LNP LDS AND THERMAL CONDUCTIVE COMPOUNDED SOLUTIONS. February 2014, Andy Verheijden

Transcription

1 LNP LDS AND THERMAL CONDUCTIVE COMPOUNDED SOLUTIONS February 2014, Andy Verheijden

2 LDS FOR MID

3 LNP THERMOCOMP LDS COMPOUNDS FOR MID Value proposition LNP Thermocomp LDS compounds will help to drive productivity and design cycle flexibility, through part consolidation and miniaturization versus conventional technologies, such as metal stamping, potentially providing system cost out thanks to shorter value chain and faster market introduction. Design freedom Part consolidation LNP Thermocomp LDS compound may provide productivity & 3D design capability No. 2

4 3 VALUE PROPOSITIONS MATERIAL & PROCESS Key advantages of LNP Thermocomp LDS compounds High flow with superior impact performance, UL mm High stiffness with excellent aesthetics High heat, UL mm, for lead free soldering Patented color capability DX compound DX compound Comp. 1 Comp. 2 Key advantages of LPKF LDS process LPKF Fusion3D 6000 Very flexible process, for 3D prototyping and production Fast operating method, typical operating speed 3 seconds/part No chemical surface activation needed Fine line processing down to 150 μm pitch size Multiple antennas can be integrated in one process step Part size possible up to 200 x 200 mm SABIC LNP & LDS technology providing potential cost & weight savings No. 3

5 LNP THERMOCOMP LDS COMPOUND SUCCESS STORY Xiaomi Inc. Smartphone MI2 A Antenna using LPKF LDS technology Application CTQs LNP Thermocomp DX11355 compound LDS for integrated antenna Excellent impact for rear cover Pass 96 hours thermal shock test 65 ºC/RH 95% Good plating performance Wide processing window Front cover Battery cover Antenna LNP Thermocomp DX10311 compound High modulus & ductile (8 GPa, INI 20 kj/m2), excellent flow, Lexan EXL based Lexan EXL1414 resin Lexan copolymer providing superior ductility/flow balance LNP Thermocomp DX11355 compound Lexan copolymer based LDS compound LNP Thermocomp LDS compounds making use of SABIC s proprietary PC copolymer No. 4

6 LNP THERMOCOMP LDS COMPOUND SUCCESS STORY 3D Circuit Ltd, Jelly Fish LED lamp LNP Thermocomp UX08325 compound High modulus (10 GPa, HDT 263 ºC), SMT capable LNP Thermocomp LDS compounds providing 3D design flexibility No. 5

7 LNP THERMOCOMP LDS COMPOUNDS LNP THERMOCOMP LDS COMPOUNDS PRODUCT PORTFOLIO PC/ABS compounds NX10302 NX11302 Black, easy plating White, easy plating DX11354 Black, high flow, superior impact PC compounds DX11355 DX11354X Black, UL94 0.6mm, high flow, superior impact White, high flow, superior impact DX GF, TM > 8 GPa, excellent surface PA compounds UX08325 UX08305 High T PA, 30GF, HDT 263 ºC, SMT capable UL94 0.8mm, HDT 267 ºC, SMT capable No. 6

8 THERMAL MANAGEMENT

9 Current (A) THERMAL MANAGEMENT Voltage (V) 25 C 45 C 60 C Heat builds up in electronics leading to reduced lifetime, and/or efficiency No. 8

10 LED APPLICATIONS REQUIRE THERMAL MANAGEMENT Lexan polycarbonate resins Transparant and diffusion grades UL94 V0 > 1mm / 3mm Higher heat grades Improved weather-ability grades LED module Bulb Thermal pad LNP Konduit compounds High thermal conductivity Inherent electrical isolative Flame retardant acc. UL94 Self Colored Heat sink Valox and/or Lexan resins Flow White color (high reflection) Valox resins Non brominated & chlorinated FR Valox ENH4565 Sustainable grade Valox IQNH4550 PCB module Base holder Potting glue Typical requirements UL 94 V0 (Nafta) UL 94 HB (RoW) Break-down voltage: 4KV Dielectric strength 1.2m drop test HDT>100C High thermal conductivity: working temp <75C Thermal cycle test HWI=4 / HAI=3 CTI=4 Paintable or in-colored For external surface >65C, RTI required Metal substitution, enhancing part & function integration with LNP Konduit compounds No. 9

11 THERMALLY CONDUCTIVE PLASTICS Today metal is the common material used for heat sinks in LED lighting, but thermal conductive thermoplastic compounds are increasingly used. Metal High thermal conductivity Good mechanical strength Poor electrical isolative property Heavy weight Poor productivity More often 2 nd operation needed Thermal conductive compounds Less thermal conductivity Less mechanical strength Good electrical isolative property Improved design flexibility Lower energy demand Light weighting Increased productivity Potential cost saving depending on design Metal substitution: integrating part & function with LNP Konduit compounds No. 10

12 11 LNP KONDUIT COMPOUNDS FOR THERMAL MANAGEMENT 500 Thermal Conductivity (Wm/K) Metals Plastics Historically plastics have not been able to compete with metals in heat transfer applications 8 TCC s provide x increased thermal conductivity compared to unfilled, or reinforced thermoplastics Thermal Conductivity (Wm/K) TCC's Unfilled Plastics TCC may work as most heat transfer applications are limited by convection No. 11

13 THERMAL CONDUCTIVITY - MECHANISM - COMPOSITIONAL EFFECTS - PROCESSING EFFECTS

14 HEAT DISSIPATION Convection: Mixing of hot and cold air due to pressure difference Conduction: Transfer of thermal energy due to temperature gradient Material property! Radiation: Heat transfer via electromagnetic waves Influenced by amount of surface (=design) No. 13

15 MECHANISM OF THERMAL CONDUCTIVITY Vibrating atoms interact with neighboring atoms, transferring kinetic energy Phonon = motion of atomic and molecular vibrations Phonons propagate as waves at a frequency, amplitude and phase Heat transport is reduced by scattering and collision of phonons Simple, rigid structures are beneficial for heat transport Polymers are thermal insulators Good heat conductive ceramics are e.g. BN, AlN and SiC No. 14

16 Electrical conductivity Thermal conductivity THERMAL VERSUS ELECTRICAL CONDUCTIVITY Electrical conductivity electrical conductivity thermal conductivity Filler fraction (vol%) High content (30 50 vol.%) of thermally conductive filler required No. 15

17 THERMAL CONDUCTIVITY TEST EQUIPMENT Netzsch NanoFlash (LFA447) HotDisk (TPS2500) According ASTM E-1461 According ISO Laser Specimen IR detector Laser-flash method Measures diffusivity (a) and C p TC is calculated by: TC = a x C p x r Graphite coating applied Through-plane and in-plane can be measured using different sample holders Hot disc - Transient plane heat source Measures TC directly Measures bulk, in-plane, through-plane on sample Variable geometries (e.g. color plaques, real-life parts) State of the art test equipment to ensure reliable and reproducible data No. 16

18 THERMAL CONDUCTIVITY CRITICAL PARAMETERS Thermal conductivity is influenced by 3 main variables Polymer Polymer type Crystallinity Filler content Filler type(s) Particle size Particle shape Filler(s) Base resin viscosity + filler loading determines injection moldability Crystalline resins allow for higher filler levels with good processability The higher the TC of the base polymer, the higher the TC of the compound TC crystalline resin >> amorphous resins Filler dispersion Polymer-Filler Interface Orientation Processing Understanding all application requirements is key to success No. 17

19 PROCESSING EFFECTS ON LNP KONDUIT PX08321 TC tp = 2.4 W/mK TC tp =4.1 W/mK TC tp =1.1 W/mK Nanoflash ip tp 1mm, Pinpoint-gated 12.7mm disc 3mm, Pinpoint-gated 12.7mm disc 3mm, film-gated 60*60MM plaque TC Bulk = SQRT(TC tp *Tc ip) TC tp = Through-plane thermal conductivity = In-plane thermal conductivity Tc ip TC Bulk = 3.8 W/mK TC tp = 0.8 W/mK = 16.4 W/mK Tc ip Hotdisk Part design crucial for heat dissipative performance No. 18

20 LNP KONDUIT COMPOUNDS PRODUCT PORTFOLIO UV Stabilized compounds available: LNP Konduit PX11313 and PX11311U No. 19

21 LNP KONDUIT SUSTAINABILITY No. 20

22 HEAT SINK PERFORMANCE

23 Heater Temp(Degree C) LNP KONDUIT FOR HEAT SINKS Heat sink dissipation 115 H eat S in k D issipation P erform an ce D ie C asting A l P X insert P X insert P X insert E X K D 0033-insert E X K D 0012-insert N on-t C P A 6-insert P X no insert P X no insert W 4.3W 4.6W 6.3~6.5W 6.75W P o w er(w ) Krauss Maffei 50T IMM Prototype Tooling Data acquisition system GWINSTEK DC Power Gauge R&R OK No. 22

24 Heater Temp(Degree C) LNP KONDUIT FOR HEAT SINKS Heat sink dissipation H eat S in k D issipation P erform an ce D ie C asting A l P X insert P X insert P X insert E X K D 0033-insert E X K D 0012-insert N on-t C P A 6-insert P X no insert P X no insert PX08322 tp: 1 W/mK ip: 4.6 W/mK 3.3W 4.3W 4.6W 6.3~6.5W 6.75W PX08321 tp: 1.1 W/mK ip: 8.6 W/mK P o w er(w ) Krauss Maffei 50T IMM Prototype Tooling Data acquisition system GWINSTEK DC Power Gauge R&R OK No. 23

25 Heater Temp(Degree C) LNP KONDUIT FOR HEAT SINKS Heat sink dissipation 115 H eat S in k D issipation P erform an ce D ie C asting A l P X insert P X insert P X insert E X K D 0033-insert E X K D 0012-insert N on-t C P A 6-insert P X no insert P X no insert PA6+stamped Al-insert 3.3W 4.3W 4.6W 6.3~6.5W 6.75W Increasing TC P o w er(w ) Krauss Maffei 50T IMM Prototype Tooling Data acquisition system GWINSTEK DC Power Gauge R&R OK No. 24

26 MODELING 100% THERMOPLASTIC HEAT SINK Cylinder has material property distribution as shown Radial Hoop Axial TH-PLANE IN-PLANE IN-PLANE k1 k2 k3 Disc has material property distribution as shown Radial Hoop Axial IN-PLANE IN-PLANE TH-PLANE k1 k2 k3 Peak temperature No. 25

27 HYBRID HEAT SINKS ANALYTICAL MODELING Heat source Convective Cooling (15W/m2-k) d No. 26

28 HYBRID HEAT SINKS DESIGN ASPECTS Increase surface area very effective to improve heat dissipation Al Konduit Konduit + Al Small sur.area DoE & Performance Testing Two times sur.area Two times sur.area Hybrid design concept 3300 Long Al Insert 3300 Long Al Insert(Slot) 1300 Short Al Insert 1300 Short Al Insert(slot) 24 rib (22000) 84.45ºC 24 rib (22000) 84.37ºC 24 rib (22000) 89.32ºC 24 rib (22000) 90.39ºC 12 rib (18000) 86.58ºC 12 rib (18000) 86.63ºC 12 rib (18000) 91.50ºC 12 rib (18000) 92.73ºC 6 rib (16000) 90.32ºC 6 rib (16000) 93.27ºC 6 rib (16000) 94.17ºC 6 rib (16000) 97.81ºC 0 rib (14000) 92.9ºC 0 rib (14000) 0 rib (14000) 97.62ºC 0 rib (14000) No. 27

29 HEAT SHOCK PERFORMANCE Complex phenomenon, main controlling factors CTE mismatch Elongation at break (PX11311 and PX11311U) Design smoothly finned More stringent test Complete part design critical No. 28

30 THERMAL CONDUCTIVE LDS COMPOUNDS

31 30 POTENTIAL VALUE PROPOSITION Why combining thermal conductivity with laser direct structuring capability? Heat dissipation often needed in miniaturized electronic applications Helps thermal management challenges with electronic circuitry, or in higher heat environments Enhanced design freedom with surface mount technology (SMT), or laser welding May eliminate need for thermally conductive interface pads, and adhesives Initial questions: Level of isolative thermal conductivity needed? In Plane/Through Plane? Temperature range required? Dimensional stability as f(t)? (Halogen free) FR needed? Only dark, or also lighter colors? Connection technology preferred? Thermal conductive LDS compound proposed: TC ip ~ 3 W/mK & TC tp ~ 1.2 W/mK Peel strength > 0.7 N/mm & Target 1 N/mm Base resin preferred? What is it that you need for you next MID solution? No. 30

32 DISCLAIMER DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF SABIC INNOVATIVE PLASTICS HOLDING B.V. ITS SUBSIDIARIES AND AFFILIATES ( SELLER ), ARE SOLD SUBJECT TO SELLER S STANDARD CONDITIONS OF SALE, WHICH CAN BE FOUND AT AND ARE AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION OR RECOMMENDATION CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SELLER MAKES NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SELLER S PRODUCTS, SERVICES OR RECOMMENDATIONS. EXCEPT AS PROVIDED IN SELLER S STANDARD CONDITIONS OF SALE, SELLER SHALL NOT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user is responsible for making its own determination as to the suitability of Seller s products, services or recommendations for the user s particular use through appropriate end-use testing and analysis. Nothing in any document or oral statement shall be deemed to alter or waive any provision of Seller s Standard Conditions of Sale or this Disclaimer, unless it is specifically agreed to in a writing signed by Seller. No statement by Seller concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Seller or as a recommendation for the use of such product, service or design in a manner that infringes any patent or other intellectual property right. Brands marked with are trademarks of SABIC Saudi Basic Industries Corporation (SABIC). All Rights Reserved. No. 31