ISMI Next Generation Factory (NGF) Roadmap Realization

Transcription

1 ISMI / SEMATECH Symposium Japan 2008 Accelerating Manufacturing Productivity ISMI Next Generation Factory (NGF) Roadmap Realization Joe Draina Director ISMI 30 October 2008 Copyright 2008 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2 Outline NGF Perspective ISMI NGF Program Mission Capabilities NGF Roadmap ISMI Projects Factory Modeling Summary October 23,

3 NGF fab improvement activity at ISMI ISMI Programs 450mm 450mm Metrology Continuing metrology advancement Environment Safety and Health Positioning for the future Continuous Improvement Individual spot solutions 300mm NGF Global infrastructure for equipment and factory development in 300mm NGF Progression 300 mm Classic Factories Benchmarking, 200mm and mature fab productivity improvement topics 200mm October 23,

4 300mm NGF program and ISMI activity - related to industry NGF Industry NGF Activity Process Equipment Development Device Development ISMI - NGF Fab Development and Improvement Metrology ESH CIP Classic Factories 300 NGF 450 Progression Other NGF development Today s presentation: Realizing the NGF Roadmap October 23,

5 ISMI NGF program mission Target improvements to increase equipment and factory productivity Address hardware and software infrastructure requirements Focus on waste reduction Provide a complementary forward-compatible approach for 300mm NGF to 450mm Enable retrofit of NGF capabilities into existing 200mm and 300mm factories where applicable October 23,

6 ISMI NGF objectives Key supplier engagement, establish strategic relationship and coordination for major equipment improvement First wafer delay, availability and predictability, quality data access and usage Identify requirements to implement small lot manufacturing and single wafer processing Identify productivity improvements necessary to implement continuous processing October 23,

7 ISMI NGF program capabilities NGF Target for 2012 centered at - 50% Cycle Time Reduction - 30% Cost Reduction Access to high quality data Performance monitoring Minimal setup time and FWD Predictability Availability Cascading Adaptive scheduling Fully automated material handling Small lot size transitioning to single wafer manufacturing Wafer oriented manufacturing October 23,

8 ISMI NGF roadmap capabilities sort Factory Equipment Global infrastructure Standards, guidelines October 23,

9 Realized factory capabilities roadmap Initial roadmap published; key stakeholders engaged NGF program approved, 19- point Guidelines document issued Small Lot Size and Waste Reduction benefits identified Equipment performance monitoring and PPM Cascading improvements EEQA/PPM processes integrated, support by industry standards Prototype of true single-wafer processing NGF CT and cost targets achievable in 300mm fabs; first instance of SWP /50 targets set, NGF program started High quality equipment data available on demand 12-wafer support implemented in BEOL; requirements for WOM and SWP understood Implementation of 12-wafer lots demonstrated in 300mm fab First 300mm factory implements flexible lot size, WOM and adaptive scheduling October 23,

10 Realized equipment capabilities roadmap Initial roadmap published; key stakeholders engaged Equipment capabilities monitored directly by equipment control system PPM implemented across 300mm tool set NGF program approved, 19- point Guidelines document issued Small Lot Size and Waste Reduction benefits identified Equipment availability and cascading improvements Automation and embedded control systems for critical tools support continuous flow of material in flexible lots /50 targets set, NGF program started High quality equipment data available on demand Basic visualization and analysis tools for monitoring Equipment performance monitoring and PPM implemented on first tools Waste reduction results demonstrated Complete EEQA/PPM integration and support by industry standards SWP solutions implemented NGF CT and cost targets achievable in 300mm fabs; first instance of SWP October 23,

11 Realized infrastructure capabilities roadmap Initial roadmap published; key stakeholders engaged NGF program approved, 19- point Guidelines document issued Equipment capabilities guidelines published (EEQA support) EEQA/PPM integrated into supplier business processes and support by industry standards NGF CT and cost targets achievable in 300mm fabs; first instance of SWP /50 targets set, NGF program started Guidelines published for EDA Metadata Models, Data Quality and RaP Small Lot Size impact on typical CIM system infrastructure published First 300mm factory implements flexible lot size and WOM NGF-related standards approved by various global standards organizations SWP supported by all Infrastructure systems October 23,

12 NGF roadmap next steps Share roadmap with suppliers Solicit feedback Develop roadmap for individual selected equipment suppliers Alignment of equipment supplier roadmaps to ISMI NGF roadmap Encourage equipment supplier participation October 23,

13 ISMI NGF projects projects SLS Factory for Small Lot Size EDA - Equipment Data Acquisition DQ - Data Quality EEQA - Enhanced Equipment Quality Assurance PPM Predictive Preventative Maintenance ECM Equipment Chamber Matching VM Virtual Metrology Enabling Seamless Cascading October 23,

14 Factory for small lot size Objectives: Identify the equipment and manufacturing systems impacts, capabilities, user requirements, consensus guidelines, standards, usage scenarios, and test criteria required to enable small lot size for high-mix or accelerated cycle time factories Evaluate and offer solutions 12-wafer lot size factory compared to 25-wafer lot size Support scenarios with highest impact to cycle time for 12-wafer size Factory challenges October 23,

15 Equipment data acquisition/data quality Objectives: Accelerate the commercial availability, maturity, and realization of the EDA interface Improve equipment self-description (metadata), based on member company requirements and update the SEMI EDA suite of standards Establish requirements, guidelines, standards, and best practices for the availability and delivery of high quality equipment data Enable using a data quality standard, a data quality evaluation method, supplier data quality improvements cycles, and a fab-wide time synchronization demonstration October 23,

16 Enhanced equipment quality assurance (EEQA) - equipment productivity improvement Objectives: Work with suppliers to build equipment data structure and visualization for intrinsic quality improvement Define quality assurance data set required from suppliers Define quality management data set required for use by device makers, execute and publish pilot program results Nominate a target supplier and tool list for pilot program Promote EEQA implementation through supplier interaction, piloting studies, and implementation October 23,

17 Predictive preventative maintenance (PPM) - equipment productivity improvement Objectives: Establish requirements, guidelines, and feasibility for the use of data and factory systems to enable improved productivity through the use of predictive maintenance capabilities Demonstrate supplier PPM capabilities and promote the adoption and implementation of PPM methods for the industry ISMI Confidential October 15 July ,

18 Equipment chamber matching (ECM) - Equipment productivity improvement Objectives: Identify and demonstrate methods that enable member companies to reduce process variation between common process chambers Use improved chamber matching capabilities and methodologies to reduce tool dedication, reduce tool qualification time, and reduce process and equipment variation High value to ISMI membership already demonstrated inside factories utilizing ISMI ECM methodologies ISMI Confidential October 23,

19 Virtual metrology (VM) Objectives: Create methodology for implementing Virtual Metrology in the fab. Demonstrate how to identify most significant parameters to reduce dependence on real wafer measurements Define VM and VM data requirements, perform pilots or prototypes, model VM contributions to reduction of cost and cycle time, publish VM implementation guide and lessons learned ISMI Confidential October 23,

20 Enabling seamless cascading Objectives: Develop cascade and dispatching scenarios to identify the requirements that are needed to enable seamless cascading of wafers to process equipment uninterrupted flow Develop ISMI guidelines that define cascading and dispatching strategies for both the factory-side and equipment Work towards standards to enable factory wide cascading and dispatching by working together with both member companies and suppliers Engage with suppliers where needed to develop solutions consistent with guidelines and standards ISMI Confidential October 23,

21 Accelerating Manufacturing Productivity Factory modeling Copyright 2008 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

22 Factory modeling Background: Previous factory modeling showed cycle time opportunities up to 51% but at the expense of increased manufacturing costs Updated model assumptions: No batching of lots Evolve batch tools to single wafer tools Introduction of different cascading scenarios Utilize additional gained factory capacity to introduce more wafer starts with the same capital equipment October 23,

23 Productivity and cost opportunities: Factory modeling Factor Modeling Targets Cycle Time Cost Availability 87% 91% From To 25-Wafer 12-Wafer 25-Wafer 12-Wafer First Wafer Delay MIN % 12.8% 4.6% 4.4% Setup MIN Batch SWP Cascading LOTS LOTS 6/ % 29.3% -0.3% 0.5% 1,2,4 1,2 35% 39% 1.7% 1.6% NPW 12% 10% 1.8% 1.5% Overall 46% 62% 7.5% 8.0% October 23,

24 Factory modeling summary Results: Improvement potential of 62% lower cycle time (CT) together with 8% cost reduction for a 12 wafer lot simulation has been identified 25 wafer batches: 46% lower CT and 8% lower cost opportunity Future work: Modeling trials of less than 12 wafer lots Modeling has not yet explicitly identified the means to achieve 50% cycle time and 30% mfg cost improvement However, year to year modeling results show improvement toward the 50/30 goal. October 23,

25 Next steps supplier communications Inform supplier community about NGF program Public events SEMICON Japan, SEMICON West, ISMI Symposium Collaboration meetings Key equipment supplier 1:1 meetings Align NGF and supplier roadmaps Solicit equipment supplier inputs Integrate roadmaps Engage with equipment suppliers Commit suppliers to engage in ISMI projects ECM, EDA/DQ, PPM, EEQA October 23,

26 300mm NGF summary ISMI NGF target remains 50% cycle time and 30% cost improvement Current model shows a potential of 60% and 10% improvement respectively NGF roadmap and vision is in place ISMI has projects in place to work toward realization of capabilities Active key supplier engagement in progress October 23,

27 Accelerating Manufacturing Productivity Thank you Joe Draina Director ISMI 30 October 2008 Copyright 2008 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.