Cypress Semiconductor Mold Compound Qualification Report
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1 Cypress Semiconductor Mold Compound Qualification Report QT# VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound Thin Quad Flat ack, (TQF), MSL3 ASE Taiwan CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Rene Rodgers Reliability Director Staff Reliability Engineer (408) (408)
2 ackage: Thin Quad Flat ack (TQF) age 2 of 8 Qual Report Description of Qualification urpose RODUCT QUALIFICATION HISTORY Date Comp Qualify EME 7320 Molding Compound, 160-lead TQF ackage, Feb Qualify EME 7320 Molding Compound, 100-lead TQF (14 x 14 x 1.4mm), 144-lead (20 x 20 x x1.4mm) and 128-lead (14 x x20 x 1.4mm) ackage, Nov 00
3 ackage: Thin Quad Flat ack (TQF) age 3 of 8 MAJOR ACKAGE INFORMATION USED IN THIS QUALIFICATION ackage Designation: A100 ackage Outline, Type, or Name: 100-pin Thin Quad Flat ack (TQF) Mold Compound Name/Manufacturer: Sumitomo EME 7320 Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: Lead Finish, Composition / Thickness: Die Backside reparation Method/Metallization: Die Separation Method: Die Attach Supplier: Copper Solder late, 85%Sn, 15%b Wafer Saw Ablestik Die Attach Material: Ablestik 8361 Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta JA C/W: ackage Cross Section Yes/No: Thermosonic Gold/ 1.3mil 60 C/W Assembly rocess Flow: Name/Location of Assembly (prime) facility: ELECTRICAL TEST / FINISH DESCRITION Test Location: Fault Coverage: 100% Note: lease contact a Cypress Representative for other packages availability.
4 ackage: Thin Quad Flat ack (TQF) age 4 of 8 MAJOR ACKAGE INFORMATION USED IN THIS QUALIFICATION ackage Designation: A128 ackage Outline, Type, or Name: 128-pin Thin Quad Flat ack (TQF) Mold Compound Name/Manufacturer: Sumitomo EME 7320 Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: Lead Finish, Composition / Thickness: Die Backside reparation Method/Metallization: Die Separation Method: Die Attach Supplier: Copper Solder late, 85%Sn, 15%b Wafer Saw Ablestik Die Attach Material: Ablestik 8361 Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta JA C/W: ackage Cross Section Yes/No: Thermosonic Gold/ 1.0mil 45 C/W Assembly rocess Flow: Name/Location of Assembly (prime) facility: ELECTRICAL TEST / FINISH DESCRITION Test Location: Fault Coverage: 100% Note: lease contact a Cypress Representative for other packages availability.
5 ackage: Thin Quad Flat ack (TQF) age 5 of 8 MAJOR ACKAGE INFORMATION USED IN THIS QUALIFICATION ackage Designation: A144 ackage Outline, Type, or Name: 144-pin Thin Quad Flat ack (TQF) Mold Compound Name/Manufacturer: Sumitomo EME 7320 Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: Lead Finish, Composition / Thickness: Die Backside reparation Method/Metallization: Die Separation Method: Die Attach Supplier: Copper Solder late, 85%Sn, 15%b Wafer Saw Ablestik Die Attach Material: Ablestik 8361 Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta JA C/W: ackage Cross Section Yes/No: Thermosonic Gold/ 1.3mil 42 C/W Assembly rocess Flow: Name/Location of Assembly (prime) facility: ELECTRICAL TEST / FINISH DESCRITION Test Location: Fault Coverage: 100% Note: lease contact a Cypress Representative for other packages availability.
6 ackage: Thin Quad Flat ack (TQF) age 6 of 8 RELIABILITY TESTS ERFORMED ER SECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result /F High Accelerated Saturation Test 1) QT #002403, QT # Bias : 5.5V, 130 C, 85%RH recondition: JESD22 Moisture Sensitivity Level Hrs., 30 C/60%RH Temperature Cycle 1) QT #002403, QT # High Temperature Storage 1) QT # MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C recondition: JESD22 Moisture Sensitivity Level 3 165C, no bias Thermal Shock 1) QT # Cypress Spec Hrs., 85 C/85%RH Acoustic Microscopy, Level 3 1) QT #002403, QT # X-Ray Cypress Spec ) QT # Cypress Spec
7 ackage: Thin Quad Flat ack (TQF) age 7 of 8 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism ACOUSTIC - MSL3 CY7C09579V-AC TAIWN-G COM 15 0 CY7C09379-AC TAIWN-G COM 15 0 CY7C43684-AC TAIWN-G COM 15 0 HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V)RE COND 192 HR 30C/60%RH CY7C09579V-AC TAIWN-G 128H 48 0 CY7C09379-AC TAIWN-G 128H 45 0 CY7C43684-AC TAIWN-G 128H 48 0 TC CONDITION C, -65C TO 150C, RE COND. 192 HRS 30C/60% RH (MSL3) CY7C09579V-AC TAIWN-G CY7C09579V-AC TAIWN-G CY7C09579V-AC TAIWN-G CY7C09379-AC TAIWN-G CY7C09379-AC TAIWN-G CY7C09379-AC TAIWN-G CY7C43684-AC TAIWN-G CY7C43684-AC TAIWN-G CY7C43684-AC TAIWN-G
8 ackage: Thin Quad Flat ack (TQF) age 8 of 8 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism ACOUSTIC CY7C375I-AC TAIWN-G COM 15 0 CY7C375I-AC TAIWN-G COM 15 0 CY7C375I-AC TAIWN-G COM 15 0 HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V)RE COND 192 HR 30C/60%RH CY7C375I-AC TAIWN-G HIGH TEM STORAGE, LASTIC, 165C CY7C375I-AC TAIWN-G TC CONDITION C, -65C TO 150C, RE COND. 192 HRS 30C/60% RH (MSL3) CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G THERMAL SHOCK, CONDITION B (150C, -55C) CY7C375I-AC TAIWN-G CY7C375I-AC TAIWN-G X-RAY (EXAMLE: LOOKING FOR WIRE-SWEE) CY7C375I-AC TAIWN-G COM 15 0
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12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of HANA Thailand as Additional Assembly and Test Site for Select SSOP Package Devices Change Notification / Sample Request Date: January 16,
QUALIFICATION REPORT RELIABILITY LABORATORY
QUALIFICATION REPORT RELIABILITY LABORATORY PCN #: IIRA-19WCBW841 Date: Jan 21, 2014 Qualification of 28L QFN (6x6x0.9mm) package at MTAI assembly site. The 28L QFN (5x5x0.9mm), 20L QFN (5x5x0.9mm, 4x4x0.9mm)
Analog & MEMS Group (AMG)
PRODUCT/PROCESS CHANGE INFORMATION PCI AMG/17/10616 Analog & MEMS Group (AMG) Introduction of a new Lead-frame in ST Bouskoura for AMG products (Analog & MEMS Group) in SO8 package 1 WHAT: Progressing
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3674ECM+T Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
PRODUCT / PROCESS CHANGE NOTIFICATION. 1. PCN basic data
PRODUCT / PROCESS CHANGE NOTIFICATION 1. PCN basic data 1.1 Company STMicroelectronics International N.V 1.2 PCN No. ADG/18/10672 1.3 Title of PCN LQFP64 (Muar): Standardization and High Density LeadFrame
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of NFME as additional Assembly and Test Site for Select Devices Change Notification / Sample Request Date: June 29, 2017 To: MOUSER PCN Dear
PRODUCT / PROCESS CHANGE NOTIFICATION. 1. PCN basic data
PRODUCT / PROCESS CHANGE NOTIFICATION 1. PCN basic data 1.1 Company STMicroelectronics International N.V 1.2 PCN No. AMG/17/10447 1.3 Title of PCN Material set change on TSSOP14 and TSSOP16 packages for
IPG (Industrial & Power Group) Industrial Power Conversion. Linear Voltage Regulators & Vref Quality and Reliability. Reliability Report.
Reliability Report BE Change New frame TO220 SG T.V: L7805 Product Line General Information LX05 Wafer fab Locations SINGAPORE Ang Mo Kio Product Description POSITIVE VR 1.5A 5V Assembly plant SHENZHEN
Final Product/Process Change Notification Document # : FPCN22191XF Issue Date: 23 April 2018
Title of Change: SOIC-8 Insourcing to ON Semiconductor Carmona, Philippines (OSPI) Factory from GEM (China). Proposed first ship date: 30 July 2018 Contact information: Contact your local ON Semiconductor
Environmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3637ETM+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of HNT as an additional assembly site for select devices in the MSSOP (DGK, DGN, DGQ, and DGS) package Final Change Notification Date: 7/30/2010
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20121120000 Qualification of CLARK-AT as new assembly site for affected device(s) moving from SCSAT, corresponding package change from punched RSP
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of CLARK-AT as new assembly site for affected device(s) moving from SCSAT, corresponding package change from punched RSP to sawn RHH and associated
Process Change Notice #
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Reliability Qualification Report
Reliability SUF-1000 SUF-2000 SUF-3000 SUF-4000 SUF-5000 The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions.
Analog, MEMS and Sensors Group
28-october-2015 Report ID 2015-W44 -SOAG PRODUCT/PROCESS CHANGE NOTIFICATION PCN AMS/15/9514 Analog, MEMS and Sensors Group New material set in ST Bouskoura for AMS products in SO8 and SO14 packages October
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20170216000 Qualification of NFME as an additional Assembly & Test site for select devices Change Notification / Sample Request Date: February 17,
PRODUCT/PROCESS CHANGE NOTICE (PCN)
Date Effective: Contact: Bimla Paul Date Code Other Title: Product Quality Assurance Attachment: Yes No Phone #: (408) 574-6419 E-mail: Bimla.Paul@idt.com Samples: DESCRIPTION AND PURPOSE OF CHANGE: Die
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20150713000 Qualification of NFME as additional Assembly and Test Site for Select Devices Change Notification / Sample Request Date: 7/30/2015 To: