Aerospace Products. Quality Flows. 1. Introduction

Transcription

1 1. Introduction Design and manufacturing facilities meet international quality standards. For Space, Avionic and Military Projects, production screenings and qualification are compliant either with ESCC 9000 or MIL-PRF Atmel is fully DSCC QML qualified for level Q (military) and V (space), effective December Qualification is granted up to 0.18 µm CMOS technology based products. RHA (Radiation Hardness Assurance) certification is valid from October Atmel is ESCC qualified for MH1RT asic s according to ESCC (ESCC QML) and has begun the certification and qualification process for ATC18RHA asic s. Aerospace Products

2 2. Quality Management System (QMS) 2.1 Space Quality Flow 2.2 Military Quality Flow Level A (SLA) Compliant with ESCC System Compliant with MIL-PRF System Screening compliant ESCC 9000 Screening compliant MIL-PRF QML-V Procurement specification : ESCC Detail specification or SMD Level B (SLB) Screening equivalent to ESCC 9000 Screening equivalent to MIL-PRF QML-V Procurement specification : Atmel Product Specification (PS) Level A (MLA) Compliant with MIL-PRF System Screening compliant MIL-PRF QML-Q Procurement specification : SMD Level B (MLB) Screening equivalent to MIL-PRF QML-Q Procurement specification : Atmel Product Specification (PS) Level C (MLC) Screening Atmel Military Temperature Range flow Procurement specification : Atmel Datasheet 2

3 Table 2-1. Prototype Offering Reference Document Notes: Standard Product Procurement specification Datasheet Design Review Document Wafer Fab Standard processes X X Rad Tolerant processes X X Probe Go-no-go X X Assembly Package type Multilayer Multilayer Test Test 25 C Go-no-go X X 1. Samples are manufactured according to an engineering flow only. Wafers are electrically tested at room temperature only, and no inspection is performed during the assembly, which means that these prototypes are not suitable for any kind of qualification or flight use. 2. Atmel denies the right and will not accept any responsibility for prototypes used outside of the stated conditions and cannot provide device failure analysis in the event of any such issues occurring. ASIC 3

4 2.3 Space Projects These flows apply to devices built with Radiation Tolerant or Radiation Hardened wafer fabrication processes. Table 2-2. Reference Document Space Projects Compliance MLA MLB SLA SLB QML-Q flow (1) Atmel QMS QML-V flow (1) ESCC flow (1) ESCC QML Atmel (1, 2) flow MIL-PRF X X X - - X ESCC X X - PID X X - QMS Procurement specification (3) SMD Atmel Product Spec SMD ( Detail Spec Detail Spec Atmel Product Spec Traceability Process traceability Lot traceability Part traceability - - X X X X Wafer Fab Radiation Tolerant process Process monitoring review Probe Go-no-go Assembly Package type Multilayer Multilayer Multilayer Multilayer Multilayer Multilayer Die inspection TM 2010 cond B TM 2010 cond A and ESCC X X X X X X Acceptance - - -Sem ESCC TM X X X X -Wafer lot acceptance (4) - - X X X X -Precap (5) - - X X X X High temperature stabilization bake Thermal Cycling Constant acceleration Pind Test TM1008 TM1010 Cond C TM2001 Cond E TM2020 Cond A - - X X X X 4

5 Table 2-2. Fine leak (6) TM1014 cond A Gross leak TM1014 Cond C Serialisation - - X X X X Rx Test Space Projects Compliance TM X - - X Test 25 C go-nogo X X Test 25 C with record - - X X X X Burn-in 125 C, 160h, VCC +10% (7) TM1015 Burn-in 125 C, 240h, VCC +10% (7) TM1015 MLA MLB SLA SLB QML-Q flow (1) Atmel QMS QML-V flow (1) ESCC flow (1) ESCC QML Atmel (1, 2) flow X X X X X X Test 55, 25 and 125 C go-nogo X X Test 25 C with record and drift - - X X X X Test -55 C, +125 C with record - - X X X X PDA - - X (8) X (9 X (9) X (8) QMS Fine leak (6) TM1014 cond A X X - (20) X X - Gross leak IVE Lot qualification electrical test (10) TM1014 Cond C TM2009 ESCC X X - (20 X X - 0/116 (12) 0/116 (12) 0/116 (12) - - 0/116 (12) assembly test (11) MI-PRF /4 (10) 0/4 (10) 0/4 (10) 0/5 (10, 13) 0/5 (14, 15) 0/4 (10) life test ESCC /45 (14) 0/45 (14) (10, 16, 0/45 0/15 (10, 13) 0/15 (14) (10, 16, 0/45 package test 0/53 (14) 0/53 (14) 0/53 (14) 0/30 (10, 13 0/30 (14 0/53 (14) 17) 17) Radiation test (10, 13) TM 1019 ESCC /22 0/22 0/22 0/22 (18, 19) delivery Certificate of Conformity Data package - - X X X X Note: 1. Alternative methods could be introduced after Space Agencies approval, Customer will be notified 2. For ESCC qualified products according to ESCC For ASIC devices, dedicated procurement specification ((AID or Asic Sheet) has to be approved latest at Prototypes Approval 5

6 4. Wafer lot Acceptance includes Wafer thickness, Metallization thickness, SEM, Glassivation thickness, QBD (charge in oxide), Parametric tests Review and radiation test report if applicable. 5. Precap is carried out by Atmel Quality representative 6. Fine leak is done with fixed method, A1 according to TM Alternative temperature and time combinations per method 1015 are permissible 8. Rejects at room temperature taken in account. Limit at 5% with 3% functional 9. Rejects at three temperatures taken in account. Limit at 5% 10.lot by lot test 11.For solderability test, for J and L lead packages, one lead on two is untested to avoid bridging during the testt 12.Alternative method may be introduced according to TM If required in the Purchase Order 14.Periodic test 15.Solderability is performed lot by lot on 5 parts. 16.Test performed with 45 parts for 1000 hours or 22 parts during 2000 hours at 125 C.For lot less than or equal to 200 parts, the number of devices shall be the greater of 5 or 10% of the lot, SEC results (from the 3 previous months) shall supplement devices to result in a sample of 22 parts. For ASIC, the sample is fixed at 5 parts with the balance being made up of the SEC. 17.Alternative temperature and time combinations per method 1005 are permissible 18.Parts packing compliant with ESCC Parts held for a period exceeding 36 months are re-screening as minimum versus Mil-M

7 2.4 Military Projects These flows apply to devices built with standard fabrication processes. Table 2-3. Reference Document Military Projects MLA MLB MLC Compliance QML-Q flow (1) Atmel QMS MIL-PRF X X - Procurement specification SMD (2) Atmel Product Spec Datasheet Traceability Process traceability X X X Lot traceability X X X Part traceability Wafer Fab Standard processes X X X Process monitoring review X X X Probe Go-no-go X X X Assembly Package type Multilayer Multilayer Multilayer Seal glass Die inspection Atmel spec - - AQL 0.4% TM2010 Cond B X X - Thermal Cycling TM1010 Cond C X X - Constant acceleration TM2001 Cond E X X - Pind Test TM2020 Cond A Fine leak (3) TM1014 cond A X X X Gross leak TM1014 Cond C X X X Test Test 25 C Go-no-go X X - Burn-in 125 C, 160h, VCC +10% (4) TM1015 X X - Test 25 C Go-no-go X X X Test -55 C, +125 C Go-no-go X X X Fine leak (3) TM1014 Cond A X X - Gross leak TM1014 Cond C X X - IVE TM2009 X X X Lot qualification electrical test (5, 6) 0/116 0/116 - assembly test (5, 8) MIL-PRF /4 0/4 - life test (7) 0/45 (8) 0/45 (8) - package test (7) 0/53 (8) 0/53 (8) - Delivery (9) Certificate of Conformity X X - 7

8 Note: 1. Alternative methods could be introduced after DSCC Agency approval, Customer will be notified 2. For ASIC devices, dedicated AID has to be approved latest at Prototypes Approval 3. Fine leak is done with fixed method, A1 according to TM Alternative temperature and time combinaisons per method 1015 are permissible 5. Lot by lot test 6. Alternative method may be introduced according to TM Periodic test 8. For solderability test, for J and L lead packages, one lead on two is untested to avoid bridging during the test 9. Parts held for a period exceeding 36 months are re-screening as minimum versus Mil-M Document Revision History 3.1 Rev D 06/08 1. Update in compliance with Mil-Prf rev H. 2. Correction in MLC flow: Test at three temperatures added. 8

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