Cypress Semiconductor Automotive Package Qualification Report
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1 Automotive ackage Qualification Report QT# VERSION 1.0 May 2009 Automotive 56-Lead QFN NidAu, MSL3, 260C Reflow Amkor-Korea (L) CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) Mira Ben-Tzur Quality Engineering Director (408)
2 Automotive 56-Lead QFN, NidAu, MSL3, 260C Reflow age 2 of 7 ACKAGE QUALIFICATION HISTORY Qual Report Description of Qualification urpose Qualify Automotive ackage 56 QFN SoC Radon device CY8C LFXA, EME G700 Mold Compound, Ablestik 8290 epoxy, NidAu, MSL3/260C, Amkor (L) Date Comp May 09
3 Automotive 56-Lead QFN, NidAu, MSL3, 260C Reflow age 3 of 7 MAJOR ACKAGE INFORMATION USED IN THIS QUALIFICATION ackage Designation: LY56 ackage Outline, Type, or Name: 56-Lead QFN Mold Compound Name/Manufacturer: Hitachi EME-G700 Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: Ni-d-Au Die Backside reparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation: Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0mil Thermal Resistance Theta JA C/W: 23 C/W ackage Cross Section Yes/No: N/A Assembly rocess Flow: Name/Location of Assembly (prime) facility: Amkor-Korea (L) MSL Level 3 Reflow rofile 260C ELECTRICAL TEST / FINISH DESCRITION Test Location: CML-R
4 Automotive 56-Lead QFN, NidAu, MSL3, 260C Reflow age 4 of 7 RELIABILITY TESTS ERFORMED ER SECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Early Failure Rate High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) AEC-Q and JESD22-A108 Dynamic Operating Condition, Vcc Max = 5.5V, 125 C JESD22-A110, 130C, 5.25V, 85%RH recondition: JESD22-A113 Moisture Sensitivity MSL Hrs, 30C/60%RH+3IR-Reflow, 260 C+0, -5 C Result /F Temperature Cycle JESD22-A104, -65 C to 150 C recondition: JESD22-A113 Moisture Sensitivity MSL Hrs, 30C/60%RH+3IR-Reflow, 260 C+0, -5 C ressure Cooker JESD22-A102, 121C, 100%RH, 15 sig recondition: JESD22-A113 Moisture Sensitivity MSL Hrs, 30C/60%RH+3IR-Reflow, 260 C+0, -5 C Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) NVM Endurance /Data Retention (lastic ) NVM Endurance / High Temperature Operating Life AEC-Q V/1000V/1500V/2000V AEC-Q V/500V/750V AEC-Q , 150 C, non-biased AEC-Q and JESD22-A108, 125C Dynamic Operating Condition, Vcc = 5.5V Acoustic Microscopy JEDEC JSTD-020, Cypress Spec Wire Ball Shear AEC-Q , Cypress Spec Wire Bond ull Mil-Std 883, Method 2011, Cypress Spec Electrical Distribution AEC-Q Final Visual Inspection Cypress Spec Lead Integrity JESD22-B105 hysical Dimensions JESD22-B100/108, Cypress Spec ost Temp Cycle Wire Bond ull Mil-Std 883, Method 2011 Solderability JESD22-B102, Cypress Spec Static Latchup AEC-Q , 125C, 5.4V, ± 200mA, 6.5V, ± 240mA Cypress Spec Constructional Analysis Cypress Spec Dye enetrant Test Cypress Spec
5 Automotive 56-Lead QFN, NidAu, MSL3, 260C Reflow age 5 of 7 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C24894 (8C24894AC) L-KOREA COM 22 0 CY8C24894 (8C24894AC) L-KOREA COM 22 0 CY8C24894 (8C24894AC) L-KOREA COM 22 0 STRESS: BALL SHEAR CY8C24894 (8A24894AC) L-KOREA COM 30 0 STRESS: BOND ULL CY8C24894 (8A24894AC) L-KOREA COM 30 0 STRESS: CONSTRUCTIONAL ANALYSIS CY8C24894 (8C24894AC) L-KOREA COM 5 0 STRESS: DATA RETENTION, 150C non-biased CY8C24894 (8C24894AC) L-KOREA STRESS: DYE ENETRANT TEST CY8C24894 (8C24894AC) L-KOREA COM 15 0 CY8C24894 (8C24894AC) L-KOREA COM 15 0 CY8C24894 (8C24894AC) L-KOREA COM 15 0 STRESS: ELECTRICAL DISTRIBUTION CY8C24894 (8A24894AC) L-KOREA COM 30 0 CY8C24894 (8A24894AC) L-KOREA COM 30 0 CY8C24894 (8A24894AC) L-KOREA COM 30 0 STRESS: HIGH TEM DYNAMIC OERATING LIFE-EARLY FAILURE RATE, 125C, 5.5V, Vcc Max CY8C24894 (8A24894AC) L-KOREA CY8C24894 (8A24894AC) L-KOREA CY8C24894 (8A24894AC) L-KOREA STRESS: ENDURANCE CY8C24894 (8C24894AC) L-KOREA STRESS: ESD-CHARGE DEVICE MODEL, 200V CY8C24894 (8A24894AC) L-KOREA COM 3 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8C24894 (8A24894AC) L-KOREA COM 3 0 STRESS: ESD-CHARGE DEVICE MODEL, 750V CY8C24894 (8A24894AC) L-KOREA COM 3 0
6 Automotive 56-Lead QFN, NidAu, MSL3, 260C Reflow age 6 of 7 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT ER JESD22-A114-B, 500V CY8C24894 (8A24894AC) L-KOREA COM 3 0 STRESS: ESD-HUMAN BODY CIRCUIT ER JESD22-A114-B, 1,000V CY8C24894 (8A24894AC) L-KOREA COM 3 0 STRESS: ESD-HUMAN BODY CIRCUIT ER JESD22-A114-B, 1,500V CY8C24894 (8A24894AC) L-KOREA COM 3 0 STRESS: ESD-HUMAN BODY CIRCUIT ER JESD22-A114-B, 2,000V CY8C24894 (8A24894AC) L-KOREA COM 3 0 STRESS: FINAL VISUAL CY8C24894 (8C24894AC) L-KOREA COM CY8C24894 (8C24894AC) L-KOREA COM CY8C24894 (8C24894AC) L-KOREA COM STRESS: STATIC LATCH-U TESTING, 125C, 5.4V, +/200mA CY8C24894 (8A24894AC) L-KOREA COM 6 0 STRESS: STATIC LATCH-U TESTING, 125C, 6.5V, +/240mA CY8C24894 (8A24894AC) L-KOREA COM 6 0 STRESS: HYSICAL DIMENSIONS CY8C24894 (8A24894AC) L-KOREA COM 10 0 CY8C24894 (8A24894AC) L-KOREA COM 10 0 CY8C24894 (8A24894AC) L-KOREA COM 10 0 STRESS: OST TEM CYCLE WIRE BOND ULL CY8C24894 (8C24894AC) L-KOREA COM 5 0 STRESS: RESSURE COOKER TEST, 121C, 100%RH, 15 sig, RE COND 192 HR 30C/60%RH, MSL3 CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.25V, RE COND 192 HR 30C/60%RH, MSL3 CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA
7 Automotive 56-Lead QFN, NidAu, MSL3, 260C Reflow age 7 of 7 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: SOLDERABILITY CY8C24894 (8C24894AC) L-KOREA COM 15 0 CY8C24894 (8C24894AC) L-KOREA COM 15 0 CY8C24894 (8C24894AC) L-KOREA COM 15 0 STRESS: TC COND. C -65C TO 150C, RE COND 192 HRS 30C/60%RH, MSL3 CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA CY8C24894 (8C24894AC) L-KOREA
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