COMPARATIVE THERMAL ANALYSIS ON HEAT SINK WITH DIFFERENT GEOMETRIES
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1 COMPARATIVE THERMAL ANALYSIS ON HEAT SINK WITH DIFFERENT GEOMETRIES S.L.N.Reddy 1, P.H.C.Prasad 2, Mohammed Hussain 3 1 Department of Mechanical Engineering, Aditya Engineering College (India) 2 Department of Mechanical Engineering, Aditya College of Engineering (India) Received: May 18, 2018 Accepted: June 18, 2018 ABSTRACT Heat sink is a device used to remove the heat produced in electronic appliances which are work with the aid of electrical power. This removal of heat is desirable to satisfy the designed parameters of the equipment. In this paper a heat sink is designed to compare and improve the results of temperature and heat flux parameters. Comparison of design a heat sink with rectangular fins, rectangular fins of slot rectangular and slot circular. This analysis is carried out in two states - steady and transient conditions. Materials used for heat sink geometry are aluminum (Al) and copper(cu). Design part is done by using solid works and analysis is done by ANSYS software. Keywords: Heat sink, Temperature and Heat flux distribution, Fins with rectangular and circular slots, Aluminum and Copper materials. Modeling: The design is done in solid works with a geometry 150*150*25 mm. In rectangular slotted heat fin the slot is made a dimensions of 80*10 mm In circular slotted heat fin hole of diameter 10 mm is made. After designing it is converted to IGES files which are imported in ANSYS WORK BENCH. Research Paper IJRAR- International Journal of Research and Analytical Reviews 2121
2 [ VOLUME 5 I ISSUE 2 I APRIL JUNE 2018] E ISSN , PRINT ISSN MATERIALS AND BOUNDARY CONDITIONS: Properties Aluminum Alloy 6063 Copper Density (kg/m3) Sp. Heat (Cp) (J/kgK) Thermal Conductivity (W/mK) In this analysis the blocks are modeled and heat sink is modeled with a temperature of 300 o C. In this case heat sink material considered as aluminum alloy and copper alloy. The analysis is done at atmospheric temperature of 295K. Boundary conditions are entered as follows: Heat source: - Temperature of 300 o C, Aluminum alloy and copper properties are assigned. Heatsink: it is receiving heat from the heat source, so heat flux is applied on the heat sink. After applying the above boundary conditions, Simulation is performed under steady state conditions and transient state conditions. Solid Steady state aluminum Solid Steady state copper Solid transient state aluminum Solid transient state copper 2122 IJRAR- International Journal of Research and Analytical Reviews Research Paper
3 Solid steady state aluminum Solid steady state copper Solid transient state aluminum Solid transient state copper Aluminum rectangular slots Aluminum circular slots Research Paper IJRAR- International Journal of Research and Analytical Reviews 2123
4 [ VOLUME 5 I ISSUE 2 I APRIL JUNE 2018] E ISSN , PRINT ISSN copper rectangular slots copper circular slots Aluminum transient temperature Aluminum transient temperature Copper transient temperature Copper transient temperature 2124 IJRAR- International Journal of Research and Analytical Reviews Research Paper
5 Aluminum heat flux Aluminum heat flux copper heat flux copper heat flux Research Paper IJRAR- International Journal of Research and Analytical Reviews 2125
6 [ VOLUME 5 I ISSUE 2 I APRIL JUNE 2018] E ISSN , PRINT ISSN Aluminum heat flux transient Aluminum heat flux transient copper heat flux transient copper heat flux transient TABLES Steady state thermal Transient thermal Aluminum Copper Steady state thermal Transient thermal Aluminum e e e e-10 Copper 1.432e e e e-10 Aluminum Copper Aluminum Copper Aluminum e e e e-10 Copper e e e e IJRAR- International Journal of Research and Analytical Reviews Research Paper
7 Aluminum 1.224e e e e-10 Copper e e e e-9 CONCLUSION: The thermal analysis is conducted on heat sink with different geometry and two different materials are used. As per theresults copper shows good temperature distribution than aluminumand while comparing the geometry rectangular slots shows good temperature distribution. REFERENCES 1. P VijayaSagar,KKiranChand,THERMAL ANALYSIS OF AN AUTOMOBILE RADIATOR WITHAND WITHOUT LOUVERED FINS, International Conference On Recent Trends In Mechanical Engineering, ISSN Number (Online): KM Sajesh, Neelesh And Siddhartha Kosti,DESIGN MODIFICATION AND HEAT TRANSFER ANALYSIS OF AIR COOLED RECTANGULAR FIN ENGINE,International Journal Of Recent Scientific Research,Vol. 7, Issue, 3, Pp , March, Deepak Gupta, VigneshVenkataraman, RakeshNimje, CFD AND THERMAL ANALYSIS OF HEAT SINK AND ITS APPLICATIONS IN CPU,International Journal Of Emerging Technology And Advanced Engineering, (ISSN , ISO 9001:2008 Certified Journal, Volume 4, Issue 8, August 2014). 4. Mr. Mehul S. Patel, Mr. N.M.Vora, Thermal Analysis Of I C Engine Cylinder Fins Array Using CFD,International Journal Of Advance Engineering And Research Development (IJAERD) Volume 1,Issue 5,May 2014, E-ISSN: , Print-ISSN: Deepak Gupta,MominNausheen,A.D. Dhale, CFD Analysis & Simulation Of Pin Fin For Optimum Cooling Of Motherboard, 2014 IJEDR Volume 2, Issue 2 ISSN: Research Paper IJRAR- International Journal of Research and Analytical Reviews 2127
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