PRELIMINARY SPECIFICATIONS

Transcription

1 PRELIMINARY SPECIFICATIONS Customer CompoTEK GP Customer Part No.: HSX321S /1/A HELE. Part No: Application For: Products: CRYSTAL Accepted Model: Type & Freq.: HSX321S / 48.MHz Sample Order No: : 212/1/3 Approved By : HARMONY ELECTRONICS (THAILAND) CO., LTD. HARMONY ELECTRONICS (SHENZHEN) CORP., LTD. TAIPEI OFFICE: 公司 :(114) 台北市內湖區堤頂大道 2 段 49 號 2 樓 2F., NO.49, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN (R.O.C.) TEL: FAX: : 工廠 :(831) 高雄市大寮區大發工業區華東路 39 號 No.39, Hua dong Rd., Daliao Dist.,Dafa Industrial Park., Kaohsiung City 831, Taiwan (R.O.C.) TEL: (7) FAX: (7) : 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RAJCHABUREE PROVINCE 711, THAILAND TEL: (32) , FAX: (32)2742 : 深圳市福永鎮塘尾村塘橋路聚源工業區 QIAO TANG RD., TANGWEI VILLAGE FU YONG TOWN SHENZHEN CITY CHINA TEL: / FAX: /1/3 1 CompoTEK GmbH - Lindwurmstrasse 97a Munchen - quarze@compotek.de

2 HSX321S SPECIFICATION INDEX ITEM PAGE 1. QUARTZ CRYSTAL UNIT SPECIFICATION MARKING & DIMENSIONS INSIDE STRUCTURE EMBOSS CARRIER TAPE&REEL... a. DIMENSIONS OF CARRIER TAPE... 6 b. DIMENSIONS OF REEL c. STORAGE CONDITION... 7 d. STANDARD PACKING QUANTITY... 7 e. MATERIAL OF TAPE... 7 f. LABEL CONTENTS... 7 g. TAPING DIMENSION... 8 h. JOINT OF TAPE... 8 i. RELEASE STRENGHT OF COVER TAPE... 8 j. PACKAGE MECHANICAL PERFORMANCE ENVIRONMENTAL PERFORMANCE SUPPLEMENT FLOW CHART Environmental Workload Chemical Substance Components List TEST DATA /1/3 2

3 1. QUARTZ CRYSTAL UNIT SPECIFICATION 1. Frequency: 48.MHz 2. Holder type : HSX321S 3. Frequency tolerance: +/-1 ppm at 25deg.C +/-3deg.C 4. Equivalent resistance: 5 ohms Max. / SERIES 5. Storage temperature range: -4 deg.c To +85 deg.c 6. Operable temperature range: -2 deg.c To +7 deg.c 7. Temperature drift: +/-1 ppm -2 deg.c To +7deg.C 8. Loading capacitance (CL) : 16. pf 9. Drive level: 1 uw (1uW Max) 1. Shunt Capacitance: 2. pf Max 11. Insulation resistance : More than 5M ohms at DC 1V 12. Mode of oscillation: Fundamental 13. Circuit: Measured in HP/E51A,S&A 25B 14. Shocking : Dropping from 5 cm height 3 times on firm wood Variation : Frequency less than +/-5 ppm Resistance less than +/- 15 % or 2ohms max. 15. Aging: Less than +/-3 ppm/year 16. Holder HSX321S Seam type 17. Dimensions and marking Refer to page Emboss carrier tape & reel Refer to page.6 and page Note:. 212/1/3 3

4 2. HSX321S MARKING & DIMENSIONS Chamfer index mark depends on the ceramic base supplier. *Marking should be printed as following: Logo, Nominal Frequency, Manufactured year & month *Nominal frequency = integer only ( ex MHz 14 ) *Manufacturing Lot No. (Y: year) ex. 2 shall be marked as (As shown on the Table-1) (M: month) ex. June shall be marked as F (As shown on the Table-2). Marking : Laser marking. (Table-1) Year Code (Table-2) Jan. Feb. Mar. Apr. May. Jun. Jul. Aug. Sep. Oct. Nov. Dec. A B C D E F G H J K L M 212/1/3 4

5 3. INSIDE STRUCTURE Reference drawing 1) Base: Alumina Ceramic (Al 2 O 3 ) Metallized Pad: Ni Plating Au Plating (2) Lid : Fe- Ni -Co (3) Crystal Enclosure Seal: Seal Seam (4) Crystal Blank Rectangular At-Cut Quartz Crystal Blank (5) Adhesive Silver Conductive Silicon Resin Adhesive bonding: upper & lower bonding/lower bonding only (6) PAD Alumina Ceramic (Ni. Au) (7) Cover Ring: Fe-Ni-Co Alloy The use prohibition chemistry substance of Table 1 of DHE-24-1 (HE-QA-24) is not included in this item. 212/1/3 5

6 4. HSX321S EMBOSS CARRIER TAPE & REEL a.) Dimensions of Carrier Tape b.) Dimensions of Reel 212/1/3 6

7 (Table-2) FLANCE HUB (UNIT: mm) ITEM MARK DIMENSIONS ANGLE Center Core slit Diameter A ψ18+/-3 Inner Width W1 9.3+/-.3 Outer Width W /-1. Out Line diameter B ψ6.5+/-.5 F /- Width F /- F /- Position q 12deg Spindle diameter C ψ13.2+/-.5 Key Ditch Width E 3.+/-.2 c.) Storage condition Temperature: +4deg.C Max. Relative Humidity: 8% Max. d.) Standard packing quantity 3,PCS / REEL e.) Material of the tape Tape Carrier tape Top tape Material PS Conductive Polyester f.) Label contents Sticks label for every reel. 212/1/3 7

8 g.) Taping dimension Cover-tape Leader Carrier-tape Cover-tape Terminal Carrier-tape The length of cover-tape in the leader is more than 4 mm including empty embossed area. After all products were packaged, must remain more than twenty pieces or 4 mm empty area, which should be sealed by cover-tape. The tip of cover-tape shall be fixed temporary by paper tape and roll around the core of reel one round. The empty embossed area which are sealed by top cover-tape must remain more the 4 mm. Terminal Components Leader Emptv compartments Emptv compartments Top cover-tape Embossed Carrier-tape h.) Joint of tape The carrier-tape and top cover-tape should not be jointed. i.) Release strength of cover tape It has to between.1n to.7n under following condition. Pulling direction 165 to 18 Speed 3mm/min. Otherwise unless specified. 165 ~ 18 Pulling direction Other standards shall be based on JIS C /1/3 8

9 j.) Package 212/1/3 9

10 5. Mechanical Performance Item Test Methods 1 Natural Drop Drop 3 times from the height of 5cm onto min. 3mm thickness hard wooden board. 2 Vibration Frequency 1-55Hz, Sine Wave full amplitude of.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. 3 Sealing Tightness Leak Rate 1.x1-8 Pa-m 3 /sec. Max. Measured by Helium leak detector. Fine Leakage. 4 Solder ability After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-.5 sec. Specifications Code A A --- B 6. Environment Performance Item Test Methods 1 Humidity Temperature 6 +/ -2,RH 9~95%, Duration of 24 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. 2 Storage in Low Temperature 3 Storage in High Temperature -4deg.C +/-2deg.C, Duration of 24 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. +85deg.C +/-2deg.C, Duration of 24 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. 4 Temperature cycles -4deg.C +/-2deg.C (3min) +85deg.C +/-2deg.C (3min) 25 cycles. Back to the room temperature first, then in 1~2 hours, the component shall be checked. Specifications Code A A A A Specifications code A B Specifications Frequency variation shall be within +/-5ppm and equivalent resistance shall be within the specification after the test More than 9% of lead shall be covered by new solder. 212/1/3 1

11 7. Supplement 7.1.Soldering 7.2.Please stay with our proposed reflow condition and do then soldering 2 times max. Available for Lead Free Soldering 26 deg.c Temperature 22 deg.c 16~18deg.C (3) (1) (2) Time (1) Preheat 16~18 deg.c 12sec. (2) Primary heat 22 deg.c 6sec. (3) Peak 26 deg.c 1sec. Max. 7.3.Land pattern layout(example) 7.4.Solder iron (Example) Bit temp.:35 max.,time:3sec max.,each terminal solder a 1 time max. 212/1/3 11

12 7.5.Mounting This component is designed for automatic insertion. However, you are requested to do the trial with your insertion machine in order to be sure of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause Soldering Process. 7.6.Cleaning Cleaning liquid which corrodes Nickel shall not be used It may cause the problem on the surface, color, marking etc. Ultra-sonic cleaning is possible, however, you are requested to check on your board. Because we only checked as single unit. 7.7.Storage Please keep away from high temperature and high humidity,which may cause put solderbility. No direct Sunlight, No dew as well. 212/1/3 12

13 8. Flow Chart LID( 外殼蓋 ) BLANK( 晶片 ) BASE( 基座 ) 1 LID 進料檢查 Incoming Inspection of LID 4 BLANK 進料檢查 Incoming Inspection of BLANK 3 BASE 進料檢查 Incoming Inspection of BASE 2 LID 洗淨 Cleaning of LID 5 化學蝕刻 Etching 6 頻率選別 Freq. Sorting 7 8 蒸著前洗淨 Cleaning before Base Plating 微蝕刻 Flash Etching 9 基礎蒸著 Base Plating 1 押入接著 Blank Ass'y 11 接著硬化 Adhesive Curing 12 接著檢查 Bonding 13 調整蒸著 / ION Partial Partial Adjustment/Ion Partial 14 中間檢查 ($) Middle 22 氣密檢查 II ( 氦氣加壓 ) Leak II (Helium Pressurization) 15 高真空烘烤 Annealing in High Vacuum 23 氣密檢查 II (HE) Leak II 16 熔接 Seam Seal 17 強勵振 Over Drive 18 REFLOW 24 最終檢查 ($) Final 25 TAPING 19 老化 Aging 26 Taping 外觀檢查 of Taping ($): 特殊特性 (For Special Characteristics) 2 印字 + 外觀檢查 Marking & 21 氣密檢查 I (AIR) Leak I 出貨 Shipment 出貨檢查 Outgoing Inspection 出貨捆包 Packing to Shipment/stock 212/1/3 13

14 9. Environmental Workload Chemical Substance Components List Environmental Workload Chemical Substance Components List PERCENTAGE TYPE H(D)SX321S Chemical Substance Components 2.5(mg) ppm Si Au Co & Co Compound Mo & Mo Compound Ag Cu Cr & Cr Compound Al Mn & Mn Compound W & W Compound Ni & Ni Compound Fe /1/3 14

15 REV. No. DATE REASON CONTENTS 212/1/3 New 212/1/3 15