General company presentation. January 2015

Transcription

1 General company presentation January 2015

2 Mission Our mission is to be world class competence center offering development and manufacturing of functional semiconductor assembly solutions. Focus on (MEM s) sensor systems. Development from scratch to a manufacturing solution. Meeting quality demand of Automotive industry. 2

3 A young company with a long history 1987 Foundation of eurasem as an independent assembly subcontractor for plastic packaging in Nijmegen 1997 Development of first (acceleration) sensor package 1999 SOP first package using cavity molding technology 2001 Acquisition by Elmos Semiconductor AG -volume assembly SOIC-W (60 KK/yr) 2004 Name changed to Elmos Advanced Packaging BV 2007 Development of various Elmos Sensor projects SOP of oil level sensor package (MCM) 2009 Entering new markets Sencio has taken over all advanced packaging activities from Elmos Semiconductor AG SOP of functional QFN assembly solutions Release of Assembly location in Cabuyao (Philippines) 2014 SOP in Cabuyao 3

4 Facts & Figures Number of employees 45 The TS16949 & ISO certified Over 350 million assemblies supplied to the Automotive Industry. Far East assembly location Cabuyao (Philippines). Innovative engineering team: > 10 year experience. Meeting customer s expectation. Creative mindset 800 m2 clean room facility; 10K & 100K 4

5 Organisation CEO CMO COO CFO Managing Director Manager Marketing & Sales Director Operations Manager Finance Marketing & Sales - Customers Service officer Engineering - Manager Engineering Finance & Administration - Finance Assistant Development - Project leader(s) (PL) - Development Engineer(s) (DE) - Process Engineer(s) (PE) - Equipment Engineer(s) (EE) - Facility Engineer HRM - HRM Officer - General Assistant Manufacturing - Manufacturing Assistant (MA) Material supply - Product Line Guardian(s) (PG) - Product Inspector(s) (PI) - Buyer - Stores / OE ICT - Application / ICT Engineer Quality & Environmental care - Manager Quality & Environmental care - Quality Engineer

6 Proposition Core business: Development of functional plastic encapsulation solutions. Volume manufacturing of functional packaging. Other services: Ceramic / plastic fast turn prototyping Product & process qualification Component supply management Wafer processing

7 Markets & Customers Market value chain Design Component supplier 1 st level packager Final testing & calibration System supplier Final customer SENCIO Services offered to both Component and System suppliers Markets: Automotive Industrial Medical Defence / Aerospace

8 Customers Member of: 8

9 Development for manufacturing Concept engineering Package development & prototyping Industrialisation Transfer into manufacturing SENCIO Research institutes Customer expectation translated to packaging idea. From packaging idea to manufacturing solution. Design for manufacturing. Volume manufacturers Experience of volume manufacturing used to develop manufacturable functional package solution. Local industrialization assures manufacturable solution.

10 Development capabilities Design (Solid Edge & Acad) Leadframe Process design (D.O.E.) Package outline Specific tooling Finite element analysis (Ansys) Design tool Heat dissipation Stress analysis FMEA Qualification Industrialization

11 Technology survey (S.O.L.) Technology Equipment Highlights Taping/detaping Takatori ATM-1100E Takatori ATM 2100D 8 Backgrinding Disco DFG841 8 Thickness 250 µm Wafermounter Nitto MA1508N 8 Wafer labelling Longhill LH890A 8 Wafersawing Disco DFD 651, 8 dual spindle Glass / filter sawing capability Wafer inspection August NSX 95 8 Inspection after sawing

12 Technology survey (F.O.L.) Technology Equipment Highlights Die attach ESEC 2008XP ESEC 2007 Datacon APM2200 Datacon EVO RkD2200 8, wafer handling ± 25 µm Glue Jetting J9000 On Asymtek X10-20, X9-10, connected to Datacon Glue dispensing Mushashi Volumetric On ESEC machines Wirebonding ESEC 3088 Au wire µm Thermosonic ball bonding Wirebonding Delvotec Al wire µm Ultrasonic wedge bonding Plasma cleaning Tepla S660 Ar-plasma

13 Technology survey (B.O.L.) Technology Equipment Highlights Molding Ideal Lab Ideal 2SA Osprey 20t Osprey 40 ton FAM Encapsulation is explained separately Laser marking Rofin RMIC-100D-SD Integrated on T&F Trim & form ASM MP2009 Besi Fico Compactline Tray offloading Tube offloading QFN separation Besi Fico ISS QFN 3x3 mm

14 Functional encapsulation technologies Pressure Gas/ chemical / fluid Sensor types Optical Acceleration gyro Magnetic Overmolding ± Premolded Globtop overmolding Exposed die Glass on die Overmolding passives compnts. ncapsulate

15 ncapsulate Adding an extra dimension to the encapsulation of your device /system Protection Additional functionality Examples: Functional shapes. Combination of mechanics with electronics (mechatronics).

16 ncapsulate functional shapes Encapsulation shape adapted to the application. Accurate dimensional shape, stable over temperature Applications: Alignment features Mounting support Custom specific shape

17 Combination mechanics & electronics Adding mechanical elements to encapsulated electronics Alignment features Supporting features Advantages: Improved alignment (measurement accuracy) Improved thermal contact Simplified design Improved efficiency

18 Integration of screw-thread Improved alignment between nut & sensor /semiconductor

19 Integration of nut applications Direct mounting of heat sink

20 Integration of nut applications Mounting of tube access for sensor application

21 Integration of nut applications Fixation of optical elements (lens, fiber..)

22 Integration of bearing Improved alignment between bearing & semiconductor

23 Integration of bearing Application examples: Magnetic sensor (Hall, AMR) angle measurement

24 Functional encapsulation technologies Pressure Gas/ chemical / fluid Sensor types Optical Acceleration gyro Magnetic Overmolding ± Premolded Globtop overmolding Exposed die Glass on die Technologies can be combined! Overmolding passives compnts. ncapsulate

25 A combination of different technologies Pressure Gas/ chemical / fluid Sensor types Optical Acceleration gyro Magnetic Overmolding ± Premolded Globtop overmolding Exposed die Glass on die Overmolding passives compnts. ncapsulate

26 Product summary (1) Technology Sensor Outline Application Temp range Overmolded Piezo disc Automotive Motor oil-level ºC Premolded Relative P Various Dry air ºC Absolute P Automotive Side airbag ºC Globtop overmolding Absolute P Automotive TPMS ºC Exposed die Optical Automotive Power steering ºC

27 Product summary (2) Technology Sensor Outline Application Temp range Exposed die Chemical Various Various ºC Tuning Fork Automotive Motor-oil viscosity ºC Absolute P Automotive Motor-oil pressure ºC Glass on die Optical Automotive sun angle Sun Angle measurement ºC Optical various RGB-sensor ºC

28 Summary Your assembly expectation realized with a Sencio s functional packaging solution. Development for cost efficient manufacturing. Development in Europe, volume assembly location in the Philippines. Sencio BV Microweg CL NIJMEGEN Netherlands Phone: Fax: info@sencio.nl

29 Protecting your technology with ours!