CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION
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1 CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION PCN: DATE: December 16, 2002 Subject: 32 SOJ Mold Compound Changed to EME6600HR & EME9600HR at OMEDATA To: Description of change: The mold compound will be changed from NITTO MP8000CH to Sumitomo EME6600HR EME9600HR for all the 32 SOJ packages assembled at OMEDATA. EME9600HR molding compound will be used only for the products which are Alpha particle sensitive (RAM 7 & Higher). Benefit of change: Improves the reliability of the product. Qualification status: Completed. QTP# is attached for reference. The molding compound used for qualification was EME6600HR. An additional qualification is not required for EME9600HR because EME6600HR and EME9600HR has similar properties. CML (Cypress Manufacturing Limited, Philippines) has qualified EME6600HR and EME9660HR and they have been shipping production unit using EME6600HR and EME9600HR molding compound. Sample status: Samples are available by contacting our local sales office NORTH FIRST STREET SAN JOSE, CA (408) FAX (408)
2 CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION PCN: DATE: December 16, 2002 Subject: 32 SOJ Mold Compound Changed to EME6600HR & EME9600HR at OMEDATA Cypress part numbers affected: CG5143AFT CY7C VC CY7C1021B-12VIT CY7C1041B-20VI CG5624ATT CY7C VCT CY7C1021B- CY7C1041BL-20VC CG5950AFT CY7C1019- CY7C1021B-15VI CY7C1041BL-20VCT CS3909BFT CY7C1019BV33-10VCT CY7C1021B-15VIT CY7C1041BV33-12VC CS4577BFT CY7C1019BV33-12VC CY7C1021BL-15VC CY7C1041BV33-15VC CS4579BFT CY7C1019BV33-12VCT CY7C1021BV33-10VC CY7C1041BV33- CS5242BM CY7C1019BV33-12VI CY7C1021BV33-10VCT CY7C1041BV33-15VI CY7C1006B-15VC CY7C1019BV33-12VIT CY7C1021BV33L- CY7C1041BV33-15VIT CY7C1006B- CY7C1019BV33-15VC CY7C1021CV33-10VC CY7C1041BV33-20VC CY7C1007B-12VC CY7C1019BV33- CY7C1021BV33L- CY7C1041BV33L-12VC CY7C1007B-15VC CY7C1019CV33-10VC CY7C1021CV33-10VC CY7C1041BV33L-15VC CY7C1007B-25VCT CY7C1019CV33-10VCT CY7C1021CV33-10VCT CY7C1041CV33-10VC CY7C1009B-12VC CY7C1019CV33-12VC CY7C1021CV33-12VC CY7C1041CV33-12VC CY7C1009B-12VCT CY7C1019CV33-12VCT CY7C1021CV33-12VI CY7C1041CV33-12VI CY7C1009B-15VC CY7C1019CV33-12VI CY7C1021CV33-12VIT CY7C1041CV33-15VC CY7C1009B- CY7C1019CV33-12VIT CY7C1021CV33-15VC CY7C1041CV33- CY7C1009B-15VI CY7C1019CV33-15VC CY7C1021CV33- CY7C1041CV33-15VI CY7C1009B-15VIT CY7C1019CV33- CY7C1021CV33-15VI CY7C1041CV33-20VC CY7C1009B-20VC CY7C1019CV33-15VI CY7C1021CV33-15VIT CY7C1046B-15VC CY7C1009B-20VCT CY7C VC CY7C1021CV33-8VC CY7C1046B- CY7C1018BV33-12VC CY7C1020B-12VCT CY7C1041B-12VCT CY7C1046BV33-15VC CY7C1018BV33-12VCT CY7C VCT CY7C1041B-15VC CY7C1046BV33- CY7C1018CV33-10VC CY7C VC CY7C1041B- CY7C1046CV33-10VC CY7C1018CV33-12VC CY7C1021- CY7C1041B-15VI CY7C1046CV33-12VC CY7C1018CV33-12VCT CY7C1021B-12VC CY7C1041B-15VIT CY7C1046CV33-15VC CY7C1018CV33-15VC CY7C1021B-12VCT CY7C1041B-20VC CY7C1046CV33-15VI CY7C1049BV33-15VC CY7C109B-15VC CY7C1049B-12VC
3 CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION PCN: DATE: December 16, 2002 CY7C1049B-25VCT CY7C106B-20VC CY7C1399B-10VC CY7C1049B-25VI CY7C106B-25VC CY7C1399B-12VC CY7C1049B-25VIT CY7C106B-25VCT CY7C1399B-12VCT CY7C1049BL-17VC CY7C107B-15VC CY7C1399B-12VI CY7C1049BL-17VCT CY7C107B- CY7C1399B-15VC CY7C1049BL-20VC CY7C107B-15VI CY7C1399B- CY7C1049BL-25VC CY7C107B-20VCT CY7C1399B-15VI CY7C166- CY7C166-20VC Subject: 32 SOJ Mold Compound Changed to EME6600HR & EME9600HR at OMEDATA CY7C1049B-12VCT CY7C1049CV33-12VI CY7C109B-35VCT CY7C1049B-15VC CY7C1049CV33-15VC CY7C109BL-15VC CY7C1049B- CY7C1049CV33- CY7C109BL-15VI CY7C1049B-15VI CY7C1049CV33-15VI CY7C109BL-15VIT CY7C1049B-17VC CY7C1049CV33-15VIT CY7C128A-15VC CY7C1049B-17VCT CY7C1049CV33-20VC CY7C128A-20VC CY7C1049B-20VC CY7C1049CV33- CY7C128A-20VCT 20VCT CY7C1049B-20VCT CY7C1049CV33-20VI CY7C128A-25VC CY7C1049B-20VI CY7C106B-12VC CY7C128A-25VCT CY7C1049B-20VIT CY7C106B-15VC CY7C128A-35VC CY7C1049B-25VC CY7C106B- CY7C128A-35VCT CY7C1049BV33-12VC CY7C109B-12VC CY7C1399B-15VIT CY7C1049BV33- CY7C109B-12VCT CY7C199-25VCT 12VCT CY7C1049BV33-12VI CY7C194-20VC CY7C1399BL- CY7C1049BV33-12VIT CY7C109B- CY7C166-15VC CY7C1049BV33- CY7C109B-15VI CY7C1049BV33-15VIT CY7C109B-15VIT CY7C1049BV33-20VC CY7C109B-20VC CY7C166-20VCT CY7C1049BV33- CY7C109B-20VCT CY7C166-25VC 20VCT CY7C1049BV33-20VI CY7C109B-20VI CY7C166-25VCT CY7C1049BV33L-15VCCY7C109B-20VIT CY7C167A-35VC CY7C1049CV33-10VC CY7C109B-25VC CY7C1049CV33- CY7C109B-25VCT 10VCT CY7C1049CV33-12VC CY7C109B-35VC CY7C182-25VC CY7C182-25VC CY7C199L-15VC
4 CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION PCN: DATE: December 16, 2002 Subject: 32 SOJ Mold Compound Changed to EME6600HR & EME9600HR at OMEDATA CY7C185-20VC CY7C197-35VC CY7C421-20VC CY7C185-20VCT CY7C197-35VCT CY7C421-25VC CY7C185-25VC CY7C197-45VCT CY7C421-25VCT CY7C185-25VCT CY7C199-10VC CY7C425-20VC CY7C185-25VI CY7C199-10VCT CY7C425-30VIT CY7C185-25VIT CY7C199-12VC CY7C429-20VC CY7C185-35VC CY7C199-12VCT CY7C429-25VC CY7C185-35VCT CY7C199-12VI CY7C433-25VC CY7C185-35VI CY7C199-12VIT CY7C419- CY7C185-35VIT CY7C199-15VC CY7C421-15VI CY7C187-15VC CY7C199- CY7C421-20VC CY7C187- CY7C199-15VI CY7C421-25VC CY7C187-25VC CY7C199-15VIT CY7C421-25VCT CY7C187-25VCT CY7C199-20VC CY7C425-20VC CY7C187-35VC CY7C199-20VCT CY7C425-30VIT CY7C187-35VCT CY7C199-20VI CY7C429-20VC CY7C188-15VC CY7C199-20VIT CY7C429-25VC CY7C188- CY7C199-25VC CY7C433-25VC CY7C188-20VC CY7C199-15VC CY7C421-15VI CY7C188-20VCT CY7C199- CY7C421-20VC CY7C188-25VC CY7C199-15VI CY7C421-25VC CY7C188-25VCT CY7C199-15VIT CY7C421-25VCT CY7C188-35VC CY7C199-20VC CY7C425-20VC CY7C192-12VC CY7C199-20VCT CY7C425-30VIT CY7C192-12VCT CY7C199-15VC CY7C429-20VC CY7C192-15VC CY7C199- CY7C429-25VC CY7C192- CY7C199-15VI CY7C433-25VC CY7C192-25VC CY7C199-15VIT CY7C192-25VCT CY7C194-15VC CY7C194- CY7C195-20VCT CY7C197-12VC CY7C197-12VCT CY7C197-15VC CY7C197- CY7C197-20VC CY7C197-25VC CY7C197-25VCT CY7C199-20VC CY7C199-20VCT CY7C199L- CY7C199L-15VIT CY7C408A-25VIT CY7C408A-35VC CY7C409A-35VC CY7C409A-35VCT CY7C419-15VC CY7C419- CY7C421-15VI
5 CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION PCN: DATE: December 16, 2002 Subject: 32 SOJ Mold Compound Changed to EME6600HR & EME9600HR at OMEDATA Customer part numbers affected: Approximate Implementation Date: Expected release date to production is WW Response Required: Sincerely, Mike Burke Director of Quality Al Laxman PCN Process Manager
6 Cypress Semiconductor Molding Compound Qualification Report QTP# VERSION 1.0 November, 2002 Sumitomo EME-6600HR Molding Compound 32.4 lead SOJ package, MSL 3 at Omedata (INDNS-O) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Al Laxman Reliability Director Quality Engineering (408) (408)
7 PACKAGE QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Sumitomo EME 6600HR Molding Compound for 32-lead (400 mil) SOJ package with die size x mils assembled at OMEDATA Indonesia Date Comp Oct 02
8 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: V32411 Package Outline, Type, or Name: 32-lead (400 mil) Plastic Small outline J-Bend (SOJ) Mold Compound Name/Manufacturer: Sumitomo EME 6600HR Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: Copper Lead Finish, Composition / Thickness: Solder Plate, 85%Sn, 15%Pb Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: Ablestik 8361 Die Attach Method: Epoxy Bond Diagram Designation: Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0um Thermal Resistance Theta JA C/W: 55.6 C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Name/Location of Assembly (prime) facility: OMEDATA Indonesia (INDNS-O) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: OMEDATA Indonesia (INDNS-O) Fault Coverage: 100%
9 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Temperature Cycle JEDEC22, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity MSL Hrs., 30 C/60%RH+3IR-Reflow, 220 C+5, -0 C Pressure Cooker 121 C, 100%RH Precondition: JESD22 Moisture Sensitivity MSL Hrs., 30 C/60%RH+3IR-Reflow, 220 C+5, -0 C P P Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) 2,200V MIL-STD-883, Method V Cypress Spec P P High Temperature Storage 150 C, no bias P Resistance to Solvents Cypress Spec P X-Ray Cypress Spec P Acoustic Microscopy, MSL3 Cypress Spec P
10 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism ACOUSTIC, MSL3 CY7C1046BV33-VC (7C1346C) INDNS-O COMP 10 0 CY7C1046BV33-VC (7C1346C) INDNS-O COMP 15 0 CY7C1046BV33-VC (7C1346C) INDNS-O COMP 10 0 ESD-CHARGE DEVICE MODEL, 500V CY7C1046BV33-VC (7C1346C) INDNS-O COMP 9 0 CY7C1046BV33-VC (7C1346C) INDNS-O COMP 9 0 CY7C1046BV33-VC (7C1346C) INDNS-O COMP 9 0 ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, 2,200V CY7C1046BV33-VC (7C1346C) INDNS-O COMP 9 0 CY7C1046BV33-VC (7C1346C) INDNS-O COMP 9 0 CY7C1046BV33-VC (7C1346C) INDNS-O COMP 9 0 STRESS PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60% RH, MSL3 CY7C1046BV33-VC (7C1346C) INDNS-O X-RAY CY7C1046BV33-VC (7C1346C) INDNS-O COMP 96 0 HIGH TEMPERATURE STORAGE, PLASTIC, 150C CY7C1046BV33-VC (7C1346C) INDNS-O CY7C1046BV33-VC (7C1346C) INDNS-O RESISTANCE TO SOLVENTS CY7C1046BV33-VC (7C1346C) INDNS-O COMP 15 0 TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60% RH, MSL3 CY7C1046BV33-VC (7C1346C) INDNS-O CY7C1046BV33-VC (7C1346C) INDNS-O CY7C1046BV33-VC (7C1346C) INDNS-O CY7C1046BV33-VC (7C1346C) INDNS-O CY7C1046BV33-VC (7C1346C) INDNS-O CY7C1046BV33-VC (7C1346C) INDNS-O
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