ISMI 450mm Industry Briefing

Transcription

1 Accelerating Manufacturing Productivity ISMI 450mm Industry Briefing July 14th, 2010 SEMICON West Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2 Accelerating Manufacturing Productivity Opening Remarks Scott Kramer Vice President of Manufacturing Technology Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

3 Opening Remarks Industry activity Technical progress - ISMI Industry readiness Equipment Demonstration Testing Industry challenges 14 July

4 Accelerating Manufacturing Productivity Briefing Agenda Tom Jefferson 450mm Program Manager Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

5 July 2010 Briefing Agenda mm Program Overview 450mm Silicon Readiness 450mm Process and Metrology Readiness Test Wafer Generation Equipment Development Updates Demonstration Test Methods 450mm Factory Infrastructure Readiness Factory Integration Vacuum Platform Summary and Key Messages Question and Discussion Session 14 July

6 Coordinating Industry Convergence towards 450mm 2007 Early design Equipment readiness Equipment prototypes Equipment Demonstrations Test Wafer Generation Test plans Metrology & process equipment development Global Equipment Guidelines EHS Guidelines 2009 Requirements Guidelines Mechanical Wafer Bank Single Crystal Wafer Bank Equipment Performance Metrics (EPMs) Interoperability Test Bed (ITB) Early prototypes 2008 Technology intercept node defined 25 wafer FOUP Carrier & loadport interoperability 14 July

7 ISMI 450mm Program Mission and Organization ISMI s 450mm Mission Statement Enable a cost-effective 450 mm transition through coordination and development of infrastructure, guidance, and industry readiness ISMI 450mm Organization 450mm Transition Program Supplier Engagement Test Wafer Operations Vacuum Platform Development Factory Integration Readiness Starting Materials Equipment Test Methods and Metrics 14 July

8 450mm Progress 2009->2010 Jul-2009 Jul-2010 Wafer Inventory Process and Metrology Equipment Factory Integration Standards and Guidelines Single crystal wafers available for development 1 st 450mm equipment ordered Multiple carriers, loadports and EFEMS in testing. Mech. Wfr standard passed ~440 wafers loaned to 25 suppliers 450mm Particle inspection, wafer edge inspection, wet cleaning, lot sorter, and ellipsometer equipment installed and operational Experiments started for thermal oxidation and oxide deposition/etch. 450mm EHS Guidelines Defined 450mm Factory Integration is reasonably mature ISMI ITB is nearing completion AMHS pilot lines exist, and are under evaluation FOUP and Loadport standards completed Developmental wafer Standard completed Solid Progress But Many Challenges Remain 14 July

9 ISMI Supplier Acknowledgement The ISMI 450mm Program would like to acknowledge the following companies* for their support and participation in the 450mm Program: Angstrom Sun Brooks Automation CyberOptics Corp Entegris, Inc. Gudeng Precision Industrial Hirata Corp MEMC NanoPhotonics Oxford Instruments Rorze Siltronic Sinfonia Asyst Technologies CDE Daifuku Genmark Automation H-Square IDC Muratec Nikko PolyFlow SSEC SUMCO TDK *Partial List 14 July

10 ISMI Equipment Development and Demonstration Strategy Initial Wafers + Initial toolset Basic Test Wafers Equipment Performance Metrics (EPMs) Equipment Development Better Wafers + Larger Equipment Set Advanced Test Wafers -Higher quality - Higher quantity - More types Equipment capable of meaningful demonstration Demonstration Test Methodology (DTM) 14 July

11 Accelerating Manufacturing Productivity 450mm Starting Materials Activities Mike Goldstein (Intel) Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

12 Silicon Industry Update All major silicon suppliers are engaged in the 450mm program and manufacturing developmental test wafers. Wafer quality is continuously improving: Polishing process is better. Scratches have been eliminated. Particle levels have been reduced dramatically. Suppliers are able to manufacture wafers with LLS ( 0.09 μm) of per cm 2 and are working to improve wafer shipping. (10x improvement in ~6month) Surface metals metrology is in development. Inspection equipment is coming (slowly) on line. Wafer shipping methodology is in development. We are engaged with suppliers to close gaps in silicon manufacturing and inspection line. Improved hybrid wafers have been developed and both concentric and eccentric types are available July

13 450mm Surface Quality Improvements mm Surface Quality Improvement 12 Wafer Defects (Lower is Better) Key Surface Parameter Target 2 0 Q3'09 Q4'09 Q1'10 Q2'10 Time Polishing has been improved scratches have been eliminated 2010 Cleaning has been improved particle levels have been reduced 10X 14 July

14 In-line geometry measurement tools Kuroda Measurement System Kobelco Measurement System E&H Measurement System Wafer geometry inspection tools have been developed in Japan (Kuroda and Kobelco) and in Germany (E&H) July October

15 SEMI spec SEMI spec M76 : SPECIFICATION FOR DEVELOPMENTAL 450 mm DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS was published in June Three different kind of wafers have been defined to assist manufacturers in choosing the most cost effective wafers for a given application: Particle monitors Lithography monitors Other monitors for general applications We would like to thank all the Silicon SEMI standards members for their contribution July

16 ISMI activities Benchmark silicon suppliers state of the art Work with suppliers to improve wafer quality. Continuous engagement with wafer inspection OEMs Validate wafers specification in preparation for prime wafer spec generation. Wafer bank loan program have been complemented by OEMs direct wafers purchase from suppliers. We have expended our interface with materials suppliers beyond silicon (E.G. quartzware, sputtering targets), in support of ISMI process test wafers generation July

17 ISMI Wafer Bank Status 450mm Wafer Bank Loans Number of Wafers 50 0 Mar-08 Apr-08 May-08 Jun-08 Jul-08 Aug-08 Sep-08 Oct-08 Nov-08 Dec-08 Jan-09 Feb-09 Mar-09 Apr-09 May-09 Jun-09 Jul-09 Aug-09 Sep-09 Oct-09 Nov-09 Dec-09 Jan-10 Feb-10 Mar-10 Apr-10 May-10 Jun-10 # of Wafers # Wafers Loaned ~300 wafers, more than half single crystal are currently available for loans 14 July

18 Accelerating Manufacturing Productivity ISMI Test Wafer Operations Sung-Wook Park (Samsung) Paul Cherry (Intel) Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

19 ISMI Prototype Wafer Cleans Tool -SSEC Wet Clean tool installation complete in SEMATECH cleanroom SC1 / SC2 cleaning capability 12mm pitch loadport Cleaning experiments underway Cleaner wafers becoming available in ISMI wafer bank Particle experiments with Loadports / Carriers underway 14 July

20 ISMI 450mm Metrology - Particle Inspection, Edge Inspection, Film Thickness Particle Inspection / Edge Inspection Measured over mm wafers to date Thin film measurement ellipsometer Measured over mm wafers to date 14 July

21 450mm FOUP Wash 450mm FOUP washer on order Infrastructure item needed to ensure consistency on particle experiments Projected to be operational in Q July

22 450mm Test Wafer Utilities Matrix Collecting early 450mm utility projections Inputs will be used for 450mm test wafer facility planning Supplier Surveys Consolidate Surveys Supplier Estimates for 450mm equipment facility requirements are Requested 14 July

23 Summary ISMI Test Wafer Operations 450mm equipment installations continues Bare wafer particle/edge inspection Wafer cleaning Film thickness measurements EFEMs / Wafer Sorters FOUP Wash 450mm test wafer processing experiments are progressing Wafer Cleaning Metrology Inspections ISMI continues working with suppliers on Test Wafer capabilities 14 July

24 Accelerating Manufacturing Productivity 450mm Equipment Development - Test Wafer (TW) Infrastructure - Cost-Sharing Program Tom Abell (Intel) Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

25 Building Supplier TW Infrastructure Suppliers are involved in multi-step process flows for the generation of tool development test wafers Initial 3 step flows executed Q4 09. Now 3 are common. 6 or more step flows are presently in fabrication Looped flows have been designed to accelerate tool development (Processing, measurement, processing, reclaim, etc.) Examples of flow capability Particles Wet Clean Particles Metals Measurement* Particles Wet Clean Oxidation Thk/Unif Wet etch Thk/Unif Particles PECVD Oxide Particles Thk/Unif Plasma Etch Thk/Unif * Cross-section analysis Loop 14 July

26 Cost-Sharing Overview ISMI recognizes that the historical financial risk model for wafersize transition funding is no longer relevant Risk-sharing with tool suppliers is expected to realize the 450mm transition Cost-sharing is the planned mechanism to lower the financial risk; may not be necessary for tool development ISMI is prepared to engage in discussions and negotiations concerning resources for funding of development and plan scope Realistic costs for building tools are needed to help determine which projects will be supported and assess levels of support Cost-sharing program is structured to allow suppliers maximum flexibility for consideration Cost-effective transition is the program goal It is expected that suppliers will have different approaches for different business plan objectives There are several decisions to consider in the context of tool development plans and ISMI involvement ISMI requires certain information to evaluate supplier plans 14 July

27 Example Scenarios of Proposals Alpha/prototype At ISMI [ Test Wafer Tool ] Alpha/prototype At supplier [ Provides Test Wafer support remotely ] Demo tool At ISMI At supplier Demo and Advanced Test Wafers at ISMI Demo at supplier and Remote Advanced Test Wafers Alpha/prototype At supplier [ Provides Test Wafer support remotely ] Beta tool At ISMI [ Test Wafer Tool ] At Supplier [ Remote Test Wafer Tool ] Demo tool At ISMI At supplier Demo and Advanced Test Wafers at ISMI Demo at supplier and remote Advanced Test Wafers 14 July

28 ISMI Evaluation of Supplier Plans Plans would be evaluated for: Scope of intended participation Alpha/prototypes, Beta tools, Demonstration tools Which tools will provide Test Wafer support Desired location of each tool Plans for demonstration at each phase Types and quantities of Test Wafers that could be processed/measured for ISMI Timeframe in which tools and capabilities could become available Overall build cost for tools over time Negotiation of agreements should be expected 14 July

29 More Information on Cost-Sharing Two documents are available on ISMI s public website Overview presentation Text document with guidelines 14 July

30 Accelerating Manufacturing Productivity 450mm Demonstration Test Methodology Chin-Chih Chen (tsmc) Lorn Christal (ISMI) Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

31 Introduction The 450mm Demonstration Test Method has consolidated the strategies and inputs for 450mm production equipment development from both IC makers and equipment suppliers 450mm equipment demonstrations will focus on validation of process stability and equipment reliability Basic functionality not changing from 300mm will not be a focus This approach provides an efficient resource demonstration model for the industry Before formal demonstrations begin, early engagement and input from IC maker and equipment supplier will be imperative for the success of demonstration on production equipment 14 July

32 450 mm Demonstration Test Methodology (DTM) Strategy EMA DTM Phase 1 Measurable Process Level 1 Gauge Study, Passive Data Collection Phase 2 Repeatable Process Level 2 Level 1 + Mech. Dry Cycling, Sensitivity Analysis Phase 3 Stable Process Test Level Classification by Consortia Level 3 Level 2 + Marathon Testing (Demo Data) Expected Results nm EPMs 2. Standards 3. Guidelines (HVM) Expected Results nm EPMs 2. Standards 3. Guidelines 32 nm EPMs (scaled to maturity) Equipment suppliers validate basic functionality (w/consortia Monitoring) Consortia validates Repeatability and Stability of Equipment EMA: Equipment Maturity Assessment DTM = Demonstration Test Methodology Results of an EMA will define the appropriate level of testing 14 July

33 What s New in 450mm DTM Comprehensive Equipment Performance Metrics (EPM) including metrics such as ESH, Factory Integration in single document to help supplier on 450mm equipment development Concise definition on Equipment Maturity Assessment (EMA) provides easier understanding for equipment development. The EMA provides an efficient assessment of tool maturity for demonstration purposes. Web-based EMA/ESH/FIMA checklists support online data entry of assessment results. Overall EMA and Factory Integration Maturity Assessment scope (FIMA) reduced ~20% from 300mm We invite innovative ideas from the industry 14 July

34 Benefits of the 450 DTM Process Clear and consistent procedures; standardized methodology for common equipment requirements Tests items scaled-up for wafer size transition with focus on functionality required for demonstration Test methodology provides opportunity for supplier selfassessment prior to EMA E10 conformant calculator will consistently collect and report cluster tool MTBF and Availability 14 July

35 Equipment Demo Flow Method/Approach Data Collection DTM/EMA What s Important User, Working, & Advisory Groups Checklists Assessments Reported Results Foundations Foundations Supplier Input Known or Existing Data Test Planning Checklists Checklists Tests Evaluations Results Reports nm EPMs 2. Standards 3. Guidelines Expected Results Feedback DTM Demonstration Test Method EPM Equip. Performance Metrics 14 July

36 450mm DTM Development Flow I300I Demonstration Knowledge Base Strawman Version Development Now Draft Version Consolidation Input from Member Companies and Equipment Suppliers Trial Run on Current Equipment In 2010 Final Version Optimization Trial Run on Selected Test Wafer Equipment Formal 450mm Demonstrations 14 July

37 ISMI EMA Assistance EMA assessments are available now for suppliers requesting ISMI assistance No cost to suppliers Accelerates development per end-user needs 14 July

38 Accelerating Manufacturing Productivity 450mm Factory Integration Eddy Bass (Intel) Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

39 300 mm vs 450 mm Standards Development Timeline Comparison Decision to start wafer size transition and standards development FI Prelim Stds Avail Approved FI Stds Published 300 mm Transition Many cycles of revising and voting on FI stds mm Transition = = = Org Std Pub Prov or Full Std Pub Ongoing prototype testing ISMI s ITB testing helped to enable a 60-65% time reduction in FI Standards Development vs. 300mm 14 July

40 ITB Lab testing focused on the Latest FOUPs, MACs and Load ports FOUPs Carriers 12mm Pitch Std FOUPs MAC Carrier 12mm Pitch Std MACs TDK 12 mm pitch load port under continuous cycling Completed >123 k cycles with FOUPs Gudeng 12mm Pitch Latch Key FOUP Brooks 12mm pitch load port, compatible with FOUPs and MACs cycling at supplier site Completed >34 k cycles with FOUPs. Planning MAC testing in Q Sinfonia 12mm pitch load port cycling with latest FOUPs Completed >183 k cycles with FOUPs. Working with Sinfonia to test new MAC/FOUP compatible Load port Entegris 12mm Pitch Latch Key FOUP 14 July

41 New Brooks SEMI E154 MAC / FOUP Load Port Cycles mm LP Cycle Data SEMI E Cycles Complete FOUP No FOUP 14 July

42 ITB Robots and Load Port Cycle History 7000 Cumulative Total Robot & LP Cycles 7/7/ Cumulative Robot Moves (x1000) Prelim FOUP & LP Std available for developing prototypes Robot Moves Load Port Cycles 10 to 12 mm Pitch Change Yellow Ballots for FOUP & LP Focus Shifted to Load Ports & MAC FOUP & LP stds approved FOSB and MAC std & line item ballots approved for FOUP & LP stds Cumulative Load Port Cycles (x1000) 0 May-08 Jun-08 Jul-08 Aug-08 Sep-08 Oct-08 Nov-08 Dec-08 Jan-09 Feb-09 Mar-09 Apr-09 May-09 Jun-09 Jul-09 Aug-09 Sep-09 Oct-09 Nov-09 Dec-09 Jan-10 Feb-10 Mar-10 Apr-10 May-10 Jun-10 Jul-10 0 Month >5.0 M Robotic handling moves to date. >648 k Load Port cycles with Std Carriers. After SEMICON West 2009, the key focus shifted to Load Port cycling with FOUPs and MACs 14 July

43 EFEM Sorter Operating in Cleanroom Hirata 450mm EFEM Sorter Two 12mm Pitch load ports Supports both FOUP and MAC opening Graphical User Interface Vac Grip Dual End- Effector/Arm Wafer Handling Robot Wafer Pre- Aligner 14 July

44 Key Learnings from MAC Shipping Tests Non - Palletized Shipment Palletized Shipment Package flipped upside down twice!! International experiment complete Palletize all future shipments to force freight handling (pallet jacks and fork lifts). Include Tiltwatch/shock indicators and improved package labeling 14 July

45 2 PGV Prototypes Evaluated Gudeng PGV IDC PGV Multiple PGVs interoperable with all standard compliant 12mm pitch carriers and demonstrated ready for industry usage 14 July

46 AMHS Testing Planned for H mm OHT 450mm Stocker New 450 mm Stockers and Transport systems are under advanced development at suppliers sites ISMI will assess systems in H2 10 against ISMI 450mm guidelines and interoperability with 450mm standard carriers and load ports Goal is to demonstrate AMHS will be ready for 450 mm pilot lines 14 July

47 Summary 450mm Factory Integration >5.0M robotic moves and >648k load port cycles completed in the ITB with prototype carriers Upgrades to prototype 12mm pitch Std FOUPs, load ports and EFEMs continued to demonstrate good interoperability and reliability Key focus is demonstration of MAC compliance and interoperability Sun-setting ITB after completion of MAC, MAC load port (i.e., new standard load ports), and interoperability with FOUPs and MACs testing Working with AMHS Suppliers to complete evaluations of Stockers and Overhead Hoist Transport before end of July

48 Accelerating Manufacturing Productivity 450mm Vacuum Platform Development Yu-Chi Chen (tsmc) Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

49 450mm Vacuum Platform Roadmap Phase I : Evaluation and Motivation Project initiation Host successfully ISMI 450mm workshop, with 16 suppliers Created preliminary ISMI 450mm platform guidelines Published ISMI 450mm EQP software guidelines Completed test plan (platform only) Phase III : Evaluate the feasibility of platform standardization Engaged with 5 vacuum platform suppliers and had 1 st test proposals Completed early evaluation for 450mm platform standardization Encouraged suppliers to start on site test Phase II : Testing and Integration Test 1 st 450mm platform, at supplier site 14 July

50 450mm Vacuum Platform Development Strategy Preliminary Discussions Summary -450mm platform will enable cost effective 450mm EQP development -ISMI will continue to evaluate the feasibility of platform standardization Cost effective EQP Development Options EQ Supplier A PF Supplier EQ Supplier B How to move forward in Phase III? Key Goal: Balance convergence & divergence 450mm PF Suppliers EQ Suppliers without own PF One EQ Supplier + PF Supplier Integrated by 3 rd parties (Optional) Single EQ Supplier Collaborate EQ Suppliers with own PF 14 July

51 1 st 450mm Platform Configuration -RORZE Type: Pentagon Interface # : 3 process chambers, 2 Load lock 300mm and 450mm wafer handling on the same platform 14 July

52 450mm Vacuum Platform Test Data -Vacuum time for loadlock(1e+5pa to 9e-3Pa) -Slow & first valve for DRYP -Gate valve for TMP -Vacuum time for transfer chamber(1e+5pa to 1e-2Pa) -Slow & first valve for DRYP -Gate valve for TMP - Considerations of the vacuum system dynamic performance when designing the roughing lines for both the Loadlock and the transfer chamber - Other test items (wafer repeatability, exchange time, Marathon test etc.) are on going 14 July

53 Summary 450mm Vacuum Platform Readiness 1 st 450mm vacuum platform test is on going 450mm equipment platforms are becoming available to integrate process chambers ISMI will communicate additional guidelines to suppliers and industry organizations based on Phase II testing results ISMI will continue to develop the match of process chambers and platforms to enable prototype 450mm equipment development 14 July

54 Accelerating Manufacturing Productivity Summary and Key Messages Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

55 Materials Location and Contact Information Materials from today s meeting can be found at the following URL: Document should be posted by end of day today (July 14 th ). For further information, or to engage in opportunities with the ISMI 450mm Program: Tom Jefferson 450mm Program Manager tom.jefferson@ismi.sematech.org 14 July

56 Summary 450mm Readiness July 2010 Test wafer development has started for multiple process and metrology equipment. ISMI is soliciting proposals for 450mm equipment for test wafer generation and/or demonstration and supplier interest is increasing. Silicon suppliers are positioned to provide additional quantities of 450mm wafers - with improved quality SEMI Standards are completed for 450mm FOUPS and loadports, and 450mm Mechanical and Developmental grade wafers. AMHS prototype pilot lines are currently under evaluation. 450mm equipment platforms are becoming available. The strategy for Equipment Demonstration Testing are defined 14 July

57 450mm Transition Key Messages July 2010 ISMI continues to drive the activities required to enable the needs of its members towards the realization of a cost-effective 450mm transition. Industry 450mm readiness is accelerating and gaining momentum in all segments of the supply chain. Challenges remain to realize a comprehensive 450mm infrastructure at advanced technology nodes. Wanted - constructive discussion with companies interested in contributing towards the consortia s 450mm transition goals. 14 July

58 Questions and Discussion ISMI Accelerating Manufacturing Productivity 14 July