Energy Efficient PFC Reduction Technologies and other Energy Saving Solutions Andreas Neuber

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1 Energy Efficient PFC Reduction Technologies and other Energy Saving Solutions Andreas Neuber Head Fab Environmental Solutions, Applied Materials AGS/EPG/FES

2 Executive summary Today, carbon footprint reduction is a task that involves reducing both direct (scope 1) and indirect (scope 2) emissions in manufacturing. This presentation shows how the following can be achieved: Assess and subsequently reduce carbon footprint in general and GHG emissions specifically. Provide the necessary data and easily compile reports in compliance with current EPA reporting regulations. The focus of the presentation is to demonstrate that GHG emissions, as well as power and other resource consumption, can be substantially reduced even for existing fabs. 2

3 Direct and indirect emissions

4 Direct emissions (scope 1) in a semiconductor fab Stationary Combustion Process Emissions Central boiler VOC abatement Local scrubber (burn type) Emissions released during the manufacturing process (e.g., F-GHG, N2O, and ammonia) Fugitive Emissions Unintentional release of GHG from sources including chillers Note: Mobile combustion is not used much in a fab 4

1 kwh/cm2 Si Total semiconductor industry 8.1 GW (fabs only) Assume 0.

5 Process emissions: F-GHG 2014 WSC PFC CONSUMPTION AND EMISSIONS DATA (New gases include CH 2 F 2, C 4 F 6, C 3 F 8, and C 4 F 8 O) Power: 1.1 kwh/cm2 Si Total semiconductor industry 8.1 GW (fabs only) Assume kgco2e/kwh 36.2 MMTCE (scope 2) Source: World Semiconductor Council (WSC) 5

6 ITRS facilities technology requirements (Table ESH5) Year of Production FACILITIES DESIGN Facilities Design WATER Total fab* water consumption (liters/cm 2 ) [1] Meet established goal and metrics Meet established goal and metrics 300mm/450mm fabs mm fabs Total UPW consumption (liters/cm 2 ) [1] Site water recycled/reclaimed** (% of use) ENERGY Total fab energy usage (kwh/cm2) WASTE % 50% 60% 60% 70% 70% 70% 75% 75% 75% 80% 80% 80% 90% 90% 90% (ELECTRICITY, NATURAL GAS, ETC.) Non EUV EUV Hazardous waste (g per cm 2 ) [1] AIR EMISSIONS Volatile Organic Compounds (VOCs) (g per cm 2 ) [1] Fluorinated greenhouse gases, fluorinated heat transfer fluids, and nitrous oxide Normalized emission rate (NER) to be 0.22 kg CO 2 equivalent/cm 2 by as agreed by (WSC) Normalized emission rate (NER) to be 0.22 kg CO 2 equivalent/cm 2 by as agreed by World Semiconductor Council (WSC) Normalized emission rate (NER) <0.22 kg CO 2 equivalent/cm 2 1 Air emission: GHG, NOx, VOC 2 Energy consumption Manufacturable solutions exist, being optimized Manufacturable solutions known Manufacturable solutions are NOT known 6

7 Abatement for GHG: F-GHG and N2O Reduction of GHG is very important, but it also must be energy efficient BKM recipe for poly etch F-GHG reduction in kgco2e/yr 102,908 Abatement consumption with idle Standard in kgco2/yr mode control A Burn-Wet 6,645 5,440 B Burn-Wet 9,384 6,872 C Plasma-Wet 16,504 13,485 Note: Some recipes with small F-GHG flows at low GWP can even show negative effects, i.e. consume more energy during abatement than the reduction of GHG is contributing 7

8 Energy and resource savings

9 Energy consumption: energy is wasted Fab Energy Consumption Wafer Starts Source: ISMI Energy consumption does not track fab utilization. 9

10 Equivalent energy consumption fabwide according to SEMI S23 Hot UPW 4% UPW 6% Heat 7% PCW 6% Exhaust 14% N2 6% CDA 5% Manufacturing use actually 71% of energy in a fab! Power 52% SEMI S23 -> equivalent power consumption 10

11 Pareto Analysis 50.0% 45.0% Key system drivers 40.0% 35.0% 30.0% 25.0% 20.0% 15.0% 10.0% 5.0% 0.0% 12.0% 10.0% 8.0% 6.0% 4.0% Key component drivers 2.0% 0.0% Vacuum pumps + local abatement 11

12 Actual opportunities to reduce energy use High hanging fruit Green mode opportunities Dry pumps Local scrubber Manufacturing tool Subfab components Heater Local chiller RF generator Laser Remote plasma clean Turbo & cryo pumps O3 generator Non process pumps Mini-Env. + other blowers Innovation RTP FCVD CMP vs. SOG Green mode capabilities, Improvements in subfab components Interface opportunities Process support systems Ultrapure water Hot ultrapure water Nitrogen Compressed air Process cooling water Process exhaust Other process gases Process chemicals Precursor Specialty waste disp. Others Normally already optimized Low hanging fruit Infrastructure systems Cleanroom Exhaust treatment VOC Chiller Cooling tower General waste treatment Make-up air handling Other air handing Life safety Mechanical Others Normally already optimized 12

13 Best practices energy savings in subfab BACKGROUND Operating costs in the subfab have been systematically reduced over the last few years. Sometimes this has caused process issues, such as clogging, when purge flows have been selected as too small. SOLUTION Align subfab operation to process, which requires communication of process status to subfab components, specifically dry pumps and abatement (e.g., purge can be reduced without any risk to process when only inert gases are flowing from the process). Two modes will be distinguished (Source: SEMI S23, E167/2) 1. Idle mode (hot standby mode): idle mode The condition where the equipment is energized and readied for process mode (all systems ready and temperatures controlled) but is not actually performing any active function such as material movement or processing. (refer to SEMI S23) 2. Sleep mode: sleep mode the condition where the equipment is energized but it is using less energy than in idle mode. The sleep mode is primarily differentiated from idle mode in that it is initiated by a specific single command signal provided to equipment, either from an equipment actuator, from an equipment electric interface, or a message received through factory control software (e.g. SECS). Other than the possible initiation of the sleep mode by an equipment actuator, entry into the sleep mode does not require manual actions. (refer to SEMI S23) 13

(NF 3 ) VACUUM PUMP ENERGY Energy Savings Energy Savings ABATEMENT

14 Synchronizing subfab matches energy need to operation PROCESS CHAMBER Deposition (SiH 4 ) Clean (NF 3 ) Deposition (SiH 4 ) Clean (NF 3 ) VACUUM PUMP ENERGY Energy Savings Energy Savings ABATEMENT ENERGY Subfab equipment operation synchronized with process to save energy. 14

15 isys 2.0 system overview isys 2.0 QUAD Rack with Controllers Tool Ethernet Cable Remote IO Ethernet Cable Dry Contact Cables 24V DC Remote IO Modules Multiple Pumps Abatement(s) 15

16 Requirements for dry pumps Pump purge and pump speed shall be synchronized with process. Requirements: Idle mode Pump shall allow for multiple (two or three) purge N2 set points depending on type of gases coming from process. Note: VFD changes require sleep level information since frequent acceleration/decceleration cycles would even increase power consumption. Requirements: Sleep mode Pump shall allow for a lower N2 mode as well as one or more levels of reduced speed with a known and guaranteed wake-up time, e.g. to restabilize temperatures. Requirements: Communication Pump shall be able to receive idle and sleep mode signals via dry contacts or other fail safe communication, e.g. Ethernet with Heartbeat signal. When the signal is interrupted the pump shall go automatically in a safe operating mode. The pump shall maintain the interlock signals to the tool, but shall not send alarms to the tool, when the reason for the deviation is the idle/sleep mode itself. Pump shall provide hand shake signals to indicate when they are in a certain saving (green) mode. This will allow accurate recording of achieved savings and several checking functions, but is not available today. 16

17 Requirements for Abatement Abatement operation shall be synchronized with process. Requirements: Idle mode and several levels of processing mode depending on the gas type flowing at how many chambers. Abatement shall allow for multiple oxidising, scrubbing, and purge set points depending on type of gases coming from process, Note: Thermal wet abatement maintains the same temperature. Savings are achieved via less gas flowing to the reactor, Requirements: Sleep mode Abatement shall allow for an lower resource using modes with a known and guaranteed wake-up time, e.g. to restabilize temperatures. Especially to be used for thermal wet abatement systems Requirements: Communication Abatement shall be able to receive idle and sleep mode signals via dry contacts or other fail safe communication, e.g. Ethernet with Heartbeat signal When the signal is interrupted the abatement shall go automatically in a safe operating mode The abatement shall maintain the interlock signals to the tool, but shall not send alarms to the tool, when the reason for the deviation is the idle/sleep mode itself Abatement shall provide hand shake signals to indicate when they are in a certain saving (green) mode. This will allow accurate recording of achieved savings and several checking functions, but is not available today. 17

18 isystem energy/utility savings Abatement utilities Fuel gas Oxidizer (O2, CDA, Air) Power Purge gas (N2, CDA) PCW Water Caustic Foreline Secondary line heater power Pump utilities Pump purge N2 Power PCW Post pump purge Heat load To subfab 18

19 Computer based monitoring/modelling of F-GHG+N2O emissions

20 F GHG and N2O Reporting BASIC CALCULATON MODEL Monitoring of gas flows Conversion efficiencies in tool Monitoring of abatement availability Abatement performance information Emission estimate 20

21 Abatement and Subfab Monitoring Monitor gas consumptions and abatement status 21

22 Recordings/Reports Abatement on/off times and accumulative gas flows for current day, week, and/or month. Process maintenance due dates. Flows for all chambers for all manufacturing equipment. PFC gas removal configured via DRM table. 22

23 Analyze long term trends, weekly, monthly, yearly averages Task: Visualize data Total 1 year 23

24 Database CF4 CHF3 CH2F2 CH3F C2F6 c-c3f6 C3F8 c-c4f8 Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor CF CHF CH2F CH3F C2F c-c3f C3F c-c4f COF CO CO NF N2O NO NO N SF SO2F SO H2S CH C2H C3H TEOS NH H O O F HF Ar He no 0 unlikely 1 likely 2 highly likely 3 24

25 Potential output GHG emission per gas Configurations possible Optional stack locations Per stack - compare with stack measurements Per process area Gas no Gas GWP 1 CF4 6,500 2 CHF3 11,700 3 CH2F CH3F C2F6 9,200 6 c-c3f6 17,340 7 C3F8 7,000 8 c-c4f8 10,000 9 COF CO NF3 16, N2O SF6 23,900 Can be combined with tool energy measurement to provide actual carbon footprint impact 25

26 Overall Impact Assessment 5 20% reduction of NOx, VOC, direct and indirect CO2 emission 5 20% reduction of subfab power consumption (equivalent power) 5 20% of local scrubber water consumption 26

Semiconductor Abatement Systems

Semiconductor Abatement Systems Aug 2013 Jay Jung VP of Marketing What is the customer looking for? Capacity, Capability & Commitment GST Confidential 2 Capacity Size Engineering Capacity Production Capacity