SPECIFICATION TOP LED DEVICE. [Contents]

Transcription

1 *Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE [Contents] 1. Features Application Absolute Maximum Ratings Electro-optical Characteristics Rank of MFT722N-S White balance Color Rank Soldering Profile Outline Dimension Packing Reel Packing Structure Lot number Precaution for Use Characteristic Diagram CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by - 1/13 -

2 1. Features Pb-free Reflow Soldering application RoHS Compliant Material : InGaN() / InGaN(Green) / AlGaInP(Red) 6-Pin (R,G,B separate) type Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin : Silicon Resin 2. Application Indoor and outdoor displays LCD Backlights etc. R G B displays Automotive Signage and Channel letter Indicator 3. Absolute Maximum Ratings *1 (T a =25ºC) Value Parameter Symbol Unit Red Green Forward Current I F ma Forward Peak Surge Current *2 I FM ma Reverse Voltage (per die) V R 5 V Power Dissipation P d 81 *3 120 *3 114 *3 263 *4 mw Operating Temperature T opr -40 ~ +100 ºC Storage Temperature T stg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 I FM was measured at T W 1msec of pulse width and D 1/10 of duty ratio. *3 The value for one LED device.(single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. - 2/13 -

3 4. Electro-Optical Characteristics (T a =25ºC) Parameter Symbol Condition Min Typ Max Unit Red I F =20mA Forward Voltage Green V F I F =20mA V I F =20mA Reverse Current Red V Green I R =5V R (per die) µa Luminance Intensity *1 Red I Green I F =20mA V (per chip) mcd Luminance Flux Red I Green Φ F =20mA V (per chip) lm Red I F =20mA Peak Wavelength Green λ P I F =20mA nm I F =20mA Red I F =20mA Dominant Wavelength Green λ d I F =20mA nm I F =20mA Red I F =20mA Spectral Bandwidth Green λ I F =20mA nm I F =20mA Viewing Angle *2 R, G, B 2θ ½ I F =20mA (per die) deg. Optical Efficiency Red I Green η F =20mA opt (per chip) lm/w *1 The luminous intensity I V was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 2θ ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. - 3/13 -

4 5. Rank of MFT722-SN Rank Name IF Condition RED=9mA, GREEN=20mA, BLUE19mA 1) Special binning (White balance) X 1 Iv X 2 W-Color Rank Luminous Intensity [Total Iv] Rank Total Iv Name MIN MAX N O P Green wavelength [WD] Rank Name Total Iv MIN MAX L M H Luminous Intensity [Iv] R G B MIN MAX MIN MAX MIN MAX Dominant Wavelength [λd] R G B MIN MAX MIN MAX MIN MAX Forward Voltage R G B MIN MAX MIN MAX MIN MAX /13 -

5 6. White balance Color Rank Default Group (Select Group) : Bluish White - Color Coordinates (typ.): x 0.255, y IF Condition = 9mA for Red / 20mA for Green / 19mA for - Color Rank : a, b, c, d, e, f, g, h (8BIN) *1Bin Cell Size : x0.031, y0.024 *8Bin Total Cell Size : x0.076, y g h e f y 0.24 c d 0.22 a b x a b c d X y x y x y x y e f g h x y x y x y x y /13 -

6 CIE(y) CIE(x) - 6/13 -

7 7. Soldering Profile (1) Reflow Soldering Conditions / Profile Lead Solder Pre-heat 130~210 Pre-heat time 120 sec. Max. Peak-Temperature 240 Max. Soldering time Condition 10 sec. Max.. * Condition Lead Solder o 1~5 C / sec. Pre-heating 60sec. Max. 1~5 o 130~210 o C / sec. C Above 210 o C 240 oc Max. 10 sec. Max. cooling 6 o C/sec. Max. 120sec. Max. (2) Lead-free solder Lead Free Solder Pre-heat 180~200 Pre-heat time 120 sec. Max. Peak-Temperature 260 Max. Soldering time Condition 10 sec. Max. * Condition Lead-frame Solder o 1~5 C / sec. Pre-heating 60sec. Max. 1~5 o 180~220 o C / sec. C Above 220 o C 260 oc Max. 10 sec. Max. cooling 6 o C/sec. Max. 120sec. Max. (1) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (2) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don t guarantee the products. - 7/13 -

8 8. Outline Dimension Package Outlines Package Marking (Cathode) Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Circuit Diagram Recommended Solder Pad Anode 6 Green Anode 5 Red Anode 4 1 Cathode 2 Green Cathode 3 Red Cathode ( Tolerance: ±0.2, Unit: mm ) * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Silicon Resin Ag Plating Copper Alloy - 8/13 -

9 9. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package - 9/13 -

10 10. Reel Packing Structure Reel XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a b c 7inch SIDE QUANTITY : XXXX XXX c 1 LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX TOP LED a RoHS b - 10/13 -

11 11. Lot Number The lot number is composed of the following characters; MFT # ~ # MFT First Part Name Year (6 for 2006, 7 for 2007, 8 for 2008 ) Month ( 01 for Jan., 02 for Feb., 11 for Nov., 12 for Dec.) Day ( 01, 02, 03, 04, 28, 29, 30, 31.) # ~# The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : MFT PART NUMBER : MFT722N-S - 11/13 -

12 12. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. - 12/13 -

13 13. Characteristic Diagram Forward Current vs. Forward Voltage Relative Luminous Intensity vs. Forward Current Forward Current IF [ma] 10 Red Forward Voltage VF [V] Green Relative Luminous Intensity I V / I V (20mA) [Rel.] (T A =25ºC) (T A =25ºC) R G B Forward Current I F [ma] Forward Current Derating Curve Radiation Diagram (T A =25ºC) 30 1 CHIP ON Red, Green, Forward Current I F [ma] CHIP ON Ambient Temperature T a [ºC] - 13/13 -