10 C to 40 C Humidity : 15% to 85% reltive humidity No rpid chnge on temperture nd humidity Don't keep products in corrosive gses such s sulfur, chlorine gs or cid, or it my cuse oxidiztion of electrode, resulting in poor solderbility. Products should be stored on the plette for the prevention of the influence from humidity, dust nd so on. Products should be stored in the wrehouse without het shock, vibrtion, direct sunlight nd so on. Products should be stored under the irtight pckged condition. (3) Delivery Cre should be tken when trnsporting or hndling product to void excessive vibrtion or mechnicl shock. 10.! Note (1)Plese mke sure tht your product hs been evluted in view of your specifictions with our product being mounted to your product. (2)You re requested not to use our product deviting from the greed specifictions. (3)The contents of this reference specifiction re subject to chnge without dvnce notice. Plese pprove our product specifictions or trnsct the pprovl sheet for product specifictions before ordering.