2A BUS TERMINATION REGULATOR

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Adele Harrington
6 years ago
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1 A BUS TERMINATION REGULATOR Description The linear regulator is designed to provide the transient peaks up to A sourcing or sinking capability for DDR SDRAM bus termination application. The output voltage can track half of input power by two external voltage divider resistors. The provides current limiting in both sourcing/sinking mode and thermal shutdown function which protects the excessive heating due to high current and high junction temperature. The is available in the SOP-8 (Exposed Pad) package. Pin Assignments SP Package (SOP-8<Exposed Pad>) 8 7 NC NC NC Figure. Pin Assignment of (Top View) Features A Source or Sink Current Power MOSFET Integrated Low Output Voltage Offset Current Limiting Protection Thermal Shutdown Protection Adjusted Output by External Resistors Shutdown for Standby or Suspend Mode RoHS Compliant Applications DDR-I and DDR-II Bus Termination Voltage SSTL- and SSTL- Termination Active Termination Buses Ordering Information TR: Tape/Reel Blank: Tube P: Pb Free with Commercial Standard (RoHS Compliant) Package Type SP: SOP-8 (Exposed Pad) Typical Application Circuit.8V/.V V IN.V R U K C IN 7µ EN Q R D K C SS µ.9v/.v V OUT C 7µ C CNTL 7µ Figure. Typical Application Circuit of -.-JAN-7

2 Functional Pin Description Pin Name Pin Function Power input pin. is the input power supply used to create the external reference voltage for regulating. sources current to by upper NMOS. Common ground pin. The sinks current to by lower NMOS. Power input pin. The power supplies the internal control circuitry and gate drive voltage. Chip enable, and input reference voltage pin. The reference voltage is half of the power by two external voltage divide resistors. Regulator output pin. voltage tracks the voltage and is capable of sourcing or sinking current up to peak A. Block Diagram + - Error Amp Current Limit & Thermal Shutdown Figure. Block Diagram of Absolute Maximum Ratings to V to V Power Dissipation Internal Limited Junction C Storage Range C to C Package Thermal Resistance: SOP-8 (Exposed Pad), θ JC C/W SOP-8 (Exposed Pad), θ JA C/W Lead (Soldering, sec.) C ESD Susceptibility HBM(Human Body Mode) KV MM(Machine Mode) V Note:Stresses beyond those listed under Absolute Maximum Ratings" may cause permanent damage to the device. -.-JAN-7

3 Electrical Characteristics ( =.V, V IN =.V, V =.*V IN, C OUT =uf, T A = C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units INPUT Operation Voltage Range (DDRI and DDII) V IN../.8.. Quiescent Current I CNTL No Load.. ma Shutdown Current I SD V <.V ua OUTPUT VOLTAGE Output Offset Voltage V OS No Load, (V -V OUT ) - mv V Load Regulation (DDRI and DDII) PROTECTION V LOAD I OUT : to.a I OUT : to -.A mv Current Limit I LIM.. A Thermal Shutdown T SD 7 C Thermal Shutdown Hysteresis T SD C SHUTDOWN CONTROL Minimum Shutdown High Level V IH. V Minimum Shutdown Low Level V IL. V -.-JAN-7

4 Typical Performance Curves.... Turn-On Threshold Voltage (V) =.V =V Turn-OFF Threshold Voltage (V) =V =.V Figure. Turn-On Threshold Voltage vs. Junction Figure. Turn-Off Threshold Voltage vs. Junction 8 V OUT =.V 8 V OUT =.9V Output Offset V OUT -V (mv) - - =V =.V Output Offset V OUT -V (mv) - - =V =.V Figure. Output offset (V OUT -V ) vs. Junction Figure 7. Output offset (V OUT -V ) vs. Junction Sourcing Sinking =.V Current Limit (A) =.8V =.V, V IN =.V =.V, V IN =.8V Current Limit (A) =.V, V IN =.V =.V, V IN =.8V =.V =.8V Juncition ( C) Figure 8. Current Limit vs. Junction Juncition ( C) Figure 9. Current Limit vs. Junction -.-JAN-7

5 Typical Performance Curves (Continued) Source =.V VI N =.V V =.V Sink =.V V IN =.V V =.V Figure. Output Short-Circuit Protection Figure. Output Short-Circuit Protection Switching Frequency=KHz =.V V =.V A Switching Frequency=KHz =.V V =.9V A Figure..V A Transient Response Figure..9V A Transient Response -.-JAN-7

6 Outline Information SOP-8 (Exposed Pad) Package (Unit: mm) Thermal PAD Y D X E H SYMBOLS DIMENSIONS IN MILLIMETER Min Nom Max A... A A B C D E e H L y º --- 8º X. TYP Y. TYP y 7 o (X) B e A A A C θ L Note :PACKAGE BODY SIZES EXCLUDE MOLDFLA- SHAND GATE BURRS Note :DIMENSION L IS MEASURED IN GAGE PLANE Note :TOLERANCE. mm UNLESS OTHERWISE SPECIFIED Note :CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. Note :FOLLOWED FROM JEDEC MS- Note :X, Y DIMENSIONS IN INCHES:X:.9(TYP); Y:.(TYP) Life Support Policy Fitipower s products are not authorized for use as critical components in life support devices or other medical systems. -.-JAN-7

Over Voltage and Over Current Protection IC

Over Voltage and Over Current Protection IC General Description The is an Over-Voltage-Protection (OVP) and Over-Current-Protection (OCP) device. The device will switch off internal MOSFET to disconnect