Vishay Draloric / Beyschlag Resistor Division

Transcription

1 Vishay Draloric / Beyschlag Resistor Division 1. Implementation of Lead Free Terminations a. Background and Proceeding b. Important Comments and Information 2. Warranty for Non-Inclusion of Hazardous Substances in Products of Vishay Draloric / Beyschlag Resistor Division 3. Lead Free Implementation Status for Vishay Draloric / Beyschlag Resistor Division according to European RoHS / WEEE/ ELV Directives 4. Minimum Test Program for Qualification of Pb-free Products 5. Statement on Lead Free Soldering Processes and Temperature Profiles vishay dra-bey lf-rohs doc, 1/12 VISHAY Draloric / Beyschlag Resistor Division OL,

2 Implementation of Lead Free Terminations Vishay Draloric Fixed Film and Wirewound Resistors, Potentiometers and Trimmers Vishay BCcomponents Fixed Linear Leaded Film and Wirewound Resistors Vishay Draloric and Vishay Dale Commodity Chip Resistors Background and proceeding The European Legislation has established a July 1, 2006 phase-out date for Lead (Pb) in electronic products ( WEEE- and RoHS-directives ). To comply with this legislation we will replace the tin-lead (SnPb) coating on the soldering terminations and on the connecting wires of our Fixed Resistors with 100% tin. The implementation of lead free soldering terminations will be proceeded in 3 steps: 1) Convert to 100% Sn (lead free) terminations either from a certain date onwards or during a defined period as published in the related Process Change Notification (PCN), respectively in the following update time schedule. The implementation is planned from August 2004 to December 2004, the conversion period will end from September 2004 to January 2005, depending on the involved product line. 2) During and after the implementation the available inventory will be used until a certain date according to the PCN. Mixed shipments of lead free or lead containing products are possible, as these products can be used interchangeable in the current SnPb-based soldering process. 3) From 31 March onwards only lead-free products will be shipped. The details of the implementation can be found in the related Process Change Notification. A brief overview table will follow on the next pages. Important comments and information There will be no change of product name or order number for the majority of the product lines. For certain product lines, R-Chip CRCW/D-series and TNPW-series, a separate new part number for products with explicit lead-free (100%Sn) termination will be used during the transition period and beyond, details to be found in the related revised Process Change Notifications. The lead free products are fully forward and backward compatible with either conventional SnPb-based soldering processes (wave solder or reflow) or lead free soldering processes. All technical / electrical data and properties will remain unchanged after the change to lead-free soldering terminations according to the current Vishay product data sheets. Please be informed that the Vishay Beyschlag Leaded Resistors, MELF Resistors, Thin Film Chip Resistors and the Vishay Draloric Mini-MELF resistors are not part of this change. Most of these products, as the Vishay Beyschlag resistors are already lead-free since many years with their market introduction. All lead free products will be marked with a lead (Pb) -free sign and the e3 indication according to IPC/JEDEC on the label since the lead-free implementation, but latest from January 1 st, 2005 onwards. vishay dra-bey lf-rohs doc, 2/12 VISHAY Draloric / Beyschlag Resistor Division OL,

3 Warranty for Non-Inclusion of Hazardous Substances in Products of Vishay Draloric / Beyschlag Resistor Division It is the policy of Vishay Draloric / Beyschlag Resistor Division to: 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is of particular concern to control or eliminate the use of those substances with established hazardous properties. With this objective we have reviewed our manufacturing processes and materials against the following directives: a) 2000/53/EC End of Vehicle Life Directive (EVL) b) 2000/53/EC Annex II to End of Vehicle Life (EVL II) c) 2002/95/EC Restriction of the use of Hazardous Substances Directive (RoHS) d) 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) We hereby warrant and guarantee that the customer approved products supplied by our company comply fully with these directives and do not and will not contain any of the following substances: PBB (polybromobiphenyl) category and PBDE (polybrominated biphenyl ethers) category; Polychlorinated biphenyl (PCB) category; Polychlorinated naphthalene category; Organic tin compounds (Tributhyl tin category & Triphenyl tin category); Asbestos, and Azo compounds. vishay dra-bey lf-rohs doc, 3/12 VISHAY Draloric / Beyschlag Resistor Division OL,

4 Warranty for Non-Inclusion of Hazardous Substances in Products of Vishay Draloric / Beyschlag Resistor Division, continued In making this warranty we use the following exemptions as outlined in EVL II & RoHS, for the current existence of Lead, Cadmium and Chromium VI trace elements. Materials and Components Solder in electronic circuit boards and other electric applications Electrical components which contain lead in a glass or ceramic matrix compound, except glass in bulbs and glaze of spark plugs. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead). Scope and expiry date of Exemption Vishay Date of expiry None announced None announced None announced None announced Thick film pastes Corrosion preventive coating Material Declaration Material Declaration reports on individual part numbers or product families are available using any of the following internationally recognized formats. Application Reference Link 1. End-Of-Life Vehicles (ELV) Reporting Guideline and Compliance Connect Tool 2. International Material Data System 3. ZVEI Umbrella Specification vishay dra-bey lf-rohs doc, 4/12 VISHAY Draloric / Beyschlag Resistor Division OL,

5 Status for Vishay Draloric / Beyschlag Resistor Division according to RoHS / WEEE / ELV Directives Leaded Fixed Linear Film Resistors Types Brand Sizes Type Lead-Free Terminations Safe Lead-Free Determination by Date Code 1 with current RoHS 2, ELV Directives 2 exemptions used with RoHS 3 of 2006 Product Change Notification (PCN) SFR BCcomponents All Axial Metal Film YES = YES - YES IND/01/2004 MRS BCcomponents All Axial Metal Film YES All date codes YES - YES N/A MPR BCcomponents All Axial Metal Film YES = YES - YES 410a/2004 PR BCcomponents All Axial Metal Film YES = YES - YES IND/01/2004 VR/LSR BCcomponents All Axial Metal Glaze YES = YES Pb in glass YES IND/01/2004 NFR BCcomponents All Axial Fusible Film YES = YES - YES IND/01/2004 MB_ Beyschlag All Axial Metal Film YES All date codes YES - YES N/A CBB Beyschlag All Axial Carbon Film YES All date codes YES - YES N/A UX_ Beyschlag All Axial Metal Film YES = YES - YES 410a/2004 SMA / MK Draloric All Axial Metal Film YES = YES - YES 16/2004 SMA / MK Draloric 0309/ 0411 Axial Metal Film YES = YES MAR /2004 OMA / SK Draloric All Axial Metal Film YES = YES - YES 16/2004 PMA0207 Draloric All Axial Metal Film YES = YES - YES 16/2004 HMA0207 Draloric All Axial Metal Film YES = YES - YES 16/2004 ZMA0411 Draloric All Axial Metal Film YES = YES - YES 16/2004 NMA / NK Draloric All Axial Metal Film YES = YES - YES 16/2004 NMA / NK Draloric 0411 Axial Metal Film YES = YES DEC /2004 NMA SI Draloric All Axial Fusible Film YES = YES - YES 16/2004 vishay dra-bey lf-rohs doc, 5/12 VISHAY Draloric / Beyschlag Resistor Division OL,

6 Status for Vishay Draloric / Beyschlag Resistor Division according to RoHS / WEEE / ELV Directives Leaded Fixed Linear Resistors, continued Types Brand Sizes Type Lead-Free Terminations Safe Lead-Free Determination by Date Code 1 with current RoHS 2, ELV Directives 2 exemptions used with RoHS 3 of 2006 Product Change Notification (PCN) NKS Draloric All Axial Fusible Film YES =04 38 YES - YES 16/2004 SXA Draloric All Axial Met. Ox. Film YES = YES - YES 16/2004 WK / WR Draloric All Axial Met. Ox. Film YES = YES - YES 16/2004 LCA / SK Draloric All Axial Carbon Film YES = YES - YES 16/2004 LCA.NE / SK.NB Draloric All Axial Carbon Film YES =04 38 YES - YES 16/2004 HCA0207 Draloric All Axial Carbon Film YES = YES - YES 16/2004 LCA...Si Draloric All Axial Fusible Film YES = YES - YES 16/2004 SKS Draloric All Axial Fusible Film YES = YES - YES 16/2004 HGR Draloric All Axial Metal Glaze YES = YES - YES 16/2004 Leaded Variable Wirewound Resistors Types Brand Sizes Type Lead-Free Terminations Safe Lead-Free Determination by Date Code 1 with current RoHS 2, ELV Directives 2 exemptions used with RoHS 3 of 2006 Product Change Notification (PCN) P.. Draloric All Variable Wirewound YES = YES Pb in solder YES 16b/2004 P HK Draloric All Variable Wirewound YES = YES Pb in solder YES 16b/2004 F2 Draloric All Variable Wirewound YES = YES - YES 16b/2004 A4R. Draloric All Variable Wirewound YES = YES - YES 16b/2004 vishay dra-bey lf-rohs doc, 6/12 VISHAY Draloric / Beyschlag Resistor Division OL,

7 Status for Vishay Draloric / Beyschlag Resistor Division according to RoHS / WEEE / ELV Directives Leaded Fixed Linear Wirewound Resistors Types Brand Sizes Type Lead-Free Terminations Safe Lead-Free Determination by Date Code 1 with current RoHS 2, ELV Directives 2 exemptions used with RoHS 3 of 2006 Product Change Notification (PCN) AC; PAC BCcomponents All Wirewound YES = YES - YES 16a/2004 SKF Draloric All Wirewound YES = YES - YES 16a/2004 SKA Draloric All Wirewound YES = YES - YES 16a/2004 KKA Draloric All Wirewound no JAN 2005 YES - JAN a/2004 KKE Draloric All Wirewound no JAN 2005 YES - JAN a/2004 G200 Draloric All Wirewound YES = YES Pb in glass YES 16a/2004 GWS Draloric All Wirewound YES n/a YES Pb in glass YES n/a GBS Draloric All Wirewound YES n/a YES - YES n/a RW Draloric All Wirewound YES = YES - YES 16a/2004 GWK Draloric All Wirewound YES n/a YES - YES n/a Z300 Draloric All Wirewound YES = YES - YES 16a/2004 WSZ Draloric All Wirewound YES = YES - YES 16a/2004 ZWS Draloric All Wirewound YES n/a YES - YES n/a ZBS Draloric All Wirewound YES n/a YES - YES n/a ZW Draloric All Wirewound YES = YES - YES 16a/2004 ZWK Draloric All Wirewound YES n/a YES - YES n/a BWD Draloric All Wirewound YES = YES - YES 16a/2004 vishay dra-bey lf-rohs doc, 7/12 VISHAY Draloric / Beyschlag Resistor Division OL,

8 Status for Vishay Draloric / Beyschlag Resistor Division according to RoHS / WEEE / ELV Directives Fixed Linear SMD Film Resistors Types Brand Sizes Type Lead-Free Terminations Safe Lead-Free Determination by Date Code 1 with current RoHS 2, ELV Directives 2 exemptions used with RoHS 3 of 2006 Product Change Notification (PCN) CRCW / D Dale/ Draloric All Thick Film Chip on request New part number YES Pb in glass Yes, as LF / e3 version CRA Dale All Thick Film Array YES > YES Pb in glass YES n/a TNPW Dale All Thin Film Chip on request New part number YES Cd in thick film paste Yes, as LF / e3 version 16/2004 QW 0407 M Draloric All Thin Film Chip YES = YES Cd in thick DEC 2005 QW 0409 film paste SMM Draloric 0102 Thin Film MELF YES All date codes YES - YES n/a SMM / MS1 Draloric 0204 Thin Film MELF YES = YES MAR 2005 n/a OMM Draloric 0204 Thin Film MELF YES = YES MAR 2005 n/a PMM Draloric 0204 Thin Film MELF YES = YES MAR 2005 n/a SMM Draloric 0207 Thin Film MELF YES = YES - YES QW 0408 OMM Draloric 0207 Thin Film MELF YES = YES - YES QW 0408 PMM Draloric 0207 Thin Film MELF YES = YES - YES QW 0408 LCM SI Draloric 0207 Fusible MELF YES = YES NMM SI Draloric 0207 Fusible MELF YES = YES DEC 2005 QW 0408 DEC 2005 QW 0408 vishay dra-bey lf-rohs doc, 8/12 VISHAY Draloric / Beyschlag Resistor Division OL,

9 Status for Vishay Draloric / Beyschlag Resistor Division according to RoHS / WEEE / ELV Directives Fixed Linear SMD Film Resistors, continued Types Brand Sizes Type Lead-Free Terminations Safe Lead-Free Determination by Date Code 1 with current RoHS 2, ELV Directives 2 exemptions used with RoHS 3 of 2006 Product Change Notification (PCN) MC_ Beyschlag All Thin Film Chip YES All date codes YES - YES n/a OC_ Beyschlag All Cermet Film Chip YES All date codes YES Pb in glass YES n/a TC_ Beyschlag All Cermet Film Chip YES All date codes YES Pb in glass YES n/a NC_ Beyschlag All Cermet Film Chip YES All date codes YES Pb in glass YES n/a ACAC Beyschlag All Thin Film Array YES All date codes YES - YES n/a CM_ Beyschlag All Carbon Film MELF YES All date codes YES - YES n/a MM_ Beyschlag All Thin Film MELF YES All date codes YES - YES n/a UM_ Beyschlag All Thin Film MELF YES All date codes YES - YES n/a Important comments and notes: All given dates refer to the date of production as indicated also on the product label (e.g.: = week 39 of year 2004). 1) We generally will deliver all product families without new article number with lead-free terminations from 01 Apr 2005 onwards. Those customers who need pure Pb-free or pure SnPbdeliveries before that date must contact their Vishay customer service in charge for appropriate arrangements. For certain product lines, R-Chip D/CRCW-series and TNPW-series, a separate new part number for products with explicit lead-free (100%Sn) termination will be used during the transition period and beyond. Lead-free terminations are typically suitable for lead-free soldering processes wave soldering (260 C; 10 s) and reflow soldering (260 C; 40 s). All products with lead-free terminations are backwards compatible with conventional SnPb based soldering. All technical properties will remain unchanged at the transition to lead-free terminations. All ordering codes will remain unchanged at the transition to lead-free terminations. 2) All products comply fully with the directives RoHS (2002/95/EC), WEEE (2002/96/EC), ELV (2000/53/EC) as currently valid, with agreed exemptions and concentration limits. (Abbreviations: Pb in glass = Lead in glass of electronic components ; Pb in solder = Pb in high melting temperature type solders ) 3) All products will comply fully to the RoHS (2002/95/EC) as valid from 2006 without exemptions from the indicated date onwards. vishay dra-bey lf-rohs doc, 9/12 VISHAY Draloric / Beyschlag Resistor Division OL,

10 Draloric Beyschlag Division Conversion of all product families to Pb-free Minimum Test Programme for Qualification of Pb-free SMD Resistor products: All lead free product families and each different construction within a product family should undergo a standardized minimum qualification test programme (n = 20 each; for stability measurements deltar/r, lowest and critical value is used): Qualification Method SMD Resistors 1 ) Resistance to soldering heat Covering: IEC /58 (Td) MIL-STD-202 Method 210 Condition B Functional test Dipping test, visual and stability (?R/R) Reflow on PCB with SnAgCu, visual and stability (?R/R) 260 C / 10s 3x 260 C / 40s at peak temperature Solderability IEC method 58 (Td) IPC J-STD-002B Test B, category 3 Functional test - Dipping (oven-ageing 155 C/4h), - Dipping (steam ageing 4h) Non-activated flux Reflow on PCB: - oven-ageing 155 C/4h, - steam ageing 4h. Mild activated flux Backward compatibility (SnPb-soldering) >95% wetting after 215 C / 3s SnPb-solder bath 215 C / 10s peak, 50 to 70s above T L with SnPb-solder pastes Forward compatibility (Pb-free soldering) >95% wetting after 235 C / 3s SnAgCu solder bath 235 C / 10s peak, 50 to 70s above T L with SnAgCu-solder pastes Whisker growth propensity SONY SS NEMI recommendation, etc. **) As parallel measurement (not sequential) Thermal shock cycling -55/125 C(85 C)/ 500 cycles (15 min per cycle, 2x 1min transfer) and 500h / Storage at 85/85 **) (or 55 C alternatively) No Whiskers. Max. outgrowths 20µm (SEM inspection, three randomly selected pieces) vishay dra-bey lf-rohs doc, 10/12 VISHAY Draloric / Beyschlag Resistor Division OL,

11 Draloric Beyschlag Division Conversion of all product families to Pb-free Minimum Test Programme for Qualification of Pb-free Leaded Resistor products: All lead free product families and each different construction within a product family should undergo a standardized minimum qualification test programme (n = 20 each; for stability measurements deltar/r, lowest and critical value is used): Qualification Method Leaded Resistors 1 ) Resistance to soldering heat Covering: IEC / 20 (Tb) Method 1A Functional Dipping test; visual and stability (delta R/R) Reflow on PCB or reflow simulation in oven; visual and stability (delta R/R) 260 C / 10s, 2 to 2,5 mm from body 3x 260 C / 40s at peak temperature Solderability Whisker growth propensity IEC / 20 (Ta) Ageing 3 IPC J-STD-002B Test A, category 3 SONY SS NEMI recommendation, etc. **) As parallel measurement (not sequential); Dipping (oven-aged 155 C/16h); Non-activated flux Thermal shock cycling -55/125 C(85 C)/ 500 cycles (15 min per cycle, 2x 1min transfer) and 500h / Storage at 85/85 **) (or 55 C alternatively) Backward compatibility (SnPb-soldering) >95% wetting after 215 (235) C / 3s SnPb-solder bath(60/40) Forward compatibility (Pb-free soldering) >95% wetting after 235 (245) C / 3s SnAgCu solder No Whiskers. Max. outgrowths 20µm (SEM inspection, three randomly selected pieces) 1 ) Furthermore for both resistor types: - Tin thickness (and nickel respectively) by cross section and optical measurement (photograph); - Professional components fit for automotive industry application should provide additionally test results of climate sequence (e.g. 1000h damp heat steady state 40/93) after resistance to soldering as minimum condition. vishay dra-bey lf-rohs doc, 11/12 VISHAY Draloric / Beyschlag Resistor Division OL,

12 Statement on lead free soldering processes and temperature profiles Temperature ( C) C 200 Preheating C typical C C 235 C C ca s > 220 C ramp down rate < 6 K/s SnAgCu Reflow Temperature ( C) C Preheating 240 C 230 C C C 150 C 130 C ca. 60 s > 180 C SnPb Reflow ramp down rate < 6 K/s Temperature ( C) 300 Double Wave Soldering 10 s max., max. contact time 5 s per wave l l SnPb: 235 C C SnAgCu: 250 C C First wave Second wave?t < 150 K 200 Cooling Preheating...ca. 3,5 K/s typical 150 ca. 2 K/s 130 C..... ca. 5 K/s 120 C C typical 50 ramp up rate < 3 K/s 50 typical ramp up rate < 3 K/s Time (s) Time (s) Time (s) Our lead-free resistors are easily compatible with most currently discussed lead free soldering processes and temperature profiles. The lead free products are fully forward and backward compatible with either conventional SnPb-based soldering processes (wave solder or reflow) or lead free soldering processes. In fact our lead free resistors are processible with virtually any soldering profile suitable to assemble other passive components and semiconductor devices. Due to this we do not need to impose another temperature profile for our customers. 300 SnAgCu Vapour Phase 300 SnPb Vapour Phase C 20 s s C 20 s s Temperature ( C) C ca. 60 s s > 217 C ramp up rate < 3 K/s ramp down rate < 6 K/s Temperature ( C) C ca. 60 s s > 180 C ramp up rate < 3 K/s ramp down rate < 6 K/s Time (s) Time (s) Shown indicative graphs according IEC (ed.2, draft) vishay dra-bey lf-rohs doc, 12/12 VISHAY Draloric / Beyschlag Resistor Division OL,