MEC6-XX-02-XX-D-RA1 DVT Test Report

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Project Number: Tracking Code: TC069--0954 Requested by: Richie Gimmel Date: 2/27/2006 Product Rev: 2/27/06 Lot #: 2/27/06 Tech:

1 Project Number: Tracking Code: TC Requested by: Richie Gimmel Date: 2/27/2006 Product Rev: 2/27/06 Lot #: 2/27/06 Tech: Troy Cook Eng: Dave Scopelliti Qty to test: 50 Test Start: 03/08/2005 Test Completed: 4/14/2006 MEC6-XX-02-XX-D-RA1 DVT Test Report

2 CERTIFICATION All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS l and ANSI/NCSL , as applicable. All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec. SCOPE To perform the following tests: See the flowchart located at: F:\DWG\APPLICAT\NPDOCS\EPMS\Projects\pt635\MEC6\Test\MEC6-RA xls APPLICABLE DOCUMENTS Standards: EIA Publication 364 TEST SAMPLES AND PREPARATION 1) All materials were manufactured in accordance with the applicable product specification. 2) All test samples were identified and encoded to maintain traceability throughout the test sequences. 3) After soldering, the parts to be used for LLCR and DWV/IR testing were cleaned according to TLWI ) Either an automated cleaning procedure or an ultrasonic cleaning procedure may be used. 5) The automated procedure is used with aqueous compatible soldering materials. 6) The ultrasonic procedure can be used with either aqueous or non-aqueous soldering components and follows: a. Sample test boards are to be ultrasonically cleaned after test lead attachment, preparation and/or soldering. b. Sample test boards are immersed into Branson 3510 cleaner containing Kyzen Ionox HC1 (or equivalent) with the following conditions: i. Temperature: C+/- 5 C ii. Frequency: KHz iii. Immersion Time: ---5 to 10 Minutes c. Sample test boards are removed and placed into the Branson 3510 cleaner containing deionized water with the following conditions: i. Temperature: C +/- 5 C ii. Frequency: KHz iii. Immersion Time: ---5 to 10 Minutes d. Sample test boards are removed and placed in a beaker positioned on a hot plate with a magnetic stirrer containing deionized water warmed to 55 C +/- 5 C for 1/2 to 1 minute. e. Upon removal, the sample boards are rinsed for ½ to 1 minute at room temperature with free flowing deionized water. f. After the final rinse, the sample test boards are dried in an air-circulating oven for 10 to 15 minutes at 50 C +/- 5 C. g. Sample test boards are then allowed to set and recover to room ambient condition prior to testing. 7) Parts not intended for testing LLCR and DWV/IR are visually inspected and cleaned if necessary. 8) Any additional preparation will be noted in the individual test sequences. 9) Solder Information: 10) Re-Flow Time/Temp: See accompanying profile. 11) Internal Test PCBs used: PCB TST-XX

3 OVEN PROFILE (Soldering Parts to Test Boards)

4 FLOWCHARTS Current Carrying Capacity 1 Piece TEST GROUP 1 STEP 6 Adjacent Positions Powered 01 CCC Mating/Unmating/Normal Force TEST GROUP A GROUP B1 GROUP B2 STEP 10 Boards Individual Contacts (30) min Individual Contacts (30) min 100 Cycles 01 Contact Gaps Setup Approve Setup Approve 02 Mating / Unmating Normal Force Upper Row Thermal Aging (Mated) 03 Measure Board Thick Normal Force Lower Row Normal Force Upper Row 04 Data Review Data Review Normal Force Lower Row Cycles 06 Mating / Unmating 07 Contact Gaps 08 Data Review 09 Thermal Aging (Mated) 10 Mating / Unmating 11 Contact Gaps 12 Data Review 13 Humidity (Mated) 14 Mating / Unmating 15 Contact Gaps IR / DWV TEST GROUP A GROUP B1 GROUP B2 GROUP B3 STEP 2 Boards 2 Boards 2 Boards 2 Boards Ambient Ambient Thermal Humidity 01 IR DWV/Working Thermal Aging Humidity 02 Data Review 03 Thermal Aging 04 IR 05 Data Review 06 Humidity 07 IR DWV/Working DWV/Working

5 FLOWCHARTS Continued Durability/Thermal Age/Cyclic Humidity TEST GROUP A STEP 200 Points 100 Cycles 01 LLCR-1 02 Data Review Cycles 04 LLCR-2 05 Data Review 06 Thermal Age 07 LLCR-3 08 Data Review 09 Cyclic Humidity 10 LLCR-4

6 ATTRIBUTE DEFINITIONS The following is a brief, simplified description of attributes. THERMAL: 1) EIA , Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors. 2) Test Condition 4 at 105 C. 3) Test Time Condition B for 250 hours. 4) Connectors are sometimes mated and all samples are pre-conditioned at ambient. HUMIDITY: 1) Reference document: EIA , Humidity Test Procedure for Electrical Connectors. 2) Test Condition B, 240 Hours. 3) Method III, +25 C to + 65 C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b. 4) Connectors are sometimes mated and all samples are pre-conditioned at ambient. TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) EIA , Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets. 2) When current passes through a contact, the temperature of the contact increases as a result of I 2 R (resistive) heating. 3) The number of contacts being investigated plays a significant part in power dissipation and therefore temperature rise. 4) The size of the temperature probe can affect the measured temperature. 5) Copper traces on PC boards will contribute to temperature rise: a. Self heating (resistive) b. Reduction in heat sink capacity affecting the heated contacts 6) A de-rating curve, usually 20%, is calculated. 7) Calculated de-rated currents at three temperature points are reported: a. Ambient b. 80 о C c. 95 о C d. 115 о C 8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized. 9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximum temperature in the vicinity of the heat generation area. 10) A computer program, TR 803.exe, ensures accurate stability for data acquisition. 11) Hook-up wire cross section is larger than the cross section of any connector leads/pc board traces, jumpers, etc. 12) Hook-up wire length is longer than the minimum specified in the referencing standard. CONTACT GAPS: 1) Contact Gaps were measured before and after stressing the contacts (e.g. thermal aging, mechanical cycling, etc.). 2) Typically, all contacts on the connector are measured.

7 MATING/UNMATING: 1) Reference document: EIA , Mating and Unmating Forces Test Procedure for Electrical Connectors. 2) The full insertion position was to within to of the plug bottoming out in the receptacle to prevent damage to the system under test. 3) One of the mating parts is secured to a floating X-Y table to prevent damage during cycling. NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING): 1) Reference document: EIA , Normal Force Test Procedure for Electrical Connectors. 2) The contacts shall be tested in the connector housing. 3) If necessary, a window shall be made in the connector body to allow a probe to engage and deflect the contact at the same attitude and distance (plus 0.05 mm [0.002 ]) as would occur in actual use. 4) The connector housing shall be placed in a holding fixture that does not interfere with or otherwise influence the contact force or deflection. 5) Said holding fixture shall be mounted on a floating, adjustable, X-Y table on the base of the Dillon TC 2, computer controlled test stand with a deflection measurement system accuracy of 5.0 µm ( ). 6) The nominal deflection rate shall be 5 mm (0.2 )/minute. 7) Unless otherwise noted a minimum of five contacts shall be tested. 8) The force/deflection characteristic to load and unload each contact shall be repeated five times. 9) The system shall utilize the TC 2 software in order to acquire and record the test data. 10) The permanent set of each contact shall be measured within the TC 2 software. 11) The acquired data shall be graphed with the deflection data on the X-axis and the force data on the Y-axis and a print out will be stored with the Tracking Code paperwork. INSULATION RESISTANCE (IR): To determine the resistance of insulation materials to leakage of current through or on the surface of these materials when a DC potential is applied. 1) PROCEDURE: a. Reference document: EIA , Insulation Resistance Test Procedure for Electrical Connectors. b. Test Conditions: i. Between Adjacent Contacts ii. Electrification Time 2.0 minutes iii. Test (500 VDC) corresponds to calibration settings for measuring resistances. 2) MEASUREMENTS: 3) When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 100 megohms. DIELECTRIC WITHSTANDING VOLTAGE (DWV): To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect of environmental stresses so not to influence the readings from arcing that occurs during the measurement process. 1) PROCEDURE: a. Reference document: EIA , Withstanding Test Procedure for Electrical Connectors. b. Test Conditions: i. Between Adjacent Contacts ii. Rate of Application 500 V/Sec iii. Test (VAC) until breakdown occurs

8 2) MEASUREMENTS/CALCULATIONS a. The breakdown voltage shall be measured and recorded. b. The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage. c. The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (onefourth of the breakdown voltage). LLCR: 1) EIA , Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 2) A computer program, LLCR 221.exe, ensures repeatability for data acquisition. 3) The following guidelines are used to categorize the changes in LLCR as a result from stressing a. <= +5.0 mohms: Stable b to mohms: Minor c to mohms: Acceptable d to mohms: Marginal e to mohms: Unstable f. >+2000 mohms: Open Failure

9 RESULTS Temperature Rise, CCC at a 20% de-rating CCC for a 30 C Temperature Rise A per contact with 6 adjacent contacts powered Contact Gap Initial o Min mm o Max mm After 100 Cycles o Min mm o Max mm Thermal o Min mm o Max mm Humidity o Min mm o Max mm Mating Unmating Forces Initial o Mating Min Lb. Max Lb. o Unmating Min Lb. Max Lb. After 100 Cycles o o Mating Min Lb. Max Lb. Unmating Min Lb. Max Lb. Thermal o Mating Min Lb. Max Lb. o Unmating Min Lb. Max Lb. Humidity o Mating Min Lb. Max Lb. o Unmating Min Lb. Max Lb. Normal Force at.015 (.381 mm) deflection Initial o Min grams Set (.018 mm) o Max grams Set (.099 mm) Thermal o Min grams o Max grams

10 Insulation Resistance minimums, IR Initial o Mated ,000 Meg Ω Pass o Unmated ,000 Meg Ω Thermal o Mated ,000 Meg Ω o Unmated ,000 Meg Ω Humidity o Mated ,000 Meg Ω o Unmated ,000 Meg Ω Dielectric Withstanding minimums, DWV Initial o Breakdown Mated VAC Unmated ,100 VAC o DWV Mated VAC Unmated VAC o Working voltage Mated VAC Unmated VAC Thermal o Breakdown Mated VAC Unmated ,000 VAC o o DWV Mated VAC Unmated VAC Working voltage Mated VAC Unmated VAC Humidity o Breakdown Mated VAC Unmated ,000 VAC o o DWV Mated VAC Unmated VAC Working voltage Mated VAC Unmated VAC LLCR Durability (200 LLCR test points) Initial mohms Max Durability, 100 Cycles o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure

11 Thermal o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure o Humidity o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure

12 DATA SUMMARIES TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) High quality thermocouples whose temperature slopes track one another were used for temperature monitoring. 2) The thermocouples were placed at a location to sense the maximum temperature generated during testing. 3) Temperature readings recorded are those for which three successive readings, 15 minutes apart, differ less than 1 C (computer controlled data acquisition). 4) Adjacent contacts were powered: a. Linear configuration with six adjacent conductors/contacts powered Maximum Current, Amp per Contact Room Temp= 18.9 C TC Contacts powered in Linear Series MEC C Limit Base Curve Derated 20 % RT Peak Amp RT Derated Amp Measured Current 85 C 85 C Peak Amp 85 C Derated Amp 95 C 95 C Peak Amp 95 C Derated Amp Limit 115 C Peak Amp 115 C Derated Amp 115 C Room Temp Useful Range Ambient Temperature, C

13 DATA SUMMARIES Continued CONTACT GAPS: Initial Measurements in mm After 100 Cycles Measurements in mm Minimum Minimum Maximum Maximum Average Average St. Dev St. Dev Count 500 Count 500 After Thermal Measurements in mm After Humidity Measurements in mm Minimum Minimum Maximum Maximum Average Average St. Dev St. Dev Count 500 Count 500 Height Measurements Upper GAP - Inches Nominal Lower MEC6 Upper Nominal Lower Initial Mating Thermal Humidity Stress

14 DATA SUMMARIES Continued MATING/UNMATING: Force (Oz) Initial After 100 Cycles Mating Unmating Mating Unmating Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Minimum Maximum Average After Thermal After Humidity Force (Oz) Mating Unmating Mating Unmating Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Minimum Maximum Average Force (Lbs) Mating/Unmating Compare Forces, lbs Mating Unmating Initial After 100 Cycles After Thermal After Humidity Stress

15 DATA SUMMARIES Continued NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING): 1) Calibrated force gauges are used along with computer controlled positioning equipment. 2) Typically, 8-10 readings are taken and the averages reported. Initial Deflections in inches Forces in Grams Initial Deflections in inches Forces in Grams Top SET Bottom SET Ave Ave Min Min Max Max St. Dev St. Dev Count Count Thermal Deflections in inches Forces in Grams Thermal Deflections in inches Forces in Grams Top SET Bottom SET Ave Ave Min Min Max Max St. Dev St. Dev Count Count Average Top Normal Force Initial 120 Initial Normal Force, Grams Deflection, Inches

16 DATA SUMMARIES Continued Average Bottom Normal Force Initial 200 Initial Normal Force, Grams Deflection, Inches Average Top Normal Force After Thermals 120 Thermal Normal Force, Grams Deflection, Inches

17 DATA SUMMARIES Continued Average Bottom Normal Force After Thermals Thermal Normal Force, Grams Deflection, Inches INSULATION RESISTANCE (IR): Initial, Meg Ohms Thermal, Meg Ohms Humidity, Meg Ohms Mated Unmated Mated Unmated Mated Unmated Insulation Resistance Insulation Resistance Insulation Resistance Insulation Resistance Insulation Resistance Insulation Resistance Average Min Max

18 DATA SUMMARIES Continued DIELECTRIC WITHSTANDING VOLTAGE (DWV): Initial, VAC Mated Initial, VAC Unmated Breakdown DWV Working Breakdown DWV Working Average Min Max Thermal, VAC Mated Thermal, VAC Unmated Breakdown DWV Working Breakdown DWV Working Average Min Max Humidity, VAC Mated Humidity, VAC Unmated Breakdown DWV Working Breakdown DWV Working Average Min Max LLCR: 1) A total of 200 points were measured. 2) EIA , Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 3) A computer program, LLCR 221.exe, ensures repeatability for data acquisition. 4) The following guidelines are used to categorize the changes in LLCR as a result from stressing. a. <= +5.0 mohms: Stable b to mohms: Minor c to mohms: Acceptable d to mohms: Marginal e to mohms Unstable f. >+2000 mohms: Open Failure Date Mar Mar Mar Apr Room Temp C RH 34% 34% 20% 32% Name Troy Cook Troy Cook Terry Spine Troy Cook mohm values Actual Delta Delta Delta Initial 100 Cycles Thermal Humidity Average St. Dev Min Max Count

19 CONTACT GAPS: Tracking Code: TC DATA Initial Measurements in mm Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B

20 DATA Continued After 100 Cycles Measurements in mm Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B

21 DATA Continued After Thermal Measurements in mm Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B

22 DATA Continued After Humidity Measurements in mm Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B

23 MATING/UNMATING Tracking Code: TC DATA Continued Initial After 100 Cycles Mating Unmating Mating Unmating Sample# Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) After Thermal After Humidity Mating Unmating Mating Unmating Sample# Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) MATING/UNMATING TEST CARD THICKNESSES: Board# English (in) Metric (mm)

24 DATA Continued NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING): Initial - Top Deflections in inches Forces in Grams Sample # SET Initial - Bottom Deflections in inches Forces in Grams Sample # SET Thermal - Top Deflections in inches Forces in Grams Sample # SET Thermal - Bottom Deflections in inches Forces in Grams Sample # SET

25 DATA Continued INSULATION RESISTANCE (IR): Initial, Meg Ohms Thermal, Meg Ohms Mated Unmated Mated Unmated Sample # Insulation Resistance Insulation Resistance Sample # Insulation Resistance Insulation Resistance Sample # Humidity, Meg Ohms Mated Insulation Resistance Unmated Insulation Resistance DIELECTRIC WITHSTANDING VOLTAGE (DWV): Sample # Breakdown Initial, VAC Mated DWV Working Breakdown Initial, VAC Unmated DWV Working Sample # Breakdown Thermal, VAC Mated DWV Working Breakdown Thermal, VAC Unmated DWV Working Sample # Breakdown Humidity, VAC Mated DWV Working Breakdown Humidity, VAC Unmated DWV Working

26 LLCR: DATA Continued Date Mar Mar Mar Apr Room Temp C RH 34% 34% 20% 32% Name Troy Cook Troy Cook Terry Spin3 Troy Cook mohm values Actual Delta Delta Delta Initial 100 Cycles Thermal Humidity Average St. Dev Min Max Count mohm values Actual Delta Delta Delta 100 Board Position Initial Cycles Thermal Humidity 1 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P

27 2 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P

28 4 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P

29 6 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P

30 8 P P P P P P P P P P P P P P P P P P P P

31 EQUIPMENT AND CALIBRATION SCHEDULES Equipment #: OGP-01 Description: 6''X 6'' Video Measuring Machine Manufacturer: Optical Gauging Products Model: Smartscope 200 CFOV Serial #: SF Accuracy: See Manual Last Cal: 04/12/05, Next Cal: 04/12/06 Equipment #: TCT-03 Description: Dillon Quantrol TC2 Test Stand Manufacturer: Dillon Quantrol Model: TC2 Serial #: Accuracy: Speed Accuracy: +/- 5% of indicated speed; Displacement: +/- 5 micrometers. Last Cal: 5/12/05, Next Cal: 5/12/06 Equipment #: LC-250N (icell) Description: 250 Newton load cell for Dillon Quantrol test stand Manufacturer: Dillon Quantrol Model: icell Serial #: Accuracy:.10 % of Capacity Last Cal: 4/19/2005, Next Cal: 4/19/2006 Equipment #: OV-03 Description: Cascade Tek Forced Air Oven Manufacturer: Cascade Tek Model: TFO-5 Serial #: Accuracy: Temp. Stability: +/-.1C/C change in ambient Last Cal: 05/12/05, Next Cal: 05/12/06 Equipment #: THC-01 Description: Temperature/Humidity Chamber Manufacturer: Thermotron Model: SM Serial #: Accuracy: See Manual Last Cal: 7/15/2005, Next Cal: 8/15/2006 Equipment #: TCT-04 Description: Dillon Quantrol TC mm/min series test stand Manufacturer: Dillon Quantrol Model: TC2 I series test stand Serial #: Accuracy: Speed Accuracy: +/- 5% of indicated speed; Speed Accuracy: +/- 5% of indicated speed; Last Cal: 4/28/2005, Next Cal: 4/28/2006

32 Equipment #: MO-02 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual See Manual Last Cal: 05/12/05, Next Cal: 05/12/06 Equipment #: MO-04 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual Last Cal: 6/12/05, Next Cal: 6/12/06 Equipment #: PS-01 Description: System Power Supply Manufacturer: Hewlett Packard Model: HP 6033A Serial #: (HP) 3329A Accuracy: See Manual Last Cal: 05/12/05, Next Cal: 05/12/06 Equipment #: TC /105 Description: IC Thermocouple-103/105 Manufacturer: Samtec Model: Serial #: TC /105 Accuracy: +/- 1 degree C Last Cal:, Next Cal: Equipment #: HPM-01 Description: Hipot Megommeter Manufacturer: Hipotronics Model: H306B-A Serial #: SF Accuracy: 2 % Full Scale Accuracy Last Cal: 5/12/05, Next Cal: 05/12/06 Equipment #: MO-01 Description: Micro-Ohmeter Manufacturer: Keithley Model: 580 Serial #: Accuracy: See Manual Last Cal: 05/12/05, Next Cal: 05/12/06

33 Equipment #: MO-03 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual Last Cal: 05/12/05, Next Cal: 05/12/06

Mated with IPBT-110-H1-T-S

Mated with IPBT-110-H1-T-S Project Number: Requested by: Brandon Harpenau Date: 2/17/2006 Product Rev: 1 Lot #: 0 Tech: Troy Cook/ Tony Wagoner Eng: Dave Scopelliti Qty to test: 50 Test Start: 03/17/2006 Test Completed: 4/20/2006